CN210287567U - Electroplating clamp - Google Patents
Electroplating clamp Download PDFInfo
- Publication number
- CN210287567U CN210287567U CN201920483805.4U CN201920483805U CN210287567U CN 210287567 U CN210287567 U CN 210287567U CN 201920483805 U CN201920483805 U CN 201920483805U CN 210287567 U CN210287567 U CN 210287567U
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- CN
- China
- Prior art keywords
- clamp
- chuck
- movable
- fixed
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an electroplating clamp, which comprises a fixed clamp and a movable clamp, wherein the fixed clamp is connected with the movable clamp through a connecting point, the fixed clamp comprises a fixed clamp upper part and a fixed clamp lower part, the width of the fixed clamp upper part is larger than that of the fixed clamp lower part, the movable clamp comprises a movable clamp upper part and a movable clamp lower part, the width of the movable clamp upper part is larger than that of the movable clamp lower part, the widths of the fixed clamp upper part and the movable clamp upper part can obtain larger current, the connecting point with the upper part wide is used for distributing the lower part, the connecting point is closer to the clamping point of the fixed clamp and the movable clamp of the electroplating clamp, the lower parts of the fixed clamp and the movable clamp are narrow, the current can be distributed more evenly, the electroplating clamp has good conductivity, the clamping point on the fixed clamp and the, accurate contact without dislocation can be ensured, and the working efficiency is improved.
Description
Technical Field
The utility model relates to an electroplate technical field, in particular to electroplating fixture.
Background
The electroplating clamp is a necessary tool in the electroplating process of the circuit board and is used for clamping the circuit board and carrying liquid medicine with chemical drugs, current is conducted to the two side plate surfaces of the circuit board through the clamping points on the two sides of the electroplating clamp, and plating layers are generated on the two side plate surfaces of the circuit board through electrochemical reaction, so that the electroplating clamp needs to have excellent conductivity. In the prior art, when a circuit board is electroplated, because the current distribution of the clamping points on the two sides of the electroplating clamp is unbalanced, the thicknesses of the plating layers on the two side plate surfaces of the circuit board are unbalanced, and the circuit board needs to be processed to meet the requirements in the subsequent process and then enters the next process, but the existing electroplating clamp cannot effectively improve the balance of the thicknesses of the plating layers on the two side plate surfaces of the circuit board. In view of the above, there is a strong need for a plating jig that can equalize the plating thickness on both sides of the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide an electroplating fixture that makes the both sides face plating thickness of circuit board balanced.
The utility model provides a technical scheme that its technical problem adopted is: an electroplating clamp comprises a fixed chuck and a movable chuck, wherein the fixed chuck is hinged with the movable chuck through a connecting point, the fixed chuck comprises a fixed chuck upper part and a fixed chuck lower part, the width of the fixed chuck upper part is greater than that of the fixed chuck lower part, the movable chuck comprises a movable chuck upper part and a movable chuck lower part, and the width of the movable chuck upper part is greater than that of the movable chuck lower part; the widths of the upper parts of the fixed chuck and the movable chuck can obtain larger current, and the current is used for lower distribution through a connection point with the width of the upper part; the one end that fixed chuck is close to the tie point is provided with first pinch point, the one end that the activity chuck is close to the tie point is provided with the second pinch point, and the tie point is nearer apart from first pinch point of electroplating jig and second pinch point, and fixed chuck lower part and activity chuck lower part are narrow, distribution electric current that can be more balanced.
Further, the method comprises the following steps: the two sides of the first clamping point are provided with fixing frames, and the fixing frames on the fixed clamping heads are used for fixing the lower parts of the movable clamping heads, so that the first clamping point and the second clamping point can be accurately contacted without dislocation.
Further, the method comprises the following steps: the connecting points for connecting the fixed chuck and the movable chuck are connected by a connecting piece, and a gap is arranged between the connecting points and the connecting piece, so that the fixed chuck and the movable chuck can move when being clamped.
Further, the method comprises the following steps: the spring is arranged between the upper part of the fixed chuck and the upper part of the movable chuck, the spring plays a supporting role when the upper part of the fixed chuck and the upper part of the movable chuck are pressed, and the spring plays a rebounding role when the first clamping point and the second clamping point are contacted, so that the clamping is convenient to clamp again.
Further, the method comprises the following steps: the material of the fixed chuck and the movable chuck is sus 316.
The utility model has the advantages that: the utility model discloses have good electric conductive property, the width on fixed chuck upper portion is greater than the width of fixed chuck lower part, the width on activity chuck upper portion is greater than the width of activity chuck lower part, fixed chuck upper portion and activity chuck upper portion are wide can obtain great electric current, the tie point that is used for the distribution of lower part through the wide tie point in upper portion, the tie point is nearer apart from electroplating fixture's first pinch point and second pinch point, fixed chuck lower part and activity chuck lower part are narrow, distribution electric current that can be more balanced has improved work efficiency.
Drawings
FIG. 1 is a schematic view of a plating jig:
FIG. 2 is a front view of the plating jig;
labeled as: the clamping device comprises a fixed chuck 1, a movable chuck 2, a connecting point 3, a clamping point 4 on the fixed chuck, a clamping point 5 on the movable chuck, a fixed frame 6, a spring 7, an upper part 11 of the fixed chuck, a lower part 12 of the fixed chuck, an upper part 21 of the movable chuck and a lower part 22 of the movable chuck.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
As shown in fig. 1 and 2: an electroplating clamp comprises a fixed chuck 1 and a movable chuck 2, wherein the fixed chuck 1 is hinged with the movable chuck 2 through a connecting point 3, the fixed chuck 1 comprises a fixed chuck upper part 11 and a fixed chuck lower part 12, the width of the fixed chuck upper part 11 is larger than that of the fixed chuck lower part 12, the movable chuck 2 comprises a movable chuck upper part 21 and a movable chuck lower part 22, the width of the movable chuck upper part 21 is larger than that of the movable chuck lower part 22, the widths of the fixed chuck and the movable chuck can be adjusted according to actual conditions, in the embodiment, the widths of the upper part 11 of the fixed chuck and the upper part 21 of the movable chuck are set to be 22mm, the widths of the lower part 12 of the fixed chuck and the lower part 22 of the movable chuck are set to be 16mm, the widths of the upper part 11 of the fixed chuck and the upper part 21 of the movable chuck can obtain larger current, and the larger current is used for lower distribution through the connecting point 3 with the wider upper part; one end of the fixed chuck 1 close to the connecting point is provided with a first clamping point 4, one end of the movable chuck 2 close to the connecting point is provided with a second clamping point 5, the connecting point 3 is closer to the first clamping point 4 and the second clamping point 5 of the electroplating fixture, the distance from the connecting point 3 to the lower part 12 end point of the fixed chuck is smaller than the distance from the connecting point 3 to the upper part 11 end point of the fixed chuck, the distance from the connecting point 3 to the lower part 22 end point of the movable chuck is smaller than the distance from the connecting point 3 to the upper part 21 end point of the movable chuck, the lower part 12 of the fixed chuck and the lower part 22 of the movable chuck can distribute.
On the basis, in order to ensure that the clamping point 4 and the clamping point 5 are accurately contacted without dislocation during clamping, fixing frames 6 are arranged on two sides of the clamping point 4 on the fixed chuck 1.
On the basis, the connecting point 3 for connecting the fixed chuck 1 and the movable chuck 2 is connected by a connecting piece, a gap is arranged between the connecting point 3 and the connecting piece, so that the fixed chuck 1 and the movable chuck 2 can move when being clamped conveniently, and a pin is used as the connecting piece in the embodiment.
On the basis, the spring 7 is arranged between the fixed chuck upper part 11 and the movable chuck upper part 21, the spring 7 plays a supporting role when the fixed chuck upper part 11 and the movable chuck upper part 21 are pressed, and the spring 7 plays a rebounding role when the first clamping point 4 and the second clamping point 5 are contacted, so that the clamping is convenient to clamp again.
On the basis, the material of the fixed chuck 1 and the movable chuck 2 is sus 316.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (5)
1. An electroplating clamp is characterized in that: the clamp comprises a fixed clamp (1) and a movable clamp (2), wherein the fixed clamp (1) is hinged with the movable clamp (2) through a connecting point (3), the fixed clamp (1) comprises a fixed clamp upper part (11) and a fixed clamp lower part (12), the width of the fixed clamp upper part (11) is greater than that of the fixed clamp lower part (12), the movable clamp (2) comprises a movable clamp upper part (21) and a movable clamp lower part (22), and the width of the movable clamp upper part (21) is greater than that of the movable clamp lower part (22); one end of the fixed chuck (1) close to the connecting point is provided with a first clamping point (4), and one end of the movable chuck (2) close to the connecting point is provided with a second clamping point (5).
2. The plating jig of claim 1, wherein: and fixing frames (6) are arranged on two sides of the first clamping point (4) on the fixed chuck (1).
3. The plating jig of claim 1, wherein: the connecting points (3) for connecting the fixed chuck and the movable chuck are connected by connecting pieces, and gaps are reserved between the connecting points (3) and the connecting pieces.
4. The plating jig of claim 1, wherein: a spring (7) is arranged between the upper part of the fixed chuck and the upper part of the movable chuck.
5. The plating jig of claim 1, wherein: the fixed chuck (1) and the movable chuck (2) are made of sus 316.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920483805.4U CN210287567U (en) | 2019-04-11 | 2019-04-11 | Electroplating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920483805.4U CN210287567U (en) | 2019-04-11 | 2019-04-11 | Electroplating clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210287567U true CN210287567U (en) | 2020-04-10 |
Family
ID=70067411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920483805.4U Expired - Fee Related CN210287567U (en) | 2019-04-11 | 2019-04-11 | Electroplating clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210287567U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112481685A (en) * | 2020-12-11 | 2021-03-12 | 苏州浪潮智能科技有限公司 | Electroplating clamp and chuck for printed circuit board |
-
2019
- 2019-04-11 CN CN201920483805.4U patent/CN210287567U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112481685A (en) * | 2020-12-11 | 2021-03-12 | 苏州浪潮智能科技有限公司 | Electroplating clamp and chuck for printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200410 Termination date: 20210411 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |