CN210956320U - High-stability metal film resistor - Google Patents
High-stability metal film resistor Download PDFInfo
- Publication number
- CN210956320U CN210956320U CN202020090785.7U CN202020090785U CN210956320U CN 210956320 U CN210956320 U CN 210956320U CN 202020090785 U CN202020090785 U CN 202020090785U CN 210956320 U CN210956320 U CN 210956320U
- Authority
- CN
- China
- Prior art keywords
- metal film
- layer
- film layer
- resistor
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 45
- 239000002184 metal Substances 0.000 title claims abstract description 45
- 239000000919 ceramic Substances 0.000 claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000007747 plating Methods 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 6
- 239000003973 paint Substances 0.000 claims description 15
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 6
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000005245 sintering Methods 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000000151 deposition Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Images
Abstract
The utility model provides a high-stability metal film resistor, which comprises a ceramic substrate, a metal film layer, an oxide film layer, an epoxy resin layer, a terminal electrode tin/copper plating layer and a resistor pin, wherein the metal film layer is sputtered on the surface of the ceramic substrate, and the oxide film layer is sprayed on the outer side of the metal film layer; the left and right opposite end surfaces of the ceramic substrate are respectively provided with a terminal electrode tin/copper plating layer, and an epoxy resin layer is sprayed on the outer side of the oxide film layer between the two terminal electrode tin/copper plating layers; and the end electrode tin/copper plating layers are sleeved with caps, and the outer end faces of the caps are connected with resistance pins. The utility model has simple structure, can improve the stability of the resistor product, and the metal film layer has lower temperature coefficient, so that the thermal stability of the film resistor is better; the high-temperature load capacity of the film resistor is strong by high-temperature sintering of the oxide film layer; inorganic high-thermal-conductivity filler nano-alumina is filled in the epoxy resin, so that the heat dissipation capability of the encapsulating layer is greatly improved.
Description
Technical Field
The utility model relates to a resistor technical field, concretely relates to high stable metal film resistor.
Background
The Resistor (Resistor), which is generally referred to directly as a Resistor, is a current limiting element. After the resistor is connected in the circuit, the resistance of the resistor is fixed, generally two pins, which can limit the current passing through the branch to which the resistor is connected. The resistor has a wide variety and can be classified into: a. wire-wound resistor: the resistor is made by winding a resistor wire on an insulating frame, and a heat-resistant glaze insulating layer or insulating paint is coated outside the resistor wire. b. Carbon synthesized resistor: is made by pressing carbon and synthetic plastic. c. Carbon film resistor: the ceramic rod is prepared by plating a layer of carbon on a ceramic tube and depositing crystalline carbon on a ceramic rod framework. d. A metal film resistor: plating a layer of metal on the ceramic tube, and evaporating the alloy material on the surface of the ceramic rod framework by a vacuum evaporation method. e. Metal oxide film resistor: plating a layer of tin oxide on the porcelain tube, and depositing a layer of metal oxide on the insulating rod.
The metal film resistor is a type of resistor which is widely applied so far, and has high precision, stable performance, simple and light structure; it is made up by adopting high-temp. vacuum coating technique to make nickel-chromium or similar alloy be tightly adhered on the surface of porcelain rod to form a coating film, cutting and regulating resistance value so as to obtain the final required precision resistance value, then adding proper joint to cut, and coating epoxy resin on its surface to make sealing protection. When the existing metal film resistor bears external force impact or extrusion, the metal film is easy to damage, so that the resistance value is changed, and the resistor is scrapped; the film is thin and has poor stability under pulse load.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high stable metal film resistor has solved the above-mentioned technical problem who exists among the prior art.
The utility model adopts the technical proposal that: a high-stability metal film resistor comprises a ceramic substrate, a metal film layer, an oxide film layer, an epoxy resin layer, a terminal electrode tin/copper plating layer and a resistor pin, wherein the metal film layer is sputtered on the surface of the ceramic substrate, and the oxide film layer is sprayed on the outer side of the metal film layer; the left and right opposite end surfaces of the ceramic substrate are respectively provided with the terminal electrode tin/copper plating layers, and the epoxy resin layer is sprayed on the outer side of the oxide film layer between the two terminal electrode tin/copper plating layers; and the end electrode tin/copper plating layers are sleeved with caps, and the outer end faces of the caps are connected with the resistor pins.
The ceramic matrix is provided with annular grooves or spiral grooves which are uniformly distributed on the surface of the ceramic matrix; and annularly or spirally winding the metal film layer between the annular grooves or the spiral grooves.
The epoxy resin layer and the outer side surface of the cap are coated with an inner moisture-proof paint layer, the surface of the inner moisture-proof paint layer is coated with an encapsulation paint layer, and a marking color ring is arranged on the encapsulation paint layer.
The epoxy resin in the epoxy resin layer is filled with inorganic high-thermal-conductivity filler nano alumina, wherein the average grain diameter of the nano alumina is 1-5 mu m.
The ceramic base is a cylinder, and the length and the cross section diameter of the ceramic base are respectively 3.8mm and 1.5 mm.
The metal film layer is a Ni-Cr alloy film.
The cap is made of iron-nickel material.
The resistance pin is a tinned copper wire.
The utility model relates to a high-stability metal film resistor, which has simple structure and can improve the stability of the resistor product, and the metal film layer has lower temperature coefficient, so that the thermal stability of the film resistor is better; the high-temperature load capacity of the film resistor is strong by high-temperature sintering of the oxide film layer; inorganic high-thermal-conductivity filler nano-alumina is filled in the epoxy resin, so that the heat dissipation capability of the encapsulating layer is greatly improved.
Drawings
Fig. 1 is a schematic structural diagram of a high-stability metal film resistor according to the present invention;
description of reference numerals:
1-a ceramic matrix; 2-a metal film layer; 3-oxidizing the film layer; a 4-epoxy resin layer; 5-terminal electrode tin/copper plating; 6-resistor pin; 7-a cap; 8-inner moisture-proof paint layer; 9-encapsulating a paint layer; 10-mark color circle.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The present invention will be described in detail with reference to the accompanying drawings, in an embodiment of the present invention, a high-stability metal film resistor includes a ceramic substrate 1, a metal film layer 2, an oxide film layer 3, an epoxy resin layer 4, a terminal electrode tin/copper plating layer 5, and a resistor pin 6, wherein the ceramic substrate 1 is a cylinder, and the length and the cross-sectional diameter of the ceramic substrate 1 are respectively 3.8mm and 1.5 mm; the ceramic matrix 1 is provided with annular grooves or spiral grooves, and the annular grooves are uniformly distributed on the surface of the ceramic matrix 1; winding a metal film layer 2 in a ring shape between the ring-shaped grooves on the surface of the ceramic substrate 1, wherein the metal film layer 2 is a Ni-Cr alloy film, and the metal film layer 2 is sputtered on the surface of the ceramic substrate 1; the outer side of the metal film layer 2 is sprayed with an oxide film layer 3; the left and right opposite end surfaces of the ceramic substrate 1 are respectively provided with terminal electrode tin/copper plating layers 5, the outer side of an oxide film layer 3 between the two terminal electrode tin/copper plating layers 5 is sprayed with an epoxy resin layer 4, and the epoxy resin in the epoxy resin layer 4 is filled with inorganic high-heat-conductivity filler nano alumina, wherein the average grain diameter of the nano alumina is 1-5 mu m; the end electrode tin/copper plating layers 5 on the left side and the right side are respectively sleeved with a cap 7, the cap 7 is made of iron-nickel materials, the outer end face of the cap 7 is connected with a resistor pin 6, and the resistor pin 6 is a tinned copper wire.
The outer side surfaces of the epoxy resin layer 4 and the cap 7 are coated with an inner moisture-proof paint layer 8, the surface of the inner moisture-proof paint layer 8 is coated with an encapsulating paint layer 9, and the encapsulating paint layer 9 is provided with a marking color ring 10.
The utility model relates to a high-stability metal film resistor, which has simple structure, and the metal film layer adopting the Ni-Cr alloy film has lower temperature coefficient, so that the thermal stability of the film resistor is better; the high-temperature load capacity of the film resistor is strong by high-temperature sintering of the oxide film layer; the epoxy resin is filled with the inorganic high-thermal-conductivity filler nano aluminum oxide, so that the heat dissipation capacity of the encapsulating layer is greatly improved, and the comprehensive stability of the metal film resistor is integrally improved.
The present invention has been described above with reference to the accompanying drawings, but the technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (8)
1. A highly stable metal film resistor characterized by: the resistor comprises a ceramic substrate (1), a metal film layer (2), an oxide film layer (3), an epoxy resin layer (4), a terminal electrode tin/copper coating (5) and a resistor pin (6), wherein the metal film layer (2) is sputtered on the surface of the ceramic substrate (1), and the oxide film layer (3) is sprayed on the outer side of the metal film layer (2); the left end face and the right end face of the ceramic substrate (1) are respectively provided with the terminal electrode tin/copper plating layers (5), and the epoxy resin layer (4) is sprayed on the outer side of the oxide film layer (3) between the two terminal electrode tin/copper plating layers (5); and the end electrode tin/copper plating layer (5) is sleeved with a cap (7), and the outer end face of the cap (7) is connected with the resistor pin (6).
2. The highly stable metal film resistor according to claim 1, wherein: the ceramic matrix (1) is provided with annular grooves or spiral grooves, and the annular grooves or the spiral grooves are uniformly distributed on the surface of the ceramic matrix (1); -annularly or helically winding the metallic film layer (2) between the annular or helical flutes.
3. The highly stable metal film resistor according to claim 2, wherein: the epoxy resin layer (4) and the cap (7) are coated with an inner moisture-proof paint layer (8) on the outer side surface, an encapsulating paint layer (9) is coated on the surface of the inner moisture-proof paint layer (8), and a marking color ring (10) is arranged on the encapsulating paint layer (9).
4. The highly stable metal film resistor according to claim 1, wherein: and the epoxy resin in the epoxy resin layer (4) is filled with inorganic high-thermal-conductivity filler nano alumina, wherein the average particle size of the nano alumina is 1-5 mu m.
5. The highly stable metal film resistor according to claim 1, wherein: the ceramic base body (1) is a cylinder, and the length and the cross section diameter of the ceramic base body (1) are respectively 3.8mm and 1.5 mm.
6. The highly stable metal film resistor according to claim 1, wherein: the metal film layer (2) is a Ni-Cr alloy film.
7. The highly stable metal film resistor according to claim 1, wherein: the cap (7) is made of iron-nickel material.
8. The highly stable metal film resistor according to claim 1, wherein: the resistance pins (6) are tinned copper wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020090785.7U CN210956320U (en) | 2020-01-15 | 2020-01-15 | High-stability metal film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020090785.7U CN210956320U (en) | 2020-01-15 | 2020-01-15 | High-stability metal film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210956320U true CN210956320U (en) | 2020-07-07 |
Family
ID=71382742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020090785.7U Expired - Fee Related CN210956320U (en) | 2020-01-15 | 2020-01-15 | High-stability metal film resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210956320U (en) |
-
2020
- 2020-01-15 CN CN202020090785.7U patent/CN210956320U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200707 |