CN211247173U - Automatic gluing chip mounter - Google Patents
Automatic gluing chip mounter Download PDFInfo
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- CN211247173U CN211247173U CN201922086138.9U CN201922086138U CN211247173U CN 211247173 U CN211247173 U CN 211247173U CN 201922086138 U CN201922086138 U CN 201922086138U CN 211247173 U CN211247173 U CN 211247173U
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- paster
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- gluing
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Abstract
The utility model discloses an automatic rubber coating chip mounter, including the equipment organism, be provided with operating system on the equipment organism, conveyor and automatic control system, operating system and conveyor all are connected with automatic control system, equipment bottom of the body sets up the block terminal, automatic control system sets up in the block terminal, one side is provided with the support on the equipment organism, operating system includes the rubber coating system that sets gradually on the support along conveyor traffic direction, paster system and compaction system, be provided with paster conveyor on the equipment organism that paster system corresponds, the charging tray has all been placed on conveyor and the paster conveyor. The assembly of the HT19D shell and HT ceramic filling, inner cavity gluing, silicon wafer picking, pasting, compacting and other processes can be completed at one time, continuous, stable and reliable sustainable production is realized, and the production efficiency and the yield are obviously improved in the production process; the whole machine is simple to maintain, and convenient and fast to operate.
Description
Technical Field
The utility model relates to a rubber coating pastes the technical field, especially relates to an automatic rubber coating chip mounter.
Background
The gluing chip mounter is an operation mode for fixing a tiny electronic element on a circuit board, and various gluing chip mounters are also developed. At present, in the technical field of the diffusion silicon sensor gluing paster, the relative technology updating process and the sales yield are always puzzled due to the complex manufacturing process, the complex working procedures and the like. The gluing and pasting link of the diffusion silicon sensor is one of the most complex production flows in the whole production and manufacturing process, and the gluing and pasting link of the diffusion silicon sensor is completed manually at present, but the problems of silicon wafer direction deflection, mesopore blockage, low production efficiency and high production cost generally exist. Continuous production with continuity, stability and reliability cannot be realized.
Disclosure of Invention
To the problem that exists, the utility model aims at providing an automatic rubber coating chip mounter, the mobile terminal comprises an equipment body, be provided with operating system, conveyor and automatic control system on the equipment organism, operating system is including setting up rubber coating system, paster system and the compaction system on the support, can effectively solve the problem that silicon chip orientation incline, mesopore jam, production efficiency are low, manufacturing cost is high that appear in the rubber coating paster link of diffusion silicon sensor through above three system.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides an automatic rubber coating chip mounter, includes the equipment organism, be provided with operating system, conveyor and automatic control system on the equipment organism, operating system and conveyor all are connected with automatic control system, equipment bottom of the body sets up the block terminal, automatic control system sets up its characterized in that in the block terminal: one side is provided with the support on the equipment organism, conveyor sets up support one side, operating system includes rubber coating system, paster system and the compaction system that sets gradually on the support along conveyor traffic direction, be provided with paster conveyor on the equipment organism that the paster system corresponds, the charging tray has all been placed on conveyor and the paster conveyor.
Preferably, the gluing system, the pasting system and the compacting system respectively comprise a control box and an operating device, the control box is vertically arranged on the support, and the operating device is vertically arranged on one side of the support.
Preferably, the operating device comprises a horizontal guide rail arranged on one side of the support, one end of the horizontal guide rail is provided with a driving motor, glue injection ports, suction nozzles and pressure arms are sequentially vertically and downwards arranged on the horizontal guide rails of the gluing system, the pasting system and the compacting system, and the glue injection ports and the suction nozzles are connected with the control boxes through connecting pipes.
Preferably, the conveying device and the patch conveying device are linear slide rails, and one end of each linear slide rail is provided with a driving motor.
Preferably, the top of the distribution box is provided with a plurality of accessories, and the accessories comprise a power button, an emergency stop button, a reset button, a buzzer, an indicator light and a manual air valve.
Preferably, the bottom surface of the equipment body is provided with universal casters and adjustable casters.
The utility model has the advantages that: the assembly device can complete a plurality of processes of assembling components of the HT19D shell and HT ceramic filling, inner cavity gluing, silicon wafer picking, pasting, compacting and the like at one time, and has continuous, stable and reliable sustainable production. The production efficiency and the yield are obviously improved in the production process; the whole machine is simple to maintain, and convenient and fast to operate.
Drawings
Fig. 1 is a front view structure diagram of the present invention.
Fig. 2 is a top view structural diagram of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the technical solution of the present invention with reference to the accompanying drawings and embodiments.
Referring to the automatic rubber coating chip mounter that fig. 1-2 show, including equipment organism 1, be provided with operating system, conveyor 2 and automatic control system on the equipment organism 1, operating system and conveyor 2 all are connected with automatic control system, 1 major structure of equipment organism is formed by the steel structure welding, and its bottom sets up block terminal 3, and block terminal 3 divide into the three rooms for installation electrical apparatus and relevant control element, the maintenance of being convenient for of two doors, access power is AC220V, 50 HZ. Automatic control system sets up in block terminal 3, one side is provided with support 4 on the equipment organism 1, conveyor 2 sets up support 4 one side, operating system includes rubber coating system 5, paster system 6 and the compaction system 7 that sets gradually on support 4 along 2 traffic directions of conveyor, be provided with paster conveyor 8 on the equipment organism 1 that paster system 6 corresponds, all placed charging tray 9 on conveyor 2 and the paster conveyor 8.
Further, the gluing system 5, the pasting system 6 and the compacting system 7 each comprise a control box 10 and an operating device 11, the control box 10 is vertically arranged on the support 4, and the operating device 11 is vertically arranged on one side of the support 4.
In order to improve the automatic operation of the operating device 11, the operating device 11 comprises a horizontal guide rail 12 arranged on one side of the support 4, one end of the horizontal guide rail 12 is provided with a driving motor 13, the horizontal guide rail 12 of the gluing system 5, the pasting system 6 and the compacting system 7 is sequentially provided with a glue injection port 51, a suction nozzle 61 and a pressing arm 71 vertically and downwards, and the glue injection port 51 and the suction nozzle 61 are connected with each control box 10 through connecting pipes 14. The gluing system 5 is controlled by a three-axis motion control card on a horizontal guide rail 12 to complete gluing track control, the chip mounting system 6 is controlled by a four-axis motion control card on the horizontal guide rail 12 to complete grabbing and placing coordinates of the silicon wafer, and negative pressure is generated by an SMC vacuum generator to complete sucking and releasing actions of the silicon wafer, an air source is preferably nitrogen, and the air pressure is 0.6 MPa; the compacting system 7 completes compacting action by a three-axis motion control card on the horizontal guide rail 12.
In order to facilitate the smooth operation of the material tray 9, the conveying device 2 and the patch conveying device 8 are linear slide rails, and one end of each linear slide rail is provided with a driving motor 13. The driving motor 13 is a stepping motor and is driven by a synchronous belt and a synchronous belt wheel and a linear slide rail, and the driving motor 13 is automatically controlled by an automatic control system to drive the material tray 9 to accurately move.
In order to facilitate artificial control of the gluing chip mounter, a plurality of accessories 15 are arranged at the top of the distribution box 3, and the accessories 15 comprise a power button, an emergency stop button, a reset button, a buzzer, an indicator lamp and a manual air valve.
In order to level the equipment body 1 and improve the precision of gluing and pasting, the bottom surface of the equipment body 1 is provided with universal casters 16 and adjustable casters 17.
The principle of the utility model is that: (1) when a power button is pressed, an indicator light is on, the power button of the operation box 10 is turned on, and intermittent buzzing sound of 'dripping' is sent out through a buzzer device; and pressing a reset button to reset all the equipment motion system and the logic control system, and finishing the work preparation of the equipment at the moment. (2) Placing the tray 9 with the HT19D shell and the HT ceramic filling assembly in the linear slide rail, and pushing the tray leftwards to the end of the linear slide rail; and opening a manual air valve on the equipment, sending compressed air, adjusting the air pressure to a normal range, and then pressing a start button to automatically start the equipment to work. (3) When the product tray 9 enters the compacting system 7 and begins to be compacted, a next tray of products can be placed in the gluing system 5 and moved to the left end to begin the gluing operation of the tray of products, and the continuous operation can be realized by reciprocating.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides an automatic rubber coating chip mounter, includes equipment organism (1), be provided with operating system, conveyor (2) and automatic control system on equipment organism (1), operating system and conveyor (2) all are connected with automatic control system, equipment organism (1) bottom sets up block terminal (3), automatic control system sets up in block terminal (3), its characterized in that: one side is provided with support (4) on equipment organism (1), conveyor (2) set up support (4) one side, operating system includes rubber coating system (5), paster system (6) and compacting system (7) that set gradually on support (4) along conveyor (2) traffic direction, be provided with paster conveyor (8) on equipment organism (1) that paster system (6) corresponds, all placed charging tray (9) on conveyor (2) and paster conveyor (8).
2. The automatic gluing and chip mounting machine according to claim 1, wherein: the gluing system (5), the patch system (6) and the compacting system (7) respectively comprise a control box (10) and an operating device (11), the control box (10) is vertically arranged on the support (4), and the operating device (11) is vertically arranged on one side of the support (4).
3. The automatic gluing and chip mounting machine according to claim 2, wherein: the operating device (11) comprises a horizontal guide rail (12) arranged on one side of the support (4), one end of the horizontal guide rail (12) is provided with a driving motor (13), glue injection ports (51), suction nozzles (61) and pressure arms (71) are sequentially and vertically arranged on the horizontal guide rail (12) of the gluing system (5), the pasting system (6) and the compacting system (7) downwards, and the glue injection ports (51) and the suction nozzles (61) are connected with the control boxes (10) through connecting pipes (14).
4. The automatic gluing and chip mounting machine according to claim 3, wherein: the conveying device (2) and the patch conveying device (8) are linear slide rails, and one ends of the linear slide rails are provided with driving motors (13).
5. The automatic gluing and chip mounting machine according to claim 4, wherein: a plurality of accessories (15) are arranged at the top of the distribution box (3), and the accessories (15) comprise a power supply button, an emergency stop button, a reset button, a buzzer, an indicator lamp and a manual air valve.
6. The automatic gluing and chip mounting machine according to claim 5, wherein: the bottom surface of the equipment body (1) is provided with universal casters (16) and adjustable casters (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922086138.9U CN211247173U (en) | 2019-11-28 | 2019-11-28 | Automatic gluing chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922086138.9U CN211247173U (en) | 2019-11-28 | 2019-11-28 | Automatic gluing chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211247173U true CN211247173U (en) | 2020-08-14 |
Family
ID=71988460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922086138.9U Active CN211247173U (en) | 2019-11-28 | 2019-11-28 | Automatic gluing chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211247173U (en) |
-
2019
- 2019-11-28 CN CN201922086138.9U patent/CN211247173U/en active Active
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