CN211240334U

CN211240334U - Photosensitive film hole plugging plate

Info

Publication number: CN211240334U
Application number: CN201922079555.0U
Authority: CN
Inventors: 林均秀; 黄志刚; 胡可; 黄生荣; 邵家坤
Original assignee: ZHUHAI TOPSUN ELECTRONIC TECHNOLOGY CO LTD
Current assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co.,Ltd.
Priority date: 2019-11-27
Filing date: 2019-11-27
Publication date: 2020-08-11
Anticipated expiration: 2029-11-27

Abstract

The utility model discloses a and provide a photosensitive film stopper hole board, including the PCB base plate, be provided with the through-hole on the PCB base plate photosensitive film has been pasted in the one side of PCB base plate, just photosensitive film covers the through-hole, it has to extrude in the through-hole photosensitive film. The photosensitive film hole plugging plate has the advantages of simple structure, good subsequent hole plugging effect, simple production flow and easy operation. The utility model discloses a resin photosensitive film carries out the consent, uses vacuum pressure membrane hot rolling after the single face pad pasting on the PCB board, makes the photosensitive film around the hole crowded downthehole in, then exposes from the reverse side, makes the photosensitive film crowded downthehole expose, then uses to hinder and welds the developing machine and develop, develops the photosensitive film that is not exposed except downthehole, and the photosensitive film in the hole then can remain, reaches the mesh of consent; and then a needle brush plate grinding machine with small influence on plate expansion and contraction is used for grinding the slight resin residue in the hole opening, and the disc central hole structure is formed through subsequent procedures of secondary black hole copper plating, circuit etching and the like. The utility model discloses be applied to the technical field of PCB board consent.

Description

Photosensitive film hole plugging plate

Technical Field

The utility model relates to a PCB board, in particular to photosensitive film stopper hole board.

Background

The VIA hole resin hole plugging process of the PCB is characterized in that printing ink is filled in a hole in a screen printing mode, after the printing ink is solidified, redundant printing ink on the surface of the PCB around an orifice is ground to be flat by a ceramic plate grinding machine, and finally a layer of copper is plated on the surface of the hole by an electroplating method.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that overcome prior art not enough, provide a photosensitive film jack board, photosensitive film jack board's simple structure, follow-up consent are effectual, production flow is simple, easy operation.

The utility model adopts the technical proposal that: the utility model provides a photosensitive film jack panel, includes the PCB base plate, be provided with through-hole F on the PCB base plate photosensitive film D has been pasted on the one side of PCB base plate, just photosensitive film D covers through-hole F, the extrusion has in the through-hole F photosensitive film D.

Further, the through hole F is filled with the photosensitive film D.

Further, the PCB substrate comprises a dielectric layer A, and the upper surface and the lower surface of the dielectric layer A are respectively provided with an upper surface copper foil B1 and a lower surface copper foil B2; the through hole F sequentially penetrates through the upper surface copper foil B1, the dielectric layer A and the lower surface copper foil B2.

Further, a hole wall electroplated layer C for conducting the upper surface copper foil B1 and the lower surface copper foil B2 is arranged on the inner wall of the through hole F, an upper electroplated layer C1 is arranged on the upper surface of the upper surface copper foil B1, a lower electroplated layer C2 is arranged on the lower surface of the lower surface copper foil B2, the upper electroplated layer C1 is in conduction with the lower electroplated layer C2 through the hole wall electroplated layer C, and the upper electroplated layer C1 is covered by the photosensitive film D.

The utility model has the advantages that: because the utility model discloses a resin photosensitive film carries out the consent, uses vacuum pressure membrane hot rolling after the single face pad pasting on the PCB board, makes the photosensitive film around the hole squeeze into downtheholely, then exposes from the reverse side, makes the photosensitive film who is squeezed into downthehole expose, then uses to hinder and welds the developing machine and develop, the photosensitive film that is not exposed except that downthehole develops, the photosensitive film in the hole then can remain, reaches the mesh of consent; and then, a needle brush plate grinding machine with small influence on the expansion and contraction of the PCB is used for grinding the slight resin residue in the hole opening, and the disc-center hole structure is formed through subsequent procedures of secondary black hole copper plating, circuit etching and the like, and finally can be used for a surface mounting process, so that the problem that the surface copper and the board expansion and contraction are damaged in the VIA hole plugging production process of the PCB can be effectively solved.

Drawings

FIG. 1 is a schematic view of a PCB substrate;

FIG. 2 is a schematic diagram of a via drilled in a PCB substrate;

FIG. 3 is a schematic view of a first time copper via plating;

FIG. 4 is a schematic view of a photosensitive film;

FIG. 5 is a schematic view of a photosensitive film after hot pressing;

FIG. 6 is a schematic illustration of a single side exposure;

FIG. 7 is a schematic illustration of a photosensitive film after exposure and development;

FIG. 8 is a schematic view of the resin after grinding the plate.

Detailed Description

As shown in fig. 2 and fig. 3, in this embodiment, a photosensitive film plugging plate includes a PCB substrate, a through hole F is disposed on the PCB substrate, a photosensitive film D is attached to one side of the PCB substrate, and the photosensitive film D covers the through hole F, and the photosensitive film D is extruded in the through hole F.

In this embodiment, the through hole F is filled with the photosensitive film D.

In this embodiment, the PCB substrate includes a dielectric layer a, and upper and lower surfaces of the dielectric layer a are respectively provided with an upper surface copper foil B1 and a lower surface copper foil B2; the through hole F sequentially penetrates through the upper surface copper foil B1, the dielectric layer A and the lower surface copper foil B2.

In this embodiment, a hole wall plating layer C for conducting the upper surface copper foil B1 and the lower surface copper foil B2 is disposed on an inner wall of the through hole F, an upper plating layer C1 is disposed on an upper surface of the upper surface copper foil B1, a lower plating layer C2 is disposed on a lower surface of the lower surface copper foil B2, the upper plating layer C1 is in conduction with the lower plating layer C2 through the hole wall plating layer C, and the upper plating layer C1 is covered by the photosensitive film D.

As shown in fig. 1 to 8, the PCB board resin hole plugging method includes the steps of:

a. drilling a through hole F on the PCB substrate;

b. pasting a photosensitive film D on the PCB substrate, wherein the photosensitive film D covers the through hole F;

c. carrying out vacuum hot pressing on the photosensitive film D to enable the photosensitive film D to be extruded into the through hole F, wherein the photosensitive film D in the through hole F is filled with hole photosensitive resin D1;

d. exposing the lower surface of the PCB substrate by using an exposure machine light source E, wherein the light source E enters the through hole F, and the plug hole photosensitive resin D1 is exposed to generate cross-linking curing;

e. developing the photosensitive film D, and removing the unexposed part of the photosensitive film D;

f. and removing the excess resin at the two ends of the hole plugging photosensitive resin D1 by a plate grinding machine.

The PCB substrate comprises a dielectric layer A, wherein the upper surface and the lower surface of the dielectric layer A are respectively provided with an upper surface copper foil B1 and a lower surface copper foil B2; the through hole F formed in the step a sequentially penetrates through the upper surface copper foil B1, the dielectric layer A and the lower surface copper foil B2; a hole wall electroplated layer C for conducting the upper surface copper foil B1 and the lower surface copper foil B2 is arranged on the inner wall of the through hole F, an upper electroplated layer C1 is arranged on the upper surface of the upper surface copper foil B1, a lower electroplated layer C2 is arranged on the lower surface of the lower surface copper foil B2, the upper electroplated layer C1 is conducted with the lower electroplated layer C2 through the hole wall electroplated layer C, and the photosensitive film D covers the upper electroplated layer C1 in the step a; after the steps a-f, the lower end D2 and the upper end D3 of the hole plugging photosensitive resin D1 are flush with the lower electroplated layer C2 and the upper electroplated layer C1 respectively.

In this embodiment, the photosensitive film D is a translucent resin photosensitive film.

The utility model discloses be applied to the technical field of PCB board consent.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not intended to limit the scope of the invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. The utility model provides a photosensitive film jack panel, includes the PCB base plate, be provided with through-hole (F) on the PCB base plate, its characterized in that: paste photosensitive film (D) on the one side of PCB base plate, just photosensitive film (D) covers through-hole (F), it has to extrude in through-hole (F) photosensitive film (D).

2. A photosensitive film stopper plate according to claim 1, wherein: the through hole (F) is filled with the photosensitive film (D).

3. A photosensitive film stopper plate according to claim 1, wherein: the PCB substrate comprises a dielectric layer (A), wherein the upper surface and the lower surface of the dielectric layer (A) are respectively provided with an upper surface copper foil (B1) and a lower surface copper foil (B2); the through hole (F) sequentially penetrates through the upper surface copper foil (B1), the dielectric layer (A) and the lower surface copper foil (B2).

4. A photosensitive film stopper plate according to claim 3, wherein: the inner wall of the through hole (F) is provided with a hole wall electroplated layer (C) for conducting the upper surface copper foil (B1) and the lower surface copper foil (B2), the upper surface of the upper surface copper foil (B1) is provided with an upper electroplated layer (C1), the lower surface of the lower surface copper foil (B2) is provided with a lower electroplated layer (C2), the upper electroplated layer (C1) is communicated with the lower electroplated layer (C2) through the hole wall electroplated layer (C), and the upper electroplated layer (C1) is covered by the photosensitive film (D).