CN211012739U - Grabbing jig for semiconductor parts - Google Patents
Grabbing jig for semiconductor parts Download PDFInfo
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- CN211012739U CN211012739U CN201922410013.7U CN201922410013U CN211012739U CN 211012739 U CN211012739 U CN 211012739U CN 201922410013 U CN201922410013 U CN 201922410013U CN 211012739 U CN211012739 U CN 211012739U
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- reference block
- jig
- reference surface
- arc
- grabbing
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Abstract
The utility model discloses a number of grabbing tool to semiconductor part, including the number of grabbing tool, the number of grabbing tool includes the first benchmark piece that sets up and the second benchmark piece of being connected perpendicularly with first benchmark piece, second benchmark piece and first benchmark piece integrated into one piece; a first reference surface is arranged on one side of the first reference block, a second reference surface is arranged on the second reference block, the second reference surface is perpendicular to the first reference surface, and an arc avoidance groove connected with the first reference block and the second reference block is arranged at the joint of the first reference surface and the second reference surface; and an arc reference table is arranged on one side, away from the arc avoidance groove, of the first reference block and the second reference block. The utility model relates to a novelty, simple structure, reasonable can fix a position semiconductor parts's position through the first reference surface that sets up and second reference surface to side cut through the circular arc benchmark platform that sets up snatchs semiconductor parts's chamfer and the size that collapses mouthful, in order to reject bad semiconductor parts.
Description
Technical Field
The utility model relates to a tool field especially relates to a grab a number tool to semiconductor part.
Background
Semiconductor parts, i.e. semiconductor crystals, are brittle and can form chipping-like cracks at the edges during processing. If a large stress is applied to the cleavage direction of the crystal, it will cause a large chipping area and damage the machined surface in the middle. Therefore, the semiconductor crystal should be chamfered at the edge of the end face before the end face is processed, so that destructive chipping is not easily generated at the end face. However, in actual processing, most of crystals are slightly cracked and the most of crystals are damaged, so that the damaged crystals are prevented from being used continuously.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the above problem that prior art exists, provide a grab a number tool to semiconductor part, the utility model relates to a novelty, simple structure, reasonable can fix a position semiconductor part's position through the first reference surface and the second reference surface that set up to side cut through the circular arc reference platform that sets up snatchs semiconductor part's chamfer and the size that bursts at the seams, in order to reject bad semiconductor part.
For realizing above-mentioned technical purpose, reach above-mentioned technological effect, the utility model discloses a following technical scheme realizes:
a number grabbing jig for a semiconductor part comprises a number grabbing jig, wherein the number grabbing jig comprises a first reference block and a second reference block, the first reference block is arranged on the number grabbing jig, the second reference block is vertically connected with the first reference block, and the second reference block and the first reference block are integrally formed; a first reference surface is arranged on one side of the first reference block, a second reference surface is arranged on the second reference block, the second reference surface is perpendicular to the first reference surface, and an arc avoidance groove connected with the first reference block and the second reference block is arranged at the joint of the first reference surface and the second reference surface; one side of the first reference block and one side of the second reference block, which are far away from the arc avoidance groove, are provided with arc reference tables, and the circle centers of the arc reference tables are located at the connection positions of the first reference surface and the second reference surface. By adopting the technical scheme, the arranged first reference surface and the second reference surface are beneficial to the bonding of the semiconductor part; the arc avoiding groove is not only beneficial to the processing of the grabbing jig, but also beneficial to the attachment of the semiconductor parts; the arc reference table is arranged to be helpful for calculating or grabbing the size of the semiconductor part and the size of the lead angle through the trimming and grabbing number of the arc.
Preferably, the gripping number jig is also provided with a base, and four or more gripping number jigs are uniformly arranged on the base; the first reference surface or the second reference surface of the four or more than four grabbing jig are on the same straight line. By adopting the technical scheme, batch detection of the number of grabs is facilitated.
Preferably, the half-diameter of the circular arc reference table is set at a multiple of 1 mm. By adopting the technical scheme, the measurement and calculation are convenient.
Preferably, the length of the gripping number jig is set to be 40-60mm, and the width of the gripping number jig is set to be 30-50 mm. By adopting the technical scheme, the size is small, and the use and the storage are convenient.
Preferably, the width of the first reference block is consistent with that of the second reference block, and the width of the first reference block is set to be 8-12 mm. By adopting the technical scheme, the deformation of the first reference block and the second reference block is reduced.
Preferably, the surface roughness of the gripping number jig is set to Ra0.2-Ra0.1. By adopting the technical scheme, the surface is smooth and convenient to use, so that the grabbing precision of the semiconductor part is improved.
The utility model has the advantages that: the design is novel, the structure is simple and reasonable, the position of the semiconductor part can be positioned through the arranged first reference surface and the second reference surface, and the chamfer angle and the size of the crack of the semiconductor part are grabbed through the arranged trimming edge of the arc reference table so as to eliminate the bad semiconductor part; and a plurality of grabbing jig are arranged on the same jig, which is beneficial to batch detection.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood and to be implemented according to the content of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:
fig. 1 is a schematic view of a gripping number jig according to the present invention;
fig. 2 is a schematic view of an arrangement of the gripping jig according to the present invention;
fig. 3 is a schematic view illustrating the connection between the semiconductor component and the grasping jig according to the present invention.
The reference numbers in the figures illustrate: the device comprises a grabbing jig 1, a first reference block 2, a second reference block 3, a first reference surface 4, a second reference surface 5, an arc avoiding groove 6, an arc reference table 7, a base 8 and a semiconductor part 9.
Detailed Description
The invention is further described with reference to the accompanying drawings:
referring to fig. 1 to 3, a number-grabbing jig for semiconductor parts includes a number-grabbing jig 1, where the number-grabbing jig 1 includes a first reference block 2 and a second reference block 3 vertically connected to the first reference block 2, and the second reference block 3 and the first reference block 2 are integrally formed; a first reference surface 4 is arranged on one side of the first reference block 2, a second reference surface 5 is arranged on the second reference block 3, the second reference surface 5 is perpendicular to the first reference surface 4, and an arc avoidance groove 6 connected with the first reference block 2 and the second reference block 3 is arranged at the joint of the first reference surface 4 and the second reference surface 5; the side, far away from the arc avoidance groove 6, of the first reference block 2 and the second reference block 3 is provided with an arc reference table 7, and the circle center of the arc reference table 7 is located at the connection position of the first reference surface 4 and the second reference surface 5. By adopting the technical scheme, the arranged first reference surface 4 and the second reference surface 5 are beneficial to the bonding of the semiconductor part 9; the arc avoidance groove 6 is not only beneficial to processing the grabbing jig 1, but also beneficial to attaching the semiconductor part 9; the circular arc reference table 7 is provided to facilitate the calculation or grasping of the size of the semiconductor part 9 and the size of the lead angle by the cut edge grasping number of the circular arc.
Preferably, the gripping number jig 1 is further provided with a base 8, and four or more gripping number jigs 1 are uniformly arranged on the base 8; the first reference surface 4 or the second reference surface 5 of the four or more gripping jigs 1 are on the same straight line. By adopting the technical scheme, batch detection of the number of grabs is facilitated.
Preferably, the half-diameter of the circular arc reference table 7 is set at a multiple of 1 mm. By adopting the technical scheme, the measurement and calculation are convenient.
Preferably, the length of the gripping number jig 1 is set to be 40-60mm, and the width is set to be 30-50 mm. By adopting the technical scheme, the size is small, and the use and the storage are convenient.
Preferably, the width of the first reference block 2 is identical to that of the second reference block 3, and the width is set to be 8-12 mm. With this technical solution, it is helpful to reduce the deformation of the first reference block 2 and the second reference block 3.
Preferably, the surface roughness of the gripping jig 1 is set to Ra0.2-Ra0.1. By adopting the technical scheme, the surface is smooth and convenient to use, so that the grabbing precision of the semiconductor part 9 is improved.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Before use, one side of the semiconductor component is attached to the first reference surface, and then the semiconductor component is moved to make the other side of the semiconductor component close to the second reference surface, as shown in fig. 2; during actual detection, the jig is firstly accurately positioned on the detection platform, then the reference point of the semiconductor part is calculated by grabbing the trimming edge of the arc reference platform, the chamfering size and the opening collapsing size of the semiconductor part are measured by the grabbed reference point, and unqualified semiconductor parts with the detected opening collapsing size larger than the chamfering size are removed.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. The utility model provides a grab a number tool to semiconductor part which characterized in that: the device comprises a grabbing jig (1), wherein the grabbing jig (1) comprises a first reference block (2) and a second reference block (3) which is vertically connected with the first reference block (2), and the second reference block (3) and the first reference block (2) are integrally formed; a first reference surface (4) is arranged on one side of the first reference block (2), a second reference surface (5) is arranged on the second reference block (3), the second reference surface (5) is perpendicular to the first reference surface (4), and an arc avoidance groove (6) connected with the first reference block (2) and the second reference block (3) is arranged at the joint of the first reference surface (4) and the second reference surface (5); one side of the first reference block (2) and the second reference block (3) far away from the arc avoidance groove (6) is provided with an arc reference table (7), and the circle center of the arc reference table (7) is located at the joint of the first reference surface (4) and the second reference surface (5).
2. The jig for grasping a number of semiconductor parts according to claim 1, wherein: the number-grabbing jig (1) is also provided with a base (8), and four or more number-grabbing jigs (1) are uniformly arranged on the base (8); the first reference surface (4) or the second reference surface (5) of the four or more than four grabbing jig (1) are on the same straight line.
3. The jig for grasping a number of semiconductor parts according to claim 1, wherein: the half warp of the circular arc reference table (7) is set at a multiple of 1 mm.
4. The jig for grasping a number of semiconductor parts according to claim 1, wherein: the length of the gripping jig (1) is set to be 40-60mm, and the width of the gripping jig is set to be 30-50 mm.
5. The jig for grasping a number of semiconductor parts according to claim 1, wherein: the width of the first reference block (2) is consistent with that of the second reference block (3), and the width of the first reference block is set to be 8-12 mm.
6. The jig for grasping a number of semiconductor parts according to claim 1, wherein: the surface roughness of the gripping jig (1) is set to Ra0.2-Ra0.1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922410013.7U CN211012739U (en) | 2019-12-28 | 2019-12-28 | Grabbing jig for semiconductor parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922410013.7U CN211012739U (en) | 2019-12-28 | 2019-12-28 | Grabbing jig for semiconductor parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211012739U true CN211012739U (en) | 2020-07-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922410013.7U Active CN211012739U (en) | 2019-12-28 | 2019-12-28 | Grabbing jig for semiconductor parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211012739U (en) |
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2019
- 2019-12-28 CN CN201922410013.7U patent/CN211012739U/en active Active
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