CN211063855U - Rigid-flex board - Google Patents

Abstract

The utility model discloses a soft-hard combined board, which comprises a base board, a positioning column and a heat dissipation pile; the soft board is arranged on the substrate and comprises a printing layer, a circuit layer and an insulating layer which are sequentially arranged from top to bottom, the insulating layer is connected with the substrate, the soft board is further provided with a positioning hole and a heat dissipation hole, the inner walls of the positioning hole and the heat dissipation hole are covered by the insulating layer, the positioning column is inserted into the positioning hole, and the heat dissipation pile is inserted into the heat dissipation hole. The positioning column can firmly hold the soft board, so that the soft board is not easy to fall off, the heat dissipation pile is used for dissipating heat of the soft board, and the heat absorbed by the heat dissipation pile can be diffused on the base plate due to the fact that the base plate is plate-shaped, and heat dissipation is facilitated; and the inner walls of the positioning hole and the heat dissipation hole are covered by the insulating layer, so that current cannot flow to the substrate from the positioning column and the heat dissipation pile. It is understood that the printed layer is also insulating, and the insulating layer may be a resin film layer or a mylar film layer, etc.

Description

Rigid-flex board

Technical Field

The utility model relates to a circuit board technical field, in particular to soft or hard combination board.

Background

The circuit board is often used in various electronic devices, and compared with the conventional wiring method, the use of the circuit board greatly reduces the space occupied by the circuit, and the various electronic devices are gradually reduced in weight and size.

The existing circuit board has poor heat-conducting property, can cause circuit damage on the circuit board due to slight overload, is not beneficial to practical use, and is easy to fall off due to infirm bonding of the circuit board, thereby causing the waste of circuit board elements in the process of producing electrical equipment.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a soft or hard combination board can heat conduction.

According to the utility model discloses a rigid-flex board of first aspect embodiment, include:

the base plate is provided with a positioning column and a heat dissipation pile;

the soft board is arranged on the substrate and comprises a printing layer, a circuit layer and an insulating layer which are sequentially arranged from top to bottom, the insulating layer is connected with the substrate, the soft board is further provided with positioning holes and heat dissipation holes, the inner walls of the positioning holes and the heat dissipation holes are covered by the insulating layer, the positioning columns are inserted into the positioning holes, and the heat dissipation piles are inserted into the heat dissipation holes.

According to the utility model discloses rigid-flex board has following beneficial effect at least: the positioning column can firmly grip the soft board to prevent the soft board from easily falling off, the heat dissipation pile is used for dissipating heat of the soft board, and the heat absorbed by the heat dissipation pile is diffused on the substrate due to the fact that the substrate is plate-shaped, and heat dissipation is facilitated; and the inner walls of the positioning hole and the heat dissipation hole are covered by the insulating layer, so that current cannot flow to the substrate from the positioning column and the heat dissipation pile.

According to the utility model discloses a some embodiments, the reference column reaches the heat dissipation stake all with base plate integrated into one piece, base plate integrated into one piece simple process makes things convenient for mass production, does benefit to and improves production efficiency.

According to the utility model discloses a some embodiments, the reference column highly reach the heat dissipation stake highly all with the thickness of soft board equals, makes the reference column with the heat dissipation stake is unlikely to the protrusion the soft board saves space during the installation and is convenient for install.

According to some embodiments of the utility model, be provided with the pin on the circuit layer, be provided with the through-hole on the printing layer, the pin passes the through-hole. The pins are used for connecting electrical components.

According to the utility model discloses a some embodiments, the base plate is provided with two, the both ends of soft board are connected respectively two on the base plate, the middle part of soft board is unsettled, the middle part flexible of soft board. The two base plates are equivalent to strengthening the terminals at the two ends of the flexible plate, and the middle part of the flexible plate is kept flexible so as to be suitable for the installation of circuit boards in various space states.

According to the utility model discloses a some embodiments, be provided with a plurality of first breachs of stepping down on the base plate, first breach of stepping down is used for stepping down for other spare parts, also can provide fastening position for the fastener simultaneously.

According to some embodiments of the invention, the substrate is made of copper, the thermal conductivity of copper is high, and the price is cheap.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a rigid-flex board according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of the rigid-flex board shown in FIG. 1;

fig. 3 is a partially enlarged view of the rigid-flex board shown in fig. 2 at a sectional view a;

fig. 4 is a schematic structural diagram of a substrate of the rigid-flex circuit board shown in fig. 1;

fig. 5 is a schematic structural view of a flexible board of the rigid-flex board shown in fig. 1.

The substrate 100, the positioning posts 110, the heat dissipation posts 120, the flexible printed circuit board 200, the circuit layer 210, the printed layer 220, the insulating layer 230, the pins 211, the positioning holes 240, the heat dissipation holes 250, and the first relief notches 130.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, a plurality of meanings are two or more, and above, below, within, and the like are understood as including the number, if there is a description that the first and the second are only used for distinguishing the technical features, it cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the precedence of the indicated technical features.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1 to 5, a rigid-flex board includes a substrate 100 provided with a positioning column 110 and a heat dissipating pile 120; the flexible printed circuit board 200 is disposed on the substrate 100, the flexible printed circuit board 200 includes a printed layer 220, a circuit layer 210 and an insulating layer 230, the printed layer 220, the circuit layer 210 and the insulating layer 230 are sequentially disposed from top to bottom, the insulating layer 230 is connected to the substrate 100, the flexible printed circuit board 200 is further provided with a positioning hole 240 and a heat dissipation hole 250, inner walls of the positioning hole 210 and the heat dissipation hole 250 are covered by the insulating layer 230, the positioning post 110 is inserted into the positioning hole 240, and the heat dissipation post. The positioning column 110 can firmly hold the soft board 200, so that the soft board 200 is not easy to fall off, the heat dissipation pile 120 is used for dissipating heat of the soft board 200, and the heat absorbed by the heat dissipation pile 120 is diffused on the substrate 100 due to the fact that the substrate 100 is plate-shaped, and heat dissipation is facilitated; and the inner walls of the positioning holes 210 and the heat dissipation holes 250 are covered by the insulating layer 230, so that current does not flow from the positioning posts 110 and the heat dissipation posts 120 to the substrate 100. It is understood that the printed layer 220 is also insulating, and the insulating layer 230 may be a resin film layer or a mylar film layer, etc.

In some embodiments, the positioning posts 110 and the heat dissipation posts 120 are integrally formed with the substrate 100, so that the substrate 100 is integrally formed, and the method is simple in process, convenient for mass production, and beneficial to improving the production efficiency.

In some embodiments, the height of the positioning column 110 and the height of the heat dissipation pile 120 are equal to the thickness of the flexible board 200, so that the positioning column 110 and the heat dissipation pile 120 do not protrude out of the flexible board 200, and the installation is convenient and space-saving.

In some embodiments, the circuit layer 210 has pins 211 disposed thereon, and the printing layer 220 has through holes disposed thereon, through which the pins 211 pass. The pins 211 are used to connect electrical components.

In some embodiments, the substrate 100 is provided with two pieces, the two ends of the flexible printed circuit board 200 are respectively connected to the two pieces of substrate 100, the middle portion of the flexible printed circuit board 200 is suspended, and the middle portion of the flexible printed circuit board 200 can be bent. The two substrates 100 correspond to terminals reinforcing both ends of the flexible board 200, while the middle portion of the flexible board 200 remains flexible to fit the circuit board in various spatial conditions. In some embodiments, the flexible board 200 and the substrate 100 are adhered by glue.

In some embodiments, a plurality of first yielding notches 130 are disposed on the substrate 100, and the first yielding notches 130 are used for yielding other components and also can provide fastening positions for the fastening device. Note that the fastener may be a bolt, a screw, a rivet, or the like.

In some embodiments, the flexible printed circuit board 200 is provided with a second relief notch, which has the same size as the first relief notch 130 and corresponds to the first relief notch 130.

In some embodiments, the substrate 100 is made of copper, which has a high thermal conductivity and is inexpensive, compared to other materials, such as aluminum, which is less expensive than copper but less thermally conductive than copper; compared with silver, the heat-conducting property of silver is better than that of copper, but the price of the silver is far higher than that of the copper, comprehensive consideration is taken, the copper is more cost-effective, and the heat-conducting coefficient of the copper can reach 398-400W/mK, the heat-conducting coefficient of the silver is 429W/mK, and the heat-conducting coefficient of the aluminum is 237W/mK at room temperature.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (7)

1. A rigid-flex board, comprising:

a substrate (100) provided with a positioning column (110) and a heat dissipation pile (120);

soft board (200), soft board (200) are including printing layer (220), circuit layer (210) and insulating layer (230) that from top to bottom set gradually, insulating layer (230) are connected base plate (100), locating hole (240) and louvre (250) have still been seted up in soft board (200), locating hole (240) with the inner wall of louvre (250) all by insulating layer (230) cover, reference column (110) insert in locating hole (240), heat dissipation stake (120) insert in louvre (250).

2. The rigid-flex board according to claim 1, wherein: the positioning column (110) and the heat dissipation pile (120) are integrally formed with the substrate (100).

3. The board of claim 2, wherein: the height of the positioning column (110) and the height of the heat dissipation pile (120) are equal to the thickness of the soft board (200).

4. The rigid-flex board according to claim 1, wherein: the printed circuit board is characterized in that pins (211) are arranged on the circuit layer (210), through holes are formed in the printed layer (220), and the pins (211) penetrate through the through holes.

5. The rigid-flex board according to claim 1, wherein: the two substrates (100) are arranged, two ends of the soft board (200) are connected to the two substrates (100) respectively, the middle of the soft board (200) is suspended, and the middle of the soft board (200) can be bent.

6. The rigid-flex board according to any one of claims 1 to 5, wherein: a plurality of first abdicating notches (130) are arranged on the substrate (100).

7. The rigid-flex board according to claim 1, wherein: the substrate (100) and the wiring layer (210) are made of copper.

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