CN203205169U - Precision mold chip type resistor - Google Patents
Precision mold chip type resistor Download PDFInfo
- Publication number
- CN203205169U CN203205169U CN 201320215093 CN201320215093U CN203205169U CN 203205169 U CN203205169 U CN 203205169U CN 201320215093 CN201320215093 CN 201320215093 CN 201320215093 U CN201320215093 U CN 201320215093U CN 203205169 U CN203205169 U CN 203205169U
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- resistor
- ceramic matrix
- cap
- precision
- chip type
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Abstract
The utility model discloses a precision mold chip type resistor which comprises a ceramic matrix, an alloy resistance film coated at the periphery of the ceramic matrix, and a cap which is tightly matched with two ends of the ceramic matrix. The precision mold chip type resistor is characterized in that an electrode lead serving as an end electrode is welded on the cap; protective coatings are coated on the surface of the cap, the root of the electrode lead and the surface of the alloy resistance film. The precision mold chip type resistor has the beneficial effects that the environmental temperature range is wide, and the temperature is between 65 DEG C below zero and 175 DEG C; the resistor is small in size, low in cost, good in radiating performance, wide in resistance range and high in resistance precision, and the precision can be +/-0.02 percent; the temperature coefficient is small and can be +/-3*10<-6>/K; the operation is stable and reliable, and the stability can be +/-0.5 percent under the environmental conditions of 125 DEG C and 1000 hours; the resistor can be conveniently and rapidly attached to a circuit board by utilizing surface mounting technology equipment, and the resistor is suitable for development of the current surface mounting technology.
Description
Technical field
The utility model relates to electronic equipment and uses the precision metal film resistor field, particularly a kind of accurate die pressing chip resistor.
Background technology
Along with the fast development of electronics industry and popularizing of surface mount (SMT) technology, it is more and more that effects on surface mounts the electronic devices and components demand, and especially effects on surface mounts the resistor demand increases year by year.The resistor volume of existing band lead-in wire is large, and precision is low, inapplicable middle and high end electronic equipment mount requirement.Present domestic kind of the surface-pasted chip resistor that has, do not go between as electrode, but at substrate two ends Du Palladium silver or print other Precious Metals as termination electrode, cost is high, because the plate resistor rete area of this structure is less, the power of resistor is just little, and Standard resistance range is narrower, precision is low, stability is not high, therefore can not adapt to the needs of current high-end electronic product development.
The utility model content
The purpose of this utility model provides high stable, the high-precision accurate die pressing chip resistor that a kind of adaptation surface mount (SMT) technology is installed, have that power is large, Standard resistance range and the wide characteristics of application, adapt to the requirement of surface mount automation, not only improve efficiency of assembling, and reduce production costs.
The purpose of this utility model is achieved by the following technical programs; a kind of accurate die pressing chip resistor; comprise the friction tight cap of resistance alloys film and ceramic matrix two ends that ceramic matrix, ceramic matrix circumferentially coat; it is characterized in that: welding is as the contact conductor of termination electrode on the described cap, and described cap surface, contact conductor root and resistance alloys film surface all are covered with protective finish.
Further, the surface of described protective finish coats thermosetting mold pressing package casing.
Further, described ceramic matrix is cylinder, and described resistor finished product is polyhedron.
Further, described contact conductor is the tinned wird of Φ 0.5～0.6mm.
Further, described resistance alloys film is Ni, Cr, Al, Fe, Si alloy film or rare-earth element modified Ni-Cr alloy film.
Beneficial effect: the utility model is compared with traditional chip resistor, and the temperature range that conforms is wide, can long-term work under-65 ℃～175 ℃ environmental conditions, have perfect heat-dissipating, resistance accuracy is high, can accomplish ± 0.02%; Temperature coefficient is little, can accomplish ± 3 * 10
-6/ K; Working stability is reliable, and stability can accomplish ± 0.5%(125 ℃, under 1000 hours environmental conditions); Be convenient to surface mount, adapt to the development of current surface mounting technology.Be mainly used in the various middle and high end electronic device field such as hybrid integrated circuit, precise electronic measurement and control instrument instrument, Aeronautics and Astronautics, automotive electronics, utilize surface mounting technology equipment to be mounted in the circuit board quickly and easily.Compare with existing chip surface mount electrical resistor; by adopting cap welding electrode exit to replace the termination electrode of existing Du Palladium silver; reduce production costs; adopt the cylinder ceramic matrix; increase the resistive layer area; improve heat dispersion and power; widened Standard resistance range; the setting of diaphragm and by the thermosetting compression molding; prevent that the electric resistance alloy rete is difficult for oxidation and mechanical damage; having solved general surface, to mount chip resistor power little; Standard resistance range is narrow; precision is not high; thermal diffusivity is bad; the problem of job insecurity, thus the precision of electronic equipment improved; stability and reliability.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
As shown in Figure 1; high-accuracy surface mount electrical resistor provided by the utility model comprises cylinder ceramic matrix 1; material is high alumina content (2% calcium oxide-96% 3 oxidation, two-2% silicon dioxide); ceramic matrix has high temperature resistant; the unit volume coefficient of heat transfer is high; the premium properties that linear expansion coefficient is little; surface vacuum plating Ni at ceramic matrix; Cr; Al; Fe; Si resistance alloys film 2; or select rare-earth element modified Ni-Cr alloy material to form the resistance blank by high vacuum coating; contain the Al-Si-Fe trace element in the Ni-Cr alloy material; cap 3 is squeezed in the two ends of ceramic matrix 1 by tight fit; contact conductor 4 butt-joints are in cap 3; contact conductor 4 is conducting positions of resistor; its material uses Φ 0.5～0.6mm tinned wird by machine-shaping; electroplating surface one deck tin; can bear the high temperature of 350 ℃/3s; solderability will be got well; two end cap covers, 3 surfaces; contact conductor 4 roots and resistance alloys film 2 surfaces all apply protective finish 5; protective finish 5 is selected by epoxy resin; the composite coating of phenolic resins and the combination of organic nano silicon dioxide; be used for the protective resistance film; to prevent the oxidation of resistance alloys film and mechanical damage; the protective finish 5 of this composite coating has high temperature resistant; anti-high moisture performance; can be in temperature 〉=150 ℃; long-term work under relative humidity 〉=85% environmental condition, (commonly used is hexahedron to become polyhedron by thermoset epoxy molding powder 6 encapsulation process at last; octahedron) surface mount chip resistor.
The utility model product important technological parameters:
Overall dimension: 4.2 * 2.3 * 2.3mm; 7.2 * 2.8 * 2.8mm; 9.9 three kinds of different sizes of * 3.6 * 3.6mm; Rated power (125 ℃): 1/20W, 1/10W, three kinds of different capacities of 1/8W; Limiting voltage: 200V(1/20W, 1/10W), 250V(1/8W); Standard resistance range: 0.1 Ω～10M Ω; Full accuracy: ± 0.02%; Ambient temperature range :-65 ℃～175 ℃; Minimum temperature coefficient: ± 3 * 10
-6/ K; Also can expand as required and make different overall dimension, power and Standard resistance range.
Above-described embodiment is as better embodiment of the present utility model; describe technical conceive of the present utility model and essential implementation in detail; be not to be that protection range of the present utility model is limited; all any simple modification and equivalent structure transformation or modifications of doing according to the utility model Spirit Essence all should be encompassed within the protection range of the present utility model.
Claims (5)
1. accurate die pressing chip resistor; comprise the friction tight cap of resistance alloys film and ceramic matrix two ends that ceramic matrix, ceramic matrix circumferentially coat; it is characterized in that: welding is as the contact conductor of termination electrode on the described cap, and described cap surface, contact conductor root and resistance alloys film surface all are covered with protective finish.
2. a kind of accurate die pressing chip resistor according to claim 1 is characterized in that: the surface coating thermosetting mold pressing package casing of described protective finish.
3. a kind of accurate die pressing chip resistor according to claim 2, it is characterized in that: described ceramic matrix is cylinder, described resistor finished product is polyhedron.
4. a kind of accurate die pressing chip resistor according to claim 1 and 2, it is characterized in that: described contact conductor is the tinned wird of Φ 0.5～0.6mm.
5. a kind of accurate die pressing chip resistor according to claim 1 and 2, it is characterized in that: described resistance alloys film is Ni, Cr, Al, Fe, Si alloy film or rare-earth element modified Ni-Cr alloy film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320215093 CN203205169U (en) | 2013-04-25 | 2013-04-25 | Precision mold chip type resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320215093 CN203205169U (en) | 2013-04-25 | 2013-04-25 | Precision mold chip type resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203205169U true CN203205169U (en) | 2013-09-18 |
Family
ID=49149254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320215093 Expired - Lifetime CN203205169U (en) | 2013-04-25 | 2013-04-25 | Precision mold chip type resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203205169U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051099A (en) * | 2014-06-27 | 2014-09-17 | 深圳市业展电子有限公司 | Production method of high-power precision alloy SMD (surface mount device) resistor |
| CN107238446A (en) * | 2016-03-28 | 2017-10-10 | 新材料与产业技术北京研究院 | Detector unit and temperature detector |
| CN109324219A (en) * | 2018-11-28 | 2019-02-12 | 江门市钧崴电子科技有限公司 | Four terminal current sensing component of noncontinuous electrode and its production technology |
-
2013
- 2013-04-25 CN CN 201320215093 patent/CN203205169U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051099A (en) * | 2014-06-27 | 2014-09-17 | 深圳市业展电子有限公司 | Production method of high-power precision alloy SMD (surface mount device) resistor |
| CN107238446A (en) * | 2016-03-28 | 2017-10-10 | 新材料与产业技术北京研究院 | Detector unit and temperature detector |
| CN109324219A (en) * | 2018-11-28 | 2019-02-12 | 江门市钧崴电子科技有限公司 | Four terminal current sensing component of noncontinuous electrode and its production technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 233010 Bengbu high tech Industrial Development Zone, Anhui, Xing Zhong Road, No. 818 Patentee after: BDS ELECTRONICS Inc. Patentee after: BENGBU SHUANGHUAN ELECTRONICS GROUP CO.,LTD. Address before: 233010 Bengbu high tech Industrial Development Zone, Anhui, Xing Zhong Road, No. 818 Patentee before: BDS ELECTRONICS INC. Patentee before: BENGBU DOUBLE CIRCLE ELECTRONICS GROUP Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130918 |