CN211235591U

CN211235591U - Automatic wafer particle detection equipment for die pasting machine

Info

Publication number: CN211235591U
Application number: CN201922211509.1U
Authority: CN
Inventors: 马东; 李晓玲
Original assignee: Wuxi Xiaodi Electronic Technology Co ltd
Current assignee: Wuxi Xiaodi Electronic Technology Co ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-08-11
Anticipated expiration: 2029-12-11

Abstract

The utility model relates to the technical field of die sticking machines, in particular to a device for automatically detecting circular slice particles for a die sticking machine, which comprises a base, wherein the left side and the right side of the top of the base are symmetrically provided with side plates, the upper end of each side plate is provided with a top plate, the middle part of each top plate is fixedly inserted with an electric telescopic rod, and the telescopic end of each electric telescopic rod is provided with a camera, through the design and the use of a series of structures, the utility model achieves the advantages of simple structure and convenient operation during the use process, and avoids the detection of a plurality of groups of detection equipment in the using process, thereby reducing the detection cost, simultaneously, the detection equipment can be adjusted, improving the detection precision, and the use efficiency of the equipment for automatically detecting the wafer particles for the die bonder is improved, and the practicability of the equipment for automatically detecting the wafer particles for the die bonder is improved.

Description

Automatic wafer particle detection equipment for die pasting machine

Technical Field

The utility model relates to a paste mould machine technical field, concretely relates to paste mould machine with automatic equipment that detects disk granule.

Background

The back face of a wafer is required to be thinned in a common wafer processing process, and in a common wafer thinning process, a wafer to be thinned is firstly subjected to film pasting on the face needing to be protected, then the wafer is thinned, and finally the film is removed. The existing thinning machine is generally provided with 1-2 loading and unloading position units except a thinning base unit, and is mainly used for placing wafer racks. In addition, 2 positions are provided, one is a unit for positioning the wafer, and the other is a unit for cleaning and drying after thinning. A common problem in the thinning process is an abnormal shutdown due to particle problems. There are no special steps on the existing equipment and process flow to avoid such problems, and although the frequency of occurrence is low, once a small amount of wafer fragments occur, the equipment and subsequent wafers are affected seriously. Generally, the wafer has been processed by the thinning step to substantially complete the front side processing, and the wafer is of higher value. Debris from the wafer due to particle problems is undesirable.

When the equipment that relates to subsides mould machine with automatic detection disk granule carries out the use, however current subsides mould machine is with automatic equipment that detects disk granule is carrying out the use, there is the structure complicacy, complex operation's phenomenon, and adopt multiunit check out test set to detect it mostly in carrying out the use, the cost of detection has been increased, check out test set is unadjustable simultaneously, lead to detecting the precision poor, and then the availability factor of pasting the equipment that mould machine was with automatic detection disk granule has been reduced, and then the practicality of pasting the equipment that mould machine was with automatic detection disk granule has been reduced, therefore need urgently to develop an equipment that pastes mould machine and detects disk granule with automation and solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides an automatic detection equipment for a die bonder, which has the advantages of simple structure and convenient operation in the using process through the design and the use of a series of structures, and avoids mostly adopting a plurality of groups of detection equipment to detect the equipment in the using process, thereby reducing the detection cost, simultaneously, the detection equipment is adjustable, improving the detection precision, further improving the use efficiency of the automatic detection equipment for the die bonder, and further improving the practicability of the automatic detection equipment for the die bonder; and the utility model discloses novel structure, design scientific and reasonable, convenient to use has stronger practicality.

The utility model discloses a following technical scheme realizes:

an automatic detection device for wafer particles for a die bonder comprises a base, wherein side plates are symmetrically arranged on the left side and the right side of the top of the base, a top plate is arranged at the upper end of each side plate, an electric telescopic rod is fixedly inserted in the middle of the top plate, a camera is arranged at the telescopic end of the electric telescopic rod, the telescopic end of the electric telescopic rod penetrates through a light supplement lamp strip, the top of the light supplement lamp strip is connected with the top plate, a bearing seat is arranged in the middle of the top of the base, a rotating shaft is installed in the bearing seat, a placing disc is arranged at the upper end of the rotating shaft, circular grooves are uniformly formed in the periphery of the top of the placing disc, a rack ring is embedded at the bottom of the outer wall of the placing disc, a driving motor is installed on the right side of the top of the base, a special-shaped gear is, the LED display screen is embedded in the middle of the front side wall of the base, and the controller is arranged on the right side of the front side wall of the base.

Preferably, the number of the circular grooves is eight, the camera is a CCD camera, and any one of the eight circular grooves is located under the camera.

Preferably, the distance of the meshing rotation of the special-shaped gear and the rack ring is equal to the distance between any two adjacent groups of the circular grooves.

Preferably, the light supplement lamp strip is arranged in an annular structure, and the light supplement lamp strip is a high-brightness LED lamp strip.

Preferably, the bearing in the bearing seat is connected with the rotating shaft in an interference mode.

Preferably, the driving motor is a servo motor.

Preferably, the controller is respectively electrically connected with the electric telescopic rod, the camera, the driving motor and the LED display screen.

The utility model has the advantages that:

under the mutually-matched use of parts such as a base, a side plate, a top plate, an electric telescopic rod, a camera, a light-compensating lamp belt, a bearing seat, a rotating shaft, a placing disc, a circular groove, a rack ring, a driving motor, a special-shaped gear, an LED display screen, a controller and the like, the utility model has the advantages of simple structure and convenient operation in the using process, avoids mostly adopting a plurality of groups of detection equipment to detect the parts in the using process, reduces the detection cost, can adjust the detection equipment, improves the detection precision, further improves the use efficiency of the equipment for automatically detecting the circular sheet particles for the die pasting machine, and further improves the practicability of the equipment for automatically detecting the circular sheet particles for the die pasting machine;

and the utility model discloses novel structure, design scientific and reasonable, convenient to use has stronger practicality.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a front view of the present invention;

fig. 2 is a bottom view of the present invention;

fig. 3 is a circuit diagram of the present invention.

In the figure: the device comprises a base 1, a side plate 2, a top plate 3, an electric telescopic rod 4, a camera 5, a light supplementing lamp strip 6, a bearing seat 7, a rotating shaft 8, a placing disc 9, a circular groove 10, a rack ring 11, a driving motor 12, a special-shaped gear 13, an LED display screen 14 and a controller 15.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

An automatic wafer particle detection device for a die bonder comprises a base 1, side plates 2 are symmetrically arranged on the left side and the right side of the top of the base 1, a top plate 3 is arranged at the upper end of each side plate 2, an electric telescopic rod 4 is fixedly inserted in the middle of the top plate 3, a camera 5 is arranged at the telescopic end of the electric telescopic rod 4, the telescopic end of the electric telescopic rod 4 penetrates through a light supplementing lamp strip 6, the top of the light supplementing lamp strip 6 is connected with the top plate 3, a bearing seat 7 is arranged in the middle of the top of the base 1, a rotating shaft 8 is installed in the bearing seat 7, a placing disc 9 is arranged at the upper end of the rotating shaft 8, circular grooves 10 are uniformly formed in the periphery of the top of the placing disc 9, a rack ring 11 is embedded at the bottom of the outer wall of the placing disc 9, a driving motor 12 is installed on the right side of the top of the base 1, an output of the driving motor 12 is, the controller 15 is arranged on the right side of the front side wall of the base 1.

Specifically, the number of the circular grooves 10 is eight, the camera 5 is a CCD camera, and any one of the eight circular grooves 10 is located under the camera 5.

Specifically, the distance of the meshing rotation of the special-shaped gear 13 and the rack ring 11 is equal to the distance between any two adjacent groups of circular grooves 10.

Specifically, light filling lamp area 6 is the loop configuration setting, and light filling lamp area 6 is hi-lite LED lamp area.

Specifically, the bearing in the bearing seat 7 is connected with the rotating shaft 8 in an interference manner.

Specifically, the driving motor 12 is a servo motor.

Specifically, the controller 15 is electrically connected to the electric telescopic rod 4, the camera 5, the driving motor 12 and the LED display 14 respectively.

The utility model discloses when using, at first will detect the disk and place in circular recess 10, control driving motor 12 and camera 5 work, the output shaft of driving motor 12 drives special-shaped gear 13 and rotates, and then drive rack circle 11 and rotate, and then drive and place the dish 9 and rotate, and then drive the disk that detects in circular recess 10 and detect the disk rotation, when detecting the disk rotation under camera 5, camera 5 carries out the granule detection to it, and special-shaped gear 13 continues to rotate this moment, no longer mesh with rack circle 11, when special-shaped gear 13 again meshes with rack circle 11, drive adjacent disk that detects and rotate under camera 5, continue to carry out the granule detection; the wafers to be detected can be detected in batch, and the phenomenon that a plurality of groups of detection equipment are used for detection is avoided; through the meshing fit relation between the special-shaped gear 13 and the rack ring 11, when the special-shaped gear 13 rotates to be not meshed with the rack ring 11, and a time gap is formed between the special-shaped gear 13 and the rack ring 11 when the special-shaped gear is meshed with the rack ring 11 again, the camera 5 can carry out sufficient time detection on the wafer to be detected, and the distance between the camera 5 and the wafer to be detected can be adjusted by controlling the extension and retraction of the electric telescopic rod 4, so that the purpose of adjusting the detection precision is achieved;

when the camera 5 works, the camera 5 detects whether particles exist in a wafer to be detected, the controller 15 receives a detection signal of the camera 5, converts the detection signal into a corresponding data value and displays the data value on the LED display screen 14, meanwhile, the data value is compared with an upper limit value preset in the controller 15, when the data value exceeds the preset upper limit value, the controller 15 converts the data value into a corresponding unqualified signal and displays the unqualified signal on the LED display screen 14, so that a worker is reminded to take out the unqualified wafer product, and economic loss in later-stage processing is avoided; moreover, the light supplementing lamp strip 6 is arranged, so that the illumination effect on the detection environment can be further achieved, the camera 5 can perform detection more clearly, the detection precision is further improved, and the detection effect is further improved;

the universal camera 5 is a CCD camera, so that the detection effect is further improved; the light supplementing lamp is a high-brightness LED lamp strip, so that the brightness of the detection environment is further enhanced, and the practicability is further improved; the driving motor 12 is a servo motor, so that the precision and the stability of the driving motor during working rotation are further improved;

furthermore, under the design and the use of the structure, the utility model has the advantages of simple structure and convenient operation in the using process, avoids mostly adopting a plurality of groups of detection equipment to detect the wafer particles in the using process, reduces the detection cost, can adjust the detection equipment, improves the detection precision, further improves the use efficiency of the equipment for automatically detecting the wafer particles for the die pasting machine, and further improves the practicability of the equipment for automatically detecting the wafer particles for the die pasting machine;

above-mentioned electric telescopic handle 4, camera 5, driving motor 12 and LED display screen 14 isoelectrical component's control mode is controlled through rather than supporting controller 15, and above-mentioned controller 15 is single chip microcomputer controller, and control circuit can realize through the simple programming of technical staff in this field, belongs to the common general knowledge in this field, only uses it, does not improve it, and the utility model discloses mainly be used for protecting mechanical device, so the utility model discloses no longer detail control mode and circuit connection are repeated.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides a paste equipment of mould machine with automatic detection disk granule which includes base (1), its characterized in that: the left side and the right side of the top of the base (1) are symmetrically provided with side plates (2), the upper end of each side plate (2) is provided with a top plate (3), the middle part of each top plate (3) is fixedly inserted with an electric telescopic rod (4), the telescopic end of each electric telescopic rod (4) is provided with a camera (5), the telescopic end of each electric telescopic rod (4) penetrates through a light supplementing lamp strip (6), the top of each light supplementing lamp strip (6) is connected with the corresponding top plate (3), the middle part of the top of the base (1) is provided with a bearing seat (7), a rotating shaft (8) is installed in each bearing seat (7), a placing disc (9) is arranged at the upper end of each rotating shaft (8), circular grooves (10) are uniformly formed in the periphery of the top of the placing disc (9), a rack ring (11) is embedded in the bottom of the outer wall of the placing disc (9), and a, the output shaft end of the driving motor (12) is provided with a special-shaped gear (13), the special-shaped gear (13) and the rack ring (11) are meshed with each other, an LED display screen (14) is embedded in the middle of the front side wall of the base (1), and a controller (15) is arranged on the right side of the front side wall of the base (1).

2. The apparatus for automatically detecting wafer particles for a die bonder as claimed in claim 1, wherein: the quantity that circular recess (10) set up is eight groups, camera (5) are the CCD camera, and in eight groups arbitrary a set of circular recess (10) are located camera (5) under.

3. The apparatus for automatically detecting wafer particles for a die bonder as claimed in claim 1, wherein: the distance of the meshing rotation of the special-shaped gear (13) and the rack ring (11) is equal to the distance between any two adjacent groups of circular grooves (10).

4. The apparatus for automatically detecting wafer particles for a die bonder as claimed in claim 1, wherein: the light supplementing lamp strip (6) is arranged in an annular structure, and the light supplementing lamp strip (6) is a high-brightness LED lamp strip.

5. The apparatus for automatically detecting wafer particles for a die bonder as claimed in claim 1, wherein: and the bearing in the bearing seat (7) is connected with the rotating shaft (8) in an interference manner.

6. The apparatus for automatically detecting wafer particles for a die bonder as claimed in claim 1, wherein: the driving motor (12) is a servo motor.

7. The apparatus for automatically detecting wafer particles for a die bonder as claimed in claim 1, wherein: the controller (15) is respectively electrically connected with the electric telescopic rod (4), the camera (5), the driving motor (12) and the LED display screen (14).