CN113645804A - Radiator for radiating large-heating-quantity VPX plug-in - Google Patents
Radiator for radiating large-heating-quantity VPX plug-in Download PDFInfo
- Publication number
- CN113645804A CN113645804A CN202110822012.2A CN202110822012A CN113645804A CN 113645804 A CN113645804 A CN 113645804A CN 202110822012 A CN202110822012 A CN 202110822012A CN 113645804 A CN113645804 A CN 113645804A
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- China
- Prior art keywords
- heat
- heat dissipation
- radiator
- pipe
- substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 3
- 230000020169 heat generation Effects 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明涉及一种用于大发热量VPX插件散热的散热器，属于电子元器件散热技术领域。本散热器包括：散热基板，所述散热基板的一面设有散热翅片；热管，所述热管连接在所述散热基板的另一面上。本散热器，解决了总热量较大和热源较为集中的散热问题，提高了散热性能。
The invention relates to a radiator for heat dissipation of a VPX plug-in with large heat generation, belonging to the technical field of heat dissipation of electronic components. The radiator includes: a heat dissipation base plate, one side of which is provided with heat dissipation fins; and a heat pipe, the heat pipe is connected to the other side of the heat dissipation base plate. The radiator solves the problem of heat dissipation that the total heat is relatively large and the heat source is relatively concentrated, and improves the heat dissipation performance.
Description
Technical Field
The invention belongs to the technical field of heat dissipation of electronic components, and particularly relates to a heat radiator for heat dissipation of a large-heat-generation VPX plug-in unit.
Background
With the continuous improvement of the working frequency and the integration level of electronic components, the power consumption and the heat productivity of the electronic components on the VPX plug-in are also increased sharply, and the requirement on heat dissipation is higher and higher.
At present, a traditional common radiator is difficult to meet the radiating requirement on the radiating capacity, when the heat of electronic components on a VPX plug-in unit is large or the heat flux density is concentrated, the temperature difference of different areas of the traditional common radiator is large, wherein the temperature of cold air downstream components is high, and the temperature difference between upstream and downstream components is large, so that the working stability, reliability and service life of the electronic components on the VPX plug-in unit are seriously influenced.
Disclosure of Invention
The invention provides the radiator for radiating the large heat-generating quantity VPX plug-in, which aims to solve the technical problems, solve the radiating problems of large total heat quantity and concentrated heat source and improve the radiating performance.
The technical scheme for solving the technical problems is as follows: a heat sink for dissipating heat from a large heat generating VPX card, comprising:
the radiating base plate is provided with radiating fins on one surface;
and the heat pipe is connected to the other surface of the heat dissipation substrate.
The invention has the beneficial effects that: (1) the heat dissipation substrate is convenient to be attached and connected with the VPX plug-in, so that heat dissipation of the VPX plug-in is realized;
(2) the heat pipe can conduct the heat on the radiating substrate, can quickly transfer the heat from high temperature to low temperature, can realize temperature equalization of the radiating substrate, reduces the temperature of the VPX plug-in unit to the maximum extent, improves the environmental adaptability of the equipment, and has very wide application prospect;
(3) the radiator has simple structure and low manufacturing cost, and can be widely applied.
On the basis of the technical scheme, the invention can be further improved as follows.
Furthermore, the heat pipe is a plurality of, be equipped with a plurality of mounting groove on the another side of radiating basal plate, it is a plurality of the heat pipe is blocked respectively and is corresponded in the mounting groove, and with mounting groove's cell wall and tank bottom closely laminate.
The beneficial effect of adopting the further scheme is that: the heat pipe is embedded into the heat dissipation substrate, so that the heat conduction effect on the heat dissipation substrate is better.
Furthermore, a plurality of connecting bumps matched with the VPX plug-in units are arranged on the other surface of the heat dissipation substrate.
The beneficial effect of adopting the further scheme is that: the contact with each heating device on the VPX plug-in is facilitated, direct heat conduction is realized, and the heat dissipation effect is improved.
Further, the plurality of connection bumps are located on the surfaces of the plurality of heat pipes, and the heat of the plurality of connection bumps is communicated through the plurality of heat pipes.
The beneficial effect of adopting the further scheme is that: the heat pipe is beneficial to directly transferring heat to the heat pipe and dispersing the heat to the heat dissipation substrate, and the local over-high temperature of the heat dissipation substrate is avoided.
Further, the heat dissipation fins and one surface of the heat dissipation substrate are integrally formed.
The beneficial effect of adopting the further scheme is that: the contact resistance can be reduced.
Further, the height of each radiating fin is 85mm, the thickness of each radiating fin is 1mm, and the distance between every two adjacent radiating fins is 3 mm.
The beneficial effect of adopting the further scheme is that: the heat dissipation effect is improved.
Further, the heat pipe is flat, the length of the cross section of the heat pipe is 8mm, the width of the cross section of the heat pipe is 3mm, and the length of the heat pipe is 100 mm and 200 mm.
The beneficial effect of adopting the further scheme is that: the temperature equalizing effect on the heat dissipation substrate is improved.
Further, the thickness of the heat dissipation substrate is 3.5 mm.
The beneficial effect of adopting the further scheme is that: the strength and the heat dissipation capability of the heat dissipation substrate are improved.
Furthermore, the heat dissipation substrate is made of aluminum alloy, and the heat conductivity coefficient is 100-.
The beneficial effect of adopting the further scheme is that: the heat dissipation capability of the heat dissipation substrate is ensured.
Furthermore, the heat pipe is a copper pipe, and the heat conductivity coefficient is 10000-20000W/(m.K).
The beneficial effect of adopting the further scheme is that: the heat conduction performance of the heat pipe is ensured.
Drawings
FIG. 1 is a perspective view of a heat sink according to the present invention;
fig. 2 is a right side view of the heat sink of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. the heat dissipation structure comprises a heat dissipation substrate, 2, a heat pipe, 3, a connecting lug, 4 and a heat dissipation fin.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
Examples
As shown in fig. 1 and 2, the present embodiment provides a heat sink for dissipating heat from a large heat generating VPX card, including: a heat-dissipating substrate 1 and a heat pipe 2.
One surface of the heat radiating substrate 1 is provided with heat radiating fins 4. The heat pipe 2 is connected to the other surface of the heat dissipating substrate 1.
Wherein, heat pipe 2 pastes and covers on the another side of radiating basal plate 1, and heat pipe 2 can switch on the heat of whole radiating basal plate 1, realizes that the heat of whole radiating basal plate 1 is even.
The heat pipe 2 can be bent as needed, and thus, the entire other surface of the heat dissipation substrate 1 can be bonded in all directions. The heat pipe 2 can be a solid pipe or a hollow pipe, and can be arranged as a hollow pipe for saving cost.
The appearance of the heat dissipation substrate 1 is reasonably bent and arranged, and the heat of the VPX plug-in unit is uniformly transferred in the heat dissipation substrate 1.
And a plurality of screw hole grooves are formed in the other surface of the heat dissipation substrate 1, so that the heat dissipation substrate is conveniently connected and fixed with a VPX plug-in unit.
The heat dissipation fins 4 are used to conduct and release heat, and can discharge the heat on the heat dissipation substrate 1, thereby achieving heat dissipation along with air flow.
The effect of the technical scheme of this embodiment is that, the heat dissipation base plate 1 through setting up is convenient to be connected with the laminating of VPX plug-in components, realizes the heat dissipation to the VPX plug-in components. The heat pipe 2 can conduct heat on the radiating substrate 1, can quickly transfer the heat to a low-temperature part from high temperature, can realize temperature equalization of the radiating substrate 1, reduces the temperature of the VPX plug-in unit to the maximum extent, improves the environmental adaptability of equipment, and has very wide application prospect. The radiator has simple structure and low manufacturing cost, and can be widely applied.
Preferably, in this embodiment, the number of the heat pipes 2 is multiple, the other surface of the heat dissipation substrate 1 is provided with a plurality of mounting grooves, and the plurality of heat pipes 2 are respectively clamped into the corresponding mounting grooves and tightly attached to the groove walls and the groove bottoms of the mounting grooves.
Wherein, heat pipe 2 and mounting groove one-to-one for during heat pipe 2 imbeds heat dissipation base plate 1, thereby the effect of conducting to the heat of heat dissipation base plate 1 is better. Wherein heat pipe 2 and mounting groove's tank bottom screwed connection can realize fixing heat pipe 2.
Preferably, in this embodiment, the other surface of the heat dissipation substrate 1 is provided with a plurality of connection bumps 3 adapted to the VPX plug-in. The connecting bumps 3 correspond to the heating devices on the VPX plug-in unit, so that heat conducted by the heating devices is received and spread in the heat dissipation substrate 1. Wherein, the connecting bump 3 is fixedly connected with the heat dissipation substrate 1 by welding.
Preferably, in the present embodiment, the plurality of connection bumps 3 are located on the surfaces of the plurality of heat pipes 2, and the plurality of connection bumps 3 are in thermal communication with the plurality of heat pipes 2. Therefore, heat received by the connecting bump 3 can directly enter the heat pipe 2 and be dispersed to the heat dissipation substrate 1 through the heat pipe 2, and the local temperature of the heat dissipation substrate 1 is prevented from being too high.
The size of the connecting bump 3 is set according to the size of the actual heating device, so that heat can be effectively transferred to the heat dissipation substrate 1. Wherein the connecting bump 3 may be made of copper.
Preferably, in the present embodiment, the heat dissipation fins 4 are integrally formed with one surface of the heat dissipation substrate 1. The radiating fins 4 increase the radiating area on one hand, and enhance the disturbance of the air flowing through the radiating fins 4 on the other hand, thereby achieving the purpose of enhancing heat transfer.
The heat radiating fins 4 and the heat radiating base plate 1 are integrally arranged, so that the contact thermal resistance can be reduced, heat on the heat radiating base plate 1 is transferred to the heat radiating fins 4 in a heat conduction mode, and finally the heat is taken away by cold air flowing through gaps among the heat radiating fins 4, so that the purpose of heat radiation is achieved.
Preferably, in the present embodiment, the height of the heat dissipation fin 4 is 85mm, the thickness is 1mm, and the distance between two adjacent heat dissipation fins 4 is 3 mm. The radiating efficiency is higher, and the radiating effect is better.
Preferably, in this embodiment, the heat pipe 2 is flat, the cross section of the heat pipe 2 has a length of 8mm and a width of 3mm, and the length of the heat pipe 2 is 100 mm and 200 mm. The dimensions of the heat pipe 2 can be selected as desired. Meanwhile, the heat pipe 2 can be bent according to requirements and changed into different structural forms, so that the whole heat dissipation substrate 1 is equalized, the highest temperature of cold air downstream components is reduced, the temperature difference between the upstream components and the downstream components is reduced, and the working reliability of the components on the VPX plug-in is improved.
Preferably, in the present embodiment, the thickness of the heat dissipation substrate 1 is 3.5 mm. The strength and heat dissipation capability of the heat dissipation substrate 1 are improved.
Preferably, in the present embodiment, the heat dissipation substrate 1 is an aluminum alloy, and the thermal conductivity is 100-. The heat dissipation capability of the heat dissipation substrate 1 is ensured.
Preferably, in this embodiment, the heat pipe 2 is a copper pipe, and the thermal conductivity is 10000-. The heat conduction performance of the heat pipe 2 is ensured, so that the temperature equalizing effect of the heat dissipation substrate 1 is better.
In the description of the present invention, it is to be understood that the terms "center", "length", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "inner", "outer", "peripheral side", "circumferential", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110822012.2A CN113645804A (en) | 2021-07-20 | 2021-07-20 | Radiator for radiating large-heating-quantity VPX plug-in |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110822012.2A CN113645804A (en) | 2021-07-20 | 2021-07-20 | Radiator for radiating large-heating-quantity VPX plug-in |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113645804A true CN113645804A (en) | 2021-11-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110822012.2A Pending CN113645804A (en) | 2021-07-20 | 2021-07-20 | Radiator for radiating large-heating-quantity VPX plug-in |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113645804A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003121A (en) * | 2022-06-15 | 2022-09-02 | 华南理工大学 | A structure and preparation method capable of realizing centralized heat dissipation and sealing of electronic components |
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|---|---|---|---|---|
| CN209609107U (en) * | 2019-01-21 | 2019-11-08 | 苏州格曼斯温控科技有限公司 | Teeth radiator and optical communication equipment |
| CN111045499A (en) * | 2019-12-02 | 2020-04-21 | 北京计算机技术及应用研究所 | A high-efficiency cooling cold plate |
| CN210959310U (en) * | 2019-12-23 | 2020-07-07 | 成都前锋电子仪器有限责任公司 | VPX direct current power supply module |
| CN211406665U (en) * | 2019-11-18 | 2020-09-01 | 中国船舶重工集团公司第七0七研究所 | Server mainboard heat abstractor |
| CN213210963U (en) * | 2020-11-11 | 2021-05-14 | 太原斯利德电子技术有限公司 | Heat dissipation device for reinforcing VPX sealed case |
-
2021
- 2021-07-20 CN CN202110822012.2A patent/CN113645804A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209609107U (en) * | 2019-01-21 | 2019-11-08 | 苏州格曼斯温控科技有限公司 | Teeth radiator and optical communication equipment |
| CN211406665U (en) * | 2019-11-18 | 2020-09-01 | 中国船舶重工集团公司第七0七研究所 | Server mainboard heat abstractor |
| CN111045499A (en) * | 2019-12-02 | 2020-04-21 | 北京计算机技术及应用研究所 | A high-efficiency cooling cold plate |
| CN210959310U (en) * | 2019-12-23 | 2020-07-07 | 成都前锋电子仪器有限责任公司 | VPX direct current power supply module |
| CN213210963U (en) * | 2020-11-11 | 2021-05-14 | 太原斯利德电子技术有限公司 | Heat dissipation device for reinforcing VPX sealed case |
Non-Patent Citations (1)
| Title |
|---|
| （美）列 维（LEVI，E.）著: "《多相电动机直接设计法》", 31 January 1989, 机械工业出版社, pages: 212 - 214 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003121A (en) * | 2022-06-15 | 2022-09-02 | 华南理工大学 | A structure and preparation method capable of realizing centralized heat dissipation and sealing of electronic components |
| CN115003121B (en) * | 2022-06-15 | 2025-06-03 | 华南理工大学 | A structure and preparation method capable of realizing centralized heat dissipation and sealing of electronic components |
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Application publication date: 20211112 |