CN211367710U - Rigid composite type imprinting mold - Google Patents
Rigid composite type imprinting mold Download PDFInfo
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- CN211367710U CN211367710U CN201921263251.3U CN201921263251U CN211367710U CN 211367710 U CN211367710 U CN 211367710U CN 201921263251 U CN201921263251 U CN 201921263251U CN 211367710 U CN211367710 U CN 211367710U
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Abstract
The utility model provides a compound impression mould of rigidity, compound impression mould of rigidity includes: the rigid substrate comprises a base and a convex structure formed on the upper surface of the base; and the metal demolding layer is formed on the upper surface of the substrate and the surface of the protruding structure. Through compound impression mould of rigidity has solved the problem that current metal impression mould preparation is with high costs and not environmental protection.
Description
Technical Field
The utility model relates to a figure impression field especially relates to a compound impression mould of rigidity.
Background
Pattern imprinting refers to a technique for effecting pattern transfer by imprinting, wherein an imprint mold plays an irreplaceable role in the pattern transfer process.
The existing rigid imprinting mold is generally a metal mold prepared by an electroplating process, but because the metal mold is high in preparation cost and not environment-friendly, a new rigid composite imprinting mold is urgently needed to solve the technical problems.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings of the prior art, an object of the present invention is to provide a rigid composite imprinting mold for solving the problems of high manufacturing cost and environmental pollution of the existing metal mold.
In order to achieve the above objects and other related objects, the present invention provides a rigid composite imprinting mold, comprising:
the rigid substrate comprises a base and a convex structure formed on the upper surface of the base;
and the metal demolding layer is formed on the upper surface of the substrate and the surface of the protruding structure.
Optionally, the metallic release layer comprises a metallic nickel layer, wherein the metallic nickel layer has a thickness of between 0.005 μm and 2 μm.
Optionally, the imprint mold further includes: at least one metallic bonding layer formed between the rigid substrate and the metallic release layer.
Optionally, the metallic bonding layer comprises a metallic titanium layer, a metallic copper layer, a metallic chromium layer or a metallic tantalum layer, and the thickness of the metallic bonding layer is less than or equal to 0.1 μm.
Optionally, the number of the metal bonding layers is 5 or less.
Optionally, the number of layers of the metal bonding layer is greater than or equal to 2 and less than or equal to 3.
As above, the utility model discloses a compound impression mould of rigidity has following beneficial effect:
the utility model forms a metal demoulding layer on the surface of the rigid substrate, thereby forming a composite rigid imprinting mould, and reducing the preparation cost of the imprinting mould while realizing the imprinting and demoulding of the graph; the utility model also adopts the magnetron sputtering technology to form the metal demoulding layer, thus avoiding the pollution and high cost of the electroplating technology to the environment; the utility model discloses more through form at least one deck metal binding layer between rigidity substrate and metal demoulding layer to improve the adhesion between rigidity substrate and the metal demoulding layer, avoid the drawing of patterns in-process to cause metal demoulding layer to drop from the rigidity substrate because of the adhesion undersize, thereby cause the damage of impression mould.
Drawings
Fig. 1 shows a flow chart of a method for manufacturing a rigid composite imprinting mold according to the present invention.
Fig. 2 to 6 show schematic structural diagrams of steps in the method for manufacturing a rigid composite imprinting mold according to the present invention.
Description of the element reference numerals
100 rigid substrate
101 substrate
102 convex structure
200 patterned mask
300 metal release layer
400 metallic bond coat
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Please refer to fig. 1 to 6. It should be noted that the drawings provided in the present embodiment are only schematic and illustrative of the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
Example one
As shown in fig. 1, the present embodiment provides a method for manufacturing a rigid composite imprinting mold, including:
providing a rigid substrate 100;
forming a patterned mask 200 on the upper surface of the rigid substrate 100, and etching the rigid substrate 100 by using the patterned mask 200 as a mask pattern to form a protruding structure 102 in the rigid substrate 100;
the patterned mask 200 is removed, and a metal release layer 400 is formed on the upper surface of the base 101 and the surface of the protruding structure 102 in the etched rigid substrate 100.
Referring to fig. 2 to 5, a method for manufacturing the rigid composite imprinting mold according to the present embodiment will be described in detail with reference to fig. 1.
Step 1): as shown in fig. 2, a rigid substrate 100 is provided, wherein the rigid substrate 100 may be a transparent rigid substrate, such as glass, quartz, etc., or an opaque rigid substrate, such as a silicon wafer, etc., and the specific material of the rigid substrate 100 is not limited in this embodiment.
Step 2): as shown in fig. 3 and 4, a patterned mask 200 is formed on the upper surface of the rigid substrate 100, and the rigid substrate 100 is etched using the patterned mask 200 as a mask pattern, so as to form a protruding structure 102 in the rigid substrate 100.
As an example, the method of forming the patterned mask 200 includes: forming a photoresist layer on the upper surface of the rigid substrate 100, and then exposing and developing the photoresist layer based on a photomask to form the patterned mask 200 on the upper surface of the rigid substrate 100.
As another example, a method of forming the patterned mask 200 includes: sequentially forming a mask material layer and a photoresist layer on the upper surface of the rigid substrate 100 from bottom to top, then exposing and developing the photoresist layer based on a photomask plate so as to form a patterned photoresist on the upper surface of the mask material layer, and finally etching the mask material layer based on the patterned photoresist so as to form the patterned mask 200 on the upper surface of the rigid substrate 100.
Although both the above two examples of methods may form the patterned mask 200, in consideration of simplification of the manufacturing process and steps, in the present embodiment, the method described in the first example is selected to form the patterned mask 200, that is, a photoresist layer is directly formed on the upper surface of the rigid substrate 100, and then the photoresist layer is exposed and developed based on a photomask plate, so as to form the patterned mask 200 on the upper surface of the rigid substrate 100. It should be noted that, since the methods described in the above two examples both involve the use of a photomask, and the fabrication of a photomask based on a final pattern is well known to those skilled in the art, the description thereof is omitted here.
As an example, the rigid substrate 100 is etched by using a plasma etching process, so as to form the protruding structure 102 on the upper surface of the base 101 in the rigid substrate 100. In the embodiment, the plasma etching process is adopted, so that the formed protruding structure 102 has a good physical appearance, and the imprint mold of the embodiment is ensured to have a high-precision imprint pattern.
Specifically, the photomask may be subjected to pattern design according to actual needs, so as to obtain the finally required protrusion structure 102. Optionally, the protruding structures 102 of this embodiment are distributed independently or in a network shape, wherein the network shape includes, but is not limited to, a rectangular grid shape, a diamond grid shape, or a triangular grid shape.
And step 3), as shown in fig. 5, removing the patterned mask 200, and forming a metal release layer 300 on the upper surface of the base 101 and the surface of the protruding structure 102 in the etched rigid substrate 100.
As an example, in the material selection of the metal mold release layer 300, a metal material with a lower surface energy is generally selected as the metal mold release layer 300, so as to facilitate mold release during the subsequent pattern imprinting. Specifically, the metal mold release layer 300 is formed by a magnetron sputtering deposition process, wherein the material of the metal mold release layer 300 includes metal nickel, and the thickness of the metal nickel is between 0.005 μm and 2 μm.
As shown in fig. 5, the present embodiment also provides a rigid composite type imprint mold, including:
a rigid substrate 100 including a base 101 and a protrusion 102 formed on an upper surface of the base 101;
and a metal demolding layer 300 formed on the upper surface of the substrate 101 and the surface of the protruding structure 102.
By way of example, the rigid substrate 100 may be a transparent rigid substrate, such as glass, quartz, etc., or may be an opaque rigid substrate, such as a silicon wafer, etc., and the specific material of the rigid substrate 100 is not limited in this embodiment.
As an example, the photomask may be subjected to a pattern design according to actual needs, so as to obtain the final desired raised structures 102. Optionally, the protruding structures 102 of this embodiment are distributed independently or in a network shape, wherein the network shape includes, but is not limited to, a rectangular grid shape, a diamond grid shape, or a triangular grid shape.
Illustratively, the metallic release layer 300 comprises a metallic nickel layer, wherein the metallic nickel layer has a thickness of between 0.005 μm and 2 μm.
Example two
As shown in fig. 6, the present embodiment is different from the first embodiment in that, before the forming of the metal mold-releasing layer 300, the preparation method of the present embodiment further includes: and selecting a metal bonding layer material, and forming at least one metal bonding layer 400 on the upper surface of the base 101 and the surface of the protruding structure 102 in the etched rigid base material 100 by using the metal bonding layer material.
As an example, the method of selecting the metallic bonding layer 400 includes:
providing a rigid test substrate, and forming a metal test material layer on the upper surface of the rigid test substrate, wherein the rigid test substrate and the rigid substrate are made of the same material;
carrying out a bonding force performance test on a rigid test substrate/metal test material layer structure with a metal test material layer formed on the upper surface, and selecting the metal test material layer as the metal bonding layer if a test result meets the bonding force requirement; otherwise, providing another metal test material layer to carry out the bonding force performance test again until the test result meets the bonding force requirement.
Specifically, the metal test material layer is formed on the upper surface of the rigid test substrate by adopting a magnetron sputtering deposition process. It should be noted that the bonding force between the rigid test substrate and the metallic test material layer has a large correlation with the material itself and a small correlation with the formation process, so the process for forming the metallic test material layer on the upper surface of the rigid test substrate in this embodiment may be different from the subsequent process for forming the metallic bonding layer 400, and certainly, the process is the same as and the most preferable.
Specifically, the bonding force performance of the structure (rigid test substrate/metal test material layer) is tested by a T-bend method, a cross-cut method, a pull-open method or a ring-cut method, so as to determine whether the test result meets the bonding force requirement of the customer for the structure. Optionally, in this embodiment, a cross-hatch method is preferably used to test the bonding force performance of the rigid test substrate/metal test material layer structure, and the specific method includes:
scribing m × n square grids on the surface of the metal test material layer, wherein each scribing line is deep to the rigidity test substrate so as to facilitate the subsequent stripping operation; wherein m and n are positive integers greater than 1;
cleaning the surface of the metal test material layer, and adhering an adhesive tape or adhesive paper with the same adhesive force on the upper surface of the grid;
and (3) tearing off the adhesive tape or the adhesive paper with the same adhesive force, observing whether the surface of the adhesive tape or the adhesive paper is provided with the stripped metal test material or not, and judging the bonding force performance according to the quantity of the stripped metal test material.
The surface of the metal test material layer can be cleaned by a soft brush so as to remove metal slag scraps remained on the surface of the metal test material layer.
The stripping amount of the metal test material is inversely proportional to the bonding force performance, namely the greater the stripping amount of the metal test material is, the lower the bonding force performance is; conversely, the less the peeling amount of the metal test material, the higher the bonding force performance. However, the bonding force performance requirement of the present embodiment is not specifically limited, and is mainly based on the customer requirement, for example, if the customer requirement is in a 10 × 10 grid, and the bonding force performance is satisfactory if the metal peeling amount is less than 5, in the actual bonding force test, the bonding force performance can be considered to be satisfactory as long as the peeling amount is less than 5.
As an example, the metal bonding layer 400 is formed by a magnetron sputtering deposition process, wherein the material of the metal bonding layer 400 includes metal titanium, metal copper, metal chromium, or metal tantalum, and the thickness of the metal bonding layer is less than or equal to 0.1 μm.
As an example, the number of the metal bonding layers 400 is 5 or less, preferably 2 to 3. It should be noted that, when the number of the metal bonding layers 400 is greater than 2, the adjacent two metal bonding layers 400 are different in material.
As shown in fig. 6, the present embodiment further provides a rigid composite imprinting mold, and the difference between the imprinting mold of the present embodiment and the imprinting mold of the first embodiment is that the imprinting mold of the present embodiment further includes: at least one metallic bonding layer 400 formed between the rigid substrate 100 and the metallic release layer 300.
As an example, the metallic bonding layer 400 is a metallic titanium layer, a metallic copper layer, a metallic chromium layer, or a metallic tantalum layer, and has a thickness of 0.1 μm or less.
As an example, the number of the metal bonding layers 400 is 5 or less, preferably 2 to 3. It should be noted that, when the number of the metal bonding layers 400 is greater than 2, the adjacent two metal bonding layers 400 are different in material.
To sum up, the utility model discloses a compound impression mould of rigidity has following beneficial effect: the utility model forms a metal demoulding layer on the surface of the rigid substrate, thereby forming a composite rigid imprinting mould, and reducing the preparation cost of the imprinting mould while realizing the imprinting and demoulding of the graph; the utility model also adopts the magnetron sputtering technology to form the metal demoulding layer, thus avoiding the pollution and high cost of the electroplating technology to the environment; the utility model discloses more through form at least one deck metal binding layer between rigidity substrate and metal demoulding layer to improve the adhesion between rigidity substrate and the metal demoulding layer, avoid the drawing of patterns in-process to cause metal demoulding layer to drop from the rigidity substrate because of the adhesion undersize, thereby cause the damage of impression mould. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (6)
1. A rigid composite imprint mold, characterized in that the imprint mold comprises:
the rigid substrate comprises a base and a convex structure formed on the upper surface of the base;
the metal demolding layer is formed on the upper surface of the substrate and the surface of the protruding structure;
at least one metallic bonding layer formed between the rigid substrate and the metallic release layer.
2. The rigid composite imprinting mold of claim 1, wherein the metal release layer comprises a metal nickel layer, wherein the metal nickel layer has a thickness of between 0.005 μ ι η and 2 μ ι η.
3. The rigid composite imprinting mold of claim 1, wherein the metallic bonding layer comprises a metallic titanium layer, a metallic copper layer, a metallic chromium layer, or a metallic tantalum layer, and has a thickness of 0.1 μm or less.
4. A rigid composite imprinting mold according to claim 1, wherein the number of layers of said metallic bonding layer is equal to or less than 5.
5. The rigid composite imprinting mold of claim 4, wherein the number of layers of the metallic bonding layer is equal to or greater than 2 and equal to or less than 3.
6. The rigid composite type imprinting mold according to claim 4, wherein when the number of the metal bonding layers is greater than 2, the material of two adjacent metal bonding layers is different; wherein the metal bonding layer comprises a metal titanium layer, a metal copper layer, a metal chromium layer or a metal tantalum layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921263251.3U CN211367710U (en) | 2019-08-06 | 2019-08-06 | Rigid composite type imprinting mold |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921263251.3U CN211367710U (en) | 2019-08-06 | 2019-08-06 | Rigid composite type imprinting mold |
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| CN211367710U true CN211367710U (en) | 2020-08-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112342510A (en) * | 2019-08-06 | 2021-02-09 | 上海量子绘景电子股份有限公司 | Rigid composite type imprinting mold and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112342510A (en) * | 2019-08-06 | 2021-02-09 | 上海量子绘景电子股份有限公司 | Rigid composite type imprinting mold and preparation method thereof |
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