CN210899839U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
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- CN210899839U CN210899839U CN201921938818.2U CN201921938818U CN210899839U CN 210899839 U CN210899839 U CN 210899839U CN 201921938818 U CN201921938818 U CN 201921938818U CN 210899839 U CN210899839 U CN 210899839U
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Abstract
The flexible circuit board comprises a flexible substrate and at least one circuit component arranged on the flexible substrate, wherein the flexible substrate is provided with a first bonding portion and at least one metal foil pattern layer, the circuit component is provided with a second bonding portion, the first bonding portion and the second bonding portion are in lead bonding, and the metal foil pattern layer comprises a first reinforcing portion covering the first bonding portion in the projection direction of the thickness of the flexible substrate and/or a second reinforcing portion covering the second bonding portion in the projection direction of the thickness of the flexible substrate. This application sets up at least one metal foil pattern layer at flexible circuit board's lead bonding department and forms permanent reinforcement structure, can satisfy the roughness and the intensity requirement of bonding position when the routing, can satisfy flexible circuit board's flexibility requirement simultaneously.
Description
Technical Field
The application relates to the technical field of flexible electronics, in particular to a flexible circuit board.
Background
The rapid development of flexible display and flexible circuit board technologies brings revolutionary changes to electronic products, so that electronic products in the field of wearable devices and electronic terminals show more and more flexible deformation capabilities.
At present, the packaging of flexible electronics is mainly performed based on the packaging process of the traditional semiconductor, and the packaging process cannot be completely suitable for or meet the performance requirements of the flexible electronics. For example, in a COB (Chip On Board) process of a flexible circuit Board, if wire bonding is performed without adding any reinforcement to the flexible substrate, because the pad position of the wire bonding has insufficient hardness and rigidity, the wire bonding efficiency is low, the bonding reliability is poor, or the Chip is broken due to uneven stress during wire bonding, and the wire bonding qualification rate is low.
SUMMERY OF THE UTILITY MODEL
To above-mentioned technical problem, the application provides a flexible circuit board, can satisfy the roughness and the intensity requirement of bonding position when the routing, can satisfy flexible circuit board's flexibility requirement simultaneously.
In order to solve the technical problem, the application provides a flexible circuit board, be in including flexible substrate and setting at least one circuit components and parts on the flexible substrate, the flexible substrate is equipped with first bonding portion and an at least metal foil pattern layer, circuit components and parts are equipped with second bonding portion, first bonding portion with lead bonding between the second bonding portion, metal foil pattern layer is in flexible substrate thickness direction ascending projection covers the first enhancement part of first bonding portion and/or be in flexible substrate thickness direction ascending projection covers the second enhancement part of second bonding portion.
Wherein, when the metal foil pattern layer contains the first reinforcing part and the second reinforcing part at the same time, the first reinforcing part and the second reinforcing part are continuous or disconnected with each other.
When the metal foil pattern layer only contains the second reinforcing part or contains the first reinforcing part and the second reinforcing part at the same time, the projection of the second reinforcing part in the thickness direction of the flexible substrate covers the arrangement area of the circuit component.
Wherein, when the metal foil pattern layer only contains the first reinforcing part or contains the first reinforcing part and the second reinforcing part at the same time, the pattern of the first reinforcing part is consistent with the arrangement pattern of the first bonding parts.
The flexible substrate comprises at least one flexible base material which is stacked, the metal foil pattern layers are arranged on at least one side surface of the flexible base material, and the adjacent metal foil pattern layers are arranged in an insulating mode.
Wherein the metal foil pattern layer further comprises a trace pattern of the flexible circuit board.
Wherein the thickness of the metal foil pattern layer is 5-25 μm.
The circuit component is a flexible bare chip.
The flexible substrate further comprises a protective film, and the protective film covers at least one metal foil pattern layer.
Wherein the projection of the metal foil pattern layer in the thickness direction of the flexible substrate covers the first bonding portion and is blank at a position corresponding to the second bonding portion, or the projection of the metal foil pattern layer in the thickness direction of the flexible substrate covers the second bonding portion and is blank at a position corresponding to the first bonding portion.
The utility model provides a flexible circuit board sets up an at least metal foil pattern layer formation permanent reinforcement structure through the lead bonding department at flexible circuit board, both can satisfy the roughness and the intensity requirement of bonding position when the routing, can also play support and guard action to the finished product after the routing is accomplished, and the off-the-shelf save of being convenient for is used and is shifted, can satisfy flexible circuit board's flexibility requirement simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board according to a first embodiment of the present application;
fig. 2 is a schematic structural view of a flexible substrate of a flexible circuit board according to a first embodiment of the present application;
FIG. 3 is a schematic side view of a flexible circuit board shown in accordance with a first embodiment of the present application;
FIG. 4 is a schematic side view of a flexible circuit board shown according to a second embodiment of the present application;
fig. 5 is a schematic structural diagram of a flexible circuit board according to a third embodiment of the present application;
FIG. 6 is a schematic side view of a flexible circuit board shown according to a third embodiment of the present application;
fig. 7 is a schematic structural view of a flexible circuit board not showing a flexible substrate shown according to a fourth embodiment of the present application;
FIG. 8 is a schematic side view of a flexible circuit board shown in accordance with a fourth embodiment of the present application;
fig. 9 is a schematic side view of a flexible circuit board according to a fifth embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.
In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.
The flexible circuit board comprises a flexible substrate and at least one circuit component arranged on the flexible substrate, the flexible substrate is provided with a first bonding portion and at least one metal foil pattern layer, the circuit component is provided with a second bonding portion, the first bonding portion is in wire bonding with the second bonding portion, and the metal foil pattern layer comprises a first reinforcing portion covering the first bonding portion in a projection manner in the thickness direction of the flexible substrate and/or a second reinforcing portion covering the second bonding portion in a projection manner in the thickness direction of the flexible substrate. The covering means that the projected part is positioned right below the first bonding part and/or the second bonding part, and the projected area is larger than or equal to the area of the first bonding part and/or the second bonding part, so that the projection can shield the first bonding part and/or the second bonding part. So, set up at least a metal foil pattern layer through the lead bonding department at flexible circuit board and form permanent reinforcement structure, both can satisfy the roughness and the intensity requirement of bonding position when the routing, can also play support and guard action to the finished product after the routing is accomplished, the off-the-shelf save of being convenient for is used and is shifted, can satisfy flexible circuit board's flexibility requirement simultaneously.
The "metal foil pattern layer" is defined in the present application to include a portion that is projected in the thickness direction of the flexible substrate and covers the first bonding portion and/or the second bonding portion, and therefore the "metal foil pattern layer" in the present application is a pattern layer including a portion that supports the first bonding portion and/or the second bonding portion in the pattern. Thus, it can be understood that, since there is no case where the projection of the first bonding portion itself covers itself or the first bonding portion supports itself, although the pattern layer where the first bonding portion is located may also be obtained by etching the metal foil, when the pattern layer where the first bonding portion is located does not include a portion for supporting the second bonding portion, the pattern layer where the first bonding portion is located does not belong to the metal foil pattern layer in the present application, and conversely, when the pattern layer where the first bonding portion is located includes a portion for supporting the second bonding portion, the pattern layer where the first bonding portion is located does belong to the metal foil pattern layer in the present application.
The metal foil pattern layers are preferably copper foil pattern layers, the number of the metal foil pattern layers can be one layer, two layers or multiple layers, the metal foil pattern layers are arranged in an insulating mode, patterns of different metal foil pattern layers can be the same or different, each metal foil pattern layer comprises a first reinforcing portion with a projection in the thickness direction of the flexible substrate covering the first bonding portion and/or a second reinforcing portion with a projection in the thickness direction of the flexible substrate covering the second bonding portion, namely, the projection of a single metal foil pattern layer can only cover the first bonding portion, only cover the second bonding portion or simultaneously cover the first bonding portion and the second bonding portion, and the projection covered area of the metal foil pattern layers, namely the area of the metal foil pattern layers, which can provide flatness and strength. When the metal foil pattern layer comprises the first reinforcing part, the flatness and the strength of the flexible substrate during routing can be improved, the routing qualification rate is improved, and when the metal foil pattern layer comprises the second reinforcing part, the flatness and the strength of the chip during routing can be improved, the routing qualification rate is improved, and the chip damage probability is reduced.
The pattern of the metal foil pattern layer can be optimized according to actual needs, for example, when the metal foil pattern layer comprises a first reinforced part and a second reinforced part, the first reinforced part and the second reinforced part are continuous or disconnected with each other; when the metal foil pattern layer comprises the first reinforcing part or comprises the first reinforcing part and the second reinforcing part, the projection of the second reinforcing part in the thickness direction of the flexible substrate covers the arrangement area of the circuit component; when the metal foil pattern layer includes the first reinforcing portion or includes the first reinforcing portion and the second reinforcing portion, the pattern of the first reinforcing portion coincides with the arrangement pattern of the first bonding portions. In practical implementation, when the metal foil pattern layer only includes the first reinforcing portion, no pattern is disposed at a position corresponding to the second bonding portion, that is, a blank is disposed at a position corresponding to the first bonding portion, and when the metal foil pattern layer only includes the second reinforcing portion, no pattern is disposed at a position corresponding to the first bonding portion, that is, a blank is disposed at a position corresponding to the second bonding portion, so that it is ensured that the unsupported portion is not uneven due to the presence of other patterns (such as a trace pattern of a flexible circuit board).
Generally, a Flexible Copper foil substrate (FCCL) is mostly used as a processing substrate of a Flexible printed circuit board, a Copper foil is covered on a surface of a polyimide base film of the FCCL, and at least one metal foil pattern layer can be obtained by etching the Copper foil on the surface of at least one Flexible Copper foil substrate.
The flexible circuit board of the present application is described in detail below with various embodiments.
First embodiment
Referring to fig. 1 to fig. 3, the flexible circuit board of the present embodiment includes a flexible substrate 22 and at least one circuit component 21 disposed on the flexible substrate 22.
The flexible substrate 22 has a first bonding portion 221 and at least one flexible base material, at least one side surface of the flexible base material has a metal foil pattern layer, in this embodiment, the first bonding portion 221, i.e. the gold finger, has 2 layers of flexible substrates, each layer of flexible substrate includes a flexible substrate, i.e. a first flexible substrate 222 and a second flexible substrate 224 respectively, the number of the metal foil pattern layers is 2 layers, and the first bonding portion 221, the first flexible substrate 222, the first metal foil pattern layer 223, the second flexible substrate 224 and the second metal foil pattern layer 225 are sequentially disposed from top to bottom, and in addition, in this embodiment, a protective film 226 is further disposed under the second metal foil pattern layer 225, the protective film 226 is a PI film, a positioning identification mark 25 and an orientation identification mark 26 are also provided on the surface of the first flexible substrate 222.
At least one side surface of each flexible base material is provided with a metal foil pattern layer, and the adjacent metal foil pattern layers are arranged in an insulating mode. In this embodiment, the first metal foil pattern layer 223 and the second metal foil pattern layer 225 are respectively etched from metal foils formed on two sides of the second flexible substrate 224, the first bonding portion 221 is etched from a metal foil formed on the upper surface of the first flexible substrate 222, and an adhesive layer may be further disposed between the first metal foil pattern layer 223 and the first flexible substrate 222, so as to form the flexible substrate 22 with a three-layer structure, that is, the flexible substrate 22 with three-layer metal foils, which are respectively metal foils including the first metal foil pattern layer 223, the second metal foil pattern layer 225 and the first bonding portion 221.
The circuit component 21 is provided with a second bonding portion 211, and the first bonding portion 221 and the second bonding portion 211 are bonded by a wire 23 to realize electrical connection. In the present embodiment, the circuit component 21 is a bare chip having flexibility, and is fixed to the flexible substrate 22 by Die Attach Film (DAF).
In the present embodiment, the first metal foil pattern layer 223 includes a first reinforced portion 2231 and a second reinforced portion 2232, and the second metal foil pattern layer 225 also includes a first reinforced portion (a portion located under the first reinforced portion 2231) and a second reinforced portion (a portion located under the second reinforced portion 2232). The pattern of the first reinforced portion 2231 in the first metal foil pattern layer 223 is consistent with the pattern of the first reinforced portion in the second metal foil pattern layer 225, the pattern of the second reinforced portion 2232 in the first metal foil pattern layer 223 is consistent with the pattern of the second reinforced portion in the second metal foil pattern layer 225, the projection of the first reinforced portion 223 and the projection of the second reinforced portion in the thickness direction of the flexible substrate 22 cover the arrangement area of the first bonding portion 221 and the second bonding portion 211, the projection of each second reinforced portion covers the arrangement area of the circuit component 21, the first reinforced portion and the second reinforced portion in each metal foil pattern layer are continuously arranged, so that a whole metal foil without hollowing is formed, all whole metal foils corresponding to different circuit components 21 in the same layer jointly form a bonding portion supporting pattern, the function of supporting the first bonding portion 221 and the second bonding portion 211 is achieved, the qualification rate of wire bonding on the circuit components 21 and the flexible substrate 22 is improved, and the circuit components 21 are prevented from being bonded on the bonding portion The thread breaks. In the gap between the whole metal foils corresponding to the adjacent circuit components 21, the trace patterns of the flexible circuit board are arranged, the bonding portion supporting patterns and the trace patterns are formed simultaneously when the metal foils are etched, the bonding portion supporting patterns and the trace patterns can be mutually insulated, or the bonding portion supporting patterns can be electrically connected with part of the trace patterns, and at the moment, the bonding portion supporting patterns can play a role in improving signals of the circuit components 21.
Second embodiment
Referring to fig. 4, the flexible circuit board of the present embodiment is different from the first embodiment in that the first metal foil pattern layer 223 includes a first reinforcing portion 2231 and a second reinforcing portion 2232, the second metal foil pattern layer 225 includes a first reinforcing portion 2251 and a second reinforcing portion 2252, the first reinforcing portion 2231 and the second reinforcing portion 2232 are disconnected from each other, and the first reinforcing portion 2251 and the second reinforcing portion 2252 are disconnected from each other, that is, the first reinforcing portion and the second reinforcing portion in each metal foil pattern layer are disconnected from each other.
For the rest of the structures in this embodiment, reference is made to the related description of the first embodiment, which is not repeated herein.
Third embodiment
Referring to fig. 5 and 6, the flexible circuit board of the present embodiment includes a flexible substrate 32 and at least one circuit component 31 disposed on the flexible substrate 32.
The flexible substrate 32 is provided with a first bonding portion 321 and at least one flexible base material, at least one side surface of the flexible base material is provided with a metal foil pattern layer, in this embodiment, the number of the flexible base materials is 2, the flexible base materials include a third flexible substrate 322 and a fourth flexible substrate 324, the number of the metal foil pattern layers is 2, each layer of flexible base material correspondingly includes a flexible substrate, that is, a third metal foil pattern layer 323 and a fourth metal foil pattern layer 325 correspondingly correspond to each other, the first bonding portion 321, the third flexible substrate 322, the third metal foil pattern layer 323, the fourth flexible substrate 324 and the fourth metal foil pattern layer 325 are sequentially arranged from top to bottom, in addition, in this embodiment, a protection film 326 is further arranged below the fourth metal foil pattern layer 325, and a positioning identification mark and a directional identification mark are further arranged on the surface of the third flexible substrate 322.
At least one side surface of each flexible base material is provided with a metal foil pattern layer, and the adjacent metal foil pattern layers are arranged in an insulating mode. In this embodiment, the third metal foil pattern layer 323 and the fourth metal foil pattern layer 325 are etched from metal foils formed on both sides of the fourth flexible substrate 324, the first bonding portion 321 is etched from a metal foil formed on the upper surface of the third flexible substrate 322, and an adhesive layer is further disposed between the third metal foil pattern layer 323 and the third flexible substrate 322, so as to form the flexible substrate 32 with a three-layer structure, that is, the flexible substrate 32 with three-layer metal foils, which are metal foils including the third metal foil pattern layer 323, the fourth metal foil pattern layer 325 and the first bonding portion 321.
The circuit component 31 is provided with a second bonding portion 311, and the first bonding portion 321 and the second bonding portion 311 are bonded by a wire 33 to realize electrical connection. In the present embodiment, the circuit component 31 is a bare chip having flexibility, and is attached and fixed to the flexible substrate 32 by a Die Attach Film (DAF).
In this embodiment, the third metal foil pattern layer 323 and the fourth metal foil pattern layer 325 only support the second bonding portion 311, that is, only include the second reinforcing portion, the second reinforcing portion in the third metal foil pattern layer 323 and the second reinforcing portion in the fourth metal foil pattern layer 325 have the same pattern, and the projection in the thickness direction of the flexible substrate 32 covers the setting area of the second bonding portion 311 and the entire setting area of the circuit component 31, so as to form a whole metal foil without hollowing, which has a better supporting effect, and all the whole metal foils corresponding to different circuit components in the same layer together form a bonding portion supporting pattern to support the second bonding portion 311, thereby improving the yield of wire bonding on the circuit component 31 and preventing the circuit component 31 from being broken during wire bonding. In the gap between the whole metal foils corresponding to the adjacent circuit components 31, the trace patterns of the flexible circuit board are arranged, the bonding portion supporting patterns and the trace patterns are formed simultaneously when the metal foils are etched, the bonding portion supporting patterns and the trace patterns can be mutually insulated, or the bonding portion supporting patterns can be electrically connected with part of the trace patterns, and at the moment, the bonding portion supporting patterns can play a role in improving signals of the circuit components 31.
In practical implementation, in this embodiment, a metal foil pattern layer that projects and covers the installation region of the second bonding portion 311 may be formed by installing a whole piece of metal foil on the upper surface of the third flexible substrate 322 at a position corresponding to the circuit component 31, and the metal foil pattern layer may also include the pattern of the first bonding portion 321. Fourth embodiment
Referring to fig. 7 and 8, wherein the flexible substrate is not shown in fig. 7, the flexible circuit board of the present embodiment includes a flexible substrate 42 and at least one circuit component 41 disposed on the flexible substrate 42.
The flexible substrate 42 is provided with a first bonding portion 421 and at least one flexible substrate, in this embodiment, the number of the flexible substrates is 2, each layer of the flexible substrate correspondingly includes a flexible substrate, that is, a fifth flexible substrate 422 and a sixth flexible substrate 424 correspondingly correspond to each other, the number of the metal foil pattern layers is 2, the flexible substrate includes a fifth metal foil pattern layer 423 and a sixth metal foil pattern layer 425, the first bonding portion 421, the fifth flexible substrate 422, the fifth metal foil pattern layer 423, the sixth flexible substrate 424 and the sixth metal foil pattern layer 425 are sequentially arranged from top to bottom, in addition, in this embodiment, a protective film 426 is further provided below the sixth metal foil pattern layer 425, and a positioning identification mark are further provided on a surface of the fifth flexible substrate 422.
At least one side surface of each flexible base material is provided with a metal foil pattern layer, and the adjacent metal foil pattern layers are arranged in an insulating mode. In this embodiment, the fifth metal foil pattern layer 423 and the sixth metal foil pattern layer 425 are respectively etched from metal foils formed on two sides of the sixth flexible substrate 424, the first bonding portion 421 is etched from a metal foil formed on the upper surface of the fifth flexible substrate 422, and an adhesive layer is further disposed between the fifth metal foil pattern layer 423 and the fifth flexible substrate 422, so as to form the flexible substrate 42 of a three-layer structure, that is, the flexible substrate 42 having three layers of metal foils, which are respectively metal foils including the fifth metal foil pattern layer 423, the sixth metal foil pattern layer 425 and the first bonding portion 421.
The circuit component 41 is provided with a second bonding portion 411, and the first bonding portion 421 and the second bonding portion 411 are bonded by a wire 43 to realize electrical connection. In this embodiment, the circuit component 41 is a bare chip having flexibility, and is fixed to the flexible substrate 42 by Die Attach Film (DAF).
In this embodiment, the fifth metal foil pattern layer 423 and the sixth metal foil pattern layer 425 only support the first bonding portion 421, that is, only include the first reinforcing portion, and the first reinforcing portion of the fifth metal foil pattern layer 423 and the first reinforcing portion of the sixth metal foil pattern layer 425 have the same pattern, and are both consistent with the arrangement pattern of the first bonding portion 421, so that when the first bonding portion 421 is covered by the projection in the thickness direction of the flexible substrate 42, the structure of the whole metal foil is not formed, and a hollow position is left, so that flexibility is better, and the yield of wire bonding on the flexible substrate 42 can be improved. The first reinforcing portions in the fifth metal foil pattern layer 423 and the sixth metal foil pattern layer 425 form a bonding portion supporting pattern, which plays a role of supporting the first bonding portion 421, and the trace patterns of the flexible circuit board are further arranged in the fifth metal foil pattern layer 423 and the sixth metal foil pattern layer 425, the bonding portion supporting pattern and the trace patterns are formed simultaneously when the metal foil is etched, the bonding portion supporting pattern and the trace patterns can be insulated from each other, or the bonding portion supporting pattern can be electrically connected with a part of the trace patterns, and at this time, the bonding portion supporting pattern can play a role of improving signals of the circuit component 41. Preferably, projections of the fifth metal foil pattern layer 423 and the sixth metal foil pattern layer 425 in the thickness direction of the flexible substrate 42 are blank in the arrangement area of the circuit component 41, that is, no metal foil pattern is located below the circuit component 41, so that the flatness and flexibility of the circuit component 41 can be increased.
For a flexible circuit board having at least two layers of metal foil, the same can be said on the basis of the structures of the above first to fourth embodiments, and the patterns between different metal foil pattern layers may be the same or different.
Fifth embodiment
Referring to fig. 9, the flexible circuit board of the present embodiment includes a flexible substrate 62 and at least one circuit component 61 disposed on the flexible substrate 62.
The flexible substrate 62 is provided with a first bonding portion 621 and a layer of flexible base material, the layer of flexible base material includes a seventh flexible substrate 622 and a seventh metal foil pattern layer 623 located on the upper surface of the seventh flexible substrate 622, and meanwhile, the upper surface of the seventh flexible substrate 622 is further provided with the first bonding portion 621, that is, the seventh metal foil pattern layer 623 and the first bonding portion 621 are located on the same side of the seventh flexible substrate 622.
The circuit component 61 is provided with a second bonding portion 611, and the first bonding portion 621 and the second bonding portion 611 are bonded by a wire 63 to achieve electrical connection. In the present embodiment, the circuit component 61 is a bare chip having flexibility, and is attached and fixed to the flexible substrate 62 by a Die Attach Film (DAF).
In this embodiment, the seventh metal foil pattern layer 623 only supports the second bonding portion 611, that is, only includes the second reinforcing portion, and the second reinforcing portion covers the entire arrangement region of the circuit component 61, so as to form a whole metal foil without hollowing out, which has a better supporting effect, and all the whole metal foils corresponding to different circuit components in the same layer together form a bonding portion supporting pattern, which plays a role of supporting the second bonding portion 611, thereby improving the qualification rate of wire bonding on the circuit component 61 and preventing the circuit component 61 from being broken during wire bonding. In the gap between the whole metal foils corresponding to the adjacent circuit components 61, the trace patterns of the flexible circuit board are arranged, the bonding portion supporting patterns and the trace patterns are formed simultaneously when the metal foils are etched, the bonding portion supporting patterns and the trace patterns can be mutually insulated, or the bonding portion supporting patterns can be electrically connected with part of the trace patterns, and at the moment, the bonding portion supporting patterns can play a role in improving signals of the circuit components 61.
In practice, when the flexible substrate has at least two layers, the same second reinforcing portion as in the present embodiment may also be provided on the flexible substrate of the top layer.
The utility model provides a flexible circuit board sets up an at least metal foil pattern layer formation permanent reinforcement structure in flexible circuit board's lead bonding department, both can satisfy the roughness and the intensity requirement of bonding position when the routing, can also play support and guard action to the finished product after the routing is accomplished, and the off-the-shelf save of being convenient for is used and is shifted, can satisfy flexible circuit board's flexibility requirement simultaneously.
The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.
Claims (10)
1. The flexible circuit board is characterized by comprising a flexible substrate and at least one circuit component arranged on the flexible substrate, wherein the flexible substrate is provided with a first bonding part and at least one metal foil pattern layer, the circuit component is provided with a second bonding part, the first bonding part and the second bonding part are in wire bonding, and the projection of the metal foil pattern layer in the thickness direction of the flexible substrate covers a first reinforcing part of the first bonding part and/or the projection of the metal foil pattern layer in the thickness direction of the flexible substrate covers a second reinforcing part of the second bonding part.
2. The flexible circuit board of claim 1, wherein when the metal foil pattern layer includes both the first reinforcing portion and the second reinforcing portion, the first reinforcing portion and the second reinforcing portion are continuous or disconnected from each other.
3. The flexible circuit board according to claim 1, wherein when the metal foil pattern layer includes only the second reinforcing portion or includes both the first reinforcing portion and the second reinforcing portion, a projection of the second reinforcing portion in a thickness direction of the flexible substrate covers a placement area of the circuit component.
4. The flexible circuit board according to claim 1, wherein when the metal foil pattern layer includes only the first reinforcing portion or includes both the first reinforcing portion and the second reinforcing portion, a pattern of the first reinforcing portion coincides with an arrangement pattern of the first bonding portions.
5. The flexible circuit board of claim 1, wherein the flexible substrate comprises at least one flexible base material stacked on top of each other, at least one side surface of the flexible base material is provided with the metal foil pattern layers, and adjacent metal foil pattern layers are insulated from each other.
6. The flexible circuit board of claim 1, wherein the metal foil pattern layer further comprises a trace pattern of the flexible circuit board.
7. The flexible circuit board of claim 1, wherein the metal foil pattern layer has a thickness of 5-25 μm.
8. The flexible circuit board of claim 1, wherein the circuit component is a bare chip having flexibility.
9. The flexible circuit board of claim 1, wherein the flexible substrate further comprises a protective film covering at least one of the metal foil pattern layers.
10. The flexible circuit board according to claim 1, wherein a projection of the metal foil pattern layer in the thickness direction of the flexible substrate covers the first bonding portion and is blank at a position corresponding to the second bonding portion, or wherein a projection of the metal foil pattern layer in the thickness direction of the flexible substrate covers the second bonding portion and is blank at a position corresponding to the first bonding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921938818.2U CN210899839U (en) | 2019-11-11 | 2019-11-11 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921938818.2U CN210899839U (en) | 2019-11-11 | 2019-11-11 | Flexible circuit board |
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| CN210899839U true CN210899839U (en) | 2020-06-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702835A (en) * | 2020-12-25 | 2021-04-23 | 浙江荷清柔性电子技术有限公司 | Flexible circuit board packaging method and flexible circuit board |
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2019
- 2019-11-11 CN CN201921938818.2U patent/CN210899839U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702835A (en) * | 2020-12-25 | 2021-04-23 | 浙江荷清柔性电子技术有限公司 | Flexible circuit board packaging method and flexible circuit board |
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