CN211930956U - High-efficient radiating circuit board - Google Patents

High-efficient radiating circuit board Download PDF

Info

Publication number
CN211930956U
CN211930956U CN202020589818.2U CN202020589818U CN211930956U CN 211930956 U CN211930956 U CN 211930956U CN 202020589818 U CN202020589818 U CN 202020589818U CN 211930956 U CN211930956 U CN 211930956U
Authority
CN
China
Prior art keywords
circuit board
heat dissipation
heat
fixedly connected
conducting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020589818.2U
Other languages
Chinese (zh)
Inventor
任雷成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Dalibang Precision Manufacturing Co ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN202020589818.2U priority Critical patent/CN211930956U/en
Application granted granted Critical
Publication of CN211930956U publication Critical patent/CN211930956U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a high-efficient radiating circuit board, including circuit board body, safety cover, heat-conducting plate, sleeve pipe, air inlet and heat dissipation mechanism, the top fixedly connected with safety cover of circuit board body, the fixedly connected with heat-conducting plate of mid point department at circuit board body top, the fixedly connected with sleeve pipe of mid point department at heat-conducting plate top, the sheathed tube top is run through the safety cover and is extended to its outside, the air inlet has all been seted up to the bottom of the safety cover left and right sides, the surface of safety cover is provided with heat dissipation mechanism, heat dissipation mechanism includes two heat dissipation motors. The utility model discloses a circuit board body, safety cover, heat-conducting plate, sleeve pipe, air inlet, heat dissipation motor, heat dissipation pivot, the blade of blowing, radiating fin, air vent, baffle, air discharge fan and gas vent mutually support, can effectively dispel the heat to the circuit board to avoid the circuit board to damage because of high temperature, greatly improved the life of circuit board.

Description

High-efficient radiating circuit board
Technical Field
The utility model relates to a circuit board technical field specifically is a high-efficient radiating circuit board.
Background
The circuit board is miniaturized and visualized, plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, needs to be radiated in order to prevent danger caused by overheating in the using process, is poor in common circuit board radiating effect, cannot effectively radiate the circuit board, and accordingly the circuit board is damaged due to high temperature.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient radiating circuit board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a circuit board capable of efficiently dissipating heat comprises a circuit board body, a protective cover, a heat conducting plate, a sleeve, an air inlet and a heat dissipation mechanism, wherein the protective cover is fixedly connected to the top of the circuit board body;
the utility model discloses a heat dissipation mechanism, including heat dissipation motor, heat-conducting plate top, heat dissipation motor, heat dissipation mechanism, heat dissipation motor.
Preferably, the heat radiating fin is made of an aluminum thin plate.
Preferably, the shape of the vent hole is conical.
Preferably, the front side and the rear side of the partition plate are fixedly connected with the inner wall of the sleeve.
Preferably, the heat conducting plate is formed by punching and molding a heat conducting metal plate.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses a circuit board body, safety cover, heat-conducting plate, sleeve pipe, air inlet, heat dissipation mechanism, heat dissipation motor, heat dissipation pivot, the blade of blowing, radiating fin, air vent, baffle, air discharge fan and gas vent mutually support, can effectively dispel the heat to the circuit board to avoid the circuit board to damage because of high temperature, greatly improved the life of circuit board.
Drawings
FIG. 1 is a structural section view in elevation of the present invention;
fig. 2 is a structural section view of the front view of the heat dissipating fin of the present invention.
In the figure: 1 circuit board body, 2 safety covers, 3 heat-conducting plates, 4 sleeves, 5 air inlets, 6 heat-dissipating mechanisms, 601 heat-dissipating motors, 602 heat-dissipating rotating shafts, 603 blowing blades, 604 heat-dissipating fins, 605 air vents, 606 partition plates, 607 exhaust fans and 608 air outlets.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-2, a circuit board with high heat dissipation efficiency, which comprises a circuit board body 1, a protection cover 2, a heat conducting plate 3, a sleeve 4, an air inlet 5 and a heat dissipation mechanism 6, wherein the protection cover 2 is fixedly connected to the top of the circuit board body 1, the heat conducting plate 3 is fixedly connected to the middle point of the top of the circuit board body 1, the heat conducting plate 3 is formed by punching a heat conducting metal plate, the sleeve 4 is fixedly connected to the middle point of the top of the heat conducting plate 3, the top of the sleeve 4 penetrates through the protection cover 2 and extends to the outside of the protection cover, the air inlet 5 is arranged at the bottom of the.
Heat dissipation mechanism 6 includes two heat dissipation motors 601, the left and right sides at safety cover 2 is installed to two heat dissipation motor 601 symmetries, fixedly connected with heat dissipation pivot 602 on heat dissipation motor 601's the output shaft, heat dissipation pivot 602 is kept away from the one end of heat dissipation motor 601 and is run through safety cover 2 and extend to its inside fixedly connected with fan blade 603, the equal fixedly connected with radiating fin 604 of the left and right sides at heat-conducting plate 3 top, radiating fin 604 is made by aluminium sheet metal, air vent 605 has been seted up on radiating fin 604's surface, air vent 605's shape is the toper, the midpoint department at heat-conducting plate 3 top just is located the inside fixed connection in position of sleeve 4 baffle 606, both sides all with sleeve 4's inner wall fixed connection around the baffle 606, the top fixed mounting of sleeve 4 inner wall has air discharge fan.
During the use, when circuit board body 1 during operation, start radiating motor 601 and air discharge fan 607, absorb the heat that circuit board body 1 produced by heat-conducting plate 3, then give radiating fin 604 heat transfer, it is rotatory simultaneously to drive heat dissipation pivot 602 and the blade 603 of blowing in proper order by radiating motor 601, thereby blow the heat dissipation to radiating fin 604, make the heat on radiating fin 604 surface blown to inside the sleeve pipe 4, because air vent 605 is the toper, consequently, when the air passes through air vent 605, can make the air velocity of flow fast, the friction increases, can consume the heat in the air simultaneously, thereby can effectively reduce the temperature on radiating fin 604 surface, then outwards discharge the inside air of sleeve pipe 4 by air discharge fan 607 is continuous, thereby make the inside heat of safety cover 2 can be discharged fast, improve the radiating efficiency.
The utility model discloses the electrical components who appears in all are connected with external master controller electricity to the master controller can be for the computer etc. to play the conventional known equipment of control, the utility model discloses in circuit and control that relate to be prior art, do not carry out too much repetitious description here.
To sum up, the utility model discloses a circuit board body 1, safety cover 2, heat-conducting plate 3, sleeve pipe 4, air inlet 5, heat dissipation mechanism 6, heat dissipation motor 601, heat dissipation pivot 602, the blade 603 of blowing, radiating fin 604, air vent 605, baffle 606, air discharge fan 607 and gas vent 608 mutually support can effectively dispel the heat to the circuit board to avoid the circuit board to damage because of high temperature, greatly improved the life of circuit board.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a high-efficient radiating circuit board, includes circuit board body (1), safety cover (2), heat-conducting plate (3), sleeve pipe (4), air inlet (5) and heat dissipation mechanism (6), its characterized in that: the heat dissipation structure comprises a circuit board body (1), a protection cover (2) is fixedly connected to the top of the circuit board body (1), a heat conduction plate (3) is fixedly connected to the middle point of the top of the circuit board body (1), a sleeve (4) is fixedly connected to the middle point of the top of the heat conduction plate (3), the top of the sleeve (4) penetrates through the protection cover (2) and extends to the outside of the protection cover, air inlets (5) are formed in the bottoms of the left side and the right side of the protection cover (2), and a heat dissipation mechanism (6) is arranged on;
the heat dissipation mechanism (6) comprises two heat dissipation motors (601), the two heat dissipation motors (601) are symmetrically arranged at the left side and the right side of the protective cover (2), the output shaft of the heat dissipation motor (601) is fixedly connected with a heat dissipation rotating shaft (602), one end of the heat radiation rotating shaft (602) far away from the heat radiation motor (601) penetrates through the protective cover (2) and extends to the interior of the protective cover to be fixedly connected with a blowing blade (603), the left side and the right side of the top of the heat conducting plate (3) are both fixedly connected with radiating fins (604), the surface of the radiating fin (604) is provided with a vent hole (605), the middle point of the top of the heat conducting plate (3) and the position inside the sleeve (4) are fixedly connected with a clapboard (606), the top fixed mounting of sleeve pipe (4) inner wall has air discharge fan (607), gas vent (608) have all been seted up to the bottom of sleeve pipe (4) left and right sides.
2. A circuit board with high heat dissipation efficiency as defined in claim 1, wherein: the heat radiating fins (604) are made of an aluminum thin plate.
3. A circuit board with high heat dissipation efficiency as defined in claim 1, wherein: the vent (605) is tapered in shape.
4. A circuit board with high heat dissipation efficiency as defined in claim 1, wherein: the front side and the rear side of the partition plate (606) are fixedly connected with the inner wall of the sleeve (4).
5. A circuit board with high heat dissipation efficiency as defined in claim 1, wherein: the heat conducting plate (3) is formed by punching a heat conducting metal plate.
CN202020589818.2U 2020-04-20 2020-04-20 High-efficient radiating circuit board Active CN211930956U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020589818.2U CN211930956U (en) 2020-04-20 2020-04-20 High-efficient radiating circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020589818.2U CN211930956U (en) 2020-04-20 2020-04-20 High-efficient radiating circuit board

Publications (1)

Publication Number Publication Date
CN211930956U true CN211930956U (en) 2020-11-13

Family

ID=73327972

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020589818.2U Active CN211930956U (en) 2020-04-20 2020-04-20 High-efficient radiating circuit board

Country Status (1)

Country Link
CN (1) CN211930956U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114916124A (en) * 2022-04-19 2022-08-16 厦门新锐创意电子科技有限公司 Aluminum-based multilayer printed circuit board capable of rapidly dissipating heat and manufacturing method thereof
TWI864459B (en) * 2022-10-18 2024-12-01 宏碁股份有限公司 Heat dissipation module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114916124A (en) * 2022-04-19 2022-08-16 厦门新锐创意电子科技有限公司 Aluminum-based multilayer printed circuit board capable of rapidly dissipating heat and manufacturing method thereof
TWI864459B (en) * 2022-10-18 2024-12-01 宏碁股份有限公司 Heat dissipation module

Similar Documents

Publication Publication Date Title
CN211930956U (en) High-efficient radiating circuit board
CN206039410U (en) Imitate water -cooled computer by force
WO2021184946A1 (en) Waterproof computer moving head spot light having efficient heat dissipation function
CN111414059A (en) Computer machine case water-cooling heat abstractor
CN210555610U (en) Unmanned aerial vehicle's heat radiation structure
CN212056886U (en) High-efficient radiating waterproof computer lamp holder of shaking head
CN210725688U (en) High heat dissipation type panel beating machine case
CN210744905U (en) Quick radiating car fan motor front end housing
CN208386082U (en) A kind of busbar side board of high heat dispersion
CN206922590U (en) An energy-saving motor
CN111405817A (en) Integrated water-cooling/air-cooling heat dissipation system of motor controller
CN211831688U (en) Controller heat abstractor
CN205405376U (en) Quick -witted case of high -efficient heat dissipation of computer
CN212112399U (en) Air-cooled heat dissipation device for display card
CN211826874U (en) Projector cooling system
CN216291907U (en) Heat dissipation structure for charging pile module
CN210270777U (en) Cooling system for computer and computer
CN220858739U (en) Power supply casing capable of rapidly radiating
CN207424777U (en) A kind of cooling cabinet
CN206672004U (en) A kind of outer surface heat abstractor
CN219513193U (en) Battery box structure with heat radiation structure
CN211127832U (en) Gateway cabinet easy to dissipate heat
CN205956073U (en) A hybrid heat dissipation blade and a blower using the same
CN210519326U (en) Electrical apparatus box heat radiation structure, electrical apparatus box structure and air conditioning equipment
CN217495201U (en) Three-dimensional printing equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20221201

Address after: 214,000 Hongshan Industrial Resettlement Area, Hongshan Street, New District, Wuxi City, Jiangsu Province

Patentee after: JIANGSU DALIBANG PRECISION MANUFACTURING CO.,LTD.

Address before: 362000 Houyao 56, Hucuo Village, Tuzhai Town, Huian County, Quanzhou City, Fujian Province

Patentee before: Zhang Zhentao