CN211184406U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
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- CN211184406U CN211184406U CN201922177740.3U CN201922177740U CN211184406U CN 211184406 U CN211184406 U CN 211184406U CN 201922177740 U CN201922177740 U CN 201922177740U CN 211184406 U CN211184406 U CN 211184406U
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Abstract
The utility model provides a multilayer printed circuit board belongs to circuit board technical field, a multilayer printed circuit board, including the frame subassembly, the frame subassembly includes left frame and right frame, the circuit board subassembly, left frame, right frame are located circuit board subassembly's the left and right sides, the circuit board subassembly includes the base plate, two first circuit layers, two first insulation layers, two second circuit layers, still including running through the second circuit layer, the first insulation layer, two stay tubes on first circuit layer, the outer wall of two stay tubes all is fixed with the fixture block, the upper and lower surface of base plate all is fixed with the stopper that is L shape, the stopper is connected with the fixture block buckle, first through-hole, second through-hole have been seted up to the outer wall of stay tube, first through-hole and first circuit layer are at same horizontal plane, the second through-hole and second circuit layer are at same horizontal plane.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a multilayer printed circuit board.
Background
The circuit board has the name: the printed circuit board comprises a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The multilayer circuit board has the advantages that the bending and tilting condition of the board is easy to occur after the multilayer circuit board is used for a long time, the normal work of an internal wiring circuit is influenced, a large amount of heat is easy to generate by the circuit board, the working state of internal electronic components is abnormal in serious conditions, and in addition, the outer side is easy to damage.
Disclosure of Invention
The utility model aims at providing a multilayer printed circuit board, its structure is firm, and effective protection circuit board's normal work, the radiating effect is good.
In order to achieve the above object, the present invention provides a multilayer printed circuit board, including:
a frame assembly including a left frame and a right frame; a first groove and a second groove are respectively formed in the right side wall of the left frame and the left side wall of the right frame;
the left frame and the right frame are positioned on the left side and the right side of the circuit board assembly, and the circuit board assembly comprises a substrate, two first circuit layers, two first insulating layers and two second circuit layers; the left end and the right end of the substrate, the left end and the right end of the two first circuit layers, the left end and the right end of the two first insulating layers and the left end and the right end of the two second circuit layers are respectively filled in the first groove and the second groove;
the two first circuit layers are respectively positioned at the upper side and the lower side of the substrate, the two first insulating layers are respectively positioned at the outer sides of the two first circuit layers, and the two second circuit layers are respectively positioned at the outer sides of the two first insulating layers;
the clamping block type LED display panel is characterized by further comprising two supporting tubes penetrating through the second circuit layer, the first insulating layer and the first circuit layer, clamping blocks are fixed on the outer walls of the two supporting tubes, L-shaped limiting blocks are fixed on the upper surface and the lower surface of the substrate, the clamping blocks and the limiting blocks are located between the first circuit layer and the substrate, the limiting blocks are connected with the clamping blocks in a clamping mode, first through holes and second through holes are formed in the outer walls of the supporting tubes, the first through holes and the first circuit layer are located on the same horizontal plane, and the second through holes and the second circuit layer are located on the same horizontal plane.
Furthermore, two the second circuit layer is opened and is all equipped with the blind hole, the blind hole runs through laminating in proper order the second circuit layer first insulating layer first circuit layer.
Further, radiating holes are formed in the side wall of the left frame and the side wall of the right frame and are located on the left side and the right side of the first circuit layer.
Furthermore, a second insulating layer is filled between the substrate and the first circuit layer, and the fixture block and the limiting block are embedded in the second insulating layer.
Furthermore, the outer wall of the first circuit layer is provided with an anti-corrosion layer, the blind hole and the supporting tube penetrate through the anti-corrosion layer, and the anti-corrosion layer is located between the left frame and the right frame.
The utility model discloses be provided with the stay tube, reduce the possibility of buckling, the stay tube still is provided with first through-hole, second through-hole, first through-hole heat of discharging on first circuit board and the second circuit board accessible stay tube, improves the radiating effect, is equipped with stopper and fixture block joint in addition, compact structure improves overall structure's stability, and left frame and the right frame protection circuit board subassembly outside avoid the outside impaired, effective protection circuit board's normal work, and the radiating effect is good.
The present invention will be described in further detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic structural view of a multilayer printed wiring board of embodiment 1;
fig. 2 is a partially enlarged schematic structural view of the multilayer printed circuit board of embodiment 1.
In the figure:
1. a frame assembly; 11. a left frame; 12. a right frame; 2. a circuit board assembly; 21. a substrate; 211. a limiting block; 22. a first circuit layer; 23. a first insulating layer; 24. a second circuit layer; 3. supporting a tube; 31. a clamping block; 32. a first through hole; 33. a second through hole; 4. blind holes; 5. heat dissipation holes; 6. a second insulating layer; 7. and an anti-corrosion layer.
Detailed Description
Example 1
The embodiment provides a multilayer printed circuit board, as shown in fig. 1-2, the multilayer printed circuit board comprises a frame assembly 1, the frame assembly 1 comprises a left frame 11 and a right frame 12, a first groove and a second groove are respectively formed in a right side wall of the left frame 11 and a left side wall of the right frame 12, the left frame 11 and the right frame 12 are located on the left side and the right side of the circuit board assembly 2, the circuit board assembly 2 comprises a substrate 21, two first circuit layers 22, two first insulating layers 23 and two second circuit layers 24, the left end and the right end of the substrate 21, the left end and the right end of the two first circuit layers 22, the left end and the right end of the two first insulating layers 23 and the left end and the right end of the two second circuit layers 24 are respectively filled in the first groove and the second groove, the two first circuit layers 22 are respectively located on the upper side and the lower side of the substrate 21, the two first insulating layers 23 are respectively located on the outer sides of the two first circuit layers 22, the two second circuit layers 24 are respectively located on the outer sides of the two first insulating layers 23, a clamping block fixing holes 353 and a clamping block 32 are formed between the first circuit layers 21 and a horizontal plane, the first through hole 31 and a clamping block 32, the second through hole 31 and a clamping block 32 are connected with the first through hole 21, the second through hole 21, the clamping block 32, the clamping block 21, the clamping block 32 is located on the same.
The utility model discloses be provided with the stay tube 3, stay tube 3 runs through anti-corrosion layer 7, first circuit layer 22, first insulating layer 23, second circuit layer 24, second insulating layer 6, make things convenient for the processing design of structure, improve the structural stability of whole circuit board, reduce the possibility of buckling, stay tube 3 still is provided with first through-hole 32, second through-hole 33 on first circuit board 22 and the second circuit board 24 accessible stay tube 3, first through-hole 32 heat of discharging, improve the radiating effect, be equipped with stopper 211 and the fixture block 31 joint that is L shape in addition, fixture block 31 is filled and is carried out the chucking in the cove of stopper 211, compact structure, improve overall structure's stability, left side frame 11 and right frame 12 protect circuit board subassembly 2 outsides, avoid the outside impaired, effective protect circuit board's normal work, the radiating effect is good, anti-corrosion layer 7, first circuit layer 22, first insulating layer 23, second circuit layer 24, second insulating layer 6 all can bond through the epoxy adhesive, this gluing agent bonding is stable.
Further, two second circuit layers 24 are provided with blind holes 4, and the blind holes 4 penetrate through the second circuit layer 24, the first insulating layer 23 and the first circuit layer 22 which are attached in sequence. The first circuit layer 22 can be electrically connected to the second circuit layer 24 by inserting an electrical conductor through the blind via 4, such as copper plating the inner wall of the blind via 4.
Further, heat dissipation holes 5 are formed in the side wall of the left frame 11 and the side wall of the right frame 12, and the heat dissipation holes 5 are located on the left side and the right side of the first circuit layer 22. The heat dissipation holes 5 are arranged to improve the heat dissipation effect of the two sides of the first circuit layer 22 inside the circuit board assembly 2.
Further, a second insulating layer 6 is filled between the substrate 21 and the first circuit layer 22, and the fixture block 31 and the limiting block 211 are embedded in the second insulating layer 6. The second insulating layer 6 may be made of a resin material to improve an insulating effect.
Furthermore, the outer wall of the first circuit layer 22 is provided with an anti-corrosion layer 7, the blind hole 4 and the support tube 3 penetrate through the anti-corrosion layer 7, and the anti-corrosion layer 7 is located between the left frame 11 and the right frame 12. The anti-corrosion layer 7 is arranged to improve the anti-corrosion performance, and a platinum-containing alloy material can be plated to improve the anti-corrosion performance.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the scope of the invention. Any person skilled in the art can make some modifications without departing from the scope of the invention, i.e. all equivalent modifications made according to the invention are intended to be covered by the scope of the invention.
Claims (5)
1. A multilayer printed circuit board, comprising:
a frame assembly including a left frame and a right frame; a first groove and a second groove are respectively formed in the right side wall of the left frame and the left side wall of the right frame;
the left frame and the right frame are positioned on the left side and the right side of the circuit board assembly, and the circuit board assembly comprises a substrate, two first circuit layers, two first insulating layers and two second circuit layers; the left end and the right end of the substrate, the left end and the right end of the two first circuit layers, the left end and the right end of the two first insulating layers and the left end and the right end of the two second circuit layers are respectively filled in the first groove and the second groove;
the two first circuit layers are respectively positioned at the upper side and the lower side of the substrate, the two first insulating layers are respectively positioned at the outer sides of the two first circuit layers, and the two second circuit layers are respectively positioned at the outer sides of the two first insulating layers;
the clamping block type LED display panel is characterized by further comprising two supporting tubes penetrating through the second circuit layer, the first insulating layer and the first circuit layer, clamping blocks are fixed on the outer walls of the two supporting tubes, L-shaped limiting blocks are fixed on the upper surface and the lower surface of the substrate, the clamping blocks and the limiting blocks are located between the first circuit layer and the substrate, the limiting blocks are connected with the clamping blocks in a clamping mode, first through holes and second through holes are formed in the outer walls of the supporting tubes, the first through holes and the first circuit layer are located on the same horizontal plane, and the second through holes and the second circuit layer are located on the same horizontal plane.
2. The multilayer printed circuit board of claim 1, wherein both of the second circuit layers are provided with blind holes, and the blind holes penetrate through the second circuit layer, the first insulating layer and the first circuit layer which are sequentially attached.
3. The multilayer printed circuit board of claim 1, wherein the sidewalls of the left frame and the right frame are formed with heat dissipation holes, and the heat dissipation holes are located on the left and right sides of the first circuit layer.
4. The multilayer printed circuit board of claim 1, wherein a second insulating layer is filled between the substrate and the first circuit layer, and the clip and the stopper are embedded in the second insulating layer.
5. The multilayer printed circuit board of claim 2, wherein the outer wall of the first circuit layer is provided with an anti-corrosion layer, the blind hole and the support tube penetrate through the anti-corrosion layer, and the anti-corrosion layer is located between the left frame and the right frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922177740.3U CN211184406U (en) | 2019-12-06 | 2019-12-06 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922177740.3U CN211184406U (en) | 2019-12-06 | 2019-12-06 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211184406U true CN211184406U (en) | 2020-08-04 |
Family
ID=71800393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922177740.3U Active CN211184406U (en) | 2019-12-06 | 2019-12-06 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211184406U (en) |
-
2019
- 2019-12-06 CN CN201922177740.3U patent/CN211184406U/en active Active
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