CN211061989U

CN211061989U - Combined heat dissipation device for computer display card

Info

Publication number: CN211061989U
Application number: CN201922292926.3U
Authority: CN
Inventors: 孙越芳
Original assignee: Guiyang Nursing Vocational College (guiyang Health School)
Current assignee: Guiyang Nursing Vocational College (guiyang Health School)
Priority date: 2019-12-18
Filing date: 2019-12-18
Publication date: 2020-07-21
Anticipated expiration: 2029-12-18

Abstract

The utility model relates to the technical field of heat dissipation of graphic cards, and discloses a combined heat dissipation device for computer graphic cards, wherein four corners of the upper surface of a circuit board are provided with positioning holes, the upper surface of the circuit board is fixedly provided with a CPU, the upper surface of the CPU is fixedly provided with a heat dissipation device, one side of the circuit board is fixedly provided with a joint, and the bottom of the circuit board is fixedly arranged in a connecting component, the heat dissipation device arranged in the utility model conveys cooling liquid through the combination of an upper heating panel and a lower heating panel at the top of the circuit board and a water tank arranged at one side of the heating panel, the clamping groove of the lower heating panel is clamped on the outer surface of the CPU, a circulating pump in the water tank conveys the cooling liquid, the cooling liquid passes through cooling liquid pipes in the upper heating panel and the lower heating panel and then flows into the water tank, and flows circularly in a closed channel without leakage, the normal work of the display card system is ensured, and the noise is reduced while the heat dissipation effect is improved.

Description

Combined heat dissipation device for computer display card

Technical Field

The utility model relates to a display card heat dissipation technical field specifically is a combination formula heat abstractor for computer display card.

Background

The computer is commonly called computer, it is a modern electronic computer used for high-speed calculation, and the display card is called display interface card, also called display adapter, it is one of the most basic configuration and most important fittings of computer, the display card is an important component in the computer host, it is the equipment for making digital-analog signal conversion of computer, and it can undertake the task of outputting display graph, and the display card can be used for radiating heat when it is run.

However, the conventional display card is easily influenced by the weight of the display card after being inserted into the case, so that the interface is damaged, the maintenance cost is influenced, the heat dissipation efficiency is low when the display card runs, the temperature is high, the service life of internal elements is prolonged, and noise is generated during heat dissipation. Accordingly, one skilled in the art provides a combined heat sink for a computer graphics card to solve the problems set forth in the background art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a combination formula heat abstractor for computer display card to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a combination formula heat abstractor for computer display card, includes circuit board, CPU, locating hole and joint, the locating hole has all been seted up to four corners of the upper surface of circuit board, and the last fixed surface of circuit board installs CPU, CPU's last fixed surface installs heat abstractor, one side fixed mounting of circuit board has the joint, and the bottom fixed mounting of circuit board is in coupling assembling's inside.

As a further aspect of the present invention: the heat abstractor includes the water tank, lower heating panel, goes up heating panel, draw-in groove, circulating pump and coolant liquid pipe, the CPU joint is in the inside of draw-in groove, the lower surface of heating panel is seted up under to the draw-in groove, the last fixed surface of heating panel installs the heating panel down, go up the heating panel and one side fixed mounting of heating panel has the water tank down, the internally mounted of water tank has the circulating pump, the output of circulating pump is connected with the coolant liquid pipe.

As a further aspect of the present invention: the coolant liquid pipe is installed at the junction of last heating panel and lower heating panel, and the coolant liquid pipe is S type structure, go up heating panel and lower heating panel formula structure as an organic whole.

As a further aspect of the present invention: the size of the upper radiating plate is matched with the size of the lower radiating plate, and the cooling liquid pipe and the water tank are of an intercommunicating structure.

As a further aspect of the present invention: coupling assembling includes roof, support frame, adjusting screw, gasket, spout, layer board and silica gel pad, the layer board is installed at four turnings of the lower surface of circuit board, the upper surface of layer board has the silica gel pad through bonding, and the bottom of layer board installs the support frame, the top of support frame slides in the inside of spout, the lower surface at the roof is seted up to the spout, adjusting screw has been run through to the inside of support frame, adjusting screw's the other end has the gasket through threaded connection.

As a further aspect of the present invention: adjusting screw and gasket formula structure as an organic whole, and the quantity of adjusting screw and gasket is four, the adjusting screw runs through the one end of support frame and the inside of roof perpendicularly, the size and the tray size phase-match of silica gel pad.

As a further aspect of the present invention: the support frame is U type structure, and the quantity of support frame is four, roof and layer board are parallel arrangement.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses the heat abstractor who sets up, through the combination of heating panel and lower heating panel on the top of circuit board, and the water tank of a side-mounting of heating panel, the draw-in groove joint of heating panel will be down at CPU's surface, the inside circulating pump of water tank carries the coolant liquid, through the coolant liquid pipe in last heating panel and the lower heating panel, then flow in the water tank again, the circulation flows and does not leak outward in an inclosed passageway, finally reach the heat that absorbs the inside CPU of display card, the normal work of display card system has been guaranteed, the noise has been reduced when the radiating effect improves.

2. The utility model discloses a coupling assembling, utilize the circuit board whole to place at the upper surface of layer board, the support frame of the other end installation of layer board simultaneously, install the support frame top in the inside gliding of roof, mutually combine through adjusting screw and gasket and fix, carry out fixed mounting with roof and quick-witted case to reach the purpose of lifting the display card monolithic bracing, effectively solved display card weight too big and lead to the problem that the interface damaged, reduced cost of maintenance simultaneously.

Drawings

FIG. 1 is a schematic structural diagram of a combined heat sink for a computer graphics card;

FIG. 2 is a schematic structural diagram of a heat sink device in a combined heat sink device for a computer graphics card;

FIG. 3 is a schematic diagram of an internal structure of a heat sink device in a combined heat sink device for a computer graphics card;

FIG. 4 is a schematic diagram of an internal structure of a connection component of a modular heat dissipation apparatus for a computer graphics card.

In the figure: 1. a circuit board; 2. a CPU; 3. positioning holes; 4. a joint; 5. a connecting assembly; 6. a heat sink; 7. a top plate; 8. a support frame; 9. adjusting screws; 10. a gasket; 11. a chute; 12. a support plate; 13. a silica gel pad; 14. a water tank; 15. a lower heat dissipation plate; 16. an upper heat dissipation plate; 17. a card slot; 18. a circulation pump; 19. a coolant tube.

Detailed Description

Referring to fig. 1 to 4, in an embodiment of the present invention, a combined heat dissipation device for a computer graphics card includes a circuit board 1, a CPU2, a positioning hole 3 and a connector 4, the positioning hole 3 is formed at each of four corners of an upper surface of the circuit board 1, the CPU2 is fixedly mounted on the upper surface of the circuit board 1, a heat dissipation device 6 is fixedly mounted on the upper surface of the CPU2, the connector 4 is fixedly mounted on one side of the circuit board 1, the bottom of the circuit board 1 is fixedly mounted inside a connecting component 5, the heat dissipation device 6 includes a water tank 14, a lower heat dissipation plate 15, an upper heat dissipation plate 16, a slot 17, a circulation pump 18 and a cooling liquid pipe 19, the CPU2 is clamped inside the slot 17, the slot 17 is formed on a lower surface of the lower heat dissipation plate 15, the upper heat dissipation plate 16 is fixedly mounted on the upper surface of the lower heat dissipation plate 15, the water tank, the model number of the circulating pump 18 is TP150-390/4, the input end of the circulating pump 18 is connected with an external power supply, the output end of the circulating pump 18 is connected with a cooling liquid pipe 19, the cooling liquid pipe 19 is installed at the joint of the upper heat dissipation plate 16 and the lower heat dissipation plate 15, the cooling liquid pipe 19 is of an S-shaped structure, the cooling liquid pipe 19 and the water tank 14 are of an intercommunicating structure, the upper heat dissipation plate 16 and the lower heat dissipation plate 15 are of an integral structure, the size of the upper heat dissipation plate 16 is matched with that of the lower heat dissipation plate 15, the cooling liquid flows in a closed channel in a circulating mode without leaking outside, and finally the heat of a.

In fig. 4: the connecting assembly 5 comprises a top plate 7, a supporting frame 8, adjusting screws 9, gaskets 10, sliding grooves 11, supporting plates 12 and silicon rubber pads 13, the supporting plates 12 are installed at four corners of the lower surface of the circuit board 1, the silicon rubber pads 13 are bonded on the upper surface of the supporting plates 12, the supporting frames 8 are installed at the bottoms of the supporting plates 12, the supporting frames 8 are of a U-shaped structure, the number of the supporting frames 8 is four, the top ends of the supporting frames 8 slide in the sliding grooves 11, the sliding grooves 11 are formed in the lower surface of the top plate 7, the adjusting screws 9 penetrate through the supporting frames 8, the gaskets 10 are connected to the other ends of the adjusting screws 9 through threads, the adjusting screws 9 and the gaskets 10 are of an integrated structure, the number of the adjusting screws 9 and the gaskets 10 is four, the adjusting screws 9 vertically penetrate through one ends of the supporting frames 8 and the inner portions of the top plate 7, the size of the, the silica gel pad 13 on the upper surface of the supporting plate 12 prevents elements on the surface of the display card from being damaged when the display card is supported, and reduces abrasion.

The utility model discloses a theory of operation is: when the display card is connected with the chassis, the circuit board 1 is integrally placed on the upper surfaces of the supporting plate 12 and the silica gel pad 13, meanwhile, the supporting frame 8 arranged at the other end of the supporting plate 12 is fixed by mutually combining the adjusting screw 9 and the gasket 10 while the top end of the supporting frame 8 slides in the top plate 7 according to the actual size of the display card, the top plate 7 and the chassis are fixedly arranged, and the joint on the circuit board 1 is connected, so that the aim of integrally supporting and lifting the display card is achieved, the problem of interface damage caused by overlarge weight of the display card is prevented, when the display card operates, through the combination of the upper heat dissipation plate 16 and the lower heat dissipation plate 15 on the top of the circuit board 1 and the water tank 14 arranged at one side of the heat dissipation plate, the clamping groove 17 of the lower heat dissipation plate 15 is clamped on the outer surface of the CPU2, the cooling liquid is conveyed by the circulating pump 18 in the water tank 14 and passes through the cooling liquid pipe, then flows into the water tank 14, and circularly flows in a closed channel without leakage, so that the heat of the CPU2 in the graphics card is finally absorbed, the normal work of the graphics card system is ensured, the heat dissipation effect is improved, and the noise is reduced.

The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a combination formula heat abstractor for computer display card, includes circuit board (1), CPU (2), locating hole (3) and joint (4), its characterized in that, locating hole (3) have all been seted up to four corners of the upper surface of circuit board (1), and the last fixed surface of circuit board (1) installs CPU (2), the last fixed surface of CPU (2) installs heat abstractor (6), one side fixed mounting of circuit board (1) has joint (4), and the bottom fixed mounting of circuit board (1) is in the inside of coupling assembling (5).

2. The combined heat dissipation device for the computer display card according to claim 1, wherein the heat dissipation device (6) comprises a water tank (14), a lower heat dissipation plate (15), an upper heat dissipation plate (16), a clamping groove (17), a circulation pump (18) and a cooling liquid pipe (19), the CPU (2) is clamped inside the clamping groove (17), the clamping groove (17) is formed in the lower surface of the lower heat dissipation plate (15), the upper surface of the lower heat dissipation plate (15) is fixedly provided with the upper heat dissipation plate (16), the water tank (14) is fixedly arranged on one side of the upper heat dissipation plate (16) and one side of the lower heat dissipation plate (15), the circulation pump (18) is arranged inside the water tank (14), and the output end of the circulation pump (18) is connected with the cooling liquid pipe (19).

3. The combined heat sink for a computer graphic card according to claim 2, wherein the coolant pipe (19) is installed at a junction of the upper heat sink (16) and the lower heat sink (15), and the coolant pipe (19) has an S-shaped structure, and the upper heat sink (16) and the lower heat sink (15) have an integral structure.

4. The combined heat sink for computer graphics card of claim 2, wherein the size of the upper heat sink (16) is matched to the size of the lower heat sink (15), and the coolant pipe (19) and the water tank (14) are in communication structure.

5. The combined heat dissipation device for the computer display card of claim 1, wherein the connection assembly (5) comprises a top plate (7), a support frame (8), an adjusting screw (9), a gasket (10), a sliding groove (11), a support plate (12) and a silica gel pad (13), the support plate (12) is installed at four corners of the lower surface of the circuit board (1), the silica gel pad (13) is adhered to the upper surface of the support plate (12), the support frame (8) is installed at the bottom of the support plate (12), the top end of the support frame (8) slides inside the sliding groove (11), the sliding groove (11) is arranged at the lower surface of the top plate (7), the adjusting screw (9) penetrates through the inside of the support frame (8), and the other end of the adjusting screw (9) is connected with the gasket (10) through a thread.

6. The combined heat dissipation device for the computer display card of claim 5, wherein the adjusting screws (9) and the gaskets (10) are of an integrated structure, the number of the adjusting screws (9) and the number of the gaskets (10) are four, the adjusting screws (9) vertically penetrate through one end of the support frame (8) and the inside of the top plate (7), and the size of the silica gel pad (13) is matched with that of the supporting plate (12).

7. The combined heat sink for computer graphics card of claim 5, wherein the supporting frames (8) are U-shaped, the number of the supporting frames (8) is four, and the top plate (7) and the supporting plate (12) are arranged in parallel.