CN211219151U

CN211219151U - Laser plane processing equipment

Info

Publication number: CN211219151U
Application number: CN201922032579.0U
Authority: CN
Inventors: 吴喜泉; 托比·如; 康玉刚
Original assignee: Suzhou Gaoyi Laser Technology Co ltd
Current assignee: Suzhou Gaoyi Laser Technology Co ltd
Priority date: 2019-11-25
Filing date: 2019-11-25
Publication date: 2020-08-11
Anticipated expiration: 2029-11-25

Abstract

The utility model discloses a laser plane processing equipment, include: a support assembly; the clamping block is arranged above the supporting component; the laser head is arranged on the clamping block and is positioned above the workpiece, and an angle is formed between the laser head and the surface to be processed of the workpiece; the monitoring assembly comprises a camera, the camera is arranged on the clamping block and is aligned to the workpiece, and the central axis of the camera is vertical to the surface to be processed of the workpiece; the measuring component comprises an optical distance meter, the optical distance meter is arranged on the clamping block, and the optical distance meter is aligned to the workpiece. In this way, the utility model discloses can make the laser treat the orientation of machined surface to the work piece in the work piece of slope, can be applicable to the initial surface and be unevenness's work piece, the application scope of this equipment is extensive, improves laser beam machining's effect.

Description

Laser plane processing equipment

Technical Field

The utility model relates to a laser beam machining technical field especially relates to a laser plane processing equipment.

Background

Most of the conventional surface machining techniques are milling or grinding using a tool having a higher hardness than a workpiece to be machined, and there are also surface machining using electric spark discharge, that is, milling using a milling cutter, a grinding wheel, electric spark discharge, or micro-powder grinding.

The use of a milling cutter for face milling does not allow the machining of superhard materials such as diamond and cubic boron nitride because the hardness of the material without the milling cutter is higher than that of these materials.

The use of spark erosion grinding has been a popular method and there are some products of superhard materials that continue to be processed using this process. But the electric spark discharge can damage the internal structure of the material, resulting in the reduction of the final quality of the product. Another disadvantage is that the electric spark process is not environment-friendly enough, and the cooling oil and the cooling liquid volatilize in a production workshop, so that the air quality of the workshop is difficult to maintain. In addition, electric sparks can only process conductive materials, some novel materials are not conductive at present, and the electric sparks are extremely slow in processing speed, so that the electric sparks cannot be processed practically.

Most manufacturers have to use diamond wheels or diamond micropowder for grinding. Because the materials with the same hardness are mutually ground, the processing time is long, and the thickness of 0.5mm can be removed generally in ten hours or more. Moreover, diamond and diamond grinding wheels are used as consumables, which occupy most of the processing cost, so that most manufacturers build grinding wheel production lines to reduce the cost. The process also faces a situation of increasingly severe environmental protection.

Recently, laser ablation has been used, but laser surface processing (or laser grinding, in some cases) is not effective, and most of the laser surface processing is a workpiece whose initial surface is flat, and if the initial surface is uneven, it is difficult to process the workpiece to a flatness and roughness close to grinding. If the workpiece is firstly ground flat, then laser grinding is carried out, and finally the workpiece is ground flat by a grinding machine, the superiority of laser processing cannot be reflected, and the cost cannot be effectively controlled.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves provides a laser plane processing equipment, can be applicable to the initial surface and be unevenness's work piece, application scope is extensive.

In order to achieve the above object, the technical solution of the present invention is:

a laser planar processing apparatus comprising:

a support assembly;

the clamping block is used for placing a workpiece on the supporting component and is arranged above the supporting component;

the laser head is arranged on the clamping block and positioned above the workpiece, and an angle is formed between the laser head and the surface to be processed of the workpiece;

the monitoring assembly comprises a camera, the camera is arranged on the clamping block and is aligned to the workpiece, and the central axis of the camera is vertical to the surface to be processed of the workpiece;

the measuring assembly comprises an optical distance meter, the optical distance meter is arranged on the clamping block, and the optical distance meter aligns to the workpiece.

Preferably, the support assembly comprises a base, an XY displacement table, a base and a positioning block; the XY displacement table is arranged on the base, the base is arranged on the XY displacement table, and the positioning block is arranged on the base.

Preferably, the support assembly further comprises a gantry, the gantry is arranged on the base, and the clamping block is arranged on the gantry.

Preferably, the device also comprises a moving rod and a motor, wherein the moving rod is arranged on the gantry, and the clamping block is arranged on the moving rod; the motor drives the movable rod to move up and down.

Preferably, the angle between the laser head and the surface to be processed of the workpiece is 0-45 °.

Preferably, the monitoring assembly further comprises a telescope, the telescope is arranged on the clamping block and located between the camera and the workpiece, the telescope is aligned with the workpiece, and a surface to be processed of the workpiece, which is the central axis of the telescope, is perpendicular to the surface to be processed.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model has the following beneficial effect:

(1) the laser plane processing equipment is applicable to workpieces with uneven initial surfaces, the surfaces to be processed of the workpieces are processed into planes firstly, the application range of the equipment is wide, and the laser processing effect is improved.

(2) Compared with the traditional carborundum grinding and electric spark grinding, the equipment does not need to use consumables, reduces the processing cost, does not need to use grinding fluid or electric spark cooling fluid and the like in the using process, and is more environment-friendly.

(3) In the laser processing process, the accurate position of the laser action can be actually and clearly monitored through the monitoring assembly and the measuring assembly, and the laser processing effect is effectively guaranteed.

Drawings

Fig. 1 is a schematic structural view of the laser plane machining apparatus of the present invention.

Fig. 2 is a partially enlarged view of a portion a in fig. 1.

Description of reference numerals:

a base 11, an XY displacement table 12, a base 13, a positioning block 14, a gantry 15,

A clamping block 2,

A laser head 3,

A camera 41, a telescope 42,

An optical distance measuring instrument 5,

A moving rod 61, a motor 62,

A workpiece 7.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.

Referring to the drawings, a laser flat processing apparatus includes: supporting component, grip block 2, laser head 3, monitoring subassembly and measuring component.

The support assembly functions primarily to fixedly support the workpiece 7. The supporting component comprises a base 11, an XY displacement table 12, a base 13 and a positioning block 14. An XY-displacement table 12 is provided on the base 11, and a base 13 is provided on the XY-displacement table 12. The base 13 is moved in the horizontal direction by the XY-displacement stage 12, and the XY-displacement stage 12 in the conventional technology can be used as the XY-displacement stage 12, which is not described herein.

The clamping block 2 is arranged above the support assembly. The laser head 3 is arranged on the clamping block 2, and the laser head 3 is positioned above the workpiece 7. The workpiece 7 is placed on a positioning block 14, and the positioning block 14 is disposed on the base 13. The laser head 3 and the surface to be processed of the workpiece 7 form an acute angle. Preferably, the angle between the laser head 3 and the surface to be processed of the workpiece 7 may be set to 0 ° to 45 °.

The laser is arranged in such a way that the laser processes the workpiece in the direction inclined to the surface of the workpiece to be processed, and the laser obliquely acts on the workpiece to remove the uneven surface layer by layer until the workpiece is processed into a plane. The laser does not process the workpiece in the direction perpendicular to the surface to be processed of the workpiece, and the effect of the laser can be reduced in the processing depth direction, so that the surface defect in the initial process of laser processing (such as laser grinding in the prior art) in the prior art is avoided, the surface defect can be remained in the surface appearance of the workpiece subjected to the laser processing all the time, and the laser processing effect is greatly reduced. The laser processing effect is particularly obvious when the workpiece with the uneven initial surface is processed, the uneven surface to be processed of the workpiece is processed into a plane through the oblique incidence angle, the laser processing effect is improved, and the device is wide in application range.

In order to effectively ensure that the incident angle of the laser on the workpiece is an acute angle, namely the laser is obliquely incident instead of vertically incident, the position and the angle of the laser head 3 can be adjusted, and the position and the angle of the workpiece 7 can also be adjusted through the positioning block 14.

For example, the upper surface of the positioning block 14 is provided with a V-shaped groove, and the workpiece is placed in the V-shaped groove of the positioning block 14. Therefore, the laser is kept acting in the vertical direction, the surface to be processed of the workpiece forms a certain included angle with the horizontal plane through the V-shaped groove of the positioning block 14, so that the laser processes the workpiece 7 in a direction which is not perpendicular to the surface to be processed of the workpiece, and the laser processes the workpiece 7 in a direction which is oblique to the surface to be processed of the workpiece.

In order to fix the monitoring assembly and the measuring assembly more stably, the supporting assembly further comprises a gantry 15, the gantry 15 is arranged on the base 11, and the clamping block 2 is arranged on the gantry 15 to increase firmness of the gantry 15.

Since the XY-displacement table 12 is moved in the horizontal direction, the apparatus further includes a moving bar 61 and a motor 62 in order that the laser processing can be applied to workpieces 7 of different heights, the moving bar 61 being provided on the gantry 15, and the holding block 2 being provided on the moving bar 61. The moving rod 61 is connected to a motor 62, and the moving rod 61 is driven by the motor 62 to move up and down. The moving rod 61 may include a slide rail and a slide rod, the slide rail is disposed on the gantry 15, the slide rod is slidably connected to the slide rail, and the slide rod drives the clamping block 2 to move up and down on the slide rail under the driving of the motor 62, so as to realize the up-and-down movement of the laser head 3 disposed on the clamping block 2.

The monitoring component comprises a camera 41, the camera 41 is arranged on the clamping block 2, and an angle is arranged between the laser head 3 and the surface to be processed of the workpiece 7. The camera 41 is aligned with the workpiece 7, and the central axis of the camera 41 is perpendicular to the surface to be processed of the workpiece 7.

For better observation and focusing, the monitoring assembly further comprises a telescope 42, the telescope 42 is arranged on the clamping block 2, the telescope 42 is positioned between the camera 41 and the workpiece 7, the telescope 42 is aligned with the workpiece 7, and the central axis of the telescope 42 is vertical to the surface to be processed of the workpiece 7. That is, the camera 41 and the telescope 42 are both disposed obliquely, and their lenses are aligned with the surface to be processed of the workpiece 7.

The measuring assembly comprises an optical distance measuring instrument 5, the optical distance measuring instrument 5 is arranged on the clamping block 2, and a camera of the optical distance measuring instrument 5 is aligned to the workpiece 7. The optical distance measuring device 5 may be an optical distance measuring device 5 in the prior art, which is not described herein. The monitoring assembly and the measuring assembly are electrically connected with the controller, data information obtained by the monitoring assembly and the measuring assembly is fed back to the controller, and the controller can adopt a conventional PLC controller.

It should be noted that the technical scheme in the utility model is applicable to curved surface processing equally, can change it through the software programming to the controller in the actual course of working and be used for plane processing or curved surface processing.

In the actual machining process, the workpiece 7 to be machined is placed on the positioning block 14. Before processing, the surface of the workpiece to be processed is scanned by the measuring assembly, and after the surface is recorded, a processing program for removing the protruding part in a layered manner is generated, so that the uneven area is gradually swept. After the flat sweeping, the surface to be processed of the workpiece 7 is a plane, and the surface to be processed of the workpiece 7 is processed to the required thickness, so that the plane processing of the workpiece 7 is completed.

The laser acts on the surface to be processed of the workpiece through the laser head 3, the laser and the surface to be processed of the workpiece form an angle of 0-45 degrees, the camera lens of the monitoring assembly is perpendicular to the surface to be processed of the workpiece, observation and focusing can be carried out, and the position coordinate of the workpiece 7 is positioned through the camera 41. The measuring assembly can measure the flatness of the surface to be processed of the workpiece, and after the workpiece is processed, the surface appearance and the processing removal amount are measured through the optical distance meter 5.

The above is only the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and all the same principles are included in the protection scope of the present invention.

Claims

1. A laser flat machining apparatus, characterized by comprising:

a support assembly;

the laser head is arranged on the clamping block and is positioned above the workpiece, and an angle is formed between the laser head and the surface to be processed of the workpiece, and the angle is an acute angle;

2. A laser flat working machine according to claim 1, characterized in that: the supporting assembly comprises a base, an XY displacement table, a base and a positioning block; the XY displacement table is arranged on the base, the base is arranged on the XY displacement table, and the positioning block is arranged on the base.

3. A laser flat working machine according to claim 2, characterized in that: the supporting assembly further comprises a gantry, the gantry is arranged on the base, and the clamping block is arranged on the gantry.

4. A laser flat working machine according to claim 3, characterized in that: the gantry clamping device is characterized by further comprising a moving rod and a motor, wherein the moving rod is arranged on the gantry, and the clamping block is arranged on the moving rod; the motor drives the movable rod to move up and down.

5. A laser flat working machine according to claim 1, characterized in that: the angle between the laser head and the surface to be processed of the workpiece is 0-45 degrees.

6. A laser flat working machine according to claim 1, characterized in that: the monitoring assembly further comprises a telescope, the telescope is arranged on the clamping block and located between the camera and the workpiece, the telescope is aligned with the workpiece, and the surface to be processed of the workpiece, which is the central axis of the telescope, is vertical to the surface to be processed of the workpiece.