CN211376621U

CN211376621U - Lowk chip packaging mechanism

Info

Publication number: CN211376621U
Application number: CN202020160965.8U
Authority: CN
Inventors: 陈卫国
Original assignee: Shanghai Genpai Semiconductor Technology Co ltd
Current assignee: Shanghai Genpai Semiconductor Technology Co ltd
Priority date: 2020-02-11
Filing date: 2020-02-11
Publication date: 2020-08-28
Anticipated expiration: 2030-02-11

Abstract

The utility model belongs to the technical field of chip package, especially Lowk chip packaging mechanism, including packaging box and encapsulation lid, equidistant fixedly connected with a plurality of first springs on the interior diapire of packaging box, a plurality of the top fixed mounting of first spring has the support box, and supports the box and do not have the top cap setting, the chip main part of the inside setting of support box, the top of chip main part is provided with the location arch, packaging lid and packaging box are detachable connection, the bottom interval of packaging lid is provided with a plurality of vertical second springs, the lower extreme of second spring is fixed with the briquetting, the bottom surface of briquetting is supported and is pressed on the top surface of chip main part; the utility model discloses when the installation, directly will encapsulate the lid and press downwards, make the joint pole get into the joint groove, during the locating pin is automatic stretches into the locating hole, realize quick fixed, the utility model discloses rational in infrastructure, design benefit conveniently dismantles the installation, is fit for using widely.

Description

Lowk chip packaging mechanism

Technical Field

The utility model relates to a chip package technical field especially relates to Lowk chip packaging mechanism.

Background

With the integration of electronic devices becoming higher and higher, the semiconductor packaging field has proposed System-in-Package (SIP), which is a single standard Package that combines a plurality of active electronic components with different functions, optional passive devices, and other devices such as Micro-Electro-Mechanical systems (MEMS) or optical devices, to realize a certain function, so as to form a System or a subsystem.

At present, a widely adopted method is to integrate a packaged passive device and other types of bare wafers or packaged chips into a package body by a secondary packaging method to achieve the effect of improving the integration level. However, in the method, all the devices are placed in place through a large number of high-precision mounting actions and then are subjected to plastic packaging, the manufacturing speed is low, the cost is high, and the packaging volume is still large.

In the prior art, the chip packaging box is inconvenient to mount and dismount, and the chip cannot be fixedly mounted in a positioning way;

in order to solve the above problems, a Lowk chip packaging mechanism is proposed in the present application.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

For solving the technical problem who exists among the background art, the utility model provides a Lowk chip packaging mechanism has easy to assemble and dismantles, can advance line location fixed characteristics to the chip.

(II) technical scheme

In order to solve the problem, the utility model provides a Lowk chip packaging mechanism, including packaging box and encapsulation lid, equidistant a plurality of first springs of fixedly connected with are a plurality of on the inner diapire of packaging box, and are a plurality of the top fixed mounting of first spring has the support box, and supports the box and set up for no top cap, support the chip main part that the inside of box set up, the top of chip main part is provided with the location arch, the packaging lid is detachable with the packaging box and is connected, the bottom interval of packaging lid is provided with the vertical second spring of a plurality of, the lower extreme of second spring is fixed with the briquetting, the bottom surface of briquetting is supported and is pressed at the top surface of chip main part.

Preferably, the top surface both sides of encapsulation box all are provided with the joint groove, the both sides bottom surface of encapsulation lid all is provided with the joint pole with joint groove matched with.

Preferably, the clamping rod is provided with a spring pin piece, and the packaging box is provided with a positioning hole matched with the spring pin piece.

Preferably, the spring pin piece comprises a third spring and a positioning pin, the third spring is arranged on the inner wall of the mounting groove, the mounting groove is formed in the outer wall of the clamping rod, the positioning pin is fixed at one end of the third spring, and the positioning pin corresponds to the positioning hole in position.

Preferably, the inner wall of the supporting box is provided with a cushion pad, the chip body is arranged on the cushion pad, and the cushion pad is made of rubber.

Preferably, the top color piece of the packaging cover is provided with a movable hole, and the positioning projection extends to the outside of the packaging cover from the movable hole.

The above technical scheme of the utility model has following profitable technological effect:

1. the supporting box is fixedly installed at the top ends of the first springs and is arranged without a top cover, the chip main body is arranged inside the supporting box, the top of the chip main body is provided with a positioning bulge, the packaging cover is detachably connected with the packaging box, a plurality of vertical second springs are arranged at the bottom of the packaging cover at intervals, a pressing block is fixed at the lower end of each second spring, the bottom surface of each pressing block is pressed against the top surface of the chip main body, the packaged chip can be damped through the arrangement of the first springs, the influence of vibration on the chip is avoided, the packaging cover is detachably connected with the packaging box, the packaging box is convenient to disassemble and install, and the packaging efficiency is improved;

2. through the bellied setting in location, can carry out quick location to the chip, make things convenient for subsequent encapsulation, when the dismantlement to encapsulation lid and encapsulation box, push away the locating pin to the inside of mounting groove, then directly upwards draw encapsulation lid, just can part encapsulation lid and encapsulation box, when the installation, directly press the encapsulation lid downwards, make the joint pole get into the joint groove, during the locating pin is automatic stretches into the locating hole, realize quick fixed, the utility model discloses rational in infrastructure, design benefit, convenient dismantlement installation is fit for using widely.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of the structure at A of the present invention;

fig. 3 is the structure diagram of the utility model after the package box and the package cover are separated and detached.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

As shown in fig. 1-3, the utility model provides a Lowk chip packaging mechanism, including packaging box 1 and encapsulation lid 5, equidistant a plurality of first springs 2 of fixedly connected with on the inner diapire of packaging box 1, the top fixed mounting of a plurality of first springs 2 has support box 3, and support box 3 and be the setting of no top cap, support the chip main part 8 of the inside setting of box 3, the top of chip main part 8 is provided with location arch 4, packaging lid 5 is detachable with packaging box 1 and is connected, packaging lid 5's bottom interval is provided with the vertical second spring 6 of a plurality of, the lower extreme of second spring 6 is fixed with briquetting 7, the bottom surface of briquetting 7 is supported and is pressed at the top surface of chip main part 8.

In the embodiment, as shown in fig. 2, it should be noted that, the package box 1 is provided with clamping grooves 9 on both sides of the top surface, and the package cover 5 is provided with clamping rods 10 on both sides of the bottom surface for cooperating with the clamping grooves 9.

In the present embodiment, as shown in fig. 2, it should be noted that a spring pin member is disposed on the clamping bar 10, and a positioning hole 14 matched with the spring pin member is disposed on the packaging box 1.

As shown in fig. 2, in this embodiment, it should be noted that the spring pin member includes a third spring 12 and a positioning pin 13, the third spring 12 is disposed on an inner wall of the mounting groove 11, the mounting groove 11 is opened on an outer wall of the clamping rod 10, the positioning pin 13 is fixed at one end of the third spring 12, and the positioning pin 13 corresponds to the positioning hole 14.

In this embodiment, it should be noted that a cushion pad is disposed on the inner wall of the supporting box 3, the chip main body 8 is disposed on the cushion pad, and the cushion pad is made of rubber, so as to protect the chip main body 8.

In the present embodiment, as shown in fig. 1, it should be noted that the top color of the packaging cover 5 has a movable hole, and the positioning protrusion extends from the movable hole to the outside of the packaging cover 5.

The working principle is as follows: the supporting box 3 is fixedly installed on the top ends of the first springs 2, the supporting box 3 is arranged without a top cover, the chip main body 8 is arranged in the supporting box 3, the positioning bulge 4 is arranged on the top of the chip main body 8, the packaging cover 5 is detachably connected with the packaging box 1, a plurality of vertical second springs 6 are arranged at the bottom of the packaging cover 5 at intervals, the pressing block 7 is fixed at the lower end of the second spring 6, the bottom surface of the pressing block 7 is pressed against the top surface of the chip main body 8, the packaged chip can be damped by the arrangement of the first springs 2, the influence of vibration on the chip is avoided, the packaging cover 5 is detachably connected with the packaging box 1, the dismounting and the installation of the packaging box 1 are facilitated, the packaging efficiency is improved, the chip can be quickly positioned by the arrangement of the positioning bulge 4, the subsequent packaging is facilitated, when the packaging cover 5 is dismounted from the packaging box 1, push away locating pin 3 to the inside of mounting groove 11, then directly upwards pull up encapsulation lid 5, just can part encapsulation lid 5 and encapsulation box 1, when the installation, directly will encapsulate lid 5 and press downwards, make the joint pole 10 get into joint groove 9, during locating pin 3 stretches into locating hole 14 automatically, realize quick fixed, the utility model discloses rational in infrastructure, design benefit conveniently dismantles the installation, is fit for using widely.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

The Lowk chip packaging mechanism comprises a packaging box (1) and a packaging cover (5), and is characterized in that a plurality of first springs (2) fixedly connected with equal intervals are arranged on the inner bottom wall of the packaging box (1) in a plurality of modes, the top end of each first spring (2) is fixedly provided with a supporting box (3), the supporting boxes (3) are arranged in a non-top cover mode, a chip body (8) arranged inside the supporting box (3) is provided with a positioning protrusion (4), the packaging cover (5) is detachably connected with the packaging box (1), a plurality of vertical second springs (6) are arranged at the bottom of the packaging cover (5) at intervals, pressing blocks (7) are fixed at the lower ends of the second springs (6), and the bottom surface of each pressing block (7) abuts against the top surface of the chip body (8).
2. The Lowk chip packaging mechanism according to claim 1, wherein both sides of the top surface of the packaging box (1) are provided with clamping grooves (9), and both sides of the bottom surface of the packaging cover (5) are provided with clamping rods (10) matched with the clamping grooves (9).
3. Lowk chip packaging mechanism according to claim 2, wherein the clamping bar (10) is provided with a spring pin, and the packaging box (1) is provided with a positioning hole (14) matching with the spring pin.
4. The Lowk chip packaging mechanism according to claim 3, wherein the spring pin member includes a third spring (12) and a positioning pin (13), the third spring (12) is disposed on an inner wall of the mounting groove (11), the mounting groove (11) is opened on an outer wall of the clamping rod (10), the positioning pin (13) is fixed at one end of the third spring (12), and the positioning pin (13) corresponds to the positioning hole (14).
5. The Lowk chip packaging mechanism according to claim 4, wherein a buffer pad is disposed on the inner wall of the supporting box (3), the chip body (8) is disposed on the buffer pad, and the buffer pad is made of rubber.
6. Lowk chip packaging mechanism according to claim 5, wherein the top colored child of the packaging cover (5) has a movable hole, and the positioning protrusion extends from the movable hole to the outside of the packaging cover (5).