CN211373837U

CN211373837U - Built-in infrared module of shutter

Info

Publication number: CN211373837U
Application number: CN201922126097.1U
Authority: CN
Inventors: 王丽娜; 黄晟; 王鹏; 周汉林
Original assignee: Wuhan Guide Sensmart Tech Co ltd
Current assignee: Wuhan Guide Sensmart Tech Co ltd
Priority date: 2019-12-02
Filing date: 2019-12-02
Publication date: 2020-08-28
Anticipated expiration: 2029-12-02

Abstract

The utility model relates to an infrared module technical field provides a built-in infrared module of shutter, including the lens cone, still include support and base plate, the upper surface of support has the recess that supplies the lens cone embedding to install, the lower surface of support is installed on the base plate, the internally mounted of support has the shutter. The infrared module with the built-in shutter not only can reduce the noise generated during the operation of the module, but also can effectively control the height of the whole module so as to be applied to thinner electronic products for use; the detector is directly adhered to the high-heat-conductivity substrate, so that heat is effectively transferred, and the detector is ensured to be in a good working environment.

Description

Built-in infrared module of shutter

Technical Field

The utility model relates to an infrared module technical field specifically is a built-in infrared module of shutter.

Background

Among the prior art, the shutter of infrared module is many above the lens, and the module during operation can send great noise, and external shutter can lead to whole module height dimension great moreover, uses on thinner electronic product to be restricted.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a built-in infrared module of shutter through place the shutter in the support in, not only can reduce the noise that the module during operation sent, but also can control whole module height effectively to use on using thinner electronic product.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the built-in infrared module of shutter comprises a lens cone, a support and a substrate, wherein the upper surface of the support is provided with a groove for the lens cone to be embedded and installed, the lower surface of the support is installed on the substrate, and the shutter is installed inside the support.

Further, the shutter is locked inside the holder by a screw.

Further, the device also comprises a detector, wherein the detector is arranged between the support and the substrate.

The detector further comprises an FPC (flexible printed circuit) wiring board, wherein the FPC wiring board is arranged between the support and the substrate and is connected with the detector through a lead.

Furthermore, the FPC winding displacement board is provided with a through hole for embedding the detector.

Further, the detector is adhered to the substrate.

Further, the support is pasted on the FPC winding displacement board.

Further, the substrate is a high thermal conductivity material substrate.

Further, the high heat conduction material substrate is an alumina ceramic substrate, a molybdenum copper substrate or an aluminum silicon carbide substrate.

Further, the lens cone is installed on the support through a threaded interface and is fixed through thread glue.

Compared with the prior art, the beneficial effects of the utility model are that: the infrared module with the built-in shutter is characterized in that the shutter is built in the support, so that the noise generated when the module works can be reduced, and the height of the whole module can be effectively controlled, so that the infrared module can be applied to thinner electronic products; the detector is directly adhered to the high-heat-conductivity substrate, so that heat is effectively transferred, and the detector is ensured to be in a good working environment.

Drawings

Fig. 1 is an exploded view of an infrared module with a built-in shutter according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of an infrared module with a built-in shutter according to an embodiment of the present invention;

in the reference symbols: 1-a lens barrel; 10-a lens; 2-a support; 20-screws; 21-a groove; 3-a detector; 4-FPC flat cable; 40-through holes; 5-a substrate; 6-shutter cover plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 and 2, an embodiment of the present invention provides an infrared module with a built-in shutter, including a lens barrel 1, a support 2 and a substrate 5, wherein the upper surface of the support 2 has a groove 21 for the lens barrel 1 to be embedded and installed, the lower surface of the support 2 is installed on the substrate 5, and the shutter is installed inside the support 2. In the prior art, the shutter is external, so that the module can emit large noise when working, and the external shutter can also make the height dimension of the whole module large, which is not beneficial to being used on thinner electronic products, therefore, in the embodiment, the technical problem can be solved by adopting the scheme of arranging the shutter internally, for example, the external dimension of the infrared module is 11mm x 11mm, the whole height is within 6mm, which is more miniature and thinner, and the blade action noise of the external shutter is large when compensating the infrared imaging quality, the internal shutter is positioned inside, and the relative dimension is smaller, thereby effectively reducing the noise. In order to ensure the stability of the built-in shutter, the shutter is selectively installed inside the support 2, and in addition, a groove 21 is formed at the upper surface of the support 2 by sinking downwards so as to facilitate the insertion installation of the lens barrel 1, and finally, the support 2 is fixed on the substrate 5. Preferably, the shutter is locked inside the holder 2 by means of screws 20 to be integral with the holder 2, although locking and removal of the shutter may also be facilitated by means of screws 20. Preferably, the shutter includes blades (not shown) and a shutter cover 6, and the shutter is integrally fixed to the holder by screws. Preferably, the lens barrel 1 comprises an infrared lens 10, and the infrared lens 10 is fixed inside the lens barrel 1 by glue.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 1 and fig. 2, the infrared module further includes a detector 3, and the detector 3 is disposed between the support 2 and the substrate 5. The system also comprises an FPC (flexible printed circuit) flat cable 4 plate, wherein the FPC flat cable 4 plate is arranged between the support 2 and the substrate 5, and the FPC flat cable 4 plate is connected with the detector 3 through a lead. In the present embodiment, the detector 3 is disposed between the support 2 and the FPC cable 4, and the FPC cable 4 is coupled to the detector 3 by a lead wire, so as to transmit the electrical signal on the chip to the FPC cable 4. Preferably, the lower surface of the support 2 is also recessed inwardly with a recess in which the detector 3 is located, which may make the structure more compact.

Further optimizing the above scheme, referring to fig. 1 and fig. 2, the FPC flat cable 4 is provided with a through hole 40 for the detector 3 to be embedded into. In this embodiment, the through hole 40 is formed on the FPC flat cable 4, the detector 3 can be embedded into the through hole 40, and the hollow structure can reduce the height of the infrared module. Preferably, support 2 is pasted 4 boards on the FPC winding displacement, the detector 3 imbeds the base plate contact of 4 boards below of FPC winding displacement behind the through-hole 40 to paste on the base plate, can guarantee the stability of the installation of detector 3, and detector 3 directly pastes on high heat conduction base plate 5, and effective heat transfer guarantees that detector 3 is in good operational environment.

As an optimized solution of the embodiment of the present invention, please refer to fig. 1 and fig. 2, the substrate 5 is a high thermal conductive material substrate, preferably, the high thermal conductive material substrate may be an alumina ceramic substrate, a molybdenum copper substrate or an aluminum silicon carbide substrate. In the embodiment, the substrate 5 is an alumina ceramic substrate, a molybdenum copper substrate or an aluminum silicon carbide substrate, so that the overall module height can be reduced, and the material of the substrate 5 is as thin as possible. In addition, the material of the substrate 5 needs to be closer to the thermal expansion coefficient of the material of the detector 3, so that the thermal stress after the detector 3 and the substrate 5 are bonded can be effectively reduced; meanwhile, the substrate 5 is made of a material with good thermal conductivity so as to ensure effective heat dissipation of the chip and make the pixel response rate of the detector 3 consistent, thereby achieving the purposes of good imaging and accurate temperature measurement.

As an optimized solution of the embodiment of the present invention, please refer to fig. 1 and fig. 2, the lens barrel 1 is installed on the support 2 through a threaded interface and fixed by a threaded glue. In this embodiment, the lens barrel 1 can be mounted by screwing for easy removal, and the mounting of the lens barrel 1 can be more stable by screwing.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a built-in infrared module of shutter, includes the lens cone, its characterized in that: the lens barrel fixing device is characterized by further comprising a support and a base plate, wherein a groove for the lens barrel to be embedded and installed is formed in the upper surface of the support, the lower surface of the support is installed on the base plate, and a shutter is installed inside the support.

2. The infrared module with a built-in shutter according to claim 1, wherein: the shutter is locked inside the holder by screws.

3. The infrared module with a built-in shutter according to claim 1, wherein: the device further comprises a detector, wherein the detector is arranged between the support and the substrate.

4. The infrared module with a built-in shutter according to claim 3, wherein: the detector is characterized by further comprising an FPC (flexible printed circuit) wiring board, wherein the FPC wiring board is arranged between the support and the substrate and is connected with the detector through a lead.

5. The infrared module with a built-in shutter according to claim 4, wherein: the FPC winding displacement board is provided with a through hole for embedding the detector.

6. The infrared module with a built-in shutter according to claim 5, wherein: the detector is adhered to the substrate.

7. The infrared module with a built-in shutter according to claim 4, wherein: the support is pasted on the FPC wiring board.

8. The infrared module with a built-in shutter according to claim 1, wherein: the substrate is a high heat conduction material substrate.

9. The infrared module with a built-in shutter according to claim 8, wherein: the high heat conduction material substrate is an aluminum oxide ceramic substrate, a molybdenum copper substrate or an aluminum silicon carbide substrate.

10. The infrared module with a built-in shutter according to claim 1, wherein: the lens cone is installed on the support through a threaded interface and is fixed through thread glue.