CN210952459U - Temperature equalizing plate - Google Patents
Temperature equalizing plate Download PDFInfo
- Publication number
- CN210952459U CN210952459U CN201921731877.2U CN201921731877U CN210952459U CN 210952459 U CN210952459 U CN 210952459U CN 201921731877 U CN201921731877 U CN 201921731877U CN 210952459 U CN210952459 U CN 210952459U
- Authority
- CN
- China
- Prior art keywords
- groove
- lower plate
- glue dispensing
- temperature
- capillary structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides a temperature-uniforming plate. This temperature-uniforming plate includes: the glue dispensing device comprises a lower plate, an upper plate, a first groove, a second groove, a capillary structure and glue dispensing grooves, wherein the lower plate and the upper plate are arranged oppositely, the first groove is formed in the lower plate, the second groove is formed in the upper plate and corresponds to the first groove, and the glue dispensing grooves are formed in the lower plate and are arranged at intervals with the first groove; the first groove and the second groove form an accommodating cavity; the capillary structure is positioned in the accommodating cavity, and the dispensing groove is close to the edge of the lower plate and far away from the accommodating cavity; the glue dispensing groove is filled with the connecting glue, so that the connecting glue can be effectively prevented from flowing into the accommodating cavity, the capillary structure is prevented from being polluted, the capillary structure is prevented from losing capillary force, and the product yield is improved.
Description
Technical Field
The utility model relates to a heat abstractor field especially relates to a temperature-uniforming plate.
Background
Along with the demand of the current electronic devices for being light and thin as a target board, the size of each component should be reduced accordingly, but the heat generated by the size reduction of the electronic devices becomes a major obstacle for improving the performance of the electronic devices and systems. At present, the Heat dissipation mode of the mobile phone mainly comprises a graphite sheet, a Heat pipe (Heat pipe) and a Vapor chamber (Vapor chamber).
The working principle of the heat pipe is that the inner wall of the heat pipe is provided with a capillary structure, and then the heat pipe is vacuumized and filled with working liquid or filled with the working liquid first and then vacuumized, and finally sealed to form the heat pipe structure. When the working liquid is heated and evaporated by the evaporation part and then is diffused to the condensation end, the working liquid is in a vapor state in the evaporation part, is gradually cooled and condensed to be converted into a liquid state after leaving from the evaporation part and then is diffused to the condensation end, and then flows back to the evaporation part through the capillary structure.
The working principle of the temperature equalizing plate is similar to that of a heat pipe, and the difference is that the heat conduction of the heat pipe is linear transmission in a one-dimensional direction, and the heat conduction of the temperature equalizing plate is linear transmission in a two-dimensional direction. The temperature-uniforming plate mainly comprises an upper plate body, a lower plate body and a cavity arranged between the upper plate body and the lower plate body, wherein working liquid is filled in the cavity, a capillary structure is arranged on the inner wall of the cavity, after the lower plate body is contacted with a heating element (such as a central processing unit, a north-south bridge crystal, a transistor and the like), the working liquid in the cavity is converted into a gaseous state from a liquid state and is transmitted towards the upper plate body, and finally, heat energy is transmitted out by a heat dissipation device (such as a fin) on the temperature-uniforming plate except the region contacted with the heating element or on the outer side of the temperature-uniforming plate, at the moment, the working liquid can be converted back into the liquid state to return to the lower plate body.
In the production process of the uniform temperature plate, a process called copper paste dispensing is carried out, namely, a lower plate body of the uniform temperature plate is fixed on a jig, then a glue dispenser dispenses copper paste on the lower plate body according to a glue dispensing procedure, and after the copper paste dispensing is finished, the upper plate body and the lower plate body of the uniform temperature plate are combined through high-temperature brazing. In this in-process, the copper paste can receive the influence of syringe needle specification, atmospheric pressure and the point of point gum machine and glue speed, and the volume of uncontrollable copper paste is too little, can lead to in-process copper paste of high temperature brazing to flow into the cavity like this, pollutes the capillary structure in the cavity, leads to the product gas leakage, and volatile substance in the copper paste is also a large amount of adhesion on capillary structure simultaneously, influences the capillary force of capillary structure, leads to the product to produce the property bad.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature-uniforming plate can prevent effectively that the connection glue from flowing into and holding the chamber, improves the product yield.
In order to achieve the above object, the utility model provides a vapor chamber, include: the glue dispensing device comprises a lower plate, an upper plate, a first groove, a second groove, a capillary structure and glue dispensing grooves, wherein the lower plate and the upper plate are arranged oppositely, the first groove is formed in the lower plate, the second groove is formed in the upper plate and corresponds to the first groove, and the glue dispensing grooves are formed in the lower plate and are arranged at intervals with the first groove;
the first groove and the second groove form an accommodating cavity; the capillary structure is positioned in the accommodating cavity, and the dispensing groove is close to the edge of the lower plate and far away from the accommodating cavity; and the adhesive dispensing groove is filled with connecting adhesive.
The connecting glue is copper paste.
The lower plate member includes a top portion, a middle portion connecting the top portion, and a bottom portion vertically connected to the middle portion; the dispensing groove comprises a first groove body positioned in the middle part and the bottom part and extending along the edges of the middle part and the bottom part, and a second groove body and a third groove body positioned in the top part and respectively connected with two ends of the first groove body; the second groove body and the third groove body are both in a closed ring shape.
The first groove is located in the middle portion and the bottom portion.
The capillary structure is a copper net, a steel net or a titanium alloy net.
And working liquid for heat dissipation is filled in the capillary structure.
The depth of the first groove is equal to that of the glue dispensing groove.
The depth of the glue dispensing groove is 0.08-0.1 mm; the width of the glue dispensing groove is 0.6-0.8 mm; the distance between the glue dispensing groove and the edge of the lower plate is 0.2-0.4 mm.
The depth of the glue dispensing groove is 0.09 mm; the width of the glue dispensing groove is 0.7 mm; the distance between the glue dispensing groove and the edge of the lower plate is 0.3 mm.
The vapor chamber also includes a plurality of support structures located in the second recess.
The utility model has the advantages that: the utility model discloses a temperature-uniforming plate includes: the glue dispensing device comprises a lower plate, an upper plate, a first groove, a second groove, a capillary structure and glue dispensing grooves, wherein the lower plate and the upper plate are arranged oppositely, the first groove is formed in the lower plate, the second groove is formed in the upper plate and corresponds to the first groove, and the glue dispensing grooves are formed in the lower plate and are arranged at intervals with the first groove; the first groove and the second groove form an accommodating cavity; the capillary structure is positioned in the accommodating cavity, and the dispensing groove is close to the edge of the lower plate and far away from the accommodating cavity; the glue dispensing groove is filled with the connecting glue, so that the connecting glue can be effectively prevented from flowing into the accommodating cavity, the capillary structure is prevented from being polluted, the capillary structure is prevented from losing capillary force, and the product yield is improved.
Drawings
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the present invention and accompanying drawings, which are provided for the purpose of illustration and description and are not intended to limit the present invention.
In the drawings, there is shown in the drawings,
fig. 1 is a schematic view of a lower plate of the vapor chamber of the present invention;
fig. 2 is a schematic view of an upper plate of the vapor chamber of the present invention;
fig. 3 is a cross-sectional view of the vapor chamber of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Referring to fig. 1 to 3, the present invention provides a vapor chamber, including: the device comprises a lower plate 10 and an upper plate 20 which are oppositely arranged, a first groove 11 arranged in the lower plate 10, a second groove 21 arranged in the upper plate 20 and corresponding to the first groove 11, a capillary structure 31 and a glue dispensing groove 12 arranged in the lower plate 10 and spaced from the first groove 11;
the first groove 11 and the second groove 21 form an accommodating cavity 30; the capillary structure 31 is positioned in the accommodating cavity 30, and the glue dispensing groove 12 is close to the edge of the lower plate 10 and far away from the accommodating cavity 30; the glue dispensing groove 12 is filled with connecting glue.
It should be noted that, in the present invention, the dispensing groove 12 spaced from the first groove 11 is disposed in the lower plate 10, the first groove 11 and the second groove 21 form an accommodating cavity 30, the capillary structure 31 is located in the accommodating cavity 30, the dispensing groove 12 is close to the edge of the lower plate 10 and is far away from the accommodating cavity 30, in the manufacturing process of the uniform temperature plate, the dispensing groove 12 can be filled with the connection glue, which can effectively prevent the connection glue from flowing into the accommodating cavity 30, avoid polluting the capillary structure 31, further avoid the capillary structure 31 from losing capillary force, and improve the yield of the product (the yield is increased from 50% to over 90%).
In particular, the capillary structure 31 is located in the first groove 11.
Specifically, the connecting glue is copper paste.
Specifically, the lower plate member 10 includes a top portion 101, a middle portion 102 connecting the top portion 101, and a bottom portion 103 vertically connected to the middle portion 102; the dispensing slot 12 comprises a first slot 121 located in the middle part 102 and the bottom part 103 and extending along the edges of the middle part 102 and the bottom part 103, and a second slot 122 and a third slot 123 located in the top part 101 and respectively connected with two ends of the first slot 121; the second groove body 122 and the third groove body 123 are both in a closed ring shape, so that air leakage at the top end of the dispensing groove 12 can be prevented, and the quality of the temperature-equalizing plate is improved.
Specifically, the first groove 11 is located in the middle portion 102 and the bottom portion 103.
Specifically, the depth of the glue dispensing groove 12 is 0.08-0.1mm, and preferably 0.09 mm.
Specifically, the width of the dispensing slot 12 is 0.6-0.8mm, and preferably 0.7 mm.
Specifically, the distance between the glue dispensing groove 12 and the edge of the lower plate 10 is 0.2-0.4mm, and preferably 0.3 mm.
Specifically, the depth of the first groove 11 and the depth of the dispensing slot 12 may be equal, which is convenient for etching the first groove 11 and the dispensing slot 12 simultaneously by one etching process.
Specifically, the capillary structure 31 is a copper mesh, a steel mesh or a titanium alloy mesh, but may also be other materials having a capillary action.
Specifically, the capillary structure 31 is filled with a working fluid for heat dissipation, that is, the working fluid is filled in the mesh gap, after the lower plate 10 contacts a heating element (such as a central processing unit, a north-south bridge crystal, a transistor, etc.), the working fluid in the accommodating cavity 30 is converted from a liquid state to a gas state and is transmitted toward the upper plate 20, and finally, heat energy is transmitted by a heat dissipation device (such as a fin) on the temperature equalization plate except the region contacting the heating element or on the outer side of the temperature equalization plate, at this time, the working fluid is converted back to the liquid state and returns to the lower plate 10, and the next heat dissipation cycle is performed again.
Specifically, the vapor chamber further comprises a plurality of support structures 22 located in the second grooves 21, wherein the support structures 22 are used for supporting the capillary structures 31 and preventing the capillary structures 31 from deforming.
Further, the shape of the supporting structure 22 is cylindrical, truncated cone, ellipsoid or rectangular parallelepiped, but may be other shapes with supporting function.
In particular, the thickness of the support structure 22 is equal to the depth of the second groove 21, so as to better support the capillary structure 31.
Specifically, the upper plate body 20 and the lower plate body 10 are correspondingly arranged, and have similar structures, and also include a top portion, a middle portion connected to the top portion, and a bottom portion vertically connected to the middle portion, so that the temperature-uniforming plate further includes an adhesive-backed groove 24 disposed at the edge of the middle portion and the bottom portion of the upper plate body 20, the adhesive-backed groove 24 is used for accommodating an adhesive, and when the temperature-uniforming plate is disposed in an electronic device (e.g., a mobile phone), the adhesive-backed groove is used for connecting a middle frame of the electronic device and the temperature-uniforming plate. In addition, the temperature equalization plate further comprises a plurality of process positioning grooves 23 arranged at the edge of the middle part of the upper plate body 20.
Specifically, the depth of the second groove 21 is 0.17-0.19mm, and preferably 0.18 mm. The depth of the back glue groove 24 is 0.09-0.11mm, and preferably 0.1 mm.
To sum up, the utility model discloses a temperature-uniforming plate includes: the glue dispensing device comprises a lower plate, an upper plate, a first groove, a second groove, a capillary structure and glue dispensing grooves, wherein the lower plate and the upper plate are arranged oppositely, the first groove is formed in the lower plate, the second groove is formed in the upper plate and corresponds to the first groove, and the glue dispensing grooves are formed in the lower plate and are arranged at intervals with the first groove; the first groove and the second groove form an accommodating cavity; the capillary structure is positioned in the accommodating cavity, and the dispensing groove is close to the edge of the lower plate and far away from the accommodating cavity; the glue dispensing groove is filled with the connecting glue, so that the connecting glue can be effectively prevented from flowing into the accommodating cavity, the capillary structure is prevented from being polluted, the capillary structure is prevented from losing capillary force, and the product yield is improved.
From the above, it is obvious to those skilled in the art that various other changes and modifications can be made according to the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protection scope of the claims of the present invention.
Claims (10)
1. A vapor chamber, comprising: the glue dispensing device comprises a lower plate (10) and an upper plate (20) which are oppositely arranged, a first groove (11) which is arranged in the lower plate (10), a second groove (21) which is arranged in the upper plate (20) and corresponds to the first groove (11), a capillary structure (31) and a glue dispensing groove (12) which is arranged in the lower plate (10) and is arranged at an interval with the first groove (11);
the first groove (11) and the second groove (21) form an accommodating cavity (30); the capillary structure (31) is positioned in the accommodating cavity (30), and the glue dispensing groove (12) is close to the edge of the lower plate (10) and far away from the accommodating cavity (30); and the glue dispensing groove (12) is filled with connecting glue.
2. The vapor chamber of claim 1, wherein the bonding paste is copper paste.
3. The vapor-insulating plate according to claim 1, wherein said lower plate member (10) comprises a top portion (101), a middle portion (102) connecting said top portion (101), and a bottom portion (103) perpendicularly connected to said middle portion (102); the dispensing groove (12) comprises a first groove body (121) which is positioned in the middle part (102) and the bottom part (103) and extends along the edges of the middle part (102) and the bottom part (103), and a second groove body (122) and a third groove body (123) which are positioned in the top part (101) and are respectively connected with two ends of the first groove body (121); the second groove body (122) and the third groove body (123) are both in a closed ring shape.
4. A temperature-uniforming plate according to claim 3, wherein the first recess (11) is located in the middle portion (102) and the bottom portion (103).
5. A temperature-uniforming plate according to claim 1, wherein the capillary structure (31) is a copper mesh, a steel mesh or a titanium alloy mesh.
6. The vapor-deposition plate according to claim 1, wherein the capillary structure (31) is filled with a working fluid for dissipating heat.
7. A temperature-uniforming plate according to claim 1, wherein the depth of the first recess (11) is equal to the depth of the dispensing groove (12).
8. A temperature-uniforming plate according to claim 1, wherein the depth of the glue dispensing groove (12) is 0.08-0.1 mm; the width of the glue dispensing groove (12) is 0.6-0.8 mm; the distance between the glue dispensing groove (12) and the edge of the lower plate (10) is 0.2-0.4 mm.
9. A temperature-uniforming plate according to claim 8, wherein the depth of the glue dispensing groove (12) is 0.09 mm; the width of the glue dispensing groove (12) is 0.7 mm; the distance between the glue dispensing groove (12) and the edge of the lower plate (10) is 0.3 mm.
10. A temperature-uniforming plate according to claim 1, further comprising a plurality of support structures (22) located in the second recess (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921731877.2U CN210952459U (en) | 2019-10-15 | 2019-10-15 | Temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921731877.2U CN210952459U (en) | 2019-10-15 | 2019-10-15 | Temperature equalizing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210952459U true CN210952459U (en) | 2020-07-07 |
Family
ID=71378012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921731877.2U Active CN210952459U (en) | 2019-10-15 | 2019-10-15 | Temperature equalizing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210952459U (en) |
-
2019
- 2019-10-15 CN CN201921731877.2U patent/CN210952459U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7169555B2 (en) | Vapor chambers, vapor chamber mounting substrates and metal sheets for vapor chambers | |
| WO2021203825A1 (en) | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus | |
| CN102202488A (en) | Heat-pipe heat radiation apparatus | |
| CN210489604U (en) | Temperature equalizing plate | |
| CN112648870A (en) | Manufacturing process of lightweight uniform temperature plate and uniform temperature plate | |
| CN210952459U (en) | Temperature equalizing plate | |
| CN110779362B (en) | Semi-shearing forming method for vapor chamber | |
| KR102092307B1 (en) | Vapor chamber | |
| CN210959288U (en) | Temperature equalizing mother board | |
| KR20180021145A (en) | Plate type temperature equalizing device | |
| CN101116886A (en) | Method for preparing samming board | |
| CN211425160U (en) | Temperature equalizing plate | |
| CN110785054A (en) | Punch forming method for vapor chamber | |
| CN214676286U (en) | Vacuum cavity temperature equalizing plate | |
| WO2024016435A1 (en) | Atomization sheet packaging structure and atomization device | |
| GB2427681A (en) | Heat pipe manufacturing method | |
| CN112968110B (en) | All-inorganic packaging high-power LED device and manufacturing method thereof | |
| US20070277962A1 (en) | Two-phase cooling system for cooling power electronic components | |
| CN212300052U (en) | Soaking plate | |
| CN211120791U (en) | Thin type temperature equalizing plate | |
| EP1863085A2 (en) | Two-phase cooling system for cooling power electronic components | |
| CN114061346A (en) | Soaking plate | |
| TW202130960A (en) | Temperature regulating board | |
| CN110740614A (en) | Vapor chamber, manufacturing method thereof and electronic equipment | |
| US11774182B2 (en) | Loop heat pipe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Leishi Thermal Management Technology Co.,Ltd. Address before: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: STONEPLUS THERMAL MANAGEMENT TECHNOLOGIES Ltd. |
|
| CP01 | Change in the name or title of a patent holder |