CN217541559U - Pipe-buried water cooling plate assembly and heat dissipation structure of pumping module - Google Patents
Pipe-buried water cooling plate assembly and heat dissipation structure of pumping module Download PDFInfo
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- CN217541559U CN217541559U CN202220548203.4U CN202220548203U CN217541559U CN 217541559 U CN217541559 U CN 217541559U CN 202220548203 U CN202220548203 U CN 202220548203U CN 217541559 U CN217541559 U CN 217541559U
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Abstract
The utility model relates to the technical field of water cooling plates, in particular to a buried pipe type water cooling plate component and a pumping module heat dissipation structure; the water-cooling plate assembly comprises a water-cooling base plate, a bent fluid channel arranged on the water-cooling base plate, a fluid pipeline is arranged in the fluid channel, heat-conducting silicone grease is filled between the fluid pipeline and the fluid channel, a first branch pipe and a second branch pipe which are used for enabling cooling liquid to enter and exit are connected to the two ends of the fluid pipeline, a fixing plate can be detachably connected to the two ends of the water-cooling base plate, a plurality of threaded holes are formed in the water-cooling base plate, and a pumping module can be detachably arranged on the water-cooling base plate. The utility model discloses, simple structure, simple to operate sets up fluid passage on the water-cooling base plate, has buried the fluid pipeline in fluid passage, need not to encapsulate again the water-cooling base plate, and the coolant liquid flows through from the fluid pipeline, and safety and no liquid seepage do not have the corrosion problems, can not cause the fluid passage to block up because of corroding, and pumping module and fluid pipeline contact can improve the radiating efficiency.
Description
Technical Field
The utility model relates to a water-cooling board technical field especially relates to a pipe laying type water-cooling board subassembly and pumping module heat radiation structure.
Background
The water-cooling plate is an element for heat exchange through liquid cooling, the principle is that a flow channel is formed in a metal plate in a processing mode, an electronic element is installed on the surface of the plate, cooling liquid enters from an inlet of the plate, an outlet of the cooling liquid comes out, heat dissipated by the element is taken away, and cooling is achieved. The high-power dissipation electronic equipment controls the temperature of a hot spot by using cooling liquid commonly used by the high-power dissipation electronic equipment, the water-cooled radiator is made of copper or aluminum with high heat conductivity coefficient, the cooling liquid flows through the water-cooled plate after entering from the water inlet end of the water-cooled plate and then comes out from the water outlet end, exchanges heat with the electronic equipment, takes away the heat of the electronic equipment, and realizes cooling. The existing water-cooling plate is mainly characterized in that a fluid channel is opened by digging holes, the heat dissipation area of the fluid channel is limited, the distance between the upper surface of the fluid channel and a heat source is far, heat conduction heat cannot be dissipated away through cooling liquid in time, and the risk of leakage of the cooling liquid exists.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, on the one hand, the utility model provides a pipe laying type water-cooling board subassembly, including the water-cooling base plate, set up crooked fluid passage on the water-cooling base plate, be provided with fluid pipeline in the fluid passage, fluid pipeline with it has heat conduction silicone grease to fill between the fluid passage, fluid pipeline's both ends are connected with first branch pipe and the second branch pipe that is used for the coolant liquid to advance, the both ends of water-cooling base plate can be dismantled and be connected with the fixed plate, be provided with a plurality of screw hole on the water-cooling base plate.
Furthermore, the upper end surface of the fluid pipeline is flush with the upper surface of the water-cooling base plate.
Further, the fluid pipeline is a copper tube, a heat pipe or a temperature equalizing pipe.
Further, the water-cooling substrate is made of an aluminum alloy material.
Furthermore, pipeline joints are arranged between the fluid pipeline and the first branch pipe and between the fluid pipeline and the second branch pipe.
Further, the fluid channel is grooved by a milling cutter.
Further, a heat insulation layer is arranged at the bottom of the water-cooling base plate.
On the other hand, the utility model provides a pumping module heat radiation structure, including at least one pumping module, and as above the water-cooling board subassembly, the pumping module can be dismantled the setting and be in on the water-cooling base plate, the bottom of pumping module with fluid pipeline and heat conduction silicone grease contact.
The utility model discloses owing to adopt above technical scheme, make it compare with prior art, have following beneficial effect:
1) The utility model provides a buried pipe type water cooling plate component, simple structure, simple to operate sets up fluid passage on the water cooling base plate, has buried the fluid pipeline in fluid passage, need not to carry out repackaging to the water cooling base plate, and the coolant liquid flows through from the fluid pipeline, and is safe and does not have the liquid seepage, does not have the corrosion problem, can not cause the fluid passage to block up because of corroding, influence the radiating effect;
2) The utility model provides an embedded pipe type water cooling plate component, fluid pipeline bury underground in fluid passage, and the gap between fluid pipeline and the water cooling base plate is filled through the heat conduction silicone grease of high coefficient of heat conductivity, can be fast with heat conduction to the coolant liquid, have improved the radiating efficiency greatly;
3) The utility model provides a pumping module heat radiation structure installs the pumping module on the water-cooling base plate of water-cooling board subassembly, and fluid pipeline evenly distributed is in pumping module below, direct and heat source pumping module contact, has improved the radiating efficiency greatly, and the heat dissipation of avoiding material thermal resistance to bring is not good.
Drawings
Fig. 1 is a schematic structural view of the buried pipe type water cooling plate assembly of the present invention;
FIG. 2 is a schematic structural diagram of a water-cooling base plate in the buried pipe type water-cooling plate assembly of the present invention;
fig. 3 is a schematic structural diagram of the heat dissipation structure of the pumping module of the present invention.
1-water-cooling the substrate; 2-a fluid channel; 3-a fluid conduit; 4-heat-conducting silicone grease; 5-a first manifold; 6-second a branch pipe; 7-fixing the plate; 8-a pipe joint; 9-pump module.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person skilled in the art without creative work belong to the scope of protection of the present invention based on the embodiments of the present invention. In the drawings, the size and relative sizes of certain features may be exaggerated for clarity.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected" and "connected" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; the term "connected" refers to a connection between two elements or an interaction between two elements, and the term is used in the present invention to be understood as a specific meaning for those skilled in the art.
In the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "center", "horizontal", "vertical", "top", "bottom", "inner", "outer", and the like are used in the positional or positional relationship shown in the drawings, and are only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore, are not to be construed as limiting the present invention.
Furthermore, in the description of the present invention, the terms "first" and "second" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or to imply that the number of indicated technical features is significant. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
As shown in the attached drawing 1 of the specification, the utility model provides a buried pipe type water-cooling plate assembly, including water-cooling base plate 1, water-cooling base plate 1 adopts aluminum alloy to make, sets up crooked fluid passage 2 on the water-cooling base plate 1, fluid passage 2 sets up recess on the water-cooling base plate 1, and fluid passage 2 can carry out the slot preparation through milling cutter and form, be provided with fluid pipeline 3 in the fluid passage 2, fluid pipeline 3 buries in the fluid passage 2, and fluid pipeline 3 buries underground on the water-cooling base plate 1 promptly, and the thickness of water-cooling base plate 1 is greater than the diameter of fluid pipeline 3, fluid pipeline 3 with it has heat conduction silicone grease 4 to fill between the fluid passage 2, the both ends of fluid pipeline 3 are connected with first branch pipe 5 and second branch pipe 6 that are used for the coolant liquid to advance, and first branch pipe 5 and second branch pipe 6 are connected with the water-cooling machine respectively for the coolant liquid circulates in fluid pipeline 3, and the coolant liquid can be water, also can be liquid metal, coolant such as ethylene glycol, selects according to the equipment that treats heat dissipation actually, the both ends of water-cooling base plate 1 are connected with can dismantle the fixed plate 7 on the water-cooling base plate 1, the fixed plate can be provided with a plurality of water-cooling base plate 1, and can be used for the fixed plate on the screw hole is used for the water-cooling base plate 1, the fixed plate 1.
As one embodiment, in order to make the contact area between the heat dissipation device and the water-cooling substrate 1 after the heat dissipation device is mounted on the water-cooling substrate 1 large, the upper end surface of the fluid pipeline 3 is aligned with the upper surface of the water-cooling substrate 1, the depth of the fluid channel 2 is not less than the diameter of the fluid pipeline 3, and the gap between the fluid pipeline 3 and the water-cooling substrate 1 is filled with the heat conductive silicone grease 4 with high thermal conductivity, which is also aligned with the upper surface of the water-cooling substrate 1, and the heat dissipation device can be mounted by attaching to the water-cooling substrate 1, so that the heat dissipation device can have a large contact area with the heat conductive silicone grease 4 and the fluid pipeline 3, and the heat dissipation efficiency can be improved, as shown in the attached drawing 2 of the specification, the fluid channel 2 is curved and is uniformly distributed at the mounting position of the heat dissipation device as much as possible, the fluid pipeline 3 is sequentially arranged along the fluid channel 2, and the heat dissipation efficiency can be improved, as a matter of course, the fluid channel 2 and the fluid pipeline 3 can also be distributed on the water-cooling substrate 1 in other forms, as well as two independent cooling fluid channels, the cooling fluid inlet and the cooling fluid outlet, and the cooling fluid outlet can be arranged side by side, and the fluid inlet and the cooling fluid channel 2 can be realized, and the cooling fluid outlet, and the fluid inlet and the fluid outlet can be realized independently. The fluid pipeline 3 is a copper tube, a heat tube or a temperature equalizing tube, the copper tube is preferably selected, the copper tube has high heat conductivity coefficient, high compressive strength, safe use and no liquid leakage, and is suitable for various cooling liquids and wide in application range.
As one of the implementation mode, all be provided with pipe joint 8 between fluid pipeline 3 and first branch pipe 5 and the second branch pipe 6, pipe joint 8's material is the same with fluid pipeline 3's material, preferentially adopts the red copper material to make, still is provided with at the end of the both ends fluid passage 2 of water-cooling base plate 1 and holds pipe joint 8's recess, pipe joint 8 and fluid pipeline 3, first branch pipe 5, second branch pipe 6 pass through threaded connection or welding, and the threaded connection mode specifically does, and pipe joint 8 is provided with the internal thread in relevant position department, and fluid pipeline 3, first branch pipe 5, second branch pipe 6 are provided with the external screw thread with pipe joint 8 junction, and interior, external screw thread are realized connecting, for avoiding the weeping, can set up waterproof cloth between interior, the external screw thread and realize connecting sealedly.
Optimize the embodiment, the bottom of water-cooling base plate 1 is provided with the heat preservation, lays the cotton insulation material of one deck nanometer promptly in the bottom of water-cooling base plate 1, reduces the heat convection of water-cooling base plate subassembly and air, avoids the dewfall phenomenon to produce.
As shown in the attached drawing 3 of the specification, the present invention further provides a heat dissipation structure for a pumping module, including at least one pumping module 9 and the above-mentioned water-cooling plate assembly, the water-cooling plate assembly can be used in but not limited to a laser, the pumping module 9 is detachably disposed on the water-cooling base plate 1, the pumping module 9 is connected to a threaded hole on the water-cooling base plate 1, the bottom of the pumping module 9 is in contact with the fluid pipeline 3 and the heat-conducting silicone grease 4, in this embodiment, the periphery of the bottom of the pumping module 9 can be in contact with the fluid pipeline 3, so as to improve the heat dissipation efficiency; the water-cooling plate component can be installed on the laser cavity through the fixing plate 7, the fixing plate 7 can be installed on the laser cavity through the bolts, the fixing plate 7 can also be of a buckling structure, and quick installation and disassembly of the water-cooling plate component and the laser cavity can be achieved. In the use, if the radiating effect of water-cooling plate subassembly worsens, then can take out the water-cooling plate subassembly and overhaul, can quick replacement fluid pipeline 3, do not influence the use of laser instrument.
And those not described in detail in this specification are well within the skill of those in the art.
To sum up, the utility model provides a pipe laying type water-cooling board subassembly and pumping module heat radiation structure, moreover, the steam generator is simple in structure, be provided with fluid passage on the water-cooling base plate, the fluid pipeline that the purple copper material was made is buried underground in the fluid passage, gap packing between fluid pipeline and the water-cooling base plate has heat conduction silicone grease, the coolant liquid flows through the fluid pipeline and dispels the heat, the pumping module is installed on the water-cooling base plate, and with fluid pipeline and heat conduction silicone grease contact, heat source pumping module can be directly with fluid pipeline and heat conduction silicone grease contact, there is great area of contact, the efficiency of heat dissipation is improved.
It will be appreciated by those skilled in the art that the invention can be embodied in many other specific forms without departing from the spirit or scope of the invention. Although the embodiments of the present invention have been described, it is to be understood that the present invention should not be limited to such embodiments, and that changes and modifications can be made by one skilled in the art within the spirit and scope of the present invention as defined by the appended claims.
Claims (8)
1. The utility model provides a buried pipe type water-cooling plate subassembly which characterized in that, includes the water-cooling base plate, sets up crooked fluid passage on the water-cooling base plate, be provided with the fluid pipeline in the fluid passage, the fluid pipeline with it has heat conduction silicone grease to fill between the fluid passage, the both ends of fluid pipeline are connected with first branch pipe and the second branch pipe that is used for the coolant liquid to advance, the both ends of water-cooling base plate can be dismantled and be connected with the fixed plate, be provided with a plurality of screw hole on the water-cooling base plate.
2. The submerged tube water-cooled plate assembly according to claim 1, wherein the upper end surface of the fluid conduit is flush with the upper surface of the water-cooled base plate.
3. The buried pipe water cooled plate assembly of claim 1, wherein the fluid conduit is a copper pipe, a heat pipe, or a temperature averaging pipe.
4. The buried pipe water-cooled plate assembly according to claim 1, wherein the water-cooled base plate is made of an aluminum alloy material.
5. The submerged tube water cooled panel assembly according to claim 1, wherein pipe joints are provided between the fluid conduit and the first and second legs.
6. The submerged tube water-cooled plate assembly according to claim 1, wherein the fluid channels are grooved by milling.
7. The buried pipe water cooled plate assembly according to claim 1, wherein the bottom of the water cooled base plate is provided with an insulating layer.
8. A heat dissipation structure of a pump module, comprising at least one pump module and the water-cooling plate assembly as claimed in any one of claims 1 to 7, wherein the pump module is detachably disposed on the water-cooling substrate, and the bottom of the pump module is in contact with the fluid pipeline and the heat-conducting silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220548203.4U CN217541559U (en) | 2022-03-14 | 2022-03-14 | Pipe-buried water cooling plate assembly and heat dissipation structure of pumping module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220548203.4U CN217541559U (en) | 2022-03-14 | 2022-03-14 | Pipe-buried water cooling plate assembly and heat dissipation structure of pumping module |
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| Publication Number | Publication Date |
|---|---|
| CN217541559U true CN217541559U (en) | 2022-10-04 |
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| CN202220548203.4U Active CN217541559U (en) | 2022-03-14 | 2022-03-14 | Pipe-buried water cooling plate assembly and heat dissipation structure of pumping module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116406144A (en) * | 2023-05-23 | 2023-07-07 | 常州贺斯特科技股份有限公司 | Fine casting aluminum water cooling plate embedded with stainless steel pipeline and use method thereof |
-
2022
- 2022-03-14 CN CN202220548203.4U patent/CN217541559U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116406144A (en) * | 2023-05-23 | 2023-07-07 | 常州贺斯特科技股份有限公司 | Fine casting aluminum water cooling plate embedded with stainless steel pipeline and use method thereof |
| CN116406144B (en) * | 2023-05-23 | 2023-08-18 | 常州贺斯特科技股份有限公司 | Fine casting aluminum water cooling plate embedded with stainless steel pipeline and use method thereof |
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