CN211128850U

CN211128850U - Electromagnetic wave shielding film

Info

Publication number: CN211128850U
Application number: CN201922440867.XU
Authority: CN
Inventors: 李林军
Original assignee: Shenzhen Jinhui Technology Co ltd
Current assignee: Shenzhen Jinhui Technology Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-07-28
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses an electromagnetic wave shielding film, which is attached to one surface of a carrier film as a reference, and is characterized in that an insulating layer, a shielding layer, a conductive layer and a non-conductive layer are sequentially arranged on the carrier film; the insulating layer is an applied non-conductive ink layer which is arranged into a uniform coating or a pyramid-shaped coating; the conductive layer is composed of conductive adhesive, and the conductive adhesive is composed of an adhesive layer and conductive metal particles fused in the conductive adhesive; the non-conductive layer is composed of a glue layer of conductive glue; conductive metal particles are arranged on the outer layer surface of the non-conductive layer; the pyramidal coating is selected as the insulating layer of the utility model, so that the surface area of the insulating layer is increased, and the wave-absorbing function is enhanced; the arrangement of the conducting layer and the non-conducting layer not only enhances the heat conducting performance of the conducting layer, but also enhances the heat dissipation effect to a certain extent.

Description

Electromagnetic wave shielding film

Technical Field

The utility model relates to an electromagnetic wave shielding film.

Background

The traditional FCC L is mainly a glued product, and is mainly a three-layer structure composed of copper, an adhesive and a PI film, the adhesive is mostly epoxy in 3L-FCC L, 3L-FCC L, the thermal stability is poorer than that of a PI base material, so that the thermal stability and the dimensional stability of FCC L are all reduced, and the thickness of the base material is larger.

However, the same type of products on the market have extremely poor heat insulation or heat dissipation effects, so that the mainboard of the main device to be protected has stronger reflection of electromagnetic waves when the temperature is higher and higher, and the requirement cannot be met when radar wave absorption is carried out. This situation results in a high loss rate of the subject device to be protected.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to overcome the above-mentioned drawbacks, and to provide an electromagnetic wave shielding film.

The utility model provides a technical scheme that its technical problem adopted is:

an electromagnetic wave shielding film is attached to one surface of a carrier film as a reference, and an insulating layer, a shielding layer, a conductive layer, and a nonconductive layer are provided in this order on the carrier film.

The insulating layer is an applied non-conductive ink layer that is provided as a uniform coating or a pyramidal coating.

The ink layer is made of polyurethane wave-absorbing materials.

The shielding layer is a copper-clad structure layer or a composite structure layer of copper cladding and silver cladding; the composite structure layer coated with copper and silver has the following arrangement modes: copper-clad layer, silver-clad layer, copper-clad layer, silver-clad layer.

The conductive layer is composed of conductive adhesive, and the conductive adhesive is composed of an adhesive layer and conductive metal particles fused in the conductive adhesive; the non-conductive layer is composed of a glue layer of conductive glue.

Conductive metal particles are arranged on the outer layer surface of the non-conductive layer.

The carrier film is a carrier for providing an attachment surface for the electromagnetic wave shielding film, and is substantially a release layer or a release film adhered with the electromagnetic wave shielding film.

When the heat-insulating layer is applied, the heat-conducting performance is enhanced due to the penetration of the conductive metal particles in the conductive layer, and the heat-insulating area is shared, so that the heat-radiating effect is enhanced to a certain extent due to the fact that the heat-insulating layer is in a surface layer stage.

Conductive metal particles are arranged on the outer layer surface of the non-conductive layer, and the metal ions penetrate through the outer layer surface of the non-conductive layer to enter the conductive layer under the action of internal heat and external heat and the combined action of wave absorption or other external forces of the insulating layer, and form more uniform metal ion arrangement with the conductive metal particles of the conductive layer in the conductive layer; the heat-conducting performance of the conducting layer is enhanced, and the heat dissipation effect is enhanced to a certain extent.

Has the advantages that:

the pyramidal coating is selected as the insulating layer of the utility model, so that the surface area of the insulating layer is increased, and the wave-absorbing function is enhanced; the arrangement of the conducting layer and the non-conducting layer not only enhances the heat conducting performance of the conducting layer, but also enhances the heat dissipation effect to a certain extent.

Drawings

Fig. 1 is a schematic diagram of the technical structure of the present invention.

Detailed Description

In the embodiment of the method, the first step,

referring to fig. 1, an electromagnetic wave shielding film is attached to one surface of a carrier film 1 as a reference, and an insulating layer 2, a shielding layer 3, a conductive layer 4, and a nonconductive layer are sequentially provided on the carrier film.

The ink layer is made of polyurethane wave-absorbing materials.

During application, the non-conductive layer is penetrated by conductive metal particles, so that the originally non-conductive adhesive layer integrates the performance of conductive adhesive, the heat conduction performance is enhanced, the heat insulation area is shared, and the heat dissipation effect is enhanced to a certain extent due to the fact that the non-conductive adhesive layer is in a surface layer stage.

The insulating layer adopts a pyramid-shaped coating, so that the surface area of the insulating layer is increased, and the wave absorbing function is enhanced.

The shielding layer is selected, and a copper-clad structure layer is selected in terms of simplification; selecting a copper-clad structure layer and a silver-clad composite structure layer from the aspects of hierarchy rise and durable use; arranging the copper-clad and silver-clad composite structure layer: the copper-clad laminate comprises a copper-clad layer and a silver-clad layer, and comprises a silver-clad layer, a copper-clad layer and a silver-clad layer.

The mutual contact among the conductive particles forms a conductive path, so that the conductive adhesive has conductivity, and the stable contact among the particles in the adhesive layer is caused by the curing or drying of the conductive adhesive. Before the conductive adhesive is cured or dried, the conductive particles are separated in the adhesive and are not in continuous contact with each other, so that the conductive adhesive is in an insulating state. After the conductive paste is cured or dried, the volume of the adhesive shrinks due to the volatilization of the solvent and the curing of the adhesive, so that the conductive particles are in a stable continuous state with each other, thereby exhibiting conductivity.

When the directional movement of the free electrons in the conductive particles is hindered, the blockage can be regarded as a potential barrier with a certain potential energy. From the concept of quantum mechanics, it is known that, even if the energy of a micro particle is smaller than that of a potential barrier, the micro particle may pass through the potential barrier in addition to being reflected, and the phenomenon that the micro particle passes through the potential barrier is called a penetration effect and may be called a tunnel effect. An electron is a microscopic particle, and thus it has a possibility of being hindered through the spacer between conductive particles. The probability of the electrons passing through the isolating layer is related to the thickness of the isolating layer and the energy of the potential barrier of the isolating layer and the energy difference of the electrons, and the smaller the thickness and the difference are, the higher the probability of the electrons passing through the isolating layer is. When the thickness of the isolation layer is reduced to a certain value, electrons easily pass through the thin isolation layer, so that the isolation layer among the conductive particles becomes a conductive layer. The conductive layer resulting from tunneling can be equated with a resistance and a capacitance.

And arranging release layers on the two sides of the carrier film, wherein the release layers comprise the base film and release agent or silicone oil coated on the surface of the base film, so that one side of the carrier film is a use side, and the other side of the carrier film provides anti-adhesion for an anti-adhesion process in subsequent work, and the thickness of the carrier film is 15-100 mu m.

The using surface is uniformly coated with an insulating layer, and the thickness of the insulating layer is between 3 and 100 mu m.

Conducting conductive treatment on the insulating layer to form a shielding layer, wherein the thickness of the shielding layer is between 1 and 5 mu m.

And coating conductive adhesive on the shielding layer to form a conductive layer.

And coating an adhesive layer on the conductive adhesive to form a non-conductive layer and scattering conductive metal particles on the non-conductive layer.

And a protective release layer for protecting the shielding film is attached to the outer surface of the non-conductive layer, and the thickness of the protective release layer is 50-150 micrometers.

The non-conductive layer disposed therein may be removed and omitted for some applications.

In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims

1. An electromagnetic wave shielding film is attached to one surface of a carrier film as a reference, and an insulating layer, a shielding layer, a conductive layer, and a nonconductive layer are provided in this order on the carrier film.

2. The electromagnetic wave shielding film of claim 1, wherein the insulating layer is an applied non-conductive ink layer, the ink layer being provided as a uniform coating or a pyramidal coating.

3. The electromagnetic wave shielding film of claim 2, wherein the material of the ink layer is a polyurethane wave absorbing material.

4. The electromagnetic wave shielding film according to claim 1, wherein the shielding layer is a copper-clad structure layer or a composite structure layer of copper clad and silver clad; the composite structure layer coated with copper and silver has the following arrangement modes: copper-clad layer, silver-clad layer, copper-clad layer, silver-clad layer.

5. The electromagnetic wave shielding film of claim 1, wherein the conductive layer is composed of a conductive adhesive, the conductive adhesive is composed of an adhesive layer and conductive metal particles fused in the conductive adhesive; the non-conductive layer is composed of a glue layer of conductive glue.

6. The electromagnetic wave shielding film according to claim 1, wherein conductive metal particles are provided on an outer surface of the non-conductive layer.

7. The electromagnetic wave shielding film of claim 1, wherein the carrier film is a carrier for providing an attachment surface for the electromagnetic wave shielding film, and is substantially a release layer or a release film adhered to the electromagnetic wave shielding film.