CN105845607B - A kind of substrate etching fixture - Google Patents
A kind of substrate etching fixture Download PDFInfo
- Publication number
- CN105845607B CN105845607B CN201610238267.3A CN201610238267A CN105845607B CN 105845607 B CN105845607 B CN 105845607B CN 201610238267 A CN201610238267 A CN 201610238267A CN 105845607 B CN105845607 B CN 105845607B
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- fixture
- substrate
- upper fixture
- lower clamp
- planar dimension
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of substrate etching fixtures, the fixture includes upper fixture, lower fixture and connecting component, it is provided centrally with coaxial upper fixture sunk area and upper fixture open top in upper fixture, the open-topped planar dimension of upper fixture is less than the planar dimension of substrate, upper fixture sunk area is provided with multiple trepannings for placing substrate at the edge of upper fixture；It is provided centrally with coaxial lower clamp recess region and lower clamp base opening in lower fixture, lower clamp recess region is for placing substrate, lower clamp base opening band has inside angle of inclination, the edge of lower fixture is provided with screw hole and cylindrical bar, cylindrical bar is matched with the trepanning of upper fixture, upper fixture and lower fixture are subjected to position alignment, connecting component is for linking together upper fixture and lower fixture with screw hole across trepanning, by means of technical scheme of the present invention, substrate face can be solved and corrode existing defect upward.
Description
Technical field
The present invention relates to epitaxial growth of semiconductor material technical field, more particularly to a kind of substrate etching fixture.
Background technology
Cadmium-zinc-teiluride (CdZnTe, CZT) material and mercury cadmium telluride (HgCdTe, MCT) material have the same zinc blende crystal knot
Structure, by adjusting zinc component (Cd1-xZnxX~4% in Te), it can realize exactly match on lattice between the two, realize accurate same
Matter extension, epitaxial growth lattice mismatch are small；Its energy gap is more than the photon energy of infrared band, fully transparent to infrared light,
It is incident that the back of the body can be achieved；It is with mercury cadmium telluride chemical compatibility, similar thermal expansion coefficient so that the epitaxial growth on cadmium-zinc-teiluride substrate
The heat resistanceheat resistant circulation ability of infrared detector prepared by mercury cadmium telluride is strong.
Just because of the above-mentioned advantage of cadmium-zinc-teiluride, Cdl-x_Znx_Te has just started just to be chosen as substrate material in tellurium cadmium mercury epitaxial
Material, is still to prepare the indispensable substrate material of high performance mercury cadmium telluride infrared focal plane detector so far, especially for middle length
The research and development of the HgCdTe infrared focal plane arrays of new generation such as wave is double-colored, avalanche, hot operation type and very long wave.
As the substrate material of tellurium cadmium mercury epitaxial, surface state directly affects the quality of tellurium cadmium mercury epitaxial material.Especially
It is for molecular beam epitaxy technique, tellurium cadmium mercury epitaxial material quality is extremely sensitive for cadmium-zinc-teiluride substrate surface state, is carrying out
It needs to corrode cadmium-zinc-teiluride substrate surface before mercury cadmium telluride extension, forms clean smooth new surface, this substrate is rotten
Etching technique is a key technology in mercury cadmium telluride epitaxy technique.
Current substrate etching process is that substrate face immerses corrosive liquid upward, to prevent from destroying substrate just in corrosion process
The surface in face.So-called substrate face is exactly the surface of epitaxial material Direct precipitation.But substrate face is corroded upward can have three
A problem：First, corrosive liquid, which remains, and corrosion reaction product cannot diffuse in time influences reaction rate except surface so that
Substrate face surface corrosion is uneven and corrosion rate is slow；Second, this substrate applies to molecular beam epitaxy chamber, and substrate is in the chamber
It is that face down is placed, after substrate etching and cleaning are completed, needs to clamp substrate using tweezers, then raise certain height
Degree, flips an angle, substrate is sucked from substrate back with vacuum WAND, face-up substrate is transferred to and is just faced simultaneously
Under substrate fixing clamp in, during which there is the risk that substrate falls damage；Third, since substrate is rectangular substrate, industrialization
The only fixed sample box of circular dimension of batch production, such sample box can guarantee that the edge of only substrate connects with sample box
It touches, and rectangular substrate is generally stored in rectangle sample box, and the objects such as dust-free paper are lined with below substrate, to prevent substrate back to be stained with
Dirt, but institute's underbed can also discharge pollutant, such as Filamentous cast, substrate be polluted, so there are the contaminated wind of substrate surface
Danger.
Invention content
In order to solve the problems, such as that substrate face corrodes existing three upward, the present invention provides a kind of substrate etching fixtures.
A kind of substrate etching fixture of the present invention, including upper fixture, lower fixture and connecting component,
It is provided centrally with coaxial upper fixture sunk area and upper fixture open top, the upper folder in the upper fixture
Have the planar dimension that open-topped planar dimension is less than substrate, prevent substrate from falling, the upper fixture sunk area is for putting
Substrate is set, the planar dimension of upper fixture sunk area is more than the planar dimension of substrate, is provided at the edge of the upper fixture more
A trepanning；
It is provided centrally with coaxial lower clamp recess region and lower clamp base opening, the lower folder in the lower fixture
Tool sunk area matches for placing substrate, the planar dimension in lower clamp recess region with the planar dimension of upper fixture sunk area
It closes, and the sum of upper fixture sunk area and the height in lower clamp recess region are more than or equal to the thickness of substrate；The lower fixture bottom
Portion's opening band has inside angle of inclination, the planar dimension of lower clamp base open upper end to be less than or equal to lower clamp recess region
Planar dimension, the planar dimension of lower clamp base open lower end is less than the planar dimension of substrate, at the edge of the lower fixture
Be provided with screw hole and cylindrical bar, the cylindrical bar is matched with the trepanning of upper fixture, for by upper fixture and lower fixture into line position
Alignment is set, the screw hole is matched with connecting component；
The connecting component is used for the screw hole of the trepanning and lower fixture across upper fixture, to connect upper fixture and lower fixture
It is connected together.
Beneficial effects of the present invention are as follows：
By providing a kind of substrate etching fixture, solve substrate face in the prior art corrode upward existing for three ask
Topic, is corroded downward using such fixture substrate face so that substrate face surface corrosion is uniform and accelerates corrosion rate；It simultaneously can
Substrate face downward, directly completes substrate transfer, while can also make this corrosion clamp with vacuum WAND when being shifted with realizing
To store fixture, substrate is put into the storage fixture, places into big rectangle sample box, can reduce the contaminated possibility of substrate.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of the upper fixture of substrate etching fixture of the present invention；
Fig. 2 is a kind of structural schematic diagram of the lower fixture of substrate etching fixture of the present invention；
Fig. 3 is a kind of structural schematic diagram of the connecting component of substrate etching fixture of the present invention；
Fig. 4 is a kind of assembling schematic diagram of substrate etching fixture of the present invention；
Wherein, trepanning 1, upper fixture open top 2, upper fixture sunk area 3, straight slot 4, screw hole 5, lower clamp recess region
6, lower clamp base opening 7, cylindrical bar 8, upper fixture 9, lower fixture 10, connecting component 11, substrate back 12, cylinder rod 13,
Threaded rod 14, lower clamp base open upper end 15, lower clamp base open lower end 16.
Specific implementation mode
In order to solve the problems, such as that face-up corrosion is three existing at prior art bottom, the present invention provides a kind of substrate etchings
Fixture, below in conjunction with attached drawing and embodiment, the present invention will be described in further detail.It should be appreciated that described herein
Specific embodiment is only used to explain the present invention, does not limit the present invention.
According to an embodiment of the invention, a kind of substrate etching fixture is provided, Fig. 4 is a kind of substrate etching fixture of the present invention
Assembling schematic diagram, as shown in figure 4, substrate etching fixture according to the ... of the embodiment of the present invention, including upper fixture 9, lower fixture 10 with
And connecting component 11, it elaborates separately below to each component：
Fig. 1 is a kind of structural schematic diagram of the upper fixture of substrate etching fixture of the present invention, is set at the center of the upper fixture 9
It is equipped with coaxial upper fixture sunk area 3 and upper fixture open top 2, the planar dimension of the upper fixture open top 2 is less than
The planar dimension of substrate, prevents substrate from falling, and the upper fixture sunk area 3 is used to place substrate, upper fixture sunk area 3
Planar dimension is more than the planar dimension of substrate, the edge of the upper fixture 9 is provided with multiple trepannings 1, specifically, on described
The edge of fixture 9 is provided with 4 trepannings 1.Preferably, the planar dimension of upper fixture sunk area 3 is slightly larger than the plane meter of substrate
It is very little.
Specifically, the sum of the upper fixture sunk area 3 and the height of upper fixture open top 2 are the height of upper fixture.
In Fig. 4, the upper fixture sunk area 3 is located at the lower end of upper fixture open top 2 (in order to more clearly express upper fixture
Structure upper fixture open top 2 has been placed on lower section, so in Fig. 1, the upper fixture sunk area 3 in Fig. 1
In the upper end of upper fixture open top 2).
As preferred embodiment, the edge of the upper fixture 9 is provided with straight slot 4 in Fig. 1, for making gripping substrate
Tool (such as tweezers) placed the substrate into upper fixture sunk area 3 by straight slot 4, specifically, the quantity of straight slot 4 be 4.
It is further preferred that the height of the straight slot 4 is less than or equal to the height of upper fixture sunk area 3, the width of the straight slot 4
Degree is more than the width of the tool of gripping substrate.
Fig. 2 is a kind of structural schematic diagram of the lower fixture of substrate etching fixture of the present invention, at the center of the lower fixture 10
It is provided with coaxial lower clamp recess region 6 and lower clamp base opening 7, the lower clamp recess region 6 is used to place substrate,
The planar dimension in lower clamp recess region 6 is matched with the planar dimension of upper fixture sunk area 3, and upper fixture sunk area 3
It is more than or equal to the thickness of substrate with the sum of the height in lower clamp recess region 6；The lower clamp base opening 7 is inclined with inside
Rake angle, the planar dimension of lower clamp base open upper end 15 are less than or equal to the planar dimension in lower clamp recess region 6, lower folder
The planar dimension for having bottom opening lower end 16 is less than the planar dimension of substrate, and the edge of the lower fixture 10 is provided with screw hole 5
With cylindrical bar 8, the cylindrical bar 8 is matched with the trepanning 1 of upper fixture 9, for upper fixture 9 and lower fixture 10 to be carried out position pair
Standard, the screw hole 5 are matched with connecting component 11.
Specifically, the sum of the height of the lower clamp recess region 6 and lower clamp base opening 7 is the height of lower fixture.
The lower clamp recess region 6 is in the lower end of lower clamp base opening 7.
The lower clamp base opening 7 carries inside angle of inclination, specifically, lower clamp base open upper end 15 is flat
Face size is less than or equal to the planar dimension in lower clamp recess region 6, and the planar dimension of lower clamp base open lower end 16 is less than
The planar dimension of substrate.The angle of inclination of lower clamp base opening 7 makes substrate face and the contact area of fixture as far as possible
It is small, and ensure that substrate is not fallen out, lower clamp base be open 7 lower ends planar dimension the planar dimension less than substrate feelings
It is big as far as possible under condition so that corrosive liquid smoothly flows through substrate surface as far as possible.
Specifically, the quantity of screw hole 5 and cylindrical bar 8 is 2, it is distributed in diagonal line.
As preferred embodiment, the height in the upper fixture sunk area 3 and lower clamp recess region 6 is all higher than lining
The half of base thickness degree.
The connecting component 11 is used for the screw hole 5 of the trepanning 1 and lower fixture 10 across upper fixture 9, thus by 9 He of upper fixture
Lower fixture 10 links together.
Specifically, Fig. 3 is a kind of structural schematic diagram of the connecting component (threaded rod) of substrate etching fixture of the present invention, it is described
Connecting component 11 includes the cylinder rod and lower thread bar of upper end, and the threaded rod is used for the trepanning 1 across upper fixture 9 under
The screw hole 5 of fixture 10, to which upper folder 9 and lower fixture 10 link together；The cylinder rod is pressed from both sides as the substrate etching
The handle of tool can make entire substrate etching fixture move up and down in corrosive liquid so that corrode more uniform, corrosion rate
Faster.
Specifically, the upper fixture 9, lower fixture 10, upper fixture sunk area 3, upper fixture open top 2, lower fixture are recessed
Fall into region 6, lower clamp base opening 7 is rectangle.
Specifically, the material of the upper fixture 9, lower fixture 10 and connecting component 11 is polytetrafluoroethylene (PTFE).Using poly- four
Vinyl fluoride as rapidoprint, upper fixture 9, lower fixture 10 and connecting component 11 (threaded rod) with higher building reason stability and
While the chemical stabilities such as corrosion-resistant, also there is preferable mechanical strength and plasticity.
In order to make it easy to understand, the use example of the substrate etching fixture below in conjunction with the present invention, to the substrate etching of the present invention
Fixture illustrates.
In this use example, using Cdl-x_Znx_Te as substrate, shape is rectangle, and upper fixture, lower fixture and threaded rod are adopted
Use polytetrafluoroethylene (PTFE) as rapidoprint.
To be immersed in MOS-II grades of methanol by upper fixture, lower fixture and the threaded rod after standard cleaning, when use from
It takes out in methanol, dried under super-clean environment or is dried up using nitrogen gun.
Downward by upper fixture open top, upper fixture sunk area places (as shown in Figure 1) upward, uses polytetrafluoroethylene (PTFE)
Cadmium-zinc-teiluride substrate is out put into the upper fixture sunk area of upper fixture by the square toes tweezers of material processing from gripping in sample box,
Substrate face is upward at this time.Tweezers grip the middle part of substrate, ensure the square toes of tweezers by the straight slot position of upper fixture, if this is rotten
Erosion fixture is used as storage, can be positioned over the upper fixture for being put into substrate in sample box together.
When substrate is corroded, lower fixture is tipped upside down on to the top of upper fixture, the protruding column bar of lower fixture, which corresponds to, to be entered
The trepanning of upper fixture.The height in upper fixture sunk area and lower clamp recess region is all slightly larger than the half of substrate thickness, two folders
Tool back-off is together just so that substrate is embedded between upper fixture and lower fixture.
Confirm that two fixtures closely and after position alignment, are overturn 180 °, at this time substrate by upper fixture and the fitting of lower fixture
The assembling schematic diagram of corrosion clamp is as shown in figure 4, upper fixture is located above, and lower fixture is located at lower section, and substrate back is (in Fig. 4
12) upward, screw hole that two threaded rods are entered to lower fixture by the trepanning of upper fixture, tightens threaded rod, it is ensured that two clamp blocks
Rigid contact.
After having configured corrosive liquid, among this substrate etching fixture is immersed corrosive liquid, substrate face is downward at this time.It is hand-held
Entire corrosion clamp can be made to move up and down in corrosive liquid on threaded rod so as to corrode more uniform, corrosion rate
Faster.
After etching, substrate etching fixture is removed into corrosive liquid, in repeated multiple times immersion methanol, cleaning substrate reaches
To the purpose for removing corrosive liquid.It is dried under super-clean environment later or dries up substrate using nitrogen gun.
Threaded rod is screwed out, upper fixture is removed, upward, substrate back can be sucked by vacuum WAND will for substrate back at this time
It is transferred into molybdenum support in terms of substrate, to carry out material epitaxy growth under predetermined circumstances.
Using this fixture, substrate face is corroded downward so that substrate face surface corrosion is uniform and accelerates corrosion rate；Together
This fixture of Shi Liyong can exclude the risk that substrate damages in transfer process, safety easy to operate；It can also be by this corrosion clamp
As storage fixture, substrate is put into the storage fixture, places into big rectangle sample box, can reduce the contaminated possibility of substrate
Property.
Obviously, those skilled in the art can carry out the present invention essence of various changes and deformation without departing from the present invention
God and range.In this way, if these modification and variation of the present invention belong to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and deformation.
Claims (6)
1. a kind of substrate etching fixture, which is characterized in that including upper fixture, lower fixture and connecting component,
It is provided centrally with coaxial upper fixture sunk area and upper fixture open top, the upper fixture top in the upper fixture
The planar dimension of portion's opening is less than the planar dimension of substrate, prevents substrate from falling, and the upper fixture sunk area is served as a contrast for placing
Bottom, the planar dimension of upper fixture sunk area are more than the planar dimension of substrate, the edge of the upper fixture are provided with multiple open
Hole；
It is provided centrally with coaxial lower clamp recess region and lower clamp base opening in the lower fixture, the lower fixture is recessed
Region is fallen into for placing substrate, the planar dimension in lower clamp recess region is matched with the planar dimension of upper fixture sunk area,
And the sum of upper fixture sunk area and the height in lower clamp recess region are more than or equal to the thickness of substrate；The lower clamp base is opened
Mouth carries inside angle of inclination, and the planar dimension of lower clamp base open upper end is less than or equal to the flat of lower clamp recess region
Face size, the planar dimension of lower clamp base open lower end are less than the planar dimension of substrate, are arranged at the edge of the lower fixture
There are screw hole and cylindrical bar, the cylindrical bar to be matched with the trepanning of upper fixture, for upper fixture and lower fixture to be carried out position pair
Standard, the screw hole are matched with connecting component；
The connecting component is used for the screw hole of the trepanning and lower fixture across upper fixture, to which upper fixture and lower fixture to be connected to
Together；
The connecting component includes the cylinder rod and lower thread bar of upper end, and the threaded rod is used for the trepanning across upper fixture
With the screw hole of lower fixture, so that upper fixture and lower fixture be linked together；The cylinder rod is pressed from both sides as the substrate etching
The handle of tool.
2. substrate etching fixture as described in claim 1, which is characterized in that the edge of the upper fixture is provided with straight slot, uses
It is placed the substrate into upper fixture sunk area in making the tool of gripping substrate pass through straight slot.
3. substrate etching fixture as claimed in claim 2, which is characterized in that it is recessed that the height of the straight slot is less than or equal to upper fixture
The height in region is fallen into, the width of the straight slot is more than the width of the tool of gripping substrate.
4. substrate etching fixture as described in claim 1, which is characterized in that the upper fixture, lower fixture, upper fixture depressed area
Domain, upper fixture open top, lower clamp recess region, lower clamp base open upper end, lower clamp base open upper end are square
Shape.
5. substrate etching fixture as described in claim 1, which is characterized in that the upper fixture sunk area and lower clamp recess
The height in region is all higher than the half of substrate thickness.
6. substrate etching fixture as described in claim 1, which is characterized in that the upper fixture, lower fixture and connecting component
Material is polytetrafluoroethylene (PTFE).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610238267.3A CN105845607B (en) | 2016-04-18 | 2016-04-18 | A kind of substrate etching fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610238267.3A CN105845607B (en) | 2016-04-18 | 2016-04-18 | A kind of substrate etching fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105845607A CN105845607A (en) | 2016-08-10 |
| CN105845607B true CN105845607B (en) | 2018-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610238267.3A Active CN105845607B (en) | 2016-04-18 | 2016-04-18 | A kind of substrate etching fixture |
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| Country | Link |
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| CN (1) | CN105845607B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244031B (en) * | 2018-07-25 | 2024-06-25 | 北京大学 | Clamp for single-sided area corrosion and corrosion method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201271647Y (en) * | 2008-09-22 | 2009-07-15 | 清溢精密光电（深圳）有限公司 | Fixture for cleaning mask plate |
| CN201720780U (en) * | 2010-04-23 | 2011-01-26 | 陈思辰 | Clamp for substrates |
| CN203659834U (en) * | 2013-12-18 | 2014-06-18 | 苏州阿特斯阳光电力科技有限公司 | Silicon chip clamp for plasma etching |
| CN204779920U (en) * | 2015-06-25 | 2015-11-18 | 中国电子科技集团公司第十一研究所 | A shift anchor clamps that is arranged in molecular beam epitaxy technology tellurium zinc cadmium substrate |
| CN105225992B (en) * | 2015-11-03 | 2018-08-24 | 株洲南车时代电气股份有限公司 | A kind of etching device and wafer single side lithographic method |
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2016
- 2016-04-18 CN CN201610238267.3A patent/CN105845607B/en active Active
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| Publication number | Publication date |
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| CN105845607A (en) | 2016-08-10 |
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