CN211150592U - Mould positioning device - Google Patents
Mould positioning device Download PDFInfo
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- CN211150592U CN211150592U CN202020252221.9U CN202020252221U CN211150592U CN 211150592 U CN211150592 U CN 211150592U CN 202020252221 U CN202020252221 U CN 202020252221U CN 211150592 U CN211150592 U CN 211150592U
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Abstract
A die positioning device belongs to the technical field of chip packaging devices. The method is characterized in that: the mould comprises a mould frame, a detection device and an adjusting device (6), wherein a clamping part is arranged on the mould frame, the adjusting device (6) is connected with the mould frame and drives the mould frame to rotate, and the detection device is arranged on one side of the clamping part. This mould positioner's clamping part presss from both sides tightly the mould, and detection device can detect and gather the image of chip to the chip on the blue membrane to drive the mould frame through adjusting device and rotate, thereby adjust the gesture of chip, guarantee that the chip gesture is accurate, and then guaranteed that the chip encapsulation after taking is accurate, make equipment job stabilization, the qualification rate of product is high.
Description
Technical Field
A die positioning device belongs to the technical field of chip packaging devices.
Background
The method is characterized in that a chip is firstly separated from a blue film and transferred to a lead frame before L ED packaging, so that the chip is packaged, the posture of the chip is required to be determined when the chip is packaged to ensure the accuracy of chip packaging, and the posture of the chip is difficult to adjust due to the fact that a die for clamping the blue film is annular, so that the posture of the chip is difficult to adjust, the adjustment of the posture of the chip is difficult, and the accuracy of chip packaging is influenced.
Disclosure of Invention
The to-be-solved technical problem of the utility model is: the defects of the prior art are overcome, and the die positioning device capable of adjusting the posture of the chip so as to ensure the accuracy of chip packaging is provided.
The utility model provides a technical scheme that its technical problem adopted is: this mould positioner, its characterized in that: the mould comprises a mould frame, a detection device and an adjusting device, wherein a clamping part is arranged on the mould frame, the adjusting device is connected with the mould frame and drives the mould frame to rotate, and the detection device is arranged on one side of the clamping part.
Preferably, the mold frame comprises a clamping ring and a pressing device, wherein a plurality of clamping pins are arranged on one side of the clamping ring at intervals, and the pressing device is arranged on the other side of the clamping ring and surrounds the clamping part together with the clamping pins.
Preferably, the clamping device further comprises a supporting bracket, the clamping ring is rotatably arranged on the upper side of the supporting bracket, the adjusting device is installed on the supporting bracket, and the adjusting device is connected with the clamping ring and drives the clamping ring to rotate.
Preferably, the adjusting device comprises an adjusting motor, and an output shaft of the adjusting motor is connected with the clamping ring through a synchronous belt and drives the clamping ring to synchronously rotate.
Preferably, the compressing device comprises a compressing rod and a compressing power device, the compressing rod is arranged on one side of the clamping ring, a lever mechanism is fixedly arranged in the middle of the compressing rod, one end of the compressing rod is an operating part connected with the compressing power device, and the other end of the compressing rod is a compressing part.
Preferably, the two pressing rods are symmetrically arranged on two sides of the pressing power device.
Preferably, the pressing power device comprises a pressing cylinder and a pressing spring, the pressing spring is arranged between the operating part and the clamping ring, the pressing spring pushes the operating part to swing and enables the operating part to be far away from the clamping ring, and a piston rod of the pressing cylinder is connected with the operating part and enables the operating part to swing towards the direction close to the clamping ring.
Preferably, a plurality of positioning wheels for positioning the mold frame are arranged around the side of the mold frame.
Compared with the prior art, the utility model discloses the beneficial effect who has is:
1. this mould positioner's clamping part presss from both sides tightly the mould, and detection device can detect and gather the image of chip to the chip on the blue membrane to drive the mould frame through adjusting device and rotate, thereby adjust the gesture of chip, guarantee that the chip gesture is accurate, and then guaranteed that the chip encapsulation after taking is accurate, make equipment job stabilization, the qualification rate of product is high.
2. The clamping pin is matched with the pressing device to clamp the die, so that the die can synchronously rotate with the clamping ring, the die is convenient to take and place, and the posture of the chip is convenient to adjust.
3. The adjusting motor is connected with the clamping ring through the synchronous belt, so that the rotating angle of the clamping ring can be accurately adjusted, the posture of the chip can be accurately adjusted, and the adjusting is convenient.
4. The pressing power device is connected with the operation part, so that the pressing rod is pushed to swing, the die is pressed on the locking pin through the pressing part, and the pressing and the releasing of the pressing of the die are facilitated.
5. The two compression rods are symmetrically arranged on two sides of the compression power device, so that the die is guaranteed to be reliably compressed.
6. The pressing rod is pushed to press the die through the pressing spring, the pressing force of the die is guaranteed to be constant, the die is prevented from being damaged, the pressing cylinder can push the pressing rod to swing and enable the pressing rod to release the swing of the die, and the die is convenient to take and place.
7. The positioning wheel can be used for positioning the die frame, so that the position of the die frame is ensured to be determined, and the die is ensured to be more accurately taken and placed and the chip is more accurately sucked.
Drawings
Fig. 1 is a perspective view of a mold positioning device.
Fig. 2 is a partially enlarged view of a portion a in fig. 1.
Fig. 3 is a schematic top view of the mold positioning device.
Fig. 4 is a partially enlarged view of fig. 3 at B.
In the figure: 1. the device comprises a support bracket 101, a support ring 2, a clamping ring 3, a clamping pin 4, a positioning wheel 5, a pressing device 6, an adjusting device 7, a translation frame 8, a mounting frame 9, a die 10, a pressing rod 1001, a pressing part 1002, an operating part 11, a supporting block 12, a pressing spring 13, a pressing cylinder 14, a pressing wheel 15, an adjusting motor 16 and a synchronous belt.
Detailed Description
Fig. 1 to 4 are preferred embodiments of the present invention, and the present invention will be further explained with reference to fig. 1 to 4.
A mold positioning device comprises a mold frame, a detection device and an adjusting device 6, wherein a clamping part is arranged on the mold frame, the adjusting device 6 is connected with the mold frame and drives the mold frame to rotate, and the detection device is arranged on one side of the clamping part. This mould positioner's clamping part presss from both sides tightly mould 9, and detection device can detect and gather the image of chip to the chip on the blue membrane to drive the mould frame through adjusting device 6 and rotate, thereby adjust the gesture of chip, guarantee that the chip gesture is accurate, and then guaranteed that the chip encapsulation after taking is accurate, make equipment job stabilization, the qualification rate of product is high.
The present invention is further described with reference to specific embodiments, however, it will be understood by those skilled in the art that the detailed description given herein with respect to the drawings is for better explanation and that the present invention is necessarily to be construed as limited to those embodiments, and equivalents or common means thereof will not be described in detail but will fall within the scope of the present application.
Specifically, the method comprises the following steps: as shown in FIGS. 1-4: the mold positioning device further comprises a support bracket 1, a transverse translation device and a longitudinal translation device, wherein the support bracket 1 is installed on the transverse translation device, the transverse translation device is installed on the longitudinal translation device, the moving directions of the transverse translation device and the longitudinal translation device are horizontal, and the moving directions of the transverse translation device and the longitudinal translation device are mutually vertical.
The supporting bracket 1 is horizontally arranged, one end of the supporting bracket 1 is arranged on the transverse translation device, the other end of the supporting bracket 1 is provided with an annular supporting ring 101, and the die frame is rotatably arranged on the upper side of the supporting ring 101. The adjusting device 6 is arranged on the supporting bracket 1, and the adjusting device 6 is connected with the die frame and drives the die frame to synchronously rotate, so that the posture of the chip is adjusted. The upper side of the die frame is provided with a clamping part, the detection devices are arranged on the upper side of the die frame at intervals, and the detection devices are aligned with the middle part of the clamping part. The detection device is a CCD camera, and the CCD can also be a photoelectric sensor.
The longitudinal translation device is installed on the mounting bracket 8, and the longitudinal translation device includes the linear module of longitudinal translation and translation frame 7, and translation frame 7 sets up the upside at mounting bracket 8, and the bilateral symmetry of mounting bracket 8 is provided with the horizontal longitudinal translation guide rail, and the both sides of translation frame 7 respectively with the longitudinal translation guide rail sliding connection who corresponds the side, the linear module of longitudinal translation is installed on mounting bracket 8, and the linear module of longitudinal translation links to each other with translation frame 7 to drive its horizontal migration.
The transverse translation device comprises a transverse translation linear module, the bearing bracket 1 is arranged on the upper side of the translation frame 7, a horizontal transverse translation guide rail is arranged on the upper side of the translation frame 7, the transverse translation guide rail is perpendicular to the longitudinal translation guide rail, and the bearing bracket 1 is slidably mounted on the transverse translation guide rail. The transverse translation linear module is arranged on the translation frame 7, is connected with the bearing bracket 1 and pushes the bearing bracket to translate.
The mould frame includes grip ring 2 and closing device 5, grip ring 2 is the annular, grip ring 2 sets up the upside at support bracket 1, grip ring 2 and the coaxial setting of support ring 101, the lateral part interval that encircles grip ring 2 is provided with at least three locating wheel 4, in this embodiment, locating wheel 4 encircles 2 interval equipartitions of grip ring and has threely, locating wheel 4 rotates and installs on support bracket 1, and fix a position grip ring 2, guarantee that grip ring 2 rotates the in-process all the time coaxial with support ring 101. One side of the clamping ring 2 is provided with a vertical clamping pin 3, the pressing device 5 is arranged on the other side of the clamping ring 2, and the pressing device 5 is matched with the clamping pin 3, so that clamping and unclamping of the mold 9 are realized, and the operation is convenient. The clamping ring 2 has a higher level on the side where the clamping pin 3 is arranged than on the side where the pressing device 5 is arranged, so that the working of the pressing device 5 is not hindered.
The pressing device 5 comprises a pressing rod 10 and a pressing power device, the pressing rod 10 is arranged between the clamping ring 2 and the pressing power device, the middle of the pressing rod 10 is rotatably installed on the supporting bracket 1 to form a lever mechanism, one end, close to the pressing power device, of the pressing rod 10 is provided with an operating portion 1002, the other end of the pressing rod is provided with a pressing portion 1001, and the pressing portion 1001 is arc-shaped, protruding in the middle of the pressing rod, so that damage to the die 9 is avoided. The pressing power device is connected to the operating portion 1002 and pushes it to swing, and thus pressing of the mold 9 is achieved by the pressing portion 1001. The two pressing rods 10 are symmetrically arranged on two sides of the pressing power device, and the control portion 1002 of each pressing rod 10 is arranged close to the pressing power device, so that clamping of the mold 9 is more reliable, and the mold 9 can be prevented from being crushed.
The pressing power device comprises a pressing spring 12 and a pressing air cylinder 13, a supporting block 11 is arranged on the supporting bracket 1 between the operating part 1002 and the clamping ring 2, the pressing spring 12 is in one-to-one correspondence with the pressing rods 10, the pressing spring 12 is arranged between the supporting block 11 and the corresponding operating part 1002, one end of the pressing spring 12 is connected with the supporting block 11, the other end of the pressing spring is connected with the corresponding operating part 1002, and the pressing spring 12 is in a compressed state. The pressing cylinder 13 is arranged on one side, far away from the clamping ring 2, of the pressing rod 10, the pressing cylinder 13 is arranged along the radial direction of the clamping ring 2, a pressing wheel 14 is rotatably mounted on a piston rod of the pressing cylinder 13, the pressing cylinder 13 pushes the two control portions 1002 to swing through the pressing wheel 14, and then the pressing rod 10 is released from pressing the die 9.
Adjusting device 6 includes adjusting motor 15, and adjusting motor 15 installs on bearing bracket 1, and adjusting motor 15's the vertical setting of output shaft, and adjusting motor 15's output shaft passes through hold-in range 16 and links to each other with grip ring 2 to drive 2 synchronous rotations of grip ring, and can the 2 pivoted angles of accurate adjustment grip ring. A synchronous belt wheel is installed on an output shaft of the adjusting motor 15, side teeth meshed with the synchronous belt 16 are arranged on the side portion of the clamping ring 2, one end of the synchronous belt 16 is meshed with the synchronous belt wheel, and the other end of the synchronous belt 16 is meshed with the side teeth of the clamping ring 2.
When the die positioning device is used, the pressing cylinder 13 pushes the pressing rod 10 to be opened, when the die 9 enters the upper side of the clamping ring 2, the pressing cylinder 13 resets, and the pressing spring 12 pushes the pressing rod 10 to swing and presses the die 9. At this moment, the detection device detects the chip on the die 9, the adjusting motor 15 drives the clamping ring 2 to rotate, the posture of the chip is adjusted, and the chip is accurately packaged.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical substance of the present invention still belong to the protection scope of the technical solution of the present invention.
Claims (8)
1. A mold positioning device is characterized in that: the die comprises a die frame, a detection device and an adjusting device (6), wherein the die frame is provided with a clamping part, the adjusting device (6) is connected with the die frame and drives the die frame to rotate, and the detection device is arranged on one side of the clamping part.
2. The mold positioning apparatus of claim 1, wherein: the die frame comprises a clamping ring (2) and a pressing device (5), a plurality of clamping pins (3) are arranged on one side of the clamping ring (2) at intervals, and the pressing device (5) is arranged on the other side of the clamping ring (2) and surrounds the clamping pins (3) to form a clamping part.
3. The mold positioning apparatus of claim 2, wherein: the clamping ring device is characterized by further comprising a supporting bracket (1), the clamping ring (2) is rotatably arranged on the upper side of the supporting bracket (1), the adjusting device (6) is installed on the supporting bracket (1), and the adjusting device (6) is connected with the clamping ring (2) and drives the clamping ring (2) to rotate.
4. The mold positioning device according to claim 1 or 3, characterized in that: the adjusting device (6) comprises an adjusting motor (15), and an output shaft of the adjusting motor (15) is connected with the clamping ring (2) through a synchronous belt (16) and drives the clamping ring to synchronously rotate.
5. The mold positioning apparatus of claim 2, wherein: the pressing device (5) comprises a pressing rod (10) and a pressing power device, the pressing rod (10) is arranged on one side of the clamping ring (2), a lever mechanism is fixedly arranged in the middle of the pressing rod (10), one end of the pressing rod (10) is an operating portion (1002) connected with the pressing power device, and the other end of the pressing rod (10) is a pressing portion (1001).
6. The mold positioning apparatus of claim 5, wherein: the two pressing rods (10) are symmetrically arranged on two sides of the pressing power device.
7. The mold positioning device according to claim 5 or 6, characterized in that: the pressing power device comprises a pressing cylinder (13) and a pressing spring (12), the pressing spring (12) is arranged between the operating part (1002) and the clamping ring (2), the pressing spring (12) pushes the operating part (1002) to swing and enables the operating part to be far away from the clamping ring (2), and a piston rod of the pressing cylinder (13) is connected with the operating part (1002) and enables the operating part to swing towards the direction close to the clamping ring (2).
8. The mold positioning apparatus of claim 1, wherein: a plurality of positioning wheels (4) for positioning the mould frame are arranged around the side part of the mould frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020252221.9U CN211150592U (en) | 2020-03-04 | 2020-03-04 | Mould positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020252221.9U CN211150592U (en) | 2020-03-04 | 2020-03-04 | Mould positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211150592U true CN211150592U (en) | 2020-07-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020252221.9U Active CN211150592U (en) | 2020-03-04 | 2020-03-04 | Mould positioning device |
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| CN (1) | CN211150592U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113970658A (en) * | 2021-10-22 | 2022-01-25 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
-
2020
- 2020-03-04 CN CN202020252221.9U patent/CN211150592U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113970658A (en) * | 2021-10-22 | 2022-01-25 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
| CN113970658B (en) * | 2021-10-22 | 2024-02-23 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
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