CN211204000U - Heat conduction structure, module with heat conduction structure and terminal - Google Patents
Heat conduction structure, module with heat conduction structure and terminal Download PDFInfo
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- CN211204000U CN211204000U CN202020179027.2U CN202020179027U CN211204000U CN 211204000 U CN211204000 U CN 211204000U CN 202020179027 U CN202020179027 U CN 202020179027U CN 211204000 U CN211204000 U CN 211204000U
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Abstract
The utility model provides a heat conduction structure, module and terminal that have heat conduction structure, heat conduction structure includes: a substrate for carrying devices, the substrate comprising a plurality of device regions for carrying devices; and the heat conducting unit is used for radiating heat and is arranged between two adjacent device areas. The heat conduction unit is arranged between the two adjacent device areas, the heat conduction block can conduct heat on the substrate, heat effect superposition between the two adjacent device areas can be reduced, heat conduction from the device area with high heat consumption to the device area with low power consumption can be blocked, the purpose of reducing the temperature of the device area is achieved, loss caused by the fact that the devices arranged on the device area are affected by the heat effect is avoided, and reliability of the devices is improved.
Description
Technical Field
The utility model relates to the field of electronic technology, especially, relate to a heat conduction structure, module and terminal that have heat conduction structure.
Background
In some lamps and lanterns or terminals, often need provide illumination or light filling through the mode that multiple lamps and lanterns combine, in the use of multiple lamps and lanterns, often can produce the heat, produce thermal interference and heat stack between the multiple lamps and lanterns, because the consumption of different lamps and lanterns, heat dissipation, reliability are different, cause the heat local concentration easily, aggravate the loss of partial lamps and lanterns, reduce and use the reliability.
Disclosure of Invention
In view of the above, the present invention provides a heat conduction structure, a module having the same, and a terminal, for solving the problem of poor heat dissipation.
To achieve the above and other related objects, the present invention provides a heat conducting structure, including: a substrate for carrying devices, the substrate comprising a plurality of device regions for carrying devices; and the heat conducting unit is used for radiating heat and is arranged between two adjacent device areas.
Optionally, the device regions and the heat conducting unit are disposed on the same surface of the substrate.
Optionally, the device regions are disposed on one surface of the substrate, and the heat conducting unit is disposed on the other surface of the substrate.
Optionally, the extending directions of two adjacent device regions are collinear or parallel.
Optionally, the extending directions of two adjacent device regions have a positional relationship of intersection.
Optionally, the heat conducting unit is disposed at a position where two adjacent device regions intersect.
Optionally, the substrate is U-shaped.
Optionally, the thermal conductivity of the thermal conductive unit is greater than the thermal conductivity of the substrate.
Optionally, the substrate includes an aluminum substrate, and the heat conducting unit includes a copper-based heat conducting unit.
A module having a thermally conductive structure, comprising: a substrate for carrying devices, the substrate comprising a plurality of device regions for carrying devices; the heat conducting unit is used for radiating heat and arranged between two adjacent device areas; a device, the device being matched to the device region.
Optionally, the device regions are matched to the positions and/or number of the devices.
Optionally, the device comprises one of: power device, light emitting device.
Optionally, the device comprises one of: white light lamp, infrared lamp, ultraviolet lamp, yellow light lamp, purple light lamp, blue light lamp, green light lamp.
Optionally, in two adjacent device regions, a positional relationship between an extending direction of the heat conducting unit and an extending direction of the first device region is an intersection, where the first device region is a device region provided with a device with lower thermal power consumption.
Optionally, in two adjacent device regions, the heat conducting unit is disposed close to a second device region, where the second device region is a device region provided with a device with higher thermal power.
A terminal with a heat conduction structure comprises a shell and a module with the heat conduction structure, wherein the shell is connected with the module.
As above, the utility model provides a pair of heat conduction structure, module and terminal that have heat conduction structure have following beneficial effect:
the heat conduction unit is arranged between the two adjacent device areas, the heat conduction block can conduct heat on the substrate, heat effect superposition between the two adjacent device areas can be reduced, heat conduction from the device area with high heat consumption to the device area with low power consumption can be blocked, the purpose of reducing the temperature of the device area is achieved, loss caused by the fact that the devices arranged on the device area are affected by the heat effect is avoided, and reliability of the devices is improved.
Drawings
Fig. 1 is a schematic front view of a heat conducting structure provided in embodiment 1 of the present invention.
Fig. 2 is a schematic rear view of the heat conducting structure provided in embodiment 1 of the present invention.
Fig. 3 is a schematic front view of a module having a heat conducting structure according to embodiment 2 of the present invention.
Fig. 4 is a schematic rear view of a module having a heat conducting structure according to embodiment 2 of the present invention.
Fig. 5 is a schematic perspective view of a module having a heat conducting structure according to embodiment 2 of the present invention.
Fig. 6 is a schematic view of a heat conduction process of a module having a heat conduction structure according to embodiment 2 of the present invention.
Description of the element reference numerals
1 substrate
11 first device region
12 second device region
2 Heat conducting Unit
31 first device
32 second device
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic concept of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
Referring to fig. 1 and 2, embodiment 1 provides a heat conducting structure, including: the substrate 1 for carrying the device, the substrate 1 includes a plurality of device regions for carrying the device, for example, may include a first device region 11 and a second device region 12, and the number of the first device region 11 and the second device region 12 may be plural; be used for radiating heat conduction unit 2, heat conduction unit 2 sets up in adjacent two between the device district, heat conduction unit 2 can go out the heat conduction on the base plate 1, can reduce the heat effect stack between two adjacent device districts, can also block the device district of high thermal power consumption to the heat-conduction that the device district of low-power consumption goes on, realizes reducing the purpose of device district temperature, avoids the device that sets up on the device district to receive the loss that the effect of heat arouses, improves the reliability of device.
In some implementation processes, it is a plurality of the device district with heat conduction unit 2 set up in the same face of base plate 1 reduces the manufacturing degree of difficulty of technology, and the heat conduction and the heat dissipation of heat conduction unit 2 of being convenient for moreover, heat conduction unit 2 is used for the heat of the device that sets up on the conduction device district, and when two adjacent device districts produced the heat effect and superposes, heat conduction unit 2 absorbed the heat and dispels the heat and handles, avoids the stack of heat effect to and avoid the heat to transmit to another device district by a device district, reduce the device loss in the device district, improve the reliability.
In some embodiments, a plurality of device regions may be disposed on one side of the substrate 1, and the heat conducting unit 2 is disposed on the other side of the substrate 1, so as to increase the density of the device regions and the density of the devices on the substrate 1, and in order to prevent heat conduction and heat loss between the device regions, the heat conducting unit 2 is disposed on the other side of the substrate 1, and the heat conducting unit 2 conducts heat on the substrate 1 between two adjacent devices, for example, conducts heat between the first device region 11 and the second device region 12, absorbs and dissipates the heat, avoids heat concentration, and also reduces heat conduction and heat superposition between the first device region 11 and the second device region 12, please refer to fig. 1 and fig. 2.
In some implementations, the extending directions of two adjacent device regions are collinear or parallel. When the position relation of two adjacent device areas is collinear, the two adjacent device areas are linearly arranged, and the heat conduction units are arranged at the two adjacent device areas, so that the thermal stress concentration and the heat conduction between the two adjacent device areas are avoided. When the position relation of two adjacent device areas is parallel, the extending directions of the two adjacent device areas are arranged in parallel, and a heat conduction unit can be arranged at the two adjacent device areas, so that the heat stress concentration and the heat conduction between the two adjacent device areas are reduced.
In some practical processes, the extending directions of two adjacent device regions are intersected, for example, the included angle between the extending directions of two adjacent device regions may include 30 °, 45 °, 60 °, 90 °, 120 °, 135 ° or 150 °, the design facilitates the utilization of the space of the substrate 1, and also facilitates the matching of the substrate 1 and the heat conducting unit 2 for heat dissipation, the flexible substrate and device region shape design facilitates the adaptation to different device configuration requirements, improves the application range and applicability of the heat conducting structure, for example, the included angle between the extending directions of two adjacent device regions is 90 °, the first device region 11 and the second device region 12 may be configured with devices respectively, the concentration of the heat effect at the joint of the first device region 11 and the second device region 12 is reduced, and the position requirements for device arrangement and setting can also be satisfied. For example, in order to improve heat dissipation efficiency, the heat conducting unit is disposed at a position where two adjacent device regions intersect.
In some trial processes, the substrate 1 can be in a U shape, one device is arranged on two sides of the U-shaped structure, and the other device is arranged in the middle of the U-shaped structure, for example, the devices arranged on two sides have higher thermal power, the device arranged in the middle has lower thermal power, so that the device with higher thermal power can dissipate heat through an air medium, and the heat conducted by the substrate 1 can be absorbed and dissipated through the heat conducting unit 2, thereby avoiding the excessive loss of the device with lower thermal power caused by the thermal effect generated by the device with higher thermal power, and avoiding the thermal stress concentration caused by the thermal power consumption of two adjacent devices.
In order to improve the heat dissipation performance of the heat conducting structure, in some embodiments, the heat conductivity coefficient of the heat conducting unit is greater than that of the substrate, and heat can be rapidly transferred to the heat conducting unit 2 when being conducted through the substrate 1, so as to achieve thermal insulation, for example, the heat conductivity coefficient of aluminum is 216W/(m · c), and the heat conductivity coefficient of copper is 394W/(m · c), so that the heat conductivity coefficient of the copper-based material is greater than that of the aluminum-based material, in some embodiments, the substrate may be an aluminum substrate, and the heat conducting unit may be a copper-based heat conducting unit.
Referring to fig. 3, 4 and 5, embodiment 2 provides a module having a heat conducting structure, including: a substrate 1 for carrying devices, the substrate 1 including a plurality of device regions for carrying devices, for example, may include a first device region 11 and a second device region 12; a heat conducting unit 2 for dissipating heat, the heat conducting unit 2 being disposed between two adjacent device regions, for example, may be disposed between the first device region 11 and the second device region 12; devices that match the device regions, e.g., device to device region location, and again, e.g., device to device region number. Can produce the heat-work consumption in the use of device, and then produce thermal stress concentration, the radiating condition of being not convenient for can set up heat conduction unit 2 between adjacent two device intervals, and when first device 31 or second device 32 produced the heat-work consuming time, accessible heat conduction unit 2 prevented the heat-conduction between first device 31 and the second device 32 with the heat separation, avoided the device thermal loss that thermal stress concentration arouses. For example, when the thermal power of the second device 32 is high, the heat can be conducted through the heat conducting unit disposed between the first device region 11 and the second device region 12, so as to prevent excessive heat generated by the second device 32 from being conducted to the first device region 11 or the first device 31, thereby improving the reliability of the first device 31 and avoiding premature heat loss.
In some implementations, the device may include a power device, e.g., an operational amplifier device including an electronic circuit, a memory device of an electronic circuit, a processing device of an electronic circuit, etc.; the device may comprise a light emitting device, further for example a light emitting device comprising a light emitting diode, an incandescent lamp, etc. The heating power of above-mentioned device is different, the heating loss degree is different, can effectively reduce the heat effect through above-mentioned heat conduction structure, improves the heat dissipation power.
In some implementations, the device includes a white light lamp, an infrared lamp, an ultraviolet lamp, a yellow light lamp, an ultraviolet lamp, a blue light lamp, a green light lamp. For example, the first device 31 may include a white light lamp, the second device 32 may include an infrared lamp, the thermal power consumption of the infrared lamp is high, and the thermal power consumption of the white light lamp is low, when the two devices operate simultaneously, the heat generated by the infrared lamp is effectively blocked by the heat conducting unit 2 in the process of being conducted to the white light lamp through the substrate 1, and the heat conducting direction is conducted and dissipated by the second device region 32 through the heat conducting unit 2, so that the heat dissipating capability of the infrared lamp is improved, and the degree of thermal damage of the white light lamp is reduced, please refer to fig. 6, through the above arrangement, the temperature of the device region of 5-15 degrees can be reduced, and the temperature of the connection part of the two device regions of 5-15 degrees can also be.
In some implementation processes, in two adjacent device regions, the extending direction of the heat conducting unit 2 intersects with the extending direction of the first device region, so that heat generated by a device with higher thermal power consumption can be prevented from being guided to the first device region through the heat conducting unit 2, and the purpose of blocking heat conduction and reasonably dissipating heat of the heat conducting unit 2 is further achieved, wherein the first device region is a device region provided with a device with lower thermal power consumption, please refer to fig. 5. For another example, in two adjacent device regions, the heat conducting unit is disposed close to a second device region, where the second device region is a device region where devices with higher thermal power are disposed.
In some implementations, a terminal with a thermally conductive structure is also provided, including a housing and a module with a thermally conductive structure, the housing being coupled to the module. The method can be applied to terminals with larger data reading and storage and higher heating power, such as a biological characteristic identification box, a mobile payment terminal, a data acquisition or transmission base station and the like. The heat effect concentration caused by larger thermal power of the device and the superposition of the heat effect among different devices are avoided, the heat dispersion is improved, and the use reliability of the device is improved.
Claims (16)
1. A heat conducting structure, comprising:
a substrate for carrying devices, the substrate comprising a plurality of device regions for carrying devices;
and the heat conducting unit is used for radiating heat and is arranged between two adjacent device areas.
2. The structure of claim 1, wherein a plurality of the device regions and the heat conducting unit are disposed on the same surface of the substrate.
3. The structure of claim 1, wherein a plurality of the device regions are disposed on one side of the substrate, and the heat conductive unit is disposed on the other side of the substrate.
4. The heat transfer structure according to any one of claims 1 to 3, wherein the positional relationship between the extending directions of two adjacent device regions is collinear or parallel.
5. The heat transfer structure according to any one of claims 1 to 3, wherein the extending directions of two adjacent device regions are in a positional relationship of intersecting.
6. The structure of claim 5, wherein the heat conducting unit is disposed at a position where two adjacent device regions intersect.
7. The structure of claim 5, wherein the substrate is U-shaped.
8. The heat conducting structure according to claim 1, wherein the heat conducting unit has a heat conductivity greater than that of the substrate.
9. The structure of claim 8, wherein the substrate comprises an aluminum substrate and the heat conducting unit comprises a copper-based heat conducting unit.
10. A module having a thermally conductive structure, comprising:
a substrate for carrying devices, the substrate comprising a plurality of device regions for carrying devices;
the heat conducting unit is used for radiating heat and arranged between two adjacent device areas;
a device, the device being matched to the device region.
11. Module with heat conducting structure according to claim 10, characterized in that the device areas are matched to the position and/or number of the devices.
12. The module having a thermally conductive structure of claim 10, wherein the device comprises one of: power device, light emitting device.
13. The module having a thermally conductive structure of claim 10, wherein the device comprises one of: white light lamp, infrared lamp, ultraviolet lamp, yellow light lamp, purple light lamp, blue light lamp, green light lamp.
14. The module with a heat conducting structure according to claim 10, wherein in two adjacent device regions, the extending direction of the heat conducting unit intersects with the extending direction of a first device region, wherein the first device region is a device region provided with devices with lower thermal power consumption.
15. The module with a heat conducting structure according to claim 10 or 14, wherein in two adjacent device regions, the heat conducting unit is disposed close to a second device region, wherein the second device region is a device region provided with a device with higher thermal power.
16. A terminal with a heat conducting structure is characterized by comprising a shell and a module with the heat conducting structure, wherein the shell is connected with the module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020179027.2U CN211204000U (en) | 2020-02-17 | 2020-02-17 | Heat conduction structure, module with heat conduction structure and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020179027.2U CN211204000U (en) | 2020-02-17 | 2020-02-17 | Heat conduction structure, module with heat conduction structure and terminal |
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| Publication Number | Publication Date |
|---|---|
| CN211204000U true CN211204000U (en) | 2020-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020179027.2U Active CN211204000U (en) | 2020-02-17 | 2020-02-17 | Heat conduction structure, module with heat conduction structure and terminal |
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| Country | Link |
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| CN (1) | CN211204000U (en) |
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- 2020-02-17 CN CN202020179027.2U patent/CN211204000U/en active Active
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