CN211141907U - Copper foil with gas escape structure - Google Patents
Copper foil with gas escape structure Download PDFInfo
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- CN211141907U CN211141907U CN201921478800.9U CN201921478800U CN211141907U CN 211141907 U CN211141907 U CN 211141907U CN 201921478800 U CN201921478800 U CN 201921478800U CN 211141907 U CN211141907 U CN 211141907U
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- copper foil
- copper
- copper oxide
- oxide film
- eutectic
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Abstract
The utility model provides a copper foil with escape structure, this copper foil have the basic unit and form in the copper oxide rete on basic unit surface to concave on the copper oxide rete and be provided with a plurality of gas spaces of escaping, utilize the setting of escaping the gas space, it is fashionable to let copper foil and ceramic substrate eutectic bonding, increase the ability of flowing in eutectic liquid phase, when reducing the combined type base plate and making, the air gap quantity that is mingled with between copper foil and the pottery promotes the heat-conduction ability and the joint strength of combined type base plate by a wide margin.
Description
Technical Field
The present invention relates to a copper foil with a gas escape structure, and more particularly to a copper foil used in a composite substrate to be eutectic-bonded with ceramic.
Background
The method for forming the composite substrate by the Copper foil and the ceramic is a Direct Copper Bonding technology (DCB, Direct Copper Bonding or DBC, Direct Bonding coater), wherein the Copper foil containing a Copper oxide layer is mainly bonded on the surface of a ceramic substrate with an oxide surface layer, eutectic sintering is carried out in a vacuum furnace at the temperature of 1065-1083 ℃, and the Copper foil is directly bonded on the surface of the ceramic substrate. In the early stage, a dry process was used, in which a copper foil was placed in a vacuum furnace, so that copper oxide was formed on the lower surface of the copper foil in an oxygen atmosphere, and then the copper foil containing a copper oxide layer was bonded to the surface of a ceramic substrate having an oxide surface layer, and then eutectic sintering was performed in the vacuum furnace at a temperature of 1065 to 1083 ℃, so that the copper foil was directly bonded to the surface of the ceramic substrate, and thus, copper oxide was formed on both sides of the copper foil, which is not favorable for eutectic bonding of one side of the copper foil to the ceramic. At present, the copper foil of the copper oxide layer is a wet process, and the copper foil can form the copper oxide layer on one side by using a liquid medicine.
However, no matter what the formation method of the copper oxide layer is, many fine voids are formed in the copper oxide layer, and the gas in the voids cannot be exhausted due to the poor flowing ability of the eutectic liquid phase during the eutectic sintering, so that many air gaps are interposed between the copper foil and the ceramic after the composite substrate is manufactured, which not only reduces the heat conduction ability, but also reduces the bonding strength.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: the copper foil with the gas escape structure is provided, and the technical problems in the prior art are solved.
In order to achieve the above object, the utility model adopts the following technical scheme:
a copper foil with a gas escape structure, in particular to a copper foil which is used in a composite substrate and is in eutectic bonding with ceramics, which is characterized in that: the copper foil is provided with a base layer and a copper oxide film layer formed on the surface of the base layer, and a plurality of air escape spaces are concavely arranged on the copper oxide film layer.
The utility model has the advantages of, utilize the sunken gas space of fleing of establishing on the copper oxide rete on copper foil surface, when letting copper foil and ceramic substrate eutectic bonding, increase the ability of flowing in eutectic liquid phase, when reducing the combined type base plate and making, the air gap quantity that is mingled with between copper foil and the pottery promotes the heat-conduction ability and the joint strength of combined type base plate by a wide margin.
Drawings
Fig. 1 is a cross-sectional view of the present invention.
Fig. 2 is a partial sectional view of the present invention.
Fig. 3 is a cross-sectional view of the present invention in eutectic bonding with a ceramic substrate.
Fig. 4 is a cross-sectional view of the present invention with a shielding region on the surface of the substrate.
FIG. 5 is a cross-sectional view of the copper oxide film formed on the surface of the substrate according to the present invention.
Description of reference numerals: 1-copper foil; 11-a base layer; 12-a copper oxide film layer; 13-gas escape space; 2-a ceramic substrate; 3-shaded area.
Detailed Description
Please refer to fig. 1 to 3, as is clear from the drawings, the copper foil 1 of the present invention has a base layer 11 and a copper oxide film 12 formed on the surface of the base layer 11, and the copper oxide film 12 is concavely provided with a plurality of air escaping spaces 13, when the composite substrate is manufactured, the copper oxide film 12 of the copper foil 1 is attached to the surface of the ceramic substrate 2, and the copper foil 1 is heated to the eutectic temperature, so that the copper foil 1 and the copper oxide film 12 on the surface thereof generate the eutectic reaction, and then the composite substrate is manufactured by bonding the copper foil 1 and the ceramic substrate 2, due to the air escaping spaces 13, the flowing ability of the eutectic liquid phase of the copper oxide film 12 is increased, the generation of air gaps is reduced, when the composite substrate is manufactured, the number of air gaps between the copper foil 1 and the ceramic substrate 2 is greatly reduced, and the heat conduction ability and the bonding strength of the composite substrate are improved.
To further explain the formation of the gas escape space 13, please refer to fig. 4 and 5, it can be clearly seen from the drawings that, during the manufacturing of the copper foil 1, a plurality of shielding regions 3 are disposed on the surface of the base layer 11, so that a copper oxide film 12 is formed on the surface of the base layer 11, the copper oxide film 12 can be prepared by a dry process or a wet process, in the dry process, the portion of the base layer 11 shielded by the shielding regions 3 is not contacted with oxygen, and thus the gas escape space 13 corresponding to the shielding regions 3 is formed after the copper oxide film 12 grows out; in the wet process, similarly, the portion of the base layer 11 shielded by the shielding region 3 will not contact with the chemical solution, and the copper oxide film 12 will grow to form an air-escaping space 13 corresponding to the shielding region 3, and the wet process can use alkaline chemical solution (browning) or acidic chemical solution (blackening); after the copper oxide film layer 12 grows out, the shielding region 3 is removed.
Claims (1)
1. A copper foil with a gas escape structure, in particular to a copper foil which is used in a composite substrate and is in eutectic bonding with ceramics, which is characterized in that: the copper foil is provided with a base layer and a copper oxide film layer formed on the surface of the base layer, and a plurality of air escape spaces are concavely arranged on the copper oxide film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921478800.9U CN211141907U (en) | 2019-09-06 | 2019-09-06 | Copper foil with gas escape structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921478800.9U CN211141907U (en) | 2019-09-06 | 2019-09-06 | Copper foil with gas escape structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211141907U true CN211141907U (en) | 2020-07-31 |
Family
ID=71757879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921478800.9U Active CN211141907U (en) | 2019-09-06 | 2019-09-06 | Copper foil with gas escape structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211141907U (en) |
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2019
- 2019-09-06 CN CN201921478800.9U patent/CN211141907U/en active Active
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