CN211019434U - Combined heat-resistant hard circuit board - Google Patents
Combined heat-resistant hard circuit board Download PDFInfo
- Publication number
- CN211019434U CN211019434U CN201920304551.5U CN201920304551U CN211019434U CN 211019434 U CN211019434 U CN 211019434U CN 201920304551 U CN201920304551 U CN 201920304551U CN 211019434 U CN211019434 U CN 211019434U
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- Prior art keywords
- circuit board
- main circuit
- heat
- connector
- cooling liquid
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- 239000007788 liquid Substances 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 239000003365 glass fiber Substances 0.000 claims abstract description 7
- 239000000110 cooling liquid Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 239000002826 coolant Substances 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a modular heat-resistant type stereoplasm circuit board, including main circuit board and accessory circuit board, the draw-in groove has been seted up on the right side of main circuit board, the left side of accessory circuit board is provided with the fixture block, the outside fixed mounting of connector has the sealing washer, the upper end of coolant liquid case is provided with the filling opening, the pipe is connected with the coolant liquid case through the back flow, the upper end fixed mounting of main circuit board and accessory circuit board has the fin. This heat-resistant type stereoplasm circuit board of combination formula divide into main circuit board and accessory circuit board, main circuit board and accessory circuit board pass through draw-in groove and fixture block phase combination to carry out accurate location through locating hole and round pin axle, realize the high-speed joint, flow in the pipe through the coolant liquid, adsorb and take away the heat on the circuit board, dispel the heat to its outside through the fin on the circuit board simultaneously, heat transfer on the isolated other radiators of bottom plate through the glass fiber preparation is to the circuit board, holistic heat resistance has been improved greatly.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a modular heat-resistant type stereoplasm circuit board.
Background
The circuit board can be divided into three categories, i.e., a single-sided board, a double-sided board and a multi-layer board according to the number of layers, wherein the single-sided board is one surface with parts concentrated therein, the wires are concentrated on the other surface, the double-sided board is an extension of the single-sided board and is used for conducting the circuit between two layers in a way of passing through holes, and the multi-layer board is formed by laminating more than three conductive pattern layers and insulating materials between the conductive pattern layers at intervals.
The stereoplasm circuit board can produce high temperature in the use, and the high temperature can influence the operating condition of circuit board and lead to the fact the damage to the electronic component above that, has reduced the life of stereoplasm circuit board, and present stereoplasm circuit board is a whole mostly simultaneously, can not carry out the combination formula installation to it, has reduced the practicality of stereoplasm circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a modular heat-resistant type stereoplasm circuit board to propose among the solution above-mentioned background art that the stereoplasm circuit board can produce high temperature in the use, high temperature can influence the operating condition of circuit board and lead to the fact the damage to the electronic component above that, has reduced the life of stereoplasm circuit board, and present stereoplasm circuit board is a whole mostly simultaneously, can not carry out the combination formula installation to it, has reduced the problem of stereoplasm circuit board practicality.
In order to achieve the above object, the utility model provides a following technical scheme: a combined heat-resistant hard circuit board comprises a main circuit board and an auxiliary circuit board, wherein a clamping groove is formed in the right side of the main circuit board, a clamping block is arranged on the left side of the auxiliary circuit board, positioning holes are correspondingly formed in the clamping block and the clamping groove, a pin shaft is fixedly mounted inside the positioning holes, a connector is arranged inside the clamping groove, a sealing ring is fixedly mounted on the outer side of the connector, a connector is formed in the left side of the clamping block and is located inside the connector, a guide pipe is mounted inside the main circuit board and the auxiliary circuit board, bottom plates are arranged at the bottoms of the main circuit board and the auxiliary circuit board, a cooling liquid box is fixedly mounted on the bottom plates, a liquid feeding port is formed in the upper end of the cooling liquid box, the guide pipe is connected with the cooling liquid box through a return pipe, the cooling liquid, and the upper ends of the main circuit board and the auxiliary circuit board are fixedly provided with radiating fins.
Preferably, the clamping groove is matched with the clamping block, and three positioning holes are formed in the clamping groove and the clamping block at equal intervals.
Preferably, the number of the connectors is two in the clamping groove, and the connectors correspond to the connectors one to one.
Preferably, the guide pipes are distributed in the main circuit board and the auxiliary circuit board in a shape like a Chinese character 'kou'.
Preferably, the radiating fins are symmetrically arranged at the upper ends of the main circuit board and the auxiliary circuit board respectively.
Preferably, the bottom plate is made of glass fiber materials, and the bottom plate completely covers the bottoms of the main circuit board and the auxiliary circuit board.
Compared with the prior art, the beneficial effects of the utility model are that: this heat-resistant type stereoplasm circuit board of combination formula, divide into main circuit board and auxiliary circuit board, main circuit board and auxiliary circuit board pass through draw-in groove and fixture block phase combination, and carry out accurate location through locating hole and round pin axle, realize the high-speed joint, all be provided with the pipe in the inside of main circuit board and auxiliary circuit board simultaneously, flow in the pipe through the coolant liquid, adsorb and take away the heat on main circuit board and the auxiliary circuit board, dispel the heat to its outside through the fin on main circuit board and the auxiliary circuit board simultaneously, heat transmission to main circuit board and auxiliary circuit board on the isolated other radiators of bottom plate through the glass fiber preparation, holistic heat resistance has been improved greatly.
Drawings
FIG. 1 is a schematic view of the split structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic view of the distribution structure of the conduit of the present invention;
FIG. 4 is a schematic view of the three-dimensional structure of the auxiliary circuit board of the present invention;
fig. 5 is a schematic view of the structure at a position a of the present invention.
In the figure: 1. a main circuit board; 2. a card slot; 3. a sub circuit board; 4. a clamping block; 5. positioning holes; 6. a pin shaft; 7. a connector; 8. a seal ring; 9. a connecting port; 10. a conduit; 11. a return pipe; 12. a coolant tank; 13. a liquid filling port; 14. a micro coolant pump; 15. a heat sink; 16. a base plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a combined heat-resistant hard circuit board comprises a main circuit board 1, a clamping groove 2, an auxiliary circuit board 3, a clamping block 4, a positioning hole 5, a pin shaft 6, a connector 7, a sealing ring 8, a connector 9, a guide pipe 10, a return pipe 11, a cooling liquid box 12, a liquid filling opening 13, a micro cooling liquid pump 14, a radiating fin 15 and a bottom board 16, wherein the clamping groove 2 is formed in the right side of the main circuit board 1, the clamping block 4 is arranged on the left side of the auxiliary circuit board 3, the positioning hole 5 is correspondingly formed in the clamping block 4 and the clamping groove 2, the pin shaft 6 is fixedly arranged in the positioning hole 5, the connector 7 is arranged in the clamping groove 2, the sealing ring 8 is fixedly arranged on the outer side of the connector 7, the connector 9 is formed in the left side of the clamping block 4, the connector 7 is positioned in the connector 9, and a cooling liquid tank 12 is fixedly installed on the bottom plate 16, a liquid adding port 13 is arranged at the upper end of the cooling liquid tank 12, the guide pipe 10 is connected with the cooling liquid tank 12 through a return pipe 11, the cooling liquid tank 12 is connected with a liquid inlet of a miniature cooling liquid pump 14, a liquid outlet of the miniature cooling liquid pump 14 is connected with the guide pipe 10, the miniature cooling liquid pump 14 is HSP11050 in model, and cooling fins 15 are fixedly installed at the upper ends of the main circuit board 1 and the auxiliary circuit board 3.
Further, draw-in groove 2 and fixture block 4 looks adaptation, and draw-in groove 2 and fixture block 4 go up impartial interval and seted up three locating hole 5, main circuit board 1 and auxiliary circuit board 3 carry out the aggregate erection through draw-in groove 2 and fixture block 4, fix a position in inserting locating hole 5 through selling axle 6, realize splicing fast.
Furthermore, two connectors 7 are arranged inside the clamping groove 2, the connectors 7 correspond to the connectors 9 one by one, the main circuit board 1 and the guide pipes 10 inside the auxiliary circuit board 3 are connected through the connectors 7 and the connectors 9, and the sealing performance of the connecting positions is enhanced through the arrangement of the sealing rings 8, so that leakage is avoided.
Furthermore, the guide pipe 10 is distributed in the main circuit board 1 and the auxiliary circuit board 3 in a shape like a Chinese character 'kou', the cooling liquid flows in the guide pipe 10, and absorbs and takes away heat on the main circuit board 1 and the auxiliary circuit board 3 in the flowing process, so that the interior of the main circuit board 1 and the interior of the auxiliary circuit board 3 are cooled, and the heat resistance is improved.
Further, two groups of radiating fins 15 are symmetrically arranged at the upper ends of the main circuit board 1 and the auxiliary circuit board 3 respectively, and the radiating fins 15 are used for radiating the outside of the main circuit board 1 and the auxiliary circuit board 3.
Furthermore, the bottom plate 16 is made of glass fiber materials, the bottom plate 16 completely covers the bottoms of the main circuit board 1 and the auxiliary circuit board 3, and the bottom plate 16 made of glass fiber has certain heat insulation and heat resistance effects and can isolate heat transferred from other heat sinks.
The working principle is as follows: firstly, a main circuit board 1 and an auxiliary circuit board 3 are combined, a clamping block 4 on the auxiliary circuit board 3 is inserted into a clamping groove 2 on the main circuit board 1, the positions of the clamping groove 2 and a positioning hole 5 on the clamping block 4 are corresponding, then a pin shaft 6 is inserted into the positioning hole 5, a connector 7 is also inserted into a connector 9 while the clamping groove 2 is connected with the clamping block 4, a guide pipe 10 in the main circuit board 1 and the auxiliary circuit board 3 is connected, the sealing performance of the connection part is enhanced through a sealing ring 8, leakage is avoided, after the combination is finished, cooling liquid is injected into a cooling liquid tank 12 through a liquid filling port 13, a miniature cooling liquid pump 14 is connected with an external power supply, the miniature cooling liquid pump 14 pumps the cooling liquid in the cooling liquid tank 12 into the guide pipe 10, the cooling liquid flows in the guide pipe 10, and then flows into the cooling liquid tank 12 through a return pipe 11, the circulation is used, and the coolant liquid is at the flow in-process, adsorbs and takes away the inside heat of circuit board, cools down to it, and the fin 15 dispels the heat to the outside of main circuit board 1 and auxiliary circuit board 3 simultaneously, and the bottom plate 16 of main circuit board 1 and auxiliary circuit board 3 bottom adopts the glass fiber preparation, can completely cut off the heat of coming from transmitting on other radiators, has improved holistic heat resistance greatly.
It should be finally noted that the above only serves to illustrate the technical solution of the present invention, and not to limit the scope of the present invention, and that simple modifications or equivalent replacements performed by those skilled in the art to the technical solution of the present invention do not depart from the spirit and scope of the technical solution of the present invention.
Claims (6)
1. The utility model provides a modular heat-resisting type stereoplasm circuit board, includes main circuit board (1) and vice circuit board (3), its characterized in that: the clamping groove (2) is formed in the right side of the main circuit board (1), the clamping block (4) is arranged on the left side of the auxiliary circuit board (3), the positioning hole (5) is correspondingly formed in the clamping block (4) and the clamping groove (2), the pin shaft (6) is fixedly arranged in the positioning hole (5), the connector (7) is arranged in the clamping groove (2), the sealing ring (8) is fixedly arranged on the outer side of the connector (7), the connector (9) is formed in the left side of the clamping block (4), the connector (7) is located in the connector (9), the guide pipe (10) is arranged in the main circuit board (1) and the auxiliary circuit board (3), the bottom of the main circuit board (1) and the bottom of the auxiliary circuit board (3) are provided with the bottom plate (16), the cooling liquid tank (12) is fixedly arranged on the bottom plate (16), and the upper end of the cooling, the guide pipe (10) is connected with the cooling liquid tank (12) through the return pipe (11), the cooling liquid tank (12) is connected with a liquid inlet of the miniature cooling liquid pump (14), a liquid outlet of the miniature cooling liquid pump (14) is connected with the guide pipe (10), and radiating fins (15) are fixedly mounted at the upper ends of the main circuit board (1) and the auxiliary circuit board (3).
2. The combined heat-resistant hard circuit board according to claim 1, wherein: the clamping groove (2) is matched with the clamping block (4), and three positioning holes (5) are formed in the clamping groove (2) and the clamping block (4) at equal intervals.
3. The combined heat-resistant hard circuit board according to claim 1, wherein: the two connectors (7) are arranged inside the clamping groove (2), and the connectors (7) correspond to the connectors (9) one by one.
4. The combined heat-resistant hard circuit board according to claim 1, wherein: the guide pipes (10) are distributed in the main circuit board (1) and the auxiliary circuit board (3) in a square shape.
5. The combined heat-resistant hard circuit board according to claim 1, wherein: the radiating fins (15) are respectively and symmetrically arranged at the upper ends of the main circuit board (1) and the auxiliary circuit board (3).
6. The combined heat-resistant hard circuit board according to claim 1, wherein: the bottom plate (16) is made of glass fiber materials, and the bottom plate (16) completely covers the bottoms of the main circuit board (1) and the auxiliary circuit board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920304551.5U CN211019434U (en) | 2019-03-12 | 2019-03-12 | Combined heat-resistant hard circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920304551.5U CN211019434U (en) | 2019-03-12 | 2019-03-12 | Combined heat-resistant hard circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211019434U true CN211019434U (en) | 2020-07-14 |
Family
ID=71475513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920304551.5U Active CN211019434U (en) | 2019-03-12 | 2019-03-12 | Combined heat-resistant hard circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211019434U (en) |
-
2019
- 2019-03-12 CN CN201920304551.5U patent/CN211019434U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: No. 19 Jinhua Road, Shuixi Industrial Park, Zhanggong District, Ganzhou City, Jiangxi Province, 341000 Patentee after: Ganzhou Chaoyue Technology Co.,Ltd. Address before: 341007 Jiangxi Ganzhou Zhanggong District Water West cobalt molybdenum rare metal industrial base Patentee before: Ganzhou Chao Yue Technology Co.,Ltd. |