CN211291349U

CN211291349U - Protective clothing is tailor and is tested piece device

Info

Publication number: CN211291349U
Application number: CN202020274816.4U
Authority: CN
Inventors: 高尚荣
Original assignee: Sichuan Eupon Paper Industry Co ltd
Current assignee: Sichuan Eupon Paper Industry Co ltd
Priority date: 2020-03-09
Filing date: 2020-03-09
Publication date: 2020-08-18
Anticipated expiration: 2030-03-09

Abstract

The utility model provides a piece device is tested in tailorring of protective clothing, the purpose is cut out in solving current protective clothing production and is tested piece in-process personnel intensity of labour big, the low grade technical problem of inspection efficiency. The device includes fixed, from top to bottom, light source, sample microscope carrier and the test piece microscope carrier that is parallel to each other through the frame, and wherein, sample microscope carrier has the printing opacity plane, and the parallel light that the light source formed can transmit this printing opacity plane to test piece microscope carrier department. The utility model discloses a parallel light that the light source formed can form the equidimension projection of being shaded of sample at examination piece microscope carrier department to the transmission of sample microscope carrier. The inspector utilizes the backlight projection at the inspection slide carrying platform to compare and measure the cut piece to be inspected, and then the inspection of the cut piece can be completed. Because the sample wafer is fixed, only the cut pieces need to be laid at the wafer inspection carrying platform, and the thread working mode is favorably formed, so that the labor intensity of personnel is reduced, and the inspection efficiency is improved.

Description

Protective clothing is tailor and is tested piece device

Technical Field

The utility model belongs to the technical field of protective clothing production technique and specifically relates to a protective clothing is tailor and is tested piece device is related to.

Background

The protective clothing is used for defending adverse factors such as physics, chemistry and biology which have potential threats to personnel in special workplaces and has a protective function.

The production of the protective clothing is similar to that of common clothing, and comprises the procedures of material discharge, cutting, sewing and the like, but the production quality requirements of all the procedures of the protective clothing are extremely high due to the protection requirements of the protective clothing on the safety and health of a wearer, so that inspection operations are arranged in all the procedures and among the procedures, wherein the influence of the inspection of the piece between the cutting and sewing procedures on the quality of the ready-made clothing is very critical.

The cutting test piece of the protective clothing comprises the measurement and comparison of the cut pieces at the uppermost layer, the middle layer and the lowermost layer; comparing the cut pieces with the sample pieces one by one and measuring the cut pieces and the sample pieces as necessary. At present, the cutting and testing piece needs to be manually held by personnel to complete the comparison and measurement with the sample piece, so that the labor intensity is high, and the testing efficiency is low.

Disclosure of Invention

To the above-mentioned condition, for overcoming prior art's defect, the utility model provides a piece device is tested in tailorring of protective clothing has solved and has tailor in the production of current protective clothing and test piece in-process personnel intensity of labour big, the low grade technical problem of detection efficiency.

In order to achieve the above object, the utility model provides a following technical scheme:

a cutting and film testing device for protective clothing, comprising: a light source for projecting parallel light rays; the sample wafer carrying platform is used for laying and cutting sample wafers; the film inspection carrying platform is used for laying the film to be inspected; the frame is used for fixing the light source, the sample wafer carrying platform and the test wafer carrying platform; the light source, the sample wafer carrying platform and the test wafer carrying platform are fixed in the rack from top to bottom in parallel; the sample wafer carrying platform is provided with a light-transmitting plane, and parallel light rays formed by the light source can transmit the light-transmitting plane to the wafer testing carrying platform.

The utility model discloses a parallel light that the light source formed can form the equidimension projection of being shaded of sample at examination piece microscope carrier department to the transmission of sample microscope carrier. The inspector utilizes the backlight projection at the inspection slide carrying platform to compare and measure the cut piece to be inspected, and then the inspection of the cut piece can be completed. Because the sample wafer is fixed, only the cut pieces need to be laid at the wafer inspection carrying platform, and the thread working mode is favorably formed, so that the labor intensity of personnel is reduced, and the inspection efficiency is improved.

Furthermore, the sample wafer carrying platform and the wafer testing carrying platform of the device are both provided with central points, and the two central points are coaxial. Utilize coaxial central point, the completion that can be very fast waits to examine the location of cut-parts, further improves inspection efficiency.

Further, the apparatus further comprises: the slide rail is used for horizontally sliding the sample wafer carrying platform; an image sensor for backlight imaging; the image processing system is in communication connection with the image sensor and is used for acquiring image information at the image sensor; the slide rail is fixed at the position of the rack between the light source and the film testing carrier, and the sample film carrier is movably fixed in the slide rail and slides along the slide rail in parallel with the light source and the film testing carrier; the image sensor is fixed below the film testing carrier through the frame; the film checking carrying platform is also provided with a light-transmitting plane, so that parallel light rays formed by the light source can transmit the light-transmitting plane to the image sensor.

Through the image sensor below the film checking carrier and the sliding of the sample film carrier in the sliding rail, the image information of the to-be-checked film can be quickly acquired and transmitted to the image processing system for processing, so that the appearance and size information of the film can be obtained, manual measurement is replaced, the labor intensity of personnel is reduced, and the checking precision and efficiency are improved.

Furthermore, the light transmission planes of the sample wafer carrying platform and the wafer testing carrying platform of the device are made of ultra-white glass, and the edges of the light transmission planes are wrapped by the outer frame.

Further, the lower surface of the wafer test carrying platform of the device is attached to the upper surface of the image sensor. The accuracy of the image sensor for acquiring the backlight graphic information at the slide test platform deck is improved.

The utility model discloses still through the image sensor of examining piece microscope carrier below and the slip of cooperation sample microscope carrier in the slide rail, wait to examine the image information of cut-parts and can be acquireed fast and transmit and handle in the image processing system to obtain the appearance and the dimensional information of this cut-parts, replace artifical the measurement, be favorable to reducing personnel intensity of labour, improve inspection precision and efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of another embodiment of the present invention.

Fig. 3 is a schematic structural diagram of the application sample wafer carrier of the present invention.

Fig. 4 is an implementation structure diagram of the application of the slide test platform deck of the present invention.

Reference numerals: 1. the image sensor comprises a light source, 2. a sample wafer carrying platform, 3. a test wafer carrying platform, 4. a frame, 5. a sliding rail, 6. an image sensor, 91. a sample wafer, 92. a test wafer and 93. a backlight graph.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the claimed embodiments. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

In the description of the embodiments of the present application, it is to be understood that the terms "center", "upper", "lower", "vertical", "horizontal", and the like refer to orientations or positional relationships based on the orientation shown in the drawings, and are used only for convenience in describing the embodiments of the present application and for simplification of the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the embodiments of the present application.

In the embodiments of the present application, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or as an integral part; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.

In the embodiments of the present application, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact with each other through another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different configurations of embodiments of the invention. In order to simplify the disclosure of the embodiments of the present application, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit embodiments of the present application. Moreover, the claimed embodiments may repeat reference numerals and/or letters in the various examples, which have been repeated for purposes of brevity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed.

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Example 1

As shown in fig. 1, the present embodiment provides a cutting and film-checking device for protective clothing, which includes:

a light source 1 for projecting parallel light rays;

a sample carrier 2 with a light-transmitting plane for laying and cutting the sample 91;

the film inspection carrying platform 3 is used for laying the to-be-inspected film 92, and has a smooth and white surface;

a frame 4 for fixing the light source 1, the sample stage 2 and the test wafer stage 3 from top to bottom in parallel;

as shown in fig. 3 and 4, the inspector lays the dailies on the dailies carrier 2. Parallel light rays formed by the light source are vertically projected downwards to the sample stage 2 and are transmitted to the sample stage 3 together with the outer area of the sample, so that an equal-proportion backlight pattern 93 of the sample 91 is formed. The inspector slides the to-be-inspected cut piece 92 laid on the inspection piece carrying platform 3 to the position of the backlight pattern 93, and the central point of the inspection piece carrying platform 3 is used for assisting in positioning the to-be-inspected cut piece 92 so as to be superposed with the backlight pattern 93. And (3) observing the difference of the shape and the size between the cut piece 92 to be detected and the backlight pattern 93, and measuring and recording the cut piece with the macroscopic difference.

Example 2

As shown in fig. 2, the present embodiment is different from embodiment 1 in that it further includes:

a slide rail 5 for horizontally sliding the sample wafer carrier 2;

an image sensor 6 for backlight imaging;

the image processing system is in communication connection with the image sensor and is used for acquiring image information at the image sensor;

the slide rail 5 is fixed at the position of the frame 4 between the light source 1 and the film testing carrier 3, and the sample wafer carrier 2 is movably fixed in the slide rail 5 and slides parallel to the light source 1 and the film testing carrier 3 along the slide rail 5; the image sensor 6 is fixed below the wafer stage 3 through the frame and is attached to the wafer stage 3.

In this embodiment, the test piece carrier 3 also has a light-transmitting plane, so that the parallel light rays formed by the light source 1 can transmit the light-transmitting plane to the image sensor 6.

This example was carried out similarly to example 1, with the difference that:

after the inspector finds the visually-visible difference cut pieces, the sample carrying platform 2 is horizontally pushed to horizontally slide, so that the light source 1 is directly projected to the position of the test piece carrying platform 3. After the image sensor 6 is started to record the backlight pattern at the position of the film inspection carrier 3, the appearance and size information of the cut piece can be obtained through the processing of the image processing system.

Claims

1. The utility model provides a protection is taken and is tailor test piece device which characterized in that includes:

a light source for projecting parallel light rays;

the sample wafer carrying platform is used for laying and cutting sample wafers;

the film inspection carrying platform is used for laying the film to be inspected;

the frame is used for fixing the light source, the sample wafer carrying platform and the test wafer carrying platform;

the light source, the sample wafer carrying platform and the test wafer carrying platform are fixed in the rack from top to bottom in parallel; the sample wafer carrying platform is provided with a light-transmitting plane, and parallel light rays formed by the light source can transmit the light-transmitting plane to the wafer testing carrying platform.

2. The apparatus of claim 1, wherein the sample stage and the test stage each have a center point, and wherein the center points are coaxial.

3. The apparatus of claim 2, further comprising:

the slide rail is used for horizontally sliding the sample wafer carrying platform;

an image sensor for backlight imaging;

the slide rail is fixed at the position of the rack between the light source and the film testing carrier, and the sample film carrier is movably fixed in the slide rail and slides along the slide rail in parallel with the light source and the film testing carrier; the image sensor is fixed below the film testing carrier through the frame; the film checking carrying platform is also provided with a light-transmitting plane, so that parallel light rays formed by the light source can transmit the light-transmitting plane to the image sensor.

4. The apparatus of claim 3, wherein the sample stage and the test stage further comprise a frame for enclosing the edges of the light-transmissive plane.

5. The device of claim 4, wherein the light-transmitting plane is made of ultra-white glass.

6. The apparatus of claim 3, wherein the lower surface of the die stage is attached to the upper surface of the image sensor.