SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board test fixture, it has the multiple circuit board that awaits measuring of adaptation, the higher characteristics of utilization ratio.
The utility model provides a technical scheme:
in a first aspect, an embodiment of the present invention provides a circuit board testing jig, which includes a testing docking assembly and a testing assembly, wherein the testing docking assembly includes a testing mounting plate, a testing thimble plate and a plurality of testing thimbles; the test mounting plate is used for fixedly connecting a circuit board to be tested; the test thimble plate is provided with a plurality of test holes, the number of the test holes is more than that of the test thimbles, the test thimbles are detachably arranged in the test holes one by one, the test mounting plate is movably connected with the test thimbles and is constructed to be capable of moving close to the test thimble plate along a first direction so as to enable the test thimbles to be electrically connected with test interfaces on the circuit board to be tested respectively, wherein the first direction is a direction which is perpendicular to the test thimble plate and faces the test thimble plate; the test component is electrically connected with the plurality of test thimbles respectively and is used for testing the circuit board to be tested.
With reference to the first aspect, in a first implementation manner of the first aspect, the test mounting plate is provided with a plurality of test mounting holes, the test docking assembly further includes a plurality of test mounting pieces, which are less than the test mounting holes in number, and the test mounting pieces are detachably and one-by-one arranged in the test mounting holes, and the test mounting pieces are used for detachably connecting the circuit board to be tested so as to connect the circuit board to be tested in the test mounting plate.
With the combination of the first aspect and the implementation manner thereof, in a second implementation manner of the first aspect, the test installation part comprises a first installation section and a second installation section which are connected in sequence, the first installation section and the second installation section are arranged at included angles, the first installation section is detachably arranged in the test installation hole and is multiple, the second installation section is far away from the corresponding first installation section, and one end of the first installation section is used for being detachably connected with the circuit board to be tested.
With reference to the first aspect and the foregoing implementation manner, in a third implementation manner of the first aspect, the circuit board testing fixture further includes a testing rack, the testing ejector plate is mounted on the testing rack, and the testing mounting plate is located on one side of the testing ejector plate away from the testing rack; the test mounting plate is provided with a test through hole, the second mounting section is far away from one end of the first mounting section and extends to the test through hole, so that the circuit board to be tested corresponds to the test through hole, the test through hole corresponds to the test thimble, and the test thimble is constructed to pass through the test through hole and be electrically connected with the test interface when the test mounting plate is close to the test thimble plate to move.
With reference to the first aspect and the foregoing implementation manner of the first aspect, in a fourth implementation manner of the first aspect, the test docking assembly further includes a test pressing plate and a plurality of test pressing pieces; a plurality of the test is pressed and is held the piece all connect in the test is pressed and is held the board, test is pressed and is held board swing joint in the test frame, and be constructed as can follow the first direction is close to the test mounting panel motion is supported and is held in order to follow the first direction the test mounting panel, and drive the test is pressed and is held the piece pressure and hold the circuit board that awaits measuring keeps away from one side of test thimble board.
With reference to the first aspect and the foregoing implementation manner, in a fifth implementation manner of the first aspect, the test pressing plate is provided with a plurality of test pressing holes, the number of which is greater than that of the test pressing pieces, and the plurality of test pressing pieces are detachably arranged in the test pressing holes one by one.
With reference to the first aspect and the foregoing implementation manner of the first aspect, in a sixth implementation manner of the first aspect, the test docking assembly further includes a plurality of force-bearing columns; a plurality of the stress columns are distributed on the edge of the test mounting plate, are positioned between the test mounting plate and the test pressing plate, and are constructed in a way that the test pressing plate presses and holds the test mounting plate through a plurality of the stress columns.
With reference to the first aspect and the foregoing implementation manner, in a seventh implementation manner of the first aspect, the test docking assembly further includes a test guide post, the test guide post is disposed along the first direction, and the test pressing plate is slidably connected to the test pressing plate.
With reference to the first aspect and the foregoing implementation manner, in an eighth implementation manner of the first aspect, the test docking assembly further includes a test lifting rod, one end of the test lifting rod is rotatably connected to the test pressing plate, and a position of the test lifting rod, which is close to the test pressing plate, is rotatably connected to the test rack.
With reference to the first aspect and the foregoing implementation manner, in a ninth implementation manner of the first aspect, the test docking assembly further includes a test buffer, where the test buffer includes a buffer elastic portion and a buffer guide portion;
the one end of buffering guide part connect in test thimble board, other end movably wears to locate the test mounting panel, and follow the first direction sets up, buffering elastic component elastic deformation's compression set up in the test mounting panel with between the test thimble board, so that the test mounting panel can be followed the buffering guide part is close to the motion of test thimble board.
Compared with the prior art, the embodiment of the utility model provides a circuit board test fixture includes for prior art's beneficial effect:
the test butt joint component comprises a test mounting plate, a test thimble plate and a plurality of test thimbles, the test mounting plate is fixedly connected with a circuit board to be tested, test holes with the quantity more than that of the test thimbles are formed in the test thimble plate, the test thimbles are detachably arranged in the test holes one by one, the quantity of the test thimbles is less than that of the test holes, the test thimbles can be selectively arranged in the test holes at different positions, the test mounting plate is movably connected with the test thimbles and can move close to the test thimble plate along a first direction, so that the test thimbles are respectively electrically connected with test interfaces on the circuit board to be tested, and the first direction is perpendicular to the test thimble plate and faces towards the test. Therefore, when the test thimble structure is used, a user can arrange the test thimble in the first test hole corresponding to the test interface, fix the circuit board to be tested on the mounting plate to be tested, so that the test thimble corresponds to the test interface on the corresponding circuit board to be tested, drive the test mounting plate to move close to the test thimble plate along the first direction, so that the test thimble is in butt joint with the test interface, and then test the circuit board to be tested by the test component. When the circuit board to be tested is replaced or the distribution positions of the test interfaces of the circuit board to be tested are changed, a user can adjust the test thimble in the test holes at different positions, so that the test thimble can be adapted to different circuit boards to be tested or different distribution test interfaces, and the utilization rate of the test fixture is improved.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Example (b):
referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a circuit board testing fixture 10 according to an embodiment of the present invention. Fig. 2 is a partially enlarged schematic view of fig. 1 at II. The directions indicated by the arrows in fig. 1 and 2 are both the first direction.
An embodiment of the utility model provides a circuit board test fixture 10, this circuit board test fixture 10 have can the multiple circuit board 900 that awaits measuring of adaptation, the higher characteristics of utilization ratio. The circuit board testing jig 10 can be applied to a testing line, an assembly line, and other scenes, and of course, the circuit board testing jig 10 can also be used independently.
The circuit board testing jig 10 comprises a testing butt joint component 12 and a testing component 15, wherein the testing component 15 is used for testing the performance of the circuit board 900 to be tested, and the testing butt joint component 12 is in butt joint with a testing interface (not shown) of the circuit board 900 to be tested, and the testing butt joint component 12 can be adapted to testing interfaces distributed at different positions of different circuit boards 900 to be tested, so that the utilization rate of the circuit board testing jig 10 is improved.
The testing and docking assembly 12 includes a testing mounting plate 122, a testing ejector plate 1241 and a plurality of testing ejectors 1243, the testing mounting plate 122 is fixedly connected to the circuit board 900 to be tested, the test thimble plate 1241 is provided with test holes 1242 of which the number is larger than that of the test thimbles 1243, the plurality of test thimbles 1243 are detachably arranged in the test holes 1242 one by one, because the number of the test thimbles 1243 is smaller than that of the test holes 1242, the test thimble 1243 is selectively disposed in a test hole 1242 at a different position, and the test mounting plate 122 is movably coupled to the test thimble 1243, and is configured to be movable in a first direction toward the test thimble plate 1241, so that the plurality of testing thimbles 1243 are electrically connected to the testing interfaces of the circuit board 900 to be tested, where the first direction is a direction generally perpendicular to test ejector plate 1241 and toward test ejector plate 1241, where perpendicular is an angle between eighty-five degrees and ninety-five degrees. In other words, the plurality of test thimble 1243 is detachably disposed in a part of the test holes 1242, and when the test thimble 1243 is required to be adapted to different test interfaces or different circuit boards 900 to be tested, the test thimble 1243 is replaceable in the test holes 1242 at different positions to adapt to different test interfaces or different circuit boards 900 to be tested, and the plurality of test thimble 1243 is electrically connected to the test component 15, so that the test component 15 tests the circuit board 900 to be tested through the test thimble 1243, for example, whether the circuit board 900 to be tested is normal in operation, whether the function is complete, and the like.
Thus, when in use, a user can set the testing thimble 1243 in the first testing hole 1242 corresponding to the testing interface, and fix the circuit board 900 to be tested on the mounting plate to be tested, so that the testing thimble 1243 corresponds to the testing interface on the corresponding circuit board 900 to be tested, and then drive the testing mounting plate 122 to move close to the testing thimble plate 1241 along the first direction, so that the testing thimble 1243 is in butt joint with the testing interface, and then the testing component 15 completes the testing of the circuit board 900 to be tested.
When the circuit board 900 to be tested is replaced or the distribution positions of the test interfaces of the circuit board 900 to be tested are changed, a user can adjust the test thimble 1243 in the test holes 1242 at different positions, so that the test thimble 1243 can be adapted to different circuit boards 900 to be tested or different distribution test interfaces, and the utilization rate of the test fixture is improved.
It should be noted that the cross-sectional area of the testing thimble 1243 is smaller than or equal to the area of the testing interface to ensure that the testing thimble 1243 can conveniently and stably contact with the testing interface, and the testing thimble 1243 is made of a flexible material, so that the position of the testing thimble 1243 can be further finely adjusted by adjusting the shape of the testing thimble 1243 to ensure that the thimble contacts with the testing interface well.
Referring to fig. 2, a plurality of test mounting holes 1221 may be formed in the test mounting plate 122, the test docking assembly 12 may further include a plurality of test mounting members 123 less than the test mounting holes 1221, the plurality of test mounting members 123 are disposed in the test mounting holes 1221 one by one, and the plurality of test mounting members 123 are detachably connected to the circuit board 900 to be tested, so that the circuit board 900 to be tested may be selectively and detachably connected to some of the test mounting holes 1221 through the test mounting members 123 to connect the circuit board 900 to be tested to the test mounting plate 122, in other words, for different circuit boards, different docking interface distribution changes or different test requirements changes, the positions of the test mounting members 123 on the test mounting plate 122 may be adapted, that is, the test mounting members 123 are connected to the test mounting holes 1221 at different positions, and then the test mounting members 123 are connected to the circuit board 900 to be tested to adjust the, so as to further improve the adaptability of the circuit board testing jig 10.
Further, this test installation part 123 can include first installation section 1231 and second installation section 1232 that connect gradually, and first installation section 1231 and second installation section 1232 are the contained angle setting, wherein, first installation section 1231 detachably sets up in test mounting hole 1221, and because the quantity of test mounting hole 1221 is more than test installation part 123, first installation section 1231 optionally sets up in the test mounting hole 1221 of different positions, the one end that corresponding first installation section 1231 was kept away from to a plurality of second installation sections 1232 is used for detachably connecting circuit board 900 that awaits measuring.
In this way, the circuit board 900 to be tested is connected to the test mounting plate 122 through the first mounting section 1231 and the second mounting section 1232 which are bent, when the circuit board 900 to be tested is replaced or the distribution position of the test interface of the circuit board 900 to be tested is changed, the position of one end, away from the first mounting section 1231, of the second mounting section 1232 can be adjusted by arranging the first mounting section 1231 in different test mounting holes 1221, or by arranging the first mounting section 1231 in different test mounting holes 1221, so that the second mounting section 1232 extends towards the circuit board 900 to be tested from different directions, the position, away from one end of the first mounting section 1231, of the second mounting section 1232 can be finely adjusted, and the adaptability of the circuit board test fixture 10 is further improved.
It should be noted that, in this embodiment, the first installation section 1231 and the second installation section 1232 are substantially at a right angle, in other embodiments, the first installation section 1231 and the second installation section 1232 may be disposed at other angles, and the test docking assembly 12 may further include a test buffer 125, the test buffer 125 includes a buffer elastic portion 1251 and a buffer guide portion 1252, one end of the buffer guide portion 1252 is connected to the test thimble plate 1241, the other end is movably inserted through the test installation plate 122 and is disposed along the first direction, a compression of elastic deformation of the buffer elastic portion 1251 is disposed between the test installation plate 122 and the test thimble plate 1241, so that the test installation plate 122 can move along the buffer guide portion 1252 close to the test thimble plate 1241, so that when the test installation plate 122 moves close to the test thimble plate 1241, the buffer elastic portion 1251 is compressed to avoid abutting the test interface with the test thimble 3, the circuit board 900 to be tested or the mounting part of the test thimble 1243 receives a large impact, and after the test is completed, the buffer elastic part 1251 can also lift the test mounting plate 122 to separate the test thimble 1243 from the test interface.
With reference to fig. 1 and fig. 2, the circuit board testing apparatus 10 may further include a testing frame 17, wherein the testing ejector plate 1241 is mounted on the testing frame 17, and the testing mounting plate 122 is located on a side of the testing ejector plate 1241 away from the testing frame 17, in other words, the testing mounting plate 122 and the testing frame 17 are respectively located on two sides of the testing ejector plate 1241.
A test through hole 1222 may be further formed in the test mounting plate 122, and one end of the second mounting section 1232, which is away from the first mounting section 1231, extends to the test through hole 1222, so that the circuit board 900 to be tested corresponds to the test through hole 1222, that is, the test mounting member 123 is disposed at one side of the test mounting plate 122, which is away from the test rack 17, and connects the circuit board 900 to be tested to one side of the test mounting plate 122, which is away from the test rack 17, so that an operator can replace the circuit board 900 to be tested above the test mounting plate 122; also, test through-hole 1222 corresponds to test pin 1243, and is such that when test mounting plate 122 moves closer to test pin plate 1241, test through-hole 1222 is sleeved to test pin 1243 in the first direction, so that test pin 1243 passes through test through-hole 1222 to be electrically connected to the test interface.
Further, the test docking assembly 12 may further include a test holding plate 121 and a plurality of test holding members 1213, the plurality of test holding members 1213 are all connected to the test holding plate 121, the test holding plate 121 is movably connected to the test rack 17, and the test holding plate 121 can move along the first direction close to the test mounting plate 122 to abut against the test mounting plate 122 along the first direction, so as to drive the test mounting plate 122 to move along the first direction, and can also drive the test holding members 1213 to hold the side of the circuit board 900 to be tested away from the test thimble plate 1241, so that when the test thimble 1243 is upwardly held by the bottom of the circuit board 900 to be tested, the test holding members 1213 hold the circuit board 900 to be tested by the top of the circuit board 900 to be tested, so as to further fix the circuit board 900 to improve the stability of the test thimble 1243 in docking with the interface to be tested.
It should be noted that, in this embodiment, one end of the second mounting section 1232, which is far away from the first mounting section 1231, abuts against one side of the circuit board 900 to be tested, which is far away from the testing clamping plate 121, and clamps the circuit board 900 to be tested together with the testing clamping member 1213, so as to maintain the position of the circuit board 900 to be tested relative to the mounting board to be tested, and further improve the stability of the butt joint between the testing thimble 1243 and the interface to be tested. In addition, the position where the test pressing member 1213 abuts against the circuit board 900 to be tested and the position where the second mounting section 1232 abuts against the circuit board 900 to be tested may be both sides of the same position of the circuit board 900 to be tested, so as to improve the stability of clamping the circuit board 900 to be tested, and certainly, the position where the test pressing member 1213 abuts against the circuit board 900 to be tested and the position where the second mounting section 1232 abuts against the circuit board 900 to be tested may be staggered, and the clamping position where the test pressing member 1213 and the second mounting section 1232 clamp the circuit board 900 to be tested is adjusted according to the specific structure of the circuit board 900 to be tested.
During operation, an operator may first place the circuit board 900 to be tested on the end of the second mounting section 1232 away from the first mounting section 1231, and then operate the test pressing plate 121 to drive the test pressing plate 121 to move along the first direction, so that the test pressing member 1213 presses the circuit board 900 to be tested from above the circuit board 900 to be tested, so as to fix the circuit board 900 to be tested, and make the test mounting plate 122 move along the first direction, and the test thimble 1243 passes through the test through hole 1222 to be electrically connected to the test interface.
Further, a plurality of test pressing holes 1212 with a number greater than that of the test pressing members 1213 may be formed in the test pressing plate 121, and the plurality of test pressing members 1213 may be detachably disposed in the test pressing holes 1212 one by one, since the number of the test pressing members 1213 is less than that of the test pressing holes 1212, the position of the test pressing members 1213 on the test pressing plate 121 may be flexibly adjusted to meet the pressing requirement for the circuit board 900 to be tested when different circuit boards, docking interfaces, or test requirements change, so as to maintain the position of the circuit board 900 to be tested stable relative to the mounting board to be tested, and further improve the adaptability of the circuit board test fixture 10.
It should be noted that the test docking assembly 12 may further include a plurality of force-bearing columns 126, the force-bearing columns 126 are disposed at the edge of the test mounting plate 122 and located between the test mounting plate 122 and the test pressure plate 121, and when the test pressure plate 121 is close to the test mounting plate 122, the test pressure plate 121 presses the test mounting plate 122 together through the force-bearing columns 126, so as to improve the stability of the test mounting plate 122.
In addition, the testing thimble 1243, the testing holding unit 1213 and the first mounting section 1231 are all clamped or screwed in the corresponding holes by a fixing block 1244, and the fixing block 1244 may be rubber, plastic or metal block. The test holes 1242 are smaller and denser than the test mounting holes 1221 and the test clamping holes 1212, so as to ensure that the test thimble 1243 covers the entire circuit board 900 to be tested, and the test mounting holes 1221 and the test clamping holes 1212 with larger apertures ensure that the circuit board 900 to be tested is more stably fixed.
Further, the test docking assembly 12 may further include a test guiding column 127, the test guiding column 127 is disposed along the first direction, and the test pressing plate 121 is slidably connected to the test pressing plate 121, so that the test pressing plate 121 slides along the test guiding column 127, and the movement stability of the test pressing plate 121 is further improved.
It should be noted that the test docking assembly 12 may further include a test connection board 128, the test connection board 128 is connected to a side of the test pressure holding board 121 far from the test mounting board 122, a gap is left between the test connection board 128 and the test pressure holding board 121 so as to mount the test pressure holding member 1213, and the test connection board 128 is slidably connected to the test guide column 127 so as to slidably connect the test connection board 128 and the test pressure holding board 121.
Further, the test docking assembly 12 may further include a test lifting rod 129, one end of the test lifting rod 129 is rotatably connected to the test connecting plate 128, and the position of the test lifting rod 129 close to the test holding plate 121 is rotatably connected to the test rack 17, so that an operator can pull one end of the test lifting rod 129 far from the test holding plate 121 to drive the test connecting plate 128 to lift by a lever principle, and further drive the test holding plate 121 to lift or lower, while in other embodiments, the test holding plate 121 may also realize a motion close to the circuit board 900 to be tested by other motion mechanisms, such as a mechanical arm, or an electric, pneumatic, or oil-driven telescopic mechanism.
Referring to fig. 1, for the convenience of showing the internal structure, a part of the testing assembly 15 in fig. 1 is shown by a dotted line, wherein the testing assembly 15 includes a testing current meter 151 and a testing voltage meter 152 both electrically connected to the testing thimble 1243 for testing whether the working current and the working voltage of the circuit to be tested are normal or not.
Further, the testing component 15 further includes a function testing element 153, for testing whether the function of the circuit board 900 to be tested is normal, in this embodiment, taking the circuit board 900 to be tested as the circuit board of the hair removal instrument as an example, the function testing element 153 includes a lithium battery 1531, a pulse lamp 1532, a fan 1533, an external power interface 1534, an incandescent lamp 1535, a charging/discharging capacitor 1536, a refrigeration sheet 1537 and a touch key 1538, the function testing element 153 is electrically connected to the circuit board 900 to be tested through a testing thimble 1243 to form a circuit portion of the hair removal instrument, and an observation window 1539 is further formed on the testing frame 17 to be opposite to the incandescent lamp 1535, wherein the external power interface 1534 or the lithium battery 1531 supplies power to the circuit board 900 to be tested; the refrigeration chip 1537 is used for experiencing whether the refrigeration chip 1537 refrigerates, so as to detect whether the refrigeration function of the circuit board 900 to be detected is normal; the touch key 1538 is used to implement an operation product to detect whether the operation function of the circuit board 900 to be tested is normal; the incandescent lamp is used to discharge the charging/discharging capacitor 1536, the observation window 1539 is used to observe whether the incandescent lamp 1535 below is on during the discharging process of the charging/discharging capacitor 1536, and the pulse lamp 1532 is disposed below the testing frame 17 and staggered from the observation window 1539 to prevent the direct irradiation of the pulse light and damage to the eyes of the user. It is understood that in other embodiments, the functional test piece 153 may be a circuit portion other than the circuit board 900 to be tested, which forms other products.
When in use: adjusting a test thimble 1243 at the position of a test thimble plate 1241; fixedly placing the circuit board 900 to be tested at one end of the second installation section 1232 far away from the first installation section 1231; the test holding plate 121 is lowered through the test lifting rod 129 to hold the test mounting plate 122, the test holding piece 1213 and the second mounting section 1232 together clamp the circuit board 900 to be tested, and the test mounting plate 122 is pressed down, so that the test thimble 1243 passes through the test through hole 1222, and the test thimble 1243 passes through the test through hole 1222 to be electrically connected to the test interface; supplying power to the circuit board 900 to be tested, testing each function of the circuit board 900 to be tested one by one, and observing working current and voltage; after the test is finished, the power supply is turned off; the charging and discharging capacitor 1536 is discharged to ensure the safety of the operator, and the on and off condition of the incandescent lamp 1535 can be checked through the observation window 1539 to judge the discharging condition of the charging and discharging capacitor 1536; the test lifting rod 129 lifts the test pressing plate 121, the test mounting plate 122 is lifted under the elastic force of the buffer elastic part 1251, the test interface is separated from the test thimble 1243, and the circuit board 900 to be tested is taken down, so that the test of the circuit board 900 to be tested is completed.
The embodiment of the utility model provides a circuit board test fixture 10's theory of operation is:
the test docking assembly 12 includes a test mounting plate 122, a test thimble plate 1241 and a plurality of test thimbles 1243, the test mounting plate 122 is fixedly connected to the circuit board 900 to be tested, test holes 1242 with a larger number than the test thimbles 1243 are formed on the test thimble plate 1241, the plurality of test thimbles 1243 are detachably disposed in the test holes 1242 one by one, because the number of the test thimbles 1243 is smaller than the test holes 1242, the test thimbles 1243 are selectively disposed in the test holes 1242 at different positions, and the test mounting plate 122 is movably connected to the test thimbles 1243 and is configured to be capable of moving close to the test thimble plate 1241 along a first direction so as to make the plurality of test thimbles 1243 electrically connected to the test interfaces on the circuit board 900 to be tested, wherein the first direction is a direction perpendicular to the test thimble plate 1241 and facing the test thimble plate 1241, in other words, the plurality of test, when the test interfaces distributed differently or different circuit boards 900 to be tested need to be adapted, the test thimble 1243 can be replaced in the test hole 1242 at different positions to adapt to the test interfaces distributed differently or different circuit boards 900 to be tested, and the plurality of test thimbles 1243 are electrically connected to the test component 15, so that the test component 15 can test the circuit board 900 to be tested through the test thimble 1243, for example, the test of the circuit board 900 to be tested is normal or not, and the function is complete or not. Thus, when in use, a user can set the testing thimble 1243 in the first testing hole 1242 corresponding to the testing interface, and fix the circuit board 900 to be tested on the mounting plate to be tested, so that the testing thimble 1243 corresponds to the testing interface on the corresponding circuit board 900 to be tested, and then drive the testing mounting plate 122 to move close to the testing thimble plate 1241 along the first direction, so that the testing thimble 1243 is in butt joint with the testing interface, and then the testing component 15 completes the testing of the circuit board 900 to be tested. When the circuit board 900 to be tested is replaced or the distribution positions of the test interfaces of the circuit board 900 to be tested are changed, a user can adjust the test thimble 1243 in the test holes 1242 at different positions, so that the test thimble 1243 can be adapted to different circuit boards 900 to be tested or different distribution test interfaces, and the utilization rate of the test fixture is improved.
In summary, the following steps:
an embodiment of the utility model provides a circuit board test fixture 10, it has can the multiple circuit board 900 that awaits measuring of adaptation, the higher characteristics of utilization ratio.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it will be apparent to those skilled in the art that the features in the above embodiments may be combined with each other without conflict, and various modifications and variations of the present invention are possible. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The present embodiments are to be considered as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.