CN211184783U - Packaging heat dissipation structure for circuit board - Google Patents
Packaging heat dissipation structure for circuit board Download PDFInfo
- Publication number
- CN211184783U CN211184783U CN202020012784.0U CN202020012784U CN211184783U CN 211184783 U CN211184783 U CN 211184783U CN 202020012784 U CN202020012784 U CN 202020012784U CN 211184783 U CN211184783 U CN 211184783U
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- China
- Prior art keywords
- heat dissipation
- dissipation mechanism
- circuit board
- mechanism plate
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 112
- 238000004806 packaging method and process Methods 0.000 title description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 230000005855 radiation Effects 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims abstract description 6
- 241000883990 Flabellum Species 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 12
- 230000009977 dual effect Effects 0.000 abstract description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Abstract
The utility model discloses a circuit board is with encapsulation heat radiation structure belongs to circuit board heat dissipation technical field, including heat dissipation mechanism board, a plurality of vertical basin and horizontal basin have been seted up to heat dissipation mechanism inboard portion, all welded mounting has circulation tank on the both ends lateral wall about the heat dissipation mechanism board, the inside fixed mounting of circulation tank has miniature water pump of drawing, the connecting pipe is installed to both ends intercommunication about the circulation tank, the connecting pipe communicates in the horizontal basin of heat dissipation mechanism inboard portion, a plurality of radiating grooves have been seted up on the heat dissipation mechanism board surface, heat dissipation mechanism board lower extreme welded mounting has the heat dissipation case, the inside fixed mounting of heat dissipation case has two miniature heat dissipation fan. The utility model relates to a novelty, be convenient for operation and excellent in use effect have utilized circulation radiating mode and dual heat dissipation mechanism, dispel the heat to the circuit board effectively, promote the radiating effect, improve the radiating power, the quick heat dissipation that dispels.
Description
Technical Field
The utility model relates to a circuit board heat dissipation technical field especially relates to a circuit board is with encapsulation heat radiation structure.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, the English name is PCB, FPC circuit board (FPC circuit board is also called as flexible circuit board) which is made of polyimide or polyester film as a base material and has the characteristics of high reliability and excellent flexibility, high wiring density, light weight, thin thickness and good bending property), and the birth and development of FPC and PCB of the rigid-flexible printed circuit board and the rigid-flexible printed circuit board, and the birth and development of the rigid-flexible printed circuit board are promoted. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
Patent number CN206442576U discloses an encapsulation heat radiation structure for circuit board, including the circuit board body, circuit board body upper surface is provided with heat abstractor, and heat abstractor includes main heat dissipation plate, has evenly arranged a plurality of dispersion hot plates on the main heat dissipation plate, has evenly arranged a plurality of radiating fin on the dispersion plate, radiating fin includes one-level radiating fin, is equipped with two second grade radiating fin on the one-level radiating fin, is equipped with two tertiary radiating fin on every second grade radiating fin. The beneficial effects of the utility model are that under the limited circumstances of circuit board body surface area, arrange multistage heating panel and radiating fin and make the radiating effect more obvious, very big improvement the radiating effect, certain popularization and application prospect has.
The above patents have the following disadvantages: 1. the heat dissipation effect is poor, the circuit board cannot be effectively dissipated, the heat dissipation power is low, and the circuit board cannot be dissipated circularly; 2. and a double heat dissipation mechanism is not adopted, so that the heat dissipation area of the circuit board is small, and the quick heat dissipation cannot be realized. Therefore, a package heat dissipation structure for a circuit board is provided.
SUMMERY OF THE UTILITY MODEL
The utility model provides a packaging heat dissipation structure for a circuit board, which has novel design, convenient operation and good use effect, and aims to effectively dissipate heat of the circuit board by utilizing a circulating heat dissipation mode through a horizontal water tank, a vertical water tank and a miniature water drawing pump, thereby improving the heat dissipation effect and the heat dissipation power; through miniature heat dissipation fan and radiating groove, can adopt dual heat dissipation mechanism, increase the heat radiating area of circuit board, quick dispels the heat.
The utility model provides a specific technical scheme as follows:
The utility model provides a pair of circuit board is with encapsulation heat radiation structure, including heat dissipation mechanism board, a plurality of vertical basin and horizontal basin are seted up to heat dissipation mechanism board inside, communicate each other between vertical basin and the horizontal basin, all welded mounting has circulation tank on the both ends lateral wall about the heat dissipation mechanism board, the inside fixed mounting of circulation tank has miniature water pump of drawing, the connecting pipe is installed to both ends intercommunication about the circulation tank, the connecting pipe communicates in the horizontal basin of heat dissipation mechanism inboard, a plurality of radiating grooves have been seted up on the heat dissipation mechanism board surface, heat dissipation mechanism board upper end fixed mounting has the bars of giving vent to anger, heat dissipation mechanism board lower extreme welded mounting has the heat dissipation case, the inside fixed mounting of heat dissipation case has two miniature heat dissipation fan, heat dissipation case lower extreme fixed mounting has the air intake bars.
Optionally, a spiral gas groove, a gas guide groove and an air inlet groove are formed in the heat dissipation groove, the gas guide groove is located at the lower end of the air inlet groove, the spiral gas groove is located at the lower end of the gas guide groove, and a plurality of spiral grooves are formed in the spiral gas groove.
Optionally, a rotary motor is fixedly mounted on the miniature heat dissipation fan, a rotating shaft is fixedly mounted at the upper end of the rotary motor, a blade disc is welded to the upper end of the rotating shaft, and fan blades are fixedly mounted on the blade disc.
Optionally, the upper end and the lower end of the miniature water drawing pump are both provided with water flow ports, a pump shaft is installed in the center of the interior of the miniature water drawing pump, and pump blades are fixedly installed on the pump shaft.
Optionally, the heat sink is disposed between each vertical water tank on the surface of the heat sink mechanism plate.
The utility model has the advantages as follows:
1. The utility model relates to a novelty, be convenient for operation and excellent in use effect, it is horizontal through being equipped with, vertical basin and miniature water drawing pump, miniature water drawing pump fixed mounting is in the circulating water tank, horizontal basin, fill the comdenstion water in vertical basin and the circulating water tank, switch is opened, miniature water drawing pump circular telegram is worked, the pump shaft is rotatory, it rotates to drive the pump leaf, form circulating water flow, rivers flow in from the running water mouth of miniature water drawing pump one end, flow from the running water mouth of miniature water drawing pump other end, in connecting tube flow to horizontal basin and the vertical basin through the intercommunication, the comdenstion water circulation flow in driving horizontal basin and the vertical basin, with this, take away a large amount of heats on the circuit board, reach radiating purpose, so, usable circulation radiating mode, dispel the heat to the circuit board effectively, promote the radiating effect, the radiating power.
2. The utility model discloses a be equipped with miniature heat dissipation fan and radiating groove, power switch is opened, the work of rotating motor circular telegram, it rotates to drive the axis of rotation, the axis of rotation drives the bladed disk rotatory, the bladed disk drives the flabellum rotatory, form the air current, get into the air inlet duct that passes through the radiating groove with the air current, it is leading-in to spiral gas groove through air guide duct, be provided with the helicla flute in the spiral gas groove, the helicla flute is helical structure, can form the spiral air current with the air current, dispel the heat to the circuit board, increase radiating area of radiating circuit board, so, can adopt dual heat dissipation mechanism, increase the heat radiating area of circuit board.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of a package heat dissipation structure for a circuit board according to an embodiment of the present invention;
Fig. 2 is a schematic structural view of a heat dissipation groove of a package heat dissipation structure for a circuit board according to an embodiment of the present invention;
Fig. 3 is a schematic structural view of a micro heat dissipation fan of a package heat dissipation structure for a circuit board according to an embodiment of the present invention;
Fig. 4 is a schematic view of a micro water drawing pump of a package heat dissipation structure for a circuit board according to an embodiment of the present invention.
In the figure: 1. a heat dissipation box; 2. a connecting pipe; 3. a circulating water tank; 4. a micro water drawing pump; 5. a vertical water tank; 6. a heat sink; 7. an air outlet grid; 8. a transverse water tank; 9. a heat dissipating mechanism plate; 10. an air intake grill; 11. a micro heat dissipation fan; 12. a spiral gas groove; 13. a helical groove; 14. a gas guide groove; 15. an air inlet groove; 16. a rotary motor; 17. a leaf disc; 18. a fan blade; 19. a rotating shaft; 20. a water flowing port; 21. a pump blade; 22. and a pump shaft.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
A package heat dissipation structure for a circuit board according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 4.
Referring to fig. 1, an encapsulated heat dissipation structure for a circuit board provided by an embodiment of the present invention includes a heat dissipation mechanism plate 9, a plurality of vertical water channels 5 and horizontal water channels 8 are formed inside the heat dissipation mechanism plate 9, the vertical water channels 5 and the horizontal water channels 8 are communicated with each other, a circulation water tank 3 is welded and mounted on the outer side walls of the left and right ends of the heat dissipation mechanism plate 9, a micro water pump 4 is fixedly mounted inside the circulation water tank 3, a connecting pipe 2 is communicated and mounted at the upper and lower ends of the circulation water tank 3, the connecting pipe 2 is communicated with the horizontal water channels 8 inside the heat dissipation mechanism plate 9, a plurality of heat dissipation grooves 6 are formed on the surface of the heat dissipation mechanism plate 9, an air outlet grid 7 is fixedly mounted at the upper end of the heat dissipation mechanism plate 9, a heat dissipation box 1 is welded and mounted at the lower end of the heat dissipation mechanism plate 9, two micro heat dissipation, the air inlet grid 10 is fixedly mounted at the lower end of the heat dissipation box 1, a circulating heat dissipation mode and a dual heat dissipation mechanism are utilized, the circuit board is effectively cooled, the heat dissipation effect is improved, the heat dissipation power is improved, and heat dissipation is rapidly carried out.
Referring to fig. 2, a spiral gas groove 12, a gas guide groove 14 and an air inlet groove 15 are formed in the heat dissipation groove 6, the gas guide groove 14 is located at the lower end of the air inlet groove 15, the spiral gas groove 12 is located at the lower end of the gas guide groove 14, a plurality of spiral grooves 13 are formed in the spiral gas groove 12, and the heat dissipation groove 6 is used for increasing the heat dissipation area of the circuit board and dissipating heat quickly.
Referring to fig. 3, fixed mounting has rotary motor 16 on the miniature heat dissipation fan 11, rotary motor 16 upper end fixed mounting has axis of rotation 19, axis of rotation 19 upper end welded mounting has bladed disk 17, fixed mounting has flabellum 18 on the bladed disk 17, and miniature heat dissipation fan 11 adopts double heat dissipation mechanism, increases the heat radiating area of circuit board, and the quick heat dissipation that dispels the heat.
Referring to fig. 4, the upper end and the lower end of the micro water drawing pump 4 are both provided with water flow ports 20, a pump shaft 22 is installed at the center inside the micro water drawing pump 4, pump blades 21 are fixedly installed on the pump shaft 22, and the micro water drawing pump 4 effectively dissipates heat of the circuit board by means of a circulating heat dissipation mode, so that the heat dissipation effect is improved, and the heat dissipation power is improved.
Referring to fig. 1, the heat dissipation grooves 6 are formed between the vertical water grooves 5 on the surface of the heat dissipation mechanism plate 9, and the heat dissipation grooves 6 increase the heat dissipation area of the circuit board.
The embodiment of the utility model provides a circuit board is with encapsulation heat radiation structure, when using, miniature water drawing pump 4 and miniature heat radiation fan 11 are supplied power by external power control, through being equipped with horizontal, vertical basin and miniature water drawing pump 4, miniature water drawing pump 4 is fixed mounting in circulating water tank 3, fill with the comdenstion water in horizontal basin 8, vertical basin 5 and circulating water tank 3, open switch, miniature water drawing pump 4 circular telegram work, pump shaft 22 rotates, drive pump leaf 21 rotates, form the circulation rivers, rivers flow in from the running water mouth 20 of miniature water drawing pump 4 one end, flow out from the running water mouth 20 of miniature water drawing pump 4 other end, flow to horizontal basin 8 and vertical basin 5 through connecting pipe 2 that communicates, drive the comdenstion water circulation flow in horizontal basin 8 and vertical basin 5, so, take away a large amount of heat on the circuit board, reach the radiating purpose, therefore, the circuit board can be effectively radiated by using a circulating radiating mode, the radiating effect is improved, and the radiating power is improved; through being equipped with miniature heat dissipation fan 11 and radiating groove 6, turn on switch, 16 circular telegram work of rotary motor, it rotates to drive axis of rotation 19, axis of rotation 19 drives bladed disk 17 rotatory, bladed disk 17 drives flabellum 18 rotatory, form the air current, get into the air inlet duct 15 of radiating groove 6 with the air current, it is leading-in to spiral gas groove 12 to lead to through air guide duct 14, be provided with helicla flute 13 in the spiral gas groove 12, helicla flute 13 is helical structure, can form the spiral air current with the air current, dispel the heat to the circuit board, increase radiating circuit board's heat radiating area, therefore, can adopt dual heat dissipation mechanism, increase circuit board's heat radiating area, the quick heat dissipation that dispels.
The miniature water drawing pump 4 is a common BSP40160TAC model on the market; the miniature heat dissipation fan 11 is a common model XD3007 in the market.
It should be noted that the utility model relates to a circuit board packaging heat dissipation structure, which comprises a heat dissipation box 1; a connecting pipe 2; a circulating water tank 3; a micro water drawing pump 4; a vertical water tank 5; a heat dissipation groove 6; an air outlet grid 7; a transverse water tank 8; a heat dissipation mechanism plate 9; an intake grill 10; a micro heat dissipation fan 11; a spiral gas groove 12; a spiral groove 13; a gas guiding groove 14; an air intake duct 15; a rotation motor 16; a leaf disc 17; fan blades 18; a rotating shaft 19; a water flow port 20; a pump blade 21; the pump shaft 22 and the above electrical components are all prior art products, and those skilled in the art select, install and complete the debugging operation of the circuit according to the use requirement, so as to ensure that each electrical appliance can work normally, and the components are all universal standard components or components known by those skilled in the art, and the structure and principle thereof are known by the technical manual or by the conventional experimental method, and the applicant does not make specific limitations here.
It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (5)
1. The utility model provides a circuit board is with encapsulation heat radiation structure which characterized in that: the heat dissipation mechanism plate comprises a heat dissipation mechanism plate (9), a plurality of vertical water channels (5) and transverse water channels (8) are arranged in the heat dissipation mechanism plate (9), the vertical water channels (5) and the transverse water channels (8) are communicated with each other, circulating water tanks (3) are welded on the outer side walls of the left end and the right end of the heat dissipation mechanism plate (9), a micro water drawing pump (4) is fixedly arranged in each circulating water tank (3), connecting pipes (2) are communicated with the upper end and the lower end of each circulating water tank (3), the connecting pipes (2) are communicated with the transverse water channels (8) in the heat dissipation mechanism plate (9), a plurality of heat dissipation grooves (6) are arranged on the surface of the heat dissipation mechanism plate (9), an air outlet grid (7) is fixedly arranged at the upper end of the heat dissipation mechanism plate (9), a heat dissipation box (1) is welded at the lower end of the heat dissipation mechanism plate (9), and two micro heat dissipation fans (11, and an air inlet grid (10) is fixedly arranged at the lower end of the heat dissipation box (1).
2. The package heat dissipation structure of claim 1, wherein: spiral gas groove (12), air guide groove (14) and air inlet groove (15) have been seted up on radiating groove (6), air guide groove (14) are located air inlet groove (15) lower extreme, spiral gas groove (12) are located air guide groove (14) lower extreme, be provided with a plurality of helicla flutes (13) in spiral gas groove (12).
3. The package heat dissipation structure of claim 1, wherein: fixed mounting has rotating motor (16) on miniature heat dissipation fan (11), rotating motor (16) upper end fixed mounting has axis of rotation (19), axis of rotation (19) upper end welded mounting has bladed disk (17), fixed mounting has flabellum (18) on bladed disk (17).
4. The package heat dissipation structure of claim 1, wherein: the water inlet (20) is formed in each of the upper end and the lower end of the miniature water drawing pump (4), a pump shaft (22) is mounted in the center of the interior of the miniature water drawing pump (4), and pump blades (21) are fixedly mounted on the pump shaft (22).
5. The package heat dissipation structure of claim 1, wherein: the heat dissipation grooves (6) are arranged between every two vertical water tanks (5) on the surface of the heat dissipation mechanism plate (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020012784.0U CN211184783U (en) | 2020-01-06 | 2020-01-06 | Packaging heat dissipation structure for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020012784.0U CN211184783U (en) | 2020-01-06 | 2020-01-06 | Packaging heat dissipation structure for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211184783U true CN211184783U (en) | 2020-08-04 |
Family
ID=71799846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020012784.0U Expired - Fee Related CN211184783U (en) | 2020-01-06 | 2020-01-06 | Packaging heat dissipation structure for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211184783U (en) |
-
2020
- 2020-01-06 CN CN202020012784.0U patent/CN211184783U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200804 |
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| CF01 | Termination of patent right due to non-payment of annual fee |