CN210159983U - Semiconductor component detection device - Google Patents
Semiconductor component detection device Download PDFInfo
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- CN210159983U CN210159983U CN201920641547.8U CN201920641547U CN210159983U CN 210159983 U CN210159983 U CN 210159983U CN 201920641547 U CN201920641547 U CN 201920641547U CN 210159983 U CN210159983 U CN 210159983U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 238000001514 detection method Methods 0.000 title claims abstract description 30
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000000428 dust Substances 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 5
- 239000000047 product Substances 0.000 description 27
- 239000000203 mixture Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012916 structural analysis Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of semiconductor equipment, a semiconductor component detection device, which comprises a frame and a workbench, wherein the workbench is arranged at the top of the frame, a first mounting plate and a second mounting plate are respectively arranged at the top and the bottom of the frame through mounting racks, the first mounting plate and the second mounting plate are respectively positioned at the top and the bottom of the workbench, a first camera is detachably arranged at the bottom of the first mounting plate, a second camera is detachably arranged at the top of the second mounting plate, T-shaped grooves are respectively arranged on the bottom surface of the first mounting plate and the top surface of the second mounting plate, T-shaped sliders are welded on the top surface of the first camera and the bottom surface of the second camera, and the T-shaped sliders are positioned in the; the utility model discloses a device not only detects the product top and can also detect the bottom when setting up of transparent glass and No. two cameras makes its detection, makes it detect more comprehensively, makes it detect two-sidedly simultaneously, improves work efficiency.
Description
Technical Field
The utility model belongs to the technical field of semiconductor equipment, concretely relates to semiconductor components and parts detection device.
Background
In the production of semiconductor devices, from a semiconductor single crystal wafer to a final product, several tens or even hundreds of processes are required. In order to ensure that the product is qualified, stable and reliable and has high yield, strict specific requirements are required for all process steps according to the production conditions of various products. Therefore, corresponding systems and precise monitoring measures must be established during the production process, starting from the semiconductor process inspection.
The prior art has the following problems:
1. the existing detection equipment cannot detect two side surfaces of a product at the same time, so that the working efficiency is reduced;
2. the detection structure of the existing detection equipment is inconvenient to disassemble and assemble, and the detection is divided into a plurality of types, so that not only the appearance condition but also the internal structure condition need to be detected, and therefore detection devices with different pertinence are needed for detecting different conditions, and the overall replacement cost is high.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a semiconductor component detection device, when the transparent glass and a second camera are arranged, the device can not only detect the top of a product, but also detect the bottom of the product, so that the detection is more comprehensive, the device can detect two sides simultaneously, and the working efficiency is improved; the first mounting plate is detachably connected with the first camera through the T-shaped groove and the T-shaped sliding block, and the second mounting plate is detachably connected with the second camera through the T-shaped groove and the T-shaped sliding block, so that the first camera box and the second camera are convenient to mount and dismount, devices with different acquisition conditions need to be replaced for detecting different conditions of a product, the cameras can detect the appearance, but cannot analyze composition knots and the like, so that the first camera and the second camera can be replaced by a device capable of detecting composition structure analysis, and the cost is saved; the dust scraper of bottom strikes off bottom surface dust when transparent glass is rotatory, avoids the fuzzy influence of bottom surface camera to shoot the clarity characteristics.
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor component detection device comprises a machine frame and a workbench, wherein the workbench is arranged at the top of the machine frame, the top and the bottom of the frame are respectively provided with a first mounting plate and a second mounting plate through mounting racks, the first mounting plate and the second mounting plate are respectively positioned at the top and the bottom of the workbench, the first camera is detachably mounted at the bottom of the first mounting plate, a second camera is detachably arranged on the top of the second mounting plate, T-shaped grooves are formed in the bottom surface of the first mounting plate and the top surface of the second mounting plate, t-shaped sliding blocks are welded on the top surface of the first camera and the bottom surface of the second camera, the T-shaped sliding block is positioned in the inner cavity of the T-shaped groove, transparent glass is movably arranged at the top of the inner cavity of the workbench, a dust scraper is arranged on one side of the inner cavity wall of the workbench and is positioned at the bottom of the transparent glass.
Preferably, the surface of the top of the transparent glass is provided with four sets of placing grooves, the first camera is positioned at the top of the placing grooves, the surface of the top of the workbench is provided with an observation window, and the observation window is positioned at the top of the second camera.
Preferably, a rotary table is arranged on one side of the workbench and movably mounted on the top surface of the rack, the bottom of the rotary table and the bottom of the transparent glass are both provided with motors through rotating shafts, and the motors are located at the bottom of the rack.
Preferably, one side of the top of the turntable is provided with a clamping arm, and one end of the clamping arm is provided with a vacuum chuck.
Preferably, a collecting tank is installed on one side of the rack and is located at the bottom of the vacuum chuck.
Preferably, the mounting rack is respectively mounted at the top and the bottom of the frame through screws.
Preferably, the first mounting plate is detachably connected with the first camera through a T-shaped groove and a T-shaped sliding block, and the second mounting plate is detachably connected with the second camera through a T-shaped groove and a T-shaped sliding block.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the device not only can detect the bottom to the product top when transparent glass and No. two cameras set up and make its detection, makes it detect more comprehensively, makes it detect two-sidedly simultaneously, improves work efficiency.
2. A mounting panel passes through T type groove and T type slider and can dismantle with a camera and be connected, and No. two mounting panels pass through T type groove and T type slider and can dismantle with No. two cameras and be connected, made things convenient for the installation and the dismantlement of No. two cameras of camera box like this, make its convenient device that needs to change different collection conditions to the product detection different situation, the camera can detect the appearance, but can not analyze composition knot etc. so can change a camera and No. two cameras and change into and can detect composition structure analysis device, the cost is saved.
3. The dust scraper of bottom strikes off bottom surface dust when transparent glass is rotatory, avoids the fuzzy influence second camera of bottom surface to shoot the clarity.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic top view of the transparent glass of the present invention;
fig. 3 is a schematic structural view of a first mounting plate in the present invention;
fig. 4 is a schematic structural view of the workbench in the present invention.
In the figure: 1. a frame; 2. a work table; 3. a mounting frame; 4. a first mounting plate; 5. a second mounting plate; 6. a camera number one; 7. a camera number two; 8. a T-shaped groove; 9. a T-shaped slider; 10. a placement groove; 11. transparent glass; 12. a dust scraper; 13. a motor; 14. a turntable; 15. a gripping arm; 16. a vacuum chuck; 17. collecting tank; 18. and (4) an observation window.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-4, the present invention provides the following technical solutions: a semiconductor component detection device comprises a frame 1 and a workbench 2, wherein the workbench 2 is arranged at the top of the frame 1, a first mounting plate 4 and a second mounting plate 5 are respectively arranged at the top and the bottom of the frame 1 through a mounting rack 3, the first mounting plate 4 and the second mounting plate 5 are respectively positioned at the top and the bottom of the workbench 2, the first camera 6 is detachably mounted at the bottom of the first mounting plate 4, the second camera 7 is detachably mounted at the top of the second mounting plate 5, T-shaped grooves 8 are respectively formed in the bottom surface of the first mounting plate 4 and the top surface of the second mounting plate 5, T-shaped sliding blocks 9 are respectively welded on the top surface of the first camera 6 and the bottom surface of the second camera 7, and the T-shaped sliding block 9 is positioned in the inner cavity of the T-shaped groove 8, the transparent glass 11 is movably arranged at the top of the inner cavity of the workbench 2, a dust scraper 12 is arranged on one side of the wall of the inner cavity of the workbench 2, and the dust scraper 12 is positioned at the bottom of the transparent glass 11.
In this embodiment: the circular transparent glass 11 is movably arranged at the top of the workbench 2 through a rotating shaft, semiconductor chips to be detected are placed in four groups of placing groove 10 inner cavities at the top of the transparent glass 11, then the first camera 6 and the second camera 7 take pictures of the top and the bottom of the semiconductor, after the detection is finished, if the semiconductor chips are qualified, the motor 13 at the bottom of the transparent glass 11 rotates, the transparent glass 11 rotates ninety degrees to replace the semiconductor in the inner cavity of the next placing groove 10 for detection, the qualified semiconductor is unloaded through a mechanical arm, then the inner cavity of the placing groove 10 after the semiconductor to be detected is placed is filled, so that the rotation circulation detection is carried out, if the semiconductor chips are not qualified, the motor 13 at the bottom of the turntable 14 drives the clamping arm 15 and the vacuum sucker 16 to be positioned at the top of the placing groove 10 at the bottom of the first camera 6 to clamp the unqualified product, then the turntable 14 rotates again to make the vacuum sucker 16 be positioned at the top of the collecting groove, then, unqualified products are placed in the inner cavity of the collecting groove 17 to be removed, and the transparent glass 11 and the second camera 7 are arranged so that the device can detect not only the top of the product but also the bottom of the product when the product is detected, so that the product is detected more comprehensively, double surfaces of the product are detected simultaneously, and the working efficiency is improved; when the transparent glass 11 rotates, the dust scraper 12 at the bottom scrapes dust on the surface of the bottom, so that the influence of the blurring of the surface of the bottom on the shooting clarity of the camera 7 is avoided; no. 4 mounting panels and No. 5 mounting panels are installed respectively to the end department of the mounting bracket 3 of 1 top of frame and bottom, and T type groove 8 has all been seted up to a 4 bottom surfaces of mounting panels and No. 5 top surfaces of mounting panels, T type slider 9 has all been welded to a 6 top surfaces of camera and No. 7 bottom surfaces of camera, and T type slider 9 is located the 8 inner chambers of T type groove, so a mounting panel 4 can be dismantled with a camera 6 through T type groove 8 and T type slider 9 and be connected, and No. 5 mounting panels can be dismantled with No. 7 camera through T type groove 8 and T type slider 9, the installation and the dismantlement of No. 6 camera of a camera box No. 7 have been made things convenient for like this, make it conveniently need to change the device of different collection circumstances to product detection different situations, the camera can detect the appearance, but can not analyze composition knot etc., so can change camera 6 and No. 7 into and can detect composition structural analysis dress And the cost is saved.
Specifically, a placing groove 10 is arranged on the top surface of the transparent glass 11, four groups of placing grooves 10 are arranged, the first camera 6 is positioned on the top of the placing groove 10, an observation window 18 is arranged on the top surface of the workbench 2, and the observation window 18 is positioned on the top of the second camera 7; the observation window 18 facilitates the second camera 7 to directly take a picture of the bottom of the product on the top of the transparent glass 11 through the observation window 18 for detection.
Specifically, a rotary table 14 is arranged on one side of the workbench 2, the rotary table 14 is movably mounted on the surface of the top of the rack 1, a motor 13 is mounted at the bottoms of the rotary table 14 and the transparent glass 11 through a rotating shaft, and the motor 13 is located at the bottom of the rack 1; the turntable 14 conveniently drives the clamping arm 15 to move, and unqualified products are removed.
Specifically, a clamping arm 15 is mounted on one side of the top of the turntable 14, and a vacuum chuck 16 is mounted at one end of the clamping arm 15; the gripping arm 15 cooperates with the vacuum chuck 16 to discharge the defective products.
Specifically, a collecting tank 17 is arranged on one side of the frame 1, and the collecting tank 17 is positioned at the bottom of the vacuum chuck 16; the collecting tank 17 facilitates the collection of the unqualified products.
Specifically, the mounting rack 3 is respectively mounted at the top and the bottom of the rack 1 through screws; the screw is convenient to install and dismantle.
Specifically, the first mounting plate 4 is detachably connected with the first camera 6 through a T-shaped groove 8 and a T-shaped sliding block 9, and the second mounting plate 5 is detachably connected with the second camera 7 through a T-shaped groove 8 and a T-shaped sliding block 9; the T-shaped groove 8 and the T-shaped sliding block 9 are conveniently detachably connected.
In this embodiment: the motor was XY86STH156-4208A, sold by Shenglong Motor, Inc., Guangzhou.
In this embodiment: the vacuum chuck adopted model is PFTK-6A-N, sold by Paienbo Automation technology Zhejiang GmbH.
The utility model discloses a theory of operation and use flow: the circular transparent glass 11 is movably arranged at the top of the workbench 2 through a rotating shaft, semiconductor chips to be detected are placed in four groups of placing groove 10 inner cavities at the top of the transparent glass 11, then the top and the bottom of a semiconductor are photographed and detected by a first camera 6 and a second camera 7, an observation window 18 is convenient for the second camera 7 to directly photograph and detect the bottom of a product at the top of the transparent glass 11 through the observation window 18, after the detection is finished, a motor 13 at the bottom of the transparent glass 11 rotates if the detection is qualified, so that the transparent glass 11 rotates ninety degrees to replace the semiconductor in the inner cavity of the placing groove 10 for detection, the qualified semiconductor is unloaded through a manipulator, then the semiconductor to be detected is filled in the inner cavity of the placing groove 10 after the unloading, the rotation circulation detection is carried out, if the detection is not qualified, the motor 13 at the bottom of the turntable 14 drives the rotation by one hundred eighty degrees, the clamping arm 15 and the vacuum sucker 16 are driven by the camera to be positioned at the top of the placing groove 10 at the bottom of the first camera 6 to clamp the unqualified product, then the turntable 14 rotates again to enable the vacuum sucker 16 to be positioned at the top of the collecting groove 17, then the unqualified product is placed in the inner cavity of the collecting groove 17 to be removed, and the transparent glass 11 and the second camera 7 are arranged to enable the device to detect not only the top of the product but also the bottom of the product during detection, so that the detection is more comprehensive, the double surfaces of the product can be detected simultaneously, and the working efficiency is improved; when the transparent glass 11 rotates, the dust scraper 12 at the bottom scrapes dust on the surface of the bottom, so that the influence of the blurring of the surface of the bottom on the shooting clarity of the camera 7 is avoided; no. 4 mounting panels and No. 5 mounting panels are installed respectively to the end department of the mounting bracket 3 of 1 top of frame and bottom, and T type groove 8 has all been seted up to a 4 bottom surfaces of mounting panels and No. 5 top surfaces of mounting panels, T type slider 9 has all been welded to a 6 top surfaces of camera and No. 7 bottom surfaces of camera, and T type slider 9 is located the 8 inner chambers of T type groove, so a mounting panel 4 can be dismantled with a camera 6 through T type groove 8 and T type slider 9 and be connected, and No. 5 mounting panels can be dismantled with No. 7 camera through T type groove 8 and T type slider 9, the installation and the dismantlement of No. 6 camera of a camera box No. 7 have been made things convenient for like this, make it conveniently need to change the device of different collection circumstances to product detection different situations, the camera can detect the appearance, but can not analyze composition knot etc., so can change camera 6 and No. 7 into and can detect composition structural analysis dress And the cost is saved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a semiconductor components and parts detection device, includes frame (1) and workstation (2), its characterized in that are installed to frame (1) top: the utility model discloses a dust scraper, including frame (1), mounting panel (4) and No. two mounting panels (5) are all installed respectively through mounting bracket (3) in frame (1) top and bottom, and mounting panel (4) and No. two mounting panels (5) are located workstation (2) top and bottom respectively, but mounting panel (4) bottom demountable installation has camera (6), but mounting panel (5) top demountable installation has camera (7) No. two, T type groove (8) have all been seted up on mounting panel (4) bottom surface and mounting panel (5) top surface, but T type slider (9) have all been welded on camera (6) top surface and camera (7) bottom surface, and T type slider (9) are located T type groove (8) inner chamber, workstation (2) inner chamber top movable mounting has clear glass (11), dust scraper (12) are installed to workstation (2) inner chamber wall one side, and the dust scraper (12) is positioned at the bottom of the transparent glass (11).
2. A semiconductor component detecting device according to claim 1, wherein: transparent glass (11) top surface mounting has standing groove (10), and standing groove (10) are equipped with four groups, camera (6) are located standing groove (10) top, observation window (18) have been seted up to workstation (2) top surface, and observation window (18) are located No. two camera (7) tops.
3. A semiconductor component detecting device according to claim 1, wherein: workstation (2) one side is equipped with carousel (14), and carousel (14) movable mounting in frame (1) top surface, motor (13) are all installed through the pivot in carousel (14) and transparent glass (11) bottom, and motor (13) are located frame (1) bottom.
4. A semiconductor component detecting device according to claim 3, wherein: the clamping arm (15) is installed on one side of the top of the rotary table (14), and a vacuum chuck (16) is installed at one end of the clamping arm (15).
5. A semiconductor component detecting device according to claim 1, wherein: a collecting tank (17) is installed on one side of the rack (1), and the collecting tank (17) is located at the bottom of the vacuum chuck (16).
6. A semiconductor component detecting device according to claim 1, wherein: the mounting rack (3) is respectively arranged at the top and the bottom of the rack (1) through screws.
7. A semiconductor component detecting device according to claim 1, wherein: no. one mounting panel (4) can be dismantled through T type groove (8) and T type slider (9) and be connected with camera (6), and No. two mounting panels (5) can be dismantled through T type groove (8) and T type slider (9) and be connected with No. two cameras (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920641547.8U CN210159983U (en) | 2019-05-07 | 2019-05-07 | Semiconductor component detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920641547.8U CN210159983U (en) | 2019-05-07 | 2019-05-07 | Semiconductor component detection device |
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| Publication Number | Publication Date |
|---|---|
| CN210159983U true CN210159983U (en) | 2020-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920641547.8U Expired - Fee Related CN210159983U (en) | 2019-05-07 | 2019-05-07 | Semiconductor component detection device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112317339A (en) * | 2020-09-10 | 2021-02-05 | 中国石油大学(华东) | LED wafer sorting system and sorting method thereof |
| CN113649307A (en) * | 2021-08-17 | 2021-11-16 | 深圳市凯创半导体设备有限公司 | Quick sorting braider device for semiconductor chips |
-
2019
- 2019-05-07 CN CN201920641547.8U patent/CN210159983U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112317339A (en) * | 2020-09-10 | 2021-02-05 | 中国石油大学(华东) | LED wafer sorting system and sorting method thereof |
| CN113649307A (en) * | 2021-08-17 | 2021-11-16 | 深圳市凯创半导体设备有限公司 | Quick sorting braider device for semiconductor chips |
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