CN211265433U

CN211265433U - Special basket of flowers device of silicon chip

Info

Publication number: CN211265433U
Application number: CN202020205758.XU
Authority: CN
Inventors: 杨志勇; 田飞; 刘芳亮
Original assignee: Yangzhou Sipuer Technology Co
Current assignee: Yangzhou Sipuer Technology Co
Priority date: 2020-02-25
Filing date: 2020-02-25
Publication date: 2020-08-14
Anticipated expiration: 2030-02-25

Abstract

The utility model discloses a special basket of flowers device of silicon chip, include basket of flowers support (1) and be fixed in silicon chip strutting arrangement (2) on basket of flowers support (1), silicon chip strutting arrangement (2) include first silicon chip backing sheet (2-1) and second silicon chip backing sheet (2-2), first silicon chip backing sheet (2-1) and second silicon chip backing sheet (2-2) set up relatively, and the limit that first silicon chip backing sheet (2-1) and second silicon chip backing sheet (2-2) are relative is the V-arrangement sawtooth. The utility model discloses change original U-shaped groove into the V-arrangement groove, four contact points and silicon chip surface contactless, only have four point contacts with the edge of silicon chip, this kind of special basket of flowers is effectual has solved the problem that silicon chip and basket of flowers face contact are difficult for drying and water mark, reduces hot nitrogenGas N₂Purge time, nitrogen N₂The dosage is less, the process time is 1/2-2/3, and the utilization rate of the equipment is greatly improved.

Description

Special basket of flowers device of silicon chip

Technical Field

The utility model belongs to the silicon chip bears the weight of the field, concretely relates to special basket of flowers device of silicon chip.

Background

When the silicon wafers are cleaned, the silicon wafers are required to be placed in a silicon wafer basket, and adjacent silicon wafers are separated by a partition plate, so that the silicon wafers are prevented from being stuck in the cleaning process. The used standard vertebra flower basket in the prior art, the clapboard sheet grooves are all U-shaped, and the sheet groove spacing is 4.76 mm. The silicon wafer inclines forwards and backwards in the wafer groove and is in surface contact with the wafer groove, the contact area is 5-8 square millimeters, the contact position is adhered with the silicon wafer due to the action of water, the flower basket and the silicon wafer cannot be dried quickly, the silicon wafer can be dried only by blowing and sweeping for a long time with high-temperature N2, water marks are left, and the cleaning quality of the silicon wafer is seriously affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a special basket of flowers device of silicon chip is in order to solve the difficult dry problem of leaving the water mark with the basket of flowers face contact of silicon chip easily.

In order to realize the purpose, the utility model discloses a technical scheme as follows:

the utility model provides a special basket of flowers device of silicon chip, includes basket of flowers support and is fixed in the silicon chip strutting arrangement on the basket of flowers support, silicon chip strutting arrangement includes first silicon chip backing sheet and second silicon chip backing sheet, first silicon chip backing sheet and second silicon chip backing sheet set up relatively, and the relative limit of first silicon chip backing sheet and second silicon chip backing sheet is the zigzag.

Furthermore, the silicon wafer supporting device further comprises a third silicon wafer supporting sheet and a fourth silicon wafer supporting sheet, the third silicon wafer supporting sheet is located at the lower part of the first silicon wafer supporting sheet, the fourth silicon wafer supporting sheet is located at the lower part of the second silicon wafer supporting sheet, and the opposite edges of the third silicon wafer supporting sheet and the fourth silicon wafer supporting sheet are both in a zigzag shape.

Furthermore, the saw teeth of the first silicon wafer supporting sheet, the second silicon wafer supporting sheet, the third silicon wafer supporting sheet and the fourth silicon wafer supporting sheet are all V-shaped saw teeth.

Furthermore, the included angle between the two sawtooth edges of the V-shaped sawtooth of the first silicon wafer support sheet, the second silicon wafer support sheet, the third silicon wafer support sheet and the fourth silicon wafer support sheet is 78 degrees.

Further, the first silicon wafer support sheet, the second silicon wafer support sheet, the third silicon wafer support sheet and the fourth silicon wafer support sheet have the same structure.

Further, the material of the silicon wafer supporting device is PTFE.

Compared with the prior art, the utility model, it is showing the advantage and lies in:

the utility model discloses changing original U-shaped groove into the V-arrangement groove, making the fretwork form to the basket of flowers simultaneously, only keeping two points above and two point below supporting silicon chip, four contact points and silicon chip surface contactless, there are four point contacts only with the edge of silicon chip, this kind of special basket of flowers is effectual to have solved the problem that silicon chip and basket of flowers face contact are difficult for drying and water mark, reduce hot nitrogen gas N2 sweep time, nitrogen gas N2 sweeps time, the effectual problem of dry and water mark of having solved of basket of flowers₂The dosage is less, the process time is 1/2-2/3, and the utilization rate of the equipment is greatly improved.

Drawings

Fig. 1 is a schematic view of the overall structure of the special basket device for silicon wafers of the present invention.

Fig. 2 is a schematic view of the special basket device for silicon wafers of the present invention.

Fig. 3 is a schematic structural view of a silicon wafer support wafer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The following describes the implementation of the present invention in detail with reference to specific embodiments.

With reference to fig. 1-3, a special silicon wafer basket device comprises a basket support 1 and a silicon wafer support device 2 fixed on the basket support 1, wherein the silicon wafer support device 2 comprises a first silicon wafer support sheet 2-1, a second silicon wafer support sheet 2-2, a third silicon wafer support sheet 2-3 and a fourth silicon wafer support sheet 2-4, the first silicon wafer support sheet 2-1 and the second silicon wafer support sheet 2-2 are oppositely arranged, the opposite edges of the first silicon wafer support sheet 2-1 and the second silicon wafer support sheet 2-2 are both zigzag, the third silicon wafer support sheet 2-3 is positioned at the lower part of the first silicon wafer support sheet 2-1, the fourth silicon wafer support sheet 2-4 is positioned at the lower part of the second silicon wafer 2-2, the opposite edges of the third silicon wafer support sheet 2-3 and the fourth silicon wafer support sheet 2-4 are both zigzag, the sawtooth shape is used for placing the silicon chip 3.

Preferably, the saw teeth of the first silicon wafer support piece 2-1, the second silicon wafer support piece 2-2, the third silicon wafer support piece 2-3 and the fourth silicon wafer support piece 2-4 are all V-shaped saw teeth.

Preferably, the included angle between two sawtooth edges of the V-shaped saw teeth of the first silicon wafer support sheet 2-1, the second silicon wafer support sheet 2-2, the third silicon wafer support sheet 2-3 and the fourth silicon wafer support sheet 2-4 is 78 °.

Preferably, the first silicon wafer support sheet 2-1, the second silicon wafer support sheet 2-2, the third silicon wafer support sheet 2-3 and the fourth silicon wafer support sheet 2-4 have the same structure.

Preferably, the material of the flower basket support 1 and the silicon wafer support device 2 is hydrophobic and high temperature resistant PTFE, which is beneficial to drying the flower basket itself.

As shown in figures 1 and 3, the utility model adopts four silicon wafer supporting sheets with V-shaped saw teeth on opposite sides, when a silicon wafer 3 with very thin thickness is placed in the V-shaped saw teeth, because only the edge of the thin silicon wafer 3 can contact the V-shaped saw teeth, the front and back surfaces of the silicon wafer 3 can not contact the surface of the V-shaped groove of the saw teeth, the contact area is very small, therefore, the contact position of the silicon wafer 3 and each silicon wafer supporting sheet can be nearly considered as a point, in combination with figures 1 and 2, each silicon wafer 3 is supported and only forms four supporting point contacts (such as point 1 to point 4 shown in figure 1) with the four silicon wafer supporting sheets, after being installed, the silicon wafer 3 can not contact with two sides of the V-shaped groove of the basket in the process of tilting the silicon wafer back and forth, because the distance between the two sides of the basket of the U-shaped groove is only 4.76mm, the silicon wafer front and back tilting process forms surface, a large amount of high-temperature nitrogen is needed for drying, and water marks are left on the surface of the silicon wafer. The utility model discloses four support points and silicon chip surface contactless of special basket of flowers, V-arrangement opening is big, and the silicon chip is in the front and back slope, owing to have 4 supports of point, the distance of slope can not exceed 5mm around the silicon chip, and the unable contact in silicon chip surfaceThe surface of the V-shaped groove is only in four point contacts at the edge, the contact surface can be almost ignored, residual moisture is basically not left between the silicon wafers in the flower basket and the flower basket after water drainage is finished, and only a small amount of hot N is needed after the water is completely drained₂Or without the need for hot N at all₂The wafer can be completely dried.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The special flower basket device for the silicon wafers is characterized by comprising a flower basket support (1) and a silicon wafer support device (2) fixed on the flower basket support (1), wherein the silicon wafer support device (2) comprises a first silicon wafer support sheet (2-1) and a second silicon wafer support sheet (2-2), the first silicon wafer support sheet (2-1) and the second silicon wafer support sheet (2-2) are arranged oppositely, and opposite edges of the first silicon wafer support sheet (2-1) and the second silicon wafer support sheet (2-2) are in a sawtooth shape.

2. The special basket device for silicon wafers as claimed in claim 1, wherein the silicon wafer support device (2) further comprises a third silicon wafer support sheet (2-3) and a fourth silicon wafer support sheet (2-4), the third silicon wafer support sheet (2-3) is located at the lower part of the first silicon wafer support sheet (2-1), the fourth silicon wafer support sheet (2-4) is located at the lower part of the second silicon wafer support sheet (2-2), and the opposite edges of the third silicon wafer support sheet (2-3) and the fourth silicon wafer support sheet (2-4) are both zigzag.

3. The special silicon wafer basket device according to claim 2, wherein the saw teeth of the first silicon wafer support sheet (2-1), the second silicon wafer support sheet (2-2), the third silicon wafer support sheet (2-3) and the fourth silicon wafer support sheet (2-4) are all V-shaped saw teeth.

4. The special basket device for silicon wafers as claimed in claim 3, wherein the angle between the two saw-tooth edges of the V-shaped saw-teeth of the first silicon wafer support sheet (2-1), the second silicon wafer support sheet (2-2), the third silicon wafer support sheet (2-3) and the fourth silicon wafer support sheet (2-4) is 78 °.

5. The special silicon wafer basket device according to any one of claims 2 to 4, wherein the first silicon wafer support sheet (2-1), the second silicon wafer support sheet (2-2), the third silicon wafer support sheet (2-3) and the fourth silicon wafer support sheet (2-4) have the same structure.

6. The special silicon wafer basket device according to any one of claims 2 to 4, wherein the material of the silicon wafer supporting device (2) is PTFE.