CN210923775U - 测试模具 - Google Patents
测试模具 Download PDFInfo
- Publication number
- CN210923775U CN210923775U CN201921831114.5U CN201921831114U CN210923775U CN 210923775 U CN210923775 U CN 210923775U CN 201921831114 U CN201921831114 U CN 201921831114U CN 210923775 U CN210923775 U CN 210923775U
- Authority
- CN
- China
- Prior art keywords
- fixed
- mould frame
- column
- baffle
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 16
- 230000000694 effects Effects 0.000 claims abstract description 21
- 238000009434 installation Methods 0.000 abstract description 5
- 230000002349 favourable effect Effects 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921831114.5U CN210923775U (zh) | 2019-10-29 | 2019-10-29 | 测试模具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921831114.5U CN210923775U (zh) | 2019-10-29 | 2019-10-29 | 测试模具 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210923775U true CN210923775U (zh) | 2020-07-03 |
Family
ID=71350348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921831114.5U Active CN210923775U (zh) | 2019-10-29 | 2019-10-29 | 测试模具 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210923775U (zh) |
-
2019
- 2019-10-29 CN CN201921831114.5U patent/CN210923775U/zh active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2005524239A5 (zh) | ||
JP2011014656A (ja) | 電子機器およびフレキシブルプリント配線板 | |
CN210923775U (zh) | 测试模具 | |
CN213662054U (zh) | 一种带自清洁功能的线路板 | |
US10912200B2 (en) | Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group | |
CN100579342C (zh) | 电子装置和壳体 | |
CN212970254U (zh) | 一种用于埋线线路板制作用压板装置 | |
CN109788628B (zh) | 测试用电路板 | |
CN207427562U (zh) | 一种usb电路板器件 | |
JP2011061243A (ja) | フレキシブルプリント配線板 | |
CN215835603U (zh) | 一种多状态可调的电路板 | |
CN217305408U (zh) | 一种电路板低电阻测试装置 | |
CN201724986U (zh) | 一种用于批量测量柔性电路板抗电磁干扰层电阻值的装置 | |
CN216775117U (zh) | 一种新型双面精密电路板 | |
CN215420918U (zh) | 多条导线制作的led单面线路板 | |
CN218352945U (zh) | 一种具有防护结构的5g信号传输用线路板 | |
CN102087325B (zh) | 软性电路板的检测方法 | |
CN219459374U (zh) | 一种防静电功能的pcba板 | |
CN210781514U (zh) | 一种附有防尘防静电膜的电路板 | |
CN216695542U (zh) | 一种线路板检测压合用可自动计数的计数器 | |
CN210928359U (zh) | 一种可防尘的通讯器材冷热基板 | |
CN210986574U (zh) | 一种便于定位的多层印制电路板 | |
CN215345227U (zh) | 一种表面无孔的多层电路板 | |
JP4147436B2 (ja) | ヒートシンクを挟んだ基板の接続方法と装置 | |
CN216626154U (zh) | 一种5g信号传输用便于安装的线路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240605 Address after: Room 302, Unit 3, Building 7, Provincial Administration for Industry and Commerce Dormitory, No. 316 Tiyu South Street, Yuhua District, Shijiazhuang City, Hebei Province, 050000 Patentee after: Fan Shubo Country or region after: China Address before: 516000 No. 30, qiuyeyuan Road, Longxi street, BOLUO County, Huizhou City, Guangdong Province Patentee before: Huizhou yongshenglong Electronic Technology Co.,Ltd. Country or region before: China |