CN210959310U

CN210959310U - VPX direct current power supply module

Info

Publication number: CN210959310U
Application number: CN201922332220.5U
Authority: CN
Inventors: 管邦伟; 蒋承武; 蔡鹏�
Original assignee: Chengdu Chiffo Electronics Instruments Co Ltd
Current assignee: Chengdu Chiffo Electronics Instruments Co Ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2020-07-07
Anticipated expiration: 2029-12-23

Abstract

The utility model discloses a VPX DC power supply module, fit the upper cover on the casing including casing and lid, be equipped with the printing board in the casing, be equipped with the radiating part between printing board and casing bottom plate, the radiating part includes a plurality of heat pipe and heat collection board, and every heat collection board contacts with the heat source position that corresponds on the printing board, and adjacent a plurality of heat collection board is connected to every heat pipe, and all heat pipes link to each other with the casing. In the utility model, the heat at each heat source on the printed board is quickly conducted to the shell through the heat collecting plate and the heat conducting pipe, and the heat radiating component can be quickly equalized, thereby reducing the thermal resistance value and enhancing the heat radiating effect; the power module adopts a modular design, is optimized in internal layout and good in heat dissipation performance, and can stably supply power to each module and board card in the VPX case.

Description

VPX direct current power supply module

Technical Field

The utility model relates to a power design field, concretely relates to VPX direct current power supply module.

Background

The VPX power supply adopts VITA62 standard and supplies power to each functional module and board card in the VPX case. The VPX power supply supports a PMBUS communication protocol and has the output capacity of multiple paths of voltage. The conventional power module is not designed in a modularized manner, the internal layout is not optimized enough, and when the power module is used on a VPX case, faults caused by poor heat dissipation often occur, so that stable power supply is not facilitated.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at: the VPX direct-current power supply module is designed in a modularized mode, optimized in internal layout, good in heat dissipation performance and capable of stably supplying power for all modules and board cards in the VPX case.

In order to realize the purpose, the utility model discloses a technical scheme be:

the utility model provides a VPX direct current power supply module, includes the casing and covers the upper cover that fits on the casing, be equipped with the printing board in the casing, be equipped with the radiating part between printing board and casing bottom plate, the radiating part includes a plurality of heat pipe and heat collection plate, and every heat collection plate contacts with the heat source position that corresponds on the printing board, and adjacent a plurality of heat collection plate is connected to every heat pipe, and all heat pipes link to each other with the casing.

The utility model discloses a set up casing and upper cover, be equipped with the printing board in the casing, be equipped with the radiating part between printing board and casing bottom plate, the radiating part includes a plurality of heat pipes and heat collecting plate, and every heat collecting plate contacts with the heat source position that corresponds on the printing board, and every heat pipe connects a plurality of adjacent heat collecting plates, and all heat pipes link to each other with the casing; the heat at each heat source on the printed board is quickly conducted to the shell through the heat collecting plate and the heat conducting pipe, and the heat radiating component can quickly equalize the temperature, so that the heat resistance value is reduced, and the heat radiating effect is enhanced; the power module adopts a modular design, is optimized in internal layout and good in heat dissipation performance, and can stably supply power to each module and board card in the VPX case.

As the preferred scheme of the utility model, the heat dissipation part is still including locating the heat conduction pad of each heat source position department on the printing board, heat conduction pad one side and printing board contact, opposite side and thermal-arrest board contact. The heat conducting pad is arranged between the heat source of the printed board and the heat collecting plate, so that the heat of the printed board can be better conducted to the heat collecting plate and then conducted away through the heat conducting pipe.

As the utility model discloses an optimal scheme, the heat conduction pad is heat conduction silica gel piece, and it has the compressibility, is convenient for fill the clearance between printing board and the thermal-arrest board, effectively promotes heat transfer efficiency.

As the preferred scheme of the utility model, the thickness of heat conduction pad is 1 mm.

As the preferred scheme of the utility model, be equipped with a plurality of fin on the casing outer wall, all fins are towards a direction interval arrangement. Through set up a plurality of fin on the casing outer wall, can give off the heat that conducts to on the casing, all fins are towards a direction interval arrangement for form heat dissipation channel between the fin, be favorable to promoting the radiating efficiency.

As the preferred scheme of the utility model, the casing both sides still are equipped with the locking strip for power module's installation fastening.

As the preferred scheme of the utility model, still be equipped with input/output interface on the printing board.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:

1. the utility model discloses a set up casing and upper cover, be equipped with the printing board in the casing, be equipped with the radiating part between printing board and casing bottom plate, the radiating part includes a plurality of heat pipes and heat collecting plate, and every heat collecting plate contacts with the heat source position that corresponds on the printing board, and every heat pipe connects a plurality of adjacent heat collecting plates, and all heat pipes link to each other with the casing; the heat at each heat source on the printed board is quickly conducted to the shell through the heat collecting plate and the heat conducting pipe, and the heat radiating component can quickly equalize the temperature, so that the heat resistance value is reduced, and the heat radiating effect is enhanced; the power module is in a modular design, is optimized in internal layout and good in heat dissipation performance, and can stably supply power to each module and board card in the VPX case;

2. the heat conducting pad is arranged between the heat source of the printed board and the heat collecting plate, so that the heat of the printed board can be better conducted to the heat collecting plate and then conducted away through the heat conducting pipe;

3. the heat conducting pad adopts a heat conducting silica gel sheet, has compressibility, is convenient for filling a gap between the printed board and the heat collecting board, and effectively improves heat transfer efficiency;

4. through set up a plurality of fin on the casing outer wall, can give off the heat that conducts to on the casing, all fins are towards a direction interval arrangement for form heat dissipation channel between the fin, be favorable to promoting the radiating efficiency.

Drawings

Fig. 1 is a schematic diagram of a VPX dc power supply module according to the present invention.

Fig. 2 is a schematic view of fig. 1 after being turned over.

Fig. 3 is a schematic view of fig. 2 after the housing is hidden.

The labels in the figure are: the heat collecting device comprises a shell, 11 heat radiating fins, 2 an upper cover, 3 a printed board, 31 an input and output interface, 4 a heat conducting pipe, 5 a heat collecting plate, 6 a heat conducting pad and 7 a locking strip.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings.

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Examples

As shown in fig. 1 to 3, the VPX dc power supply module in this embodiment includes a housing 1 and an upper cover 2 covering the housing, a printed board 3 is disposed in the housing 1, a heat dissipation component is disposed between the printed board 3 and a bottom plate of the housing 1, the heat dissipation component includes a plurality of heat pipes 4 and heat collecting plates 5, each heat collecting plate 5 contacts with a corresponding heat source position on the printed board 3, each heat pipe 4 is connected to a plurality of adjacent heat collecting plates 4, the heat pipes 4 are fixedly connected to the heat collecting plates 5, and all the heat pipes 4 contact with the housing 1.

In this embodiment, the heat dissipating member further includes a heat conducting pad 6 disposed at each heat source position on the printed board 3, and one side of the heat conducting pad 6 is in contact with the printed board 3 and the other side is in contact with the heat collecting plate 5. The heat conducting pad is arranged between the heat source of the printed board and the heat collecting plate, so that the heat of the printed board can be better conducted to the heat collecting plate and then conducted away through the heat conducting pipe. The heat conducting pad 6 is a heat conducting silica gel sheet, has compressibility, is convenient for filling a gap between the printed board and the heat collecting board, and effectively improves heat transfer efficiency. The thickness of the heat conducting pad 6 is 1mm, and the heat conducting pad is compressed to 0.7mm after being assembled.

In this embodiment, the outer wall of the housing 1 is provided with a plurality of cooling fins 11, and all the cooling fins 11 are arranged at intervals in one direction. Through set up a plurality of fin on the casing outer wall, can give off the heat that conducts to on the casing, all fins are towards a direction interval arrangement for form heat dissipation channel between the fin, be favorable to promoting the radiating efficiency. And locking strips 7 are further arranged on two sides of the shell 1 and used for mounting and fastening the power supply module.

In this embodiment, the printed board 3 is further provided with an input/output interface 31, which is a standard VITA62 input/output connector. The printed board extends out from one side between the shell and the upper cover, and the input and output interfaces are positioned at the extending end of the printed board, so that the interfaces are connected when the printed board is used conveniently.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the principles of the present invention should be included within the scope of the present invention.

Claims

1. The VPX direct current power supply module is characterized by comprising a shell and an upper cover covering the shell, wherein a printed board is arranged in the shell, a heat dissipation part is arranged between the printed board and a bottom plate of the shell and comprises a plurality of heat conduction pipes and heat collection plates, each heat collection plate is in contact with a corresponding heat source position on the printed board, each heat conduction pipe is connected with a plurality of adjacent heat collection plates, and all the heat conduction pipes are connected with the shell.

2. The VPX dc power supply module of claim 1, wherein the heat dissipation member further comprises a heat conductive pad disposed at each heat source position on the printed board, the heat conductive pad contacting the printed board at one side and contacting the heat collection plate at the other side.

3. The VPX dc power supply module of claim 2, wherein the thermal pad is a thermally conductive silicone sheet.

4. The VPX DC power supply module of claim 3, wherein the thermal pad has a thickness of 1 mm.

5. The VPX DC power supply module according to any one of claims 1-4, wherein the housing has a plurality of fins on an outer wall, all fins being spaced in one direction.

6. The VPX DC power supply module of any one of claims 1-4, wherein a locking bar is further disposed on both sides of the housing.

7. The VPX DC power supply module according to any of claims 1-4, wherein the printed board further comprises an input/output interface.