CN211238210U - X-axis workbench of LED wafer die bonder - Google Patents
X-axis workbench of LED wafer die bonder Download PDFInfo
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- CN211238210U CN211238210U CN202020420789.7U CN202020420789U CN211238210U CN 211238210 U CN211238210 U CN 211238210U CN 202020420789 U CN202020420789 U CN 202020420789U CN 211238210 U CN211238210 U CN 211238210U
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- plane
- guide rail
- rail seat
- seat
- die bonding
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Abstract
The utility model discloses an X-axis workbench of a LED wafer die bonder, which comprises a seat body, a first guide rail seat and a second guide rail seat, wherein the first guide rail seat and the second guide rail seat are arranged on the seat body and are integrally in a reversed double-T shape; the upper surface of the first guide rail seat is a first plane, and the upper surface of the second guide rail seat is a second plane; the first guide rail seat is provided with a seventh plane vertical to the first plane, and the second guide rail seat is provided with an eighth plane vertical to the second plane, so that the deformation in operation is avoided, the precision is high, and the sorting effect is good.
Description
Technical Field
The utility model belongs to the technical field of LED wafer automatic separation machine, specifically speaking relates to a solid brilliant platform X axle workstation of LED wafer.
Background
At present, in the sorting process of LED chips, an X-axis workbench is used for bearing a die bonding table and the die bonding process thereof
The traditional X-axis workbench is not suitable for double-arm separation due to the structure, and the traditional X-axis workbench is easy to deform and low in precision in operation after machining, so that the separation effect is influenced.
The improvement of the structure of the X-axis workbench is the development direction of the industry, but the improvement made at present is not ideal.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a solid brilliant platform X axle workstation of LED wafer is provided.
In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a solid brilliant platform X axle workstation of LED wafer which characterized in that: the device comprises a seat body, a first guide rail seat and a second guide rail seat, wherein the first guide rail seat and the second guide rail seat are arranged on the seat body and are integrally in an inverted double-T shape;
the upper surface of the first guide rail seat is a first plane, and the upper surface of the second guide rail seat is a second plane;
and a seventh plane vertical to the first plane is arranged on the first guide rail seat, and an eighth plane vertical to the second plane is arranged on the second guide rail seat.
Furthermore, the outer side surface of the second guide rail seat is a sixth plane;
a third plane and a fourth plane for installing the linear guide rail are arranged between the first guide rail seat and the second guide rail seat and are vertical to each other;
a concave fifth plane is arranged between the third plane and the second guide rail seat.
Furthermore, the seat body is rectangular, and a plurality of square grooves which are uniformly distributed are formed in the bottom surface of the seat body.
Furthermore, a plurality of mounting holes are distributed on two sides of the seat body, and a plurality of positioning pin holes are arranged on one side of the seat body.
Further, the length dimension of the seat body is as follows: 415-420 mm, width: 214-218 mm; the distance between adjacent positioning pin holes on the seat body is 370 mm, and the diameter is 6 mm.
Further, the diameter of each mounting hole is 6.2-7 mm, the mounting holes are symmetrically distributed from the center, the length of each mounting hole is 270 mm, and the width of each mounting hole is 190 mm.
Furthermore, a plurality of first threaded holes are distributed on the first plane and the second plane respectively and are uniformly distributed in a straight line, the distance between the first threaded holes is 60 mm, and the distance between the two rows of first threaded holes is 138 mm.
Furthermore, the third plane and the fourth plane are perpendicular to each other, the roughness is 1.6, a plurality of second threaded holes are distributed on the third plane, and the distance between the second threaded holes is 60 millimeters.
Furthermore, the interval between two adjacent square grooves is 18 ~ 22 millimeters, and square groove distance is 20 ~ 30 millimeters around the pedestal.
Further, the distance between the seventh plane and the eighth plane is 123 ± 2 mm.
The utility model adopts the above technical scheme, compare with prior art, have following advantage: the method has the advantages of no deformation in operation, high precision and good sorting effect.
Drawings
FIG. 1 is a three-dimensional structure diagram of an X-axis worktable of an LED wafer die bonder in the embodiment of the present invention;
FIG. 2 is a top view of an X-axis worktable of an LED wafer die bonder in an embodiment of the present invention;
fig. 3 is a bottom view of an X-axis worktable of an LED wafer die bonder in an embodiment of the present invention;
FIG. 4 is a side view of an X-axis worktable of an LED wafer die bonder in an embodiment of the present invention;
in the figure, the position of the upper end of the main shaft,
the guide rail structure comprises a base body 1, a first guide rail seat 2, a second guide rail seat 3, a bottom surface 4, a first plane 5, a second plane 6, a third plane 7, a fourth plane 8, a fifth plane 9, a sixth plane 10, a square groove 11, a positioning pin hole 12, a mounting hole 13, a seventh plane 14, an eighth plane 15, a first threaded hole 16 and a second threaded hole 17.
Detailed Description
In order to clearly understand the technical features, objects and effects of the present invention, the detailed embodiments of the present invention will be described with reference to the accompanying drawings, and those skilled in the art will understand that the following does not limit the scope of the present invention.
In an embodiment, as shown in fig. 1 to 4, an X-axis worktable of an LED chip die bonding table includes a base 1, a first guide rail base 2 and a second guide rail base 3, where the first guide rail base 2 and the second guide rail base 3 are on the base 1 and are in an inverted "double T" shape as a whole.
The upper surface of the first guide rail seat 2 is a first plane 5, the upper surface of the second guide rail seat 3 is a second plane 6, a small bulge seventh plane 14 vertical to the first plane 5 is arranged on the first guide rail seat 2, and a small bulge eighth plane 15 vertical to the second plane 6 is arranged on the second guide rail seat 3.
The outer side surface of the second guide rail seat 3 is a sixth plane 10, and the sixth plane 10 is used for adhering a grating ruler.
A third plane 7 and a fourth plane 8 for installing the linear guide rail are arranged between the first guide rail seat 2 and the second guide rail seat 3 and are perpendicular to each other.
And a concave fifth plane 9 is arranged between the third plane 7 and the second guide rail seat 3 so as to reduce the weight of the part and ensure the processing precision of the third plane 7.
The seat body 1 is rectangular, and eight square grooves 11 which are uniformly distributed are formed in the bottom surface 4 of the seat body 1, so that the weight of parts is reduced, and the strength and the precision are ensured.
Six mounting holes 13 are uniformly distributed on two sides of the seat body 1, and two positioning pin holes 12 are arranged on one side of the seat body 1, so that the seat body 1 is accurately and reliably connected with a large bottom plate of a machine.
The first plane 5 and the second plane 6 are parallel to the plane of the bottom surface 4, and the roughness of the first plane and the second plane is 1.6 on the same plane;
the third plane 7 is vertical to the fourth plane 8, the third plane 7 is parallel to the plane of the bottom surface 4, and the roughness of the two planes is 1.6;
the sixth plane 10 is perpendicular to the second plane 6, and the roughness of both planes is 1.6;
length of the seat body 1: 415-420 mm, width: 214-218 mm; the distance between the positioning pin holes 12 on the seat body 1 is 370 mm, and the diameter is 6 mm; the six mounting holes 13 are 6.2-7 mm in diameter and are symmetrically distributed from the center, and the length direction of the six mounting holes is 270 mm, and the width direction of the six mounting holes is 190 mm.
Seven first threaded holes 16 of M4 are distributed on the first plane 5 and the second plane 6 respectively and are uniformly distributed in a straight line, the distance between the first threaded holes 16 is 60 mm, the distance between the two rows of the first threaded holes 16 is 138 mm, and the roughness of the two planes is 1.6;
the roughness of the third plane 7 and the roughness of the fourth plane 8 are both 1.6, seven M5 second threaded holes 17 are distributed on the third plane 7, and the intervals between the second threaded holes 17 are 60 mm.
The interval between two adjacent square grooves 11 is 18 ~ 22 millimeters, and square groove 11 is 20 ~ 30 millimeters apart from the pedestal 1 distance all around.
The distance between the seventh plane 14 and the eighth plane 15 is 123 ± 2 mm.
The foregoing is illustrative of the best mode of the invention, and details not described herein are within the common general knowledge of a person of ordinary skill in the art. The protection scope of the present invention is subject to the content of the claims, and any equivalent transformation based on the technical teaching of the present invention is also within the protection scope of the present invention.
Claims (10)
1. The utility model provides a solid brilliant platform X axle workstation of LED wafer which characterized in that: the device comprises a seat body (1), a first guide rail seat (2) and a second guide rail seat (3), wherein the first guide rail seat (2) and the second guide rail seat (3) are arranged on the seat body (1) and are integrally in an inverted double-T shape;
the upper surface of the first guide rail seat (2) is a first plane (5), and the upper surface of the second guide rail seat (3) is a second plane (6);
a seventh plane (14) which is vertical to the first plane (5) is arranged on the first guide rail seat (2), and an eighth plane (15) which is vertical to the second plane (6) is arranged on the second guide rail seat (3).
2. The X-axis table of an LED die bonding table according to claim 1, wherein:
the outer side surface of the second guide rail seat (3) is a sixth plane (10);
a third plane (7) and a fourth plane (8) for installing the linear guide rail are arranged between the first guide rail seat (2) and the second guide rail seat (3) and are vertical to each other;
a concave fifth plane (9) is arranged between the third plane (7) and the second guide rail seat (3).
3. The X-axis table of an LED die bonding table according to claim 1, wherein: the seat body (1) is rectangular, and a plurality of square grooves (11) are uniformly distributed on the bottom surface (4) of the seat body (1).
4. The X-axis table of an LED die bonding table according to claim 1, wherein:
a plurality of mounting holes (13) are distributed on two sides of the seat body (1), and a plurality of positioning pin holes (12) are arranged on one side of the seat body (1).
5. The LED wafer die bonding table X-axis worktable of claim 4, wherein: the length size of the seat body (1): 415-420 mm, width: 214-218 mm; the distance between the adjacent positioning pin holes (12) on the seat body (1) is 370 mm, and the diameter is 6 mm.
6. The LED wafer die bonding table X-axis worktable of claim 4, wherein: the diameter of the mounting hole (13) is 6.2-7 mm, the mounting hole is symmetrically distributed from the center, the length of the mounting hole is 270 mm, and the width of the mounting hole is 190 mm.
7. The X-axis table of an LED die bonding table according to claim 1, wherein: the first plane (5) and the second plane (6) are respectively distributed with a plurality of first threaded holes (16) which are uniformly distributed in a straight line, the distance between the first threaded holes (16) is 60 mm, and the distance between the two rows of first threaded holes (16) is 138 mm.
8. The X-axis table of an LED die bonding table according to claim 2, wherein: the third plane (7) and the fourth plane (8) are perpendicular to each other, the roughness is 1.6, the third plane (7) is distributed with a plurality of second threaded holes (17), and the distance between the second threaded holes (17) is 60 mm.
9. The LED wafer die bonding table X-axis worktable of claim 3, wherein: the interval between two adjacent square grooves (11) is 18-22 mm, and the distance between the square groove (11) and the periphery of the seat body (1) is 20-30 mm.
10. The LED wafer die bonding table X-axis worktable of claim 6, wherein:
the distance between the seventh plane (14) and the eighth plane (15) is 123 +/-2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020420789.7U CN211238210U (en) | 2020-03-28 | 2020-03-28 | X-axis workbench of LED wafer die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020420789.7U CN211238210U (en) | 2020-03-28 | 2020-03-28 | X-axis workbench of LED wafer die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211238210U true CN211238210U (en) | 2020-08-11 |
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ID=71920212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020420789.7U Active CN211238210U (en) | 2020-03-28 | 2020-03-28 | X-axis workbench of LED wafer die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211238210U (en) |
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2020
- 2020-03-28 CN CN202020420789.7U patent/CN211238210U/en active Active
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