CN211170929U - Shielding device for electroplating processing - Google Patents
Shielding device for electroplating processing Download PDFInfo
- Publication number
- CN211170929U CN211170929U CN201922376939.9U CN201922376939U CN211170929U CN 211170929 U CN211170929 U CN 211170929U CN 201922376939 U CN201922376939 U CN 201922376939U CN 211170929 U CN211170929 U CN 211170929U
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- electroplating
- shielding
- frame
- clamping
- clamping frames
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Abstract
The utility model discloses a shielding device for electroplating processing, which comprises a shielding frame, wherein two sides inside the shielding frame are respectively provided with a clamping frame, two side surfaces of the shielding frame and the clamping frame are respectively provided with an electroplating opening, two clamping frames are respectively provided with a cartridge groove, a shielding plate is inserted in the cartridge groove, and the shielding plate is provided with a plurality of electroplating holes; clamping springs are fixedly arranged at four corners of the inner side surface of the shielding frame, and the other ends of the clamping springs are fixedly connected with the outer side surfaces of the two clamping frames respectively; the utility model has the advantages that the two inserting shielding plates of the inserting groove in the clamping frame are convenient for installing and replacing the shielding plates, if the electroplating position required by the part needs to be adjusted, the electroplating shielding plates can be conveniently and rapidly replaced, and the electroplating working efficiency is improved; the device can be used as an electroplating clamp, an electroplating part is clamped by the two clamping frames during electroplating, and the device is placed in an electroplating bath through the base, so that the electroplating processing of the part is facilitated, and the electroplating working efficiency is further improved.
Description
Technical Field
The utility model relates to an electroplating process technical field especially relates to a shielding device that electroplating process used.
Background
Electroplating is a process of attaching a layer of metal film on the surface of a metal or other material by electrolysis, and has the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate) and improving appearance. Plating is generally classified into full plating and partial plating according to the plating area. Many parts which need to be electroplated locally need to be protected in an insulating way on the non-plating surface, so that the technical requirements of construction are met by adopting a local shielding mode, and the non-plating surface of the parts can not be plated with a plating layer, especially the parts with special requirements. In the prior art, hole sites are usually engraved on a shielding plate according to needs, parts are clamped by the shielding plate, and the hole sites only expose the plated parts, so that the purpose of local electroplating is achieved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a shielding device for electroplating processing, which can conveniently and quickly change an electroplating shielding plate and improve the electroplating work efficiency.
In order to solve the technical problem, the utility model provides a following technical scheme:
the shielding device for electroplating processing comprises a shielding frame, wherein two clamping frames are respectively arranged on two sides in the shielding frame, electroplating openings are respectively formed in two side surfaces of the shielding frame and the clamping frames, insertion grooves are respectively formed in the two clamping frames, shielding plates are inserted in the insertion grooves, and a plurality of electroplating holes are formed in the shielding plates.
As an optimized technical scheme of the utility model, clamping spring is all equipped with admittedly in the four corners of shielding frame inside side, clamping spring's the other end respectively with the lateral surface fixed connection of two centre gripping frames.
As an optimized technical scheme of the utility model, the base is equipped with admittedly to the bottom of shadow frame.
As an optimized technical proposal of the utility model, the middle part of the inner bottom surface of the shielding frame is provided with an electroplating workpiece placing boss.
As an optimized technical scheme of the utility model, the thickness and the height of shielding plate are the same with the width and the height in cartridge groove respectively.
Compared with the prior art, the utility model discloses the beneficial effect that can reach is:
the utility model has the advantages that the two inserting shielding plates of the inserting groove in the clamping frame are convenient for installing and replacing the shielding plates, if the electroplating position required by the part needs to be adjusted, the electroplating shielding plates can be conveniently and rapidly replaced, and the electroplating working efficiency is improved; the device can be used as an electroplating clamp, an electroplating part is clamped by the two clamping frames during electroplating, and the device is placed in an electroplating bath through the base, so that the electroplating processing of the part is facilitated, and the electroplating working efficiency is further improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is an exploded view of the clamping frame and the shielding plate of the present invention;
fig. 3 is a side sectional view of the shadow frame of the present invention;
wherein: 1. a shielding frame; 2. a clamping frame; 3. inserting the slots; 4. electroplating the opening; 5. a base; 6. a shielding plate; 7. the spring is clamped.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Referring to fig. 1-3, a shielding device for electroplating process includes a shielding frame 1, a clamping frame 2 disposed on each of two sides of the shielding frame 1, electroplating openings 4 disposed on two sides of the shielding frame 1 and the clamping frame 2, inserting slots 3 disposed in the two clamping frames 2, a shielding plate 6 inserted in the inserting slots 3, and a plurality of electroplating holes disposed on the shielding plate 6.
Clamping springs 7 are fixedly arranged at four corners of the inner side face of the shielding frame 1, the other ends of the clamping springs 7 are fixedly connected with the outer side faces of the two clamping frames 2 respectively, and the clamping springs 7 can provide inward clamping force for the two clamping frames 2, so that the clamping frames 2 can clamp parts more stably.
The bottom of the shielding frame 1 is fixedly provided with a base 5, and the device can be placed in an electroplating bath through the base.
The middle part of the bottom surface of the inner side of the shielding frame 1 is provided with an electroplating workpiece placing boss for placing electroplating parts, and the parts are positioned at one side of the electroplating opening 4.
The thickness and height of the shielding plate 6 are respectively the same as the width and height of the insertion groove 3, so that the shielding plate 6 can be fixedly inserted into the insertion groove 3.
Specifically, during electroplating construction, if the position of the part to be electroplated needs to be adjusted, the shielding plate 6 in the insertion groove 3 in the clamping frame 2 is pulled out at first, a new shielding plate 6 is replaced according to electroplating needs, the shielding plate 6 is inserted into the insertion groove 3, during electroplating, the electroplating part is inserted between the two clamping frames 2, the part is clamped by the two clamping frames 2 through the acting force of the clamping spring 7, then the whole device and the electroplating part are placed in an electroplating bath, after electrification, the electroplating solution enters the electroplating hole in the shielding plate 6 through the electroplating opening 4, and the part which is not shielded is electroplated.
The embodiments of the present invention are not limited to the above embodiments, and according to the contents of the above embodiments of the present invention, the above preferred embodiments can also make modifications, replacements or combinations of other forms by using conventional technical knowledge and conventional means in the field without departing from the basic technical idea of the present invention, and the obtained other embodiments all fall within the scope of the present invention.
Claims (5)
1. The shielding device for electroplating processing comprises a shielding frame (1) and is characterized in that two clamping frames (2) are respectively arranged on two sides of the interior of the shielding frame (1), electroplating openings (4) are respectively formed in two side faces of the shielding frame (1) and the clamping frames (2), an insertion groove (3) is formed in each of the two clamping frames (2), a shielding plate (6) is inserted in each insertion groove (3), and a plurality of electroplating holes are formed in each shielding plate (6).
2. The shielding device for electroplating processing according to claim 1, wherein clamping springs (7) are fixedly mounted at four corners of the inner side surface of the shielding frame (1), and the other ends of the clamping springs (7) are fixedly connected with the outer side surfaces of the two clamping frames (2) respectively.
3. A screening arrangement for electrolytic processes according to claim 1, characterised in that a base (5) is fixedly mounted to the bottom of the screening frame (1).
4. A shield apparatus for plating process according to claim 1, wherein a plated workpiece placing boss is provided at the middle of the inner bottom surface of said shield frame (1).
5. A screening arrangement for galvanic processes according to claim 1, characterized in that the thickness and height of the screening plate (6) are the same as the width and height, respectively, of the cartridge slot (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922376939.9U CN211170929U (en) | 2019-12-26 | 2019-12-26 | Shielding device for electroplating processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922376939.9U CN211170929U (en) | 2019-12-26 | 2019-12-26 | Shielding device for electroplating processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211170929U true CN211170929U (en) | 2020-08-04 |
Family
ID=71797420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922376939.9U Active CN211170929U (en) | 2019-12-26 | 2019-12-26 | Shielding device for electroplating processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211170929U (en) |
-
2019
- 2019-12-26 CN CN201922376939.9U patent/CN211170929U/en active Active
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