CN211238206U - Top end workbench of LED wafer die bonder - Google Patents

Top end workbench of LED wafer die bonder Download PDF

Info

Publication number
CN211238206U
CN211238206U CN202020420792.9U CN202020420792U CN211238206U CN 211238206 U CN211238206 U CN 211238206U CN 202020420792 U CN202020420792 U CN 202020420792U CN 211238206 U CN211238206 U CN 211238206U
Authority
CN
China
Prior art keywords
plane
top end
workbench
supporting plate
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020420792.9U
Other languages
Chinese (zh)
Inventor
陈国强
董月宁
刘江涛
代菘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Hongrui Photoelectric Technology Co ltd
Original Assignee
Shandong Hongrui Photoelectric Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Hongrui Photoelectric Technology Co ltd filed Critical Shandong Hongrui Photoelectric Technology Co ltd
Priority to CN202020420792.9U priority Critical patent/CN211238206U/en
Application granted granted Critical
Publication of CN211238206U publication Critical patent/CN211238206U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Die Bonding (AREA)

Abstract

The utility model discloses a top end workbench of a LED wafer die bonding table, which comprises a platy seat body, wherein a supporting plate for fixing a guide rail slider and a linear motor coil is arranged on the bottom surface of the seat body, and the supporting plate is vertical to the plane where the seat body is arranged and the length direction and is arranged towards the right side; the whole body is in a T shape with long horizontal direction and short vertical direction, and the top end working table of the die bonding table is high in strength, small in size and light in weight.

Description

Top end workbench of LED wafer die bonder
Technical Field
The utility model belongs to the technical field of LED wafer automatic separation machine, specifically speaking relates to a solid brilliant platform top workstation of LED wafer.
Background
At present, in the sorting process of LED chips, a worktable at the top end of a die bonder is arranged on an X axis and a Y axis,
the die bonding table is used for bearing a die bonding table, and is small in size, light in weight and not prone to deformation under the condition of ensuring strength, and a traditional die bonding table top end working table is not easy to machine due to the structure, unstable in precision and heavy in weight.
The improvement of the strength of the top end working table of the die bonding table, the reduction of the volume and the maximum reduction of the weight are development directions of the industry, but the improvement made at present is not ideal.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a solid brilliant platform top workstation of LED wafer is provided.
In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a solid brilliant platform top workstation of LED wafer which characterized in that: the linear motor coil fixing device comprises a plate-shaped base body, wherein a supporting plate for fixing a guide rail sliding block and a linear motor coil is arranged on the bottom surface of the base body, is vertical to the plane where the base body is located and the length direction, and is arranged in a manner of deviating to the right side; the whole body is in a T shape with long horizontal direction and short vertical direction.
Furthermore, the upper surface of the seat body is a first plane, and the first plane is provided with a fixing hole and a positioning pin hole for fixing the expander.
Furthermore, a second plane and a third plane for installing the sliding block are arranged on the bottom surface of the base body and are located on the same plane, the second plane is arranged at the left end of the base body, the third plane is arranged at the right end of the base body, and a plurality of groups of round holes for fastening the sliding block are respectively arranged on the second plane and the third plane.
Further, the right side surface of the support plate is a fifth plane, and the fifth plane is perpendicular to the third plane.
Further, the left side surface of the support plate is a fourth plane, the fourth plane is perpendicular to the second plane and the third plane, and the support plate is arranged between the second plane and the third plane.
Furthermore, mounting holes for fixing the linear motor coils are formed in the fourth plane, the mounting holes are arranged in two parallel lines, and the holes in each line are uniformly distributed according to straight lines.
Further, the length of a workbench body at the top end of the die bonding table of the LED sorting machine is 175-180 mm, and the width of the workbench body is 160-170 mm.
The utility model adopts the above technical scheme, compare with prior art, have following advantage: the top end workbench of the die bonding table is high in strength, small in size and light in weight.
Drawings
Fig. 1 is a three-dimensional structure diagram of a top end worktable of an LED wafer die bonding table in the embodiment of the present invention;
fig. 2 is a top view of a top end working table of an LED chip die bonding table according to an embodiment of the present invention;
fig. 3 is a right side view of a top end working table of an LED wafer die bonding table in the embodiment of the present invention;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 2;
fig. 5 is a left side view of a top end working table of an LED wafer die bonding table according to an embodiment of the present invention;
fig. 6 is a bottom view of a top end working table of an LED chip die bonding table according to an embodiment of the present invention;
in the figure, the position of the upper end of the main shaft,
the method comprises the following steps of 1-a seat body, 2-a supporting plate, 3-a fifth plane, 4-a fourth plane, 5-a second plane, 6-a third plane, 7-a circular hole, 8-a mounting hole, 9-a first plane, 10-a positioning pin hole and 11-a fixing hole.
Detailed Description
In order to clearly understand the technical features, objects and effects of the present invention, the detailed embodiments of the present invention will be described with reference to the accompanying drawings, and those skilled in the art will understand that the following does not limit the scope of the present invention.
In the embodiment, as shown in fig. 1 to 6, a top end working table of an LED chip die bonding table includes a plate-shaped base 1, a supporting plate 2 for fixing a guide rail slider and a linear motor coil is disposed on a bottom surface of the base 1, and the supporting plate 2 is perpendicular to a plane of the base 1 and a length direction and is disposed to be inclined to a right side; the whole body is in a T shape with long horizontal direction and short vertical direction.
The upper surface of the seat body 1 is a first plane 9, and four fixing holes 11 and two positioning pin holes 10 for fixing the expander are arranged on the first plane 9.
A second plane 5 and a third plane 6 are arranged on the bottom surface of the seat body 1, the second plane 5 and the third plane 6 are used for installing a sliding block, the second plane 5 and the third plane 6 are positioned on the same plane, the second plane 5 is arranged at the left end of the seat body 1, the third plane 6 is arranged at the right end of the seat body 1, the right side surface of the support plate 2 is a fifth plane 3, the fifth plane 3 is vertical to the third plane 6, and four groups of round holes 7 for fastening the sliding block are respectively arranged on the second plane 5 and the third plane 6; the left side surface of the supporting plate 2 is a fourth plane 4, the fourth plane 4 is perpendicular to the second plane 5 and the third plane 6, the supporting plate 2 is arranged between the second plane 5 and the third plane 6, a mounting hole 8 for fixing a linear motor coil is formed in the fourth plane 4, the mounting holes 8 are arranged in two rows in parallel, and holes in each row are uniformly distributed according to straight lines.
The length of a workbench body at the top end of the die bonding table of the LED sorting machine is 175-180 mm, and the width of the workbench body is 160-170 mm.
The roughness of the second plane 5, the third plane 6, the fourth plane 4 and the first plane 9 is 3.2-1.6.
The above structures are all made of cast aluminum.
The foregoing is illustrative of the best mode of the invention, and details not described herein are within the common general knowledge of a person of ordinary skill in the art. The protection scope of the present invention is subject to the content of the claims, and any equivalent transformation based on the technical teaching of the present invention is also within the protection scope of the present invention.

Claims (7)

1. The utility model provides a solid brilliant platform top workstation of LED wafer which characterized in that: the device comprises a plate-shaped base body (1), wherein a supporting plate (2) used for fixing a guide rail sliding block and a linear motor coil is arranged on the bottom surface of the base body (1), and the supporting plate (2) is perpendicular to the plane where the base body (1) is located and the length direction and is arranged in a manner of deviating to the right side; the whole body is in a T shape with long horizontal direction and short vertical direction.
2. The top end workbench of an LED die bonder table according to claim 1, wherein: the upper surface of the seat body (1) is a first plane (9), and a fixing hole (11) for fixing the expander and a positioning pin hole (10) are formed in the first plane (9).
3. The top end workbench of an LED die bonder table according to claim 1, wherein: the bottom surface of pedestal (1) is equipped with second plane (5) and third plane (6) that are used for installing the slider, and second plane (5) and third plane (6) are located the coplanar, and second plane (5) set up the left end at pedestal (1), and third plane (6) set up the right-hand member at pedestal (1), respectively are provided with a plurality of groups round hole (7) of fastening slider on second plane (5) and the third plane (6).
4. The top end workbench of LED die attach table of claim 3, wherein: the right side surface of the supporting plate (2) is a fifth plane (3), and the fifth plane (3) is vertical to the third plane (6).
5. The top end workbench of LED die attach table of claim 3, wherein:
the left side surface of the supporting plate (2) is a fourth plane (4), the fourth plane (4) is perpendicular to the second plane (5) and the third plane (6), and the supporting plate (2) is arranged between the second plane (5) and the third plane (6).
6. The LED wafer die bonding table top end table of claim 5, wherein:
and mounting holes (8) for fixing the linear motor coils are formed in the fourth plane (4), the mounting holes (8) are arranged in two parallel lines, and the holes in each line are uniformly distributed according to straight lines.
7. The top end workbench of an LED die bonder table according to claim 1, wherein: the length of a workbench body at the top end of the die bonding table of the LED sorting machine is 175-180 mm, and the width of the workbench body is 160-170 mm.
CN202020420792.9U 2020-03-28 2020-03-28 Top end workbench of LED wafer die bonder Active CN211238206U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020420792.9U CN211238206U (en) 2020-03-28 2020-03-28 Top end workbench of LED wafer die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020420792.9U CN211238206U (en) 2020-03-28 2020-03-28 Top end workbench of LED wafer die bonder

Publications (1)

Publication Number Publication Date
CN211238206U true CN211238206U (en) 2020-08-11

Family

ID=71939823

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020420792.9U Active CN211238206U (en) 2020-03-28 2020-03-28 Top end workbench of LED wafer die bonder

Country Status (1)

Country Link
CN (1) CN211238206U (en)

Similar Documents

Publication Publication Date Title
CN211238206U (en) Top end workbench of LED wafer die bonder
CN106670931A (en) Automatic centering manipulator device used for monocrystal silicon bar rolling and grinding integrated machine
CN206104691U (en) Center cellular type direction connecting piece stamping die
CN211719564U (en) Y-axis workbench of LED wafer die bonder
CN211238210U (en) X-axis workbench of LED wafer die bonder
CN206825051U (en) A kind of sucker suction machining center tool
CN210997510U (en) Multi-guide-rail workbench
CN216829625U (en) Common base of drilling machine
CN103635030B (en) Novel patch machine platform and chip mounter
CN207508105U (en) A kind of V songs mode structure
CN208045466U (en) A kind of XY high-speed motion platforms of tier rack type decoupling
CN214817753U (en) Multi-station tool clamp for rough machining of sliding block
CN220178754U (en) Efficient CNC fixture
CN216862838U (en) Multi-station long-distance environment-friendly material shifting mechanism for gift box plates
CN216228032U (en) Dovetail slide block machining jig
CN213497674U (en) High dynamic response bridge type gantry machine tool
CN215280025U (en) Split type guide rail slide block tool clamp
CN2828420Y (en) Combined guides
CN214769963U (en) Quick clamping mechanism
CN219104598U (en) Chip crack resistance stamping test fixture
CN213225108U (en) Machine tool workbench
CN214769992U (en) Welding processing positioning tool
CN219684655U (en) Positioning tool for stator plate machining
CN217316914U (en) Machining clamp for Contraband-shaped workpiece
CN218904430U (en) Thimble processing jig

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant