CN210900114U

CN210900114U - Heat dissipation type printed wiring board

Info

Publication number: CN210900114U
Application number: CN201921518192.XU
Authority: CN
Inventors: 叶龙
Original assignee: Shenzhen Lingde Industrial Co ltd
Current assignee: Shenzhen Lingde Circuit Technology Co.,Ltd.
Priority date: 2019-09-12
Filing date: 2019-09-12
Publication date: 2020-06-30
Anticipated expiration: 2029-09-12

Abstract

The utility model provides a heat dissipation type printed wiring board belongs to electronic component equipment application technical field, including base plate, heat dissipation ball, inner chamber, radiating groove, miniature fan, the fixed outer insulating tape that has inlayed in base plate edge, fixed surface has inlayed the heat dissipation ball outward, fixed embedded inner panel in the middle of the inner chamber, radiating groove top fixedly connected with carbon powder layer, miniature fan root fixedly connected with induction controller. The utility model discloses a set up I shape circuit board shape, utilize I shape indent structure, absorb the inside heat that produces of base plate through setting up the carbon powder layer, through setting up the heat dissipation ball, directly give off the heat that the outer circuit of base plate produced, the heat dissipation ball is the arc, can increase heat radiating area, through setting up the inner chamber, keeps in the heat of base plate inside and outside, simultaneously through setting up miniature fan, can be rapid through wind-force effect with heat discharge.

Description

Heat dissipation type printed wiring board

Technical Field

The utility model relates to an electronic component equipment technical field, more specifically relates to a heat dissipation type printed wiring board.

Background

The printed circuit board is generally used in electrical equipment or electronic devices, the circuit board is installed inside the equipment or the devices, a large amount of heat is easily generated due to the fact that a large number of communication circuits are arranged on the surface of the circuit board during working, the existing printed circuit board is poor in heat dissipation performance, the generated heat cannot be effectively and timely discharged, and then the phenomenon that the circuit board is burnt out during working is easily caused.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving, current printed wiring board, heat dispersion is poor, can not give off the discharge at the timely heat that will produce of circuit board during operation, a heat dissipation type printed wiring board is provided, this circuit board comprises two upper and lower substrates, the circuit board wholly is the I shape, the substrate surface is provided with the heat dissipation ball, through setting up carbon powder layer and radiating groove in the middle of two substrates, the inside heat that produces of effectual absorption base plate in time discharges, simultaneously through at the inboard surface mounting miniature fan of base plate, carry out on-off control through the temperature of induction controller according to the base plate inner chamber, give off the heat through the wind-force effect efficient.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation type printed wiring board, includes the base plate, the heat dissipation ball, the inner chamber, the radiating groove, miniature fan, the fixed outer insulating band that has inlayed in base plate edge, and the fixed outer heat dissipation ball that has inlayed of surface, the inside fixed heat dissipation membrane that has inlayed of radiating ball, bottom fixedly connected with insulating strip, the inside fixed louvre that is provided with of insulating strip, the fixed inner panel that has inlayed in the middle of the inner chamber, the fixed heat insulation membrane that sets up in upper portion, the outside both sides fixedly connected with carbon powder layer of radiating groove, carbon powder layer outside fixedly connected with heat absorption ball, heat absorption ball left and right sides fixed mounting has miniature fan, miniature fan root fixedly connected with induction controller, inside central authorities fixed mounting has the pivot, the outside fixedly connected with.

Further preferred scheme: the substrate is divided into an upper layer and a lower layer, the whole shape of the substrate is I-shaped, the edges of the periphery of the substrate are fixedly embedded with insulating tapes, and the insulating tapes are in an arc shape protruding outwards.

Further preferred scheme: the inner chamber is the annular and encircles, and fixed embedded having the inner panel in the middle, inner chamber and inner panel cooperation form the type cavity of encircleing, run through inside the whole base plate.

Further preferred scheme: the heat dissipation ball is in a partial convex arc shape, an arc heat dissipation film which is convex is embedded in the internal fixing, and a columnar through heat dissipation hole is fixedly arranged in the internal part of the insulation sheet.

Further preferred scheme: two parallel connection about the radiating groove, both sides fixedly connected with carbon powder layer, and carbon powder layer outside fixedly connected with heat absorption ball, a plurality of connection side by side of heat absorption ball distribute, distribution length equals the length of carbon powder layer.

Further preferred scheme: the miniature fan is invertedly distributed on the inner side of the outer portion of the substrate, the leaf fan is fixedly connected to the outer portion of the rotating shaft and is in an inverted trapezoidal shape, and the long edge of the leaf fan is an outer fan edge.

The utility model provides a heat dissipation type printed wiring board has following beneficial effect:

1. the utility model discloses a wholly set up the circuit board and be the I shape, constitute by two upper and lower base plates, base plate outside fixed surface sets up by the heat dissipation ball, can in time distribute the heat that the outer circuit during operation of base plate produced through the effect of louvre and radiating film, sets up the insulating piece simultaneously and keeps apart heat dissipation ball and base plate, effectively prevents that the circuit from conducting the heat dissipation ball and leading to spheroid itself to generate heat because of the circular telegram.

2. The utility model discloses the advantage lies in setting up the inner panel and making the inside inner chamber that forms a surrounding type of base plate, and the inner chamber is provided with thermal-insulated membrane again, and thermal-insulated membrane is protruding to the inner chamber, can prevent on the heat conduction of intracavity is to base plate outside circuit, inner chamber and heat absorption ball lug connection, and the heat absorption ball can rotate, through rotating the effectual carbon powder layer that gives off of absorbed heat and caching, the rethread radiating groove is with heat discharge.

3. At last, the miniature fans are distributed on the inner side surface of the substrate, when the heat absorption balls, the carbon powder layer and the heat dissipation grooves are in a matched action to difficultly meet the heat dissipation requirement, the induction controller senses the switch of the high-temperature control fan of the inner cavity of the substrate, efficient heat dissipation is carried out under the action of wind power, and when the natural heat dissipation requirement is difficultly met, emergency protection measures are arranged.

Drawings

Fig. 1 is the overall structure diagram of the circuit board of the present invention.

Fig. 2 is a schematic diagram of the structure of the circuit board micro fan of the present invention.

Fig. 3 is a schematic diagram of the structure of the circuit board heat dissipation ball of the present invention.

In FIGS. 1-3: 1. the heat dissipation structure comprises a substrate, 2, an insulating tape, 3, a cavity, 4, a heat dissipation ball, 401, a heat dissipation film, 402, a heat dissipation hole, 403, an insulating sheet, 5, an inner plate, 6, a carbon powder layer, 7, a heat absorption ball, 8, a heat dissipation groove, 9, a heat insulation film, 10, an induction controller, 11, a micro fan, 1101, a rotating shaft, 1102 and a leaf fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to fig. 1 to 3 of the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example (b):

please refer to fig. 1 to 3:

1. the embodiment provides a heat dissipation type printed wiring board, including base plate 1, heat dissipation ball 4, inner chamber 3, radiating groove 8, micro fan 11, 1 edge of base plate is fixed to have inlayed outward insulating tape 2, and surface mounting has inlayed heat dissipation ball 4 outward, the inside fixed embedded radiating film 401 that has of radiating ball 4, the inside fixed louvre 402 that is provided with of insulating piece 403, the fixed embedded inner panel 5 that has in the middle of the inner chamber 3, the fixed thermal-insulated membrane 9 that sets up in upper portion, the outside both sides fixedly connected with carbon powder layer 6 of radiating groove 8, the 6 outside fixedly connected with heat absorption ball 7 on carbon powder layer, the 7 left and right sides fixed mounting of heat absorption ball has micro fan 11, micro fan root fixedly connected with induction controller 10, inside central fixed mounting has pivot 1101, the outside fixedly connected with leaf fan 1102 of pivot 1101.

Furthermore, two upper and lower blocks of symmetry distribution of base plate 1, whole shape are the I shape, and fixed the outer insulating tape 2 that has inlayed in base plate 1 all around edge, insulating tape 2 is the arc of evagination, encircles at whole base plate outside edge.

Further, the inner chamber 3 is inside the annular encirclement base plate, and the fixed embedded inner panel 5 that has in the middle, inside 5 size slightly is less than the inner chamber, and inner chamber 3 forms encirclement type cavity with the cooperation of inner panel 5, runs through inside whole base plate 1.

Further, eight heat dissipation balls 4 are partial evagination arc form, distribute in 1 four angles of every base plate, and the fixed embedded arc radiating membrane 401 that has four evaginations of inside, four radiating membrane 401's distribution length equals the inboard arc length of heat dissipation ball 4, bottom fixedly connected with insulating piece 403, and insulating piece 403 is inside fixed equidistant heat dissipation hole 402 that is provided with eight column run-through forms, and heat dissipation hole length equals the thickness of insulating piece 403.

Furthermore, two upper and lower parallel connections of heat dissipation groove 8, both sides fixedly connected with carbon powder layer 6, and carbon powder layer 6 outside fixedly connected with heat absorption ball 7, heat absorption ball 7 are a plurality of connected distribution side by side, and the distribution length equals the length of carbon powder layer 6, and heat absorption ball 7 can rotate.

Further, the micro fan 11 is inversely distributed on the inner side of the outer portion of the substrate 1, 6 micro fans are mounted on the inner side of each substrate 1, the mounting positions are bilaterally symmetrical, the three blades 1102 are fixedly connected to the outer portion of the rotating shaft 1101, the blades 1102 are in an inverted trapezoid shape, and the long edge of each blade 1102 is an outer edge of each blade.

The working principle is as follows: the utility model relates to a heat dissipation type printed wiring board, through setting up heat abstractor and structure in time effectual discharge to the heat that the circuit board produced, prevent that the circuit board during operation from burning out the circuit by the heat that gathers, the device mainly divide into base plate 1, heat dissipation ball 4, inner chamber 3, radiating groove 8, miniature fan 11 five main parts, at first through the holistic I-shaped structure of circuit board, increased the surface area of base plate, set up evagination arc heat dissipation ball on the surface, through the effect of louvre and heat dissipation membrane in time discharge the heat that the outer circuit of base plate produced; secondly, be provided with inner chamber and inner panel in the base plate inside, can keep in the heat that each part of base plate produced, through the rotation of heat absorption ball with heat conduction to carbon powder layer buffer memory and through the timely discharge of radiating groove, finally, through setting up a plurality of miniature fans at the base plate inboard, under induction controller's control response, when radiating ball, heat absorption ball, carbon powder layer, radiating groove are difficult to satisfy the heat dissipation demand, start miniature fan and utilize wind-force to carry out efficient heat dissipation processing, as an emergent safeguard measure.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat dissipation type printed wiring board, includes base plate (1), heat dissipation ball (4), inner chamber (3), radiating groove (8), micro-fan (11), its characterized in that: the utility model discloses a heat dissipation device, including base plate (1), fixed outer insulating tape (2) that has inlayed in edge, surface mounting has inlayed heat dissipation ball (4) outward, heat dissipation ball (4) inside fixed embedded radiating membrane (401), bottom fixedly connected with insulating piece (403), insulating piece (403) inside fixed heat dissipation hole (402) that is provided with, fixed embedded inner panel (5) in the middle of inner chamber (3), upper portion are fixed to be set up thermal-insulated membrane (9), heat dissipation groove (8) outside both sides fixedly connected with carbon powder layer (6), carbon powder layer (6) outside fixedly connected with heat absorption ball (7), heat absorption ball (7) left and right sides fixed mounting has micro fan (11), micro fan root fixedly connected with inductor (10), inside central authorities fixed mounting has pivot (1101), pivot (1101) outside fixedly connected with leaf fan (1102).

2. The heat dissipation printed wiring board of claim 1, wherein: two-layer about base plate (1), whole shape are the I shape, and fixed the outer insulating tape (2) that has inlayed in base plate (1) all around edge, insulating tape (2) are the arc of evagination.

3. The heat dissipation printed wiring board of claim 1, wherein: inner chamber (3) are the annular and encircle, and fixed embedded inner panel (5) have in the middle, and inner chamber (3) and inner panel (5) cooperation form and encircle the type cavity, run through inside whole base plate (1).

4. The heat dissipation printed wiring board of claim 1, wherein: the heat dissipation ball (4) is in a partial convex arc shape, a convex arc heat dissipation film (401) is embedded in the inner part of the heat dissipation ball, and a columnar through heat dissipation hole (402) is fixedly arranged in the insulation sheet (403).

5. The heat dissipation printed wiring board of claim 1, wherein: two parallel connection about heat dissipation groove (8), both sides fixedly connected with carbon powder layer (6), and carbon powder layer (6) outside fixedly connected with heat absorption ball (7), heat absorption ball (7) a plurality of connected distribution side by side, distribution length equals the length of carbon powder layer (6).

6. The heat dissipation printed wiring board of claim 1, wherein: miniature fan (11) are invertd and are distributed at base plate (1) outside inboard, pivot (1101) outside fixedly connected with leaf fan (1102), leaf fan (1102) are the shape of falling the trapezoidal, and the long limit is outer fan edge of leaf fan (1102).