CN210899834U - Compatible bonding pad, circuit board and electronic device - Google Patents
Compatible bonding pad, circuit board and electronic device Download PDFInfo
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- CN210899834U CN210899834U CN201920928119.3U CN201920928119U CN210899834U CN 210899834 U CN210899834 U CN 210899834U CN 201920928119 U CN201920928119 U CN 201920928119U CN 210899834 U CN210899834 U CN 210899834U
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Abstract
The utility model relates to a compatible pad, circuit board and electronic device, which comprises a first welding area, an isolation area and a second welding area; the isolation region is partially located between the first welding region and the second welding region and partially interrupts a connection between the first welding region and the second welding region. The isolation area is arranged between the first welding area and the second welding area, so that the communication area of the first welding area and the second welding area can be reduced, the heat dissipation area of the compatible bonding pad can be reduced, the heat dissipation speed of the compatible bonding pad can be effectively reduced, and the tombstoning phenomenon during welding of small packaging elements can be prevented.
Description
Technical Field
The utility model relates to an electronics manufacturing field especially relates to a compatible pad, circuit board and electron device.
Background
With the rapid development of the electronic industry, the usage of electronic components, especially resistors and capacitors, is increasing. As electronic products are more precise and compact, the demand for small-package chip resistor-capacitor usage is also increasing, especially 0201 and 0402-package resistor-capacitors. Due to the problems of resistance capacity and supply, the production line is often lack of materials, and the project schedule is hindered.
Conventionally, there are some compatible packaging designs for patch elements, and when different sizes of materials are compatible, an overlapping placement scheme is adopted, but when the patch elements for small packages (such as 0201) are targeted, a tombstoning effect is easy to occur.
SUMMERY OF THE UTILITY MODEL
The application provides a compatible bonding pad, a circuit board and an electronic device, which can solve the tombstoning effect generated when a patch element is welded.
A compatible pad comprises a first welding area, an isolation area and a second welding area; the isolation region is partially located between the first welding region and the second welding region and partially interrupts a connection between the first welding region and the second welding region.
In an embodiment, the isolation area is provided with a hollow-out portion, and the hollow-out portion partially cuts off connection between the first welding area and the second welding area.
In an embodiment, the hollow portion is disposed in the middle of the isolation area, and a first communicating portion and a second communicating portion are formed at two ends of the isolation area, and are used for communicating the first welding area and the second welding area.
In one embodiment, the sum of the lengths of the first communicating portion and the second communicating portion is 0.2mm ± 0.01 mm;
the width of the hollow part is more than or equal to 0.06mm and less than or equal to 0.25 mm.
In an embodiment, on the isolation area, the hollowed-out portion includes a first hollowed-out portion and a second hollowed-out portion respectively disposed at two ends of the isolation area, and a third communicating portion is formed in the isolation area between the first hollowed-out portion and the second hollowed-out portion and used for communicating the first welding area and the second welding area.
In one embodiment, the length of the third communicating part is 0.2mm +/-0.01 mm;
the width of the first hollow-out part and the width of the second hollow-out part are respectively more than or equal to 0.06mm and less than or equal to 0.25 mm.
In an embodiment, the hollowed-out portion is disposed at one end of the isolation area, and a fourth communication portion is formed at the other end of the isolation area and is used for communicating the first welding area and the second welding area.
In one embodiment, the length of the fourth communication part is 0.2mm ± 0.01 mm;
the width of the hollow part is more than or equal to 0.06mm and less than or equal to 0.25 mm.
In an embodiment, the area of the first welding region is smaller than the area of the second welding region.
In one embodiment, the inner wall of the hollow part is coated with a green oil layer.
A circuit board comprises a substrate and the compatible bonding pad arranged on the substrate.
In one embodiment, the circuit board comprises two compatible bonding pads, and the two compatible bonding pads are arranged in an axisymmetric manner.
An electronic device comprising a compliant pad as described above.
The compatible bonding pad, the circuit board and the electronic device comprise a first welding area, an isolation area and a second welding area; the isolation region is partially located between the first welding region and the second welding region and partially interrupts a connection between the first welding region and the second welding region. Through set up the isolation region between first welding region and the second welding region, can reduce first welding region with the area of intercommunication in second welding region to reduce compatible pad's heat radiating area, thereby can effectively slow down compatible pad's radiating rate, prevent the emergence of the tombstoning phenomenon when little encapsulated component welds.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a compliant pad according to an embodiment;
fig. 2 is a second schematic structural diagram of a compliant pad according to an embodiment;
FIG. 3 is a third schematic diagram illustrating a structure of a compliant pad according to an embodiment;
FIG. 4 is a fourth schematic diagram illustrating a compatible bonding pad according to an embodiment;
FIG. 5 is a fifth exemplary diagram illustrating a compatible bonding pad structure according to an embodiment;
fig. 6 is a schematic structural diagram of a circuit board according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first weld zone may be referred to as a second weld zone, and similarly, a second weld zone may be referred to as a first weld zone, without departing from the scope of the present application. Both the first weld area and the second weld area are weld areas, but they are not the same weld area.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Fig. 1 is a schematic structural diagram of a compliant pad provided in one embodiment. As shown in figure 1 of the drawings, in which,
the compliant pad 100 includes a first bonding area 111, an isolation area 113, and a second bonding area 112; the isolation region 113 is located partly between the first welding region 111 and the second welding region 112 and partly interrupts the connection between the first welding region 111 and the second welding region 112.
The existing pad design has some compatible designs for the patch elements, and when the patch elements with different packaging sizes are compatible, the pad areas are overlapped, but the phenomenon that the small-packaged patch elements easily cause tombstoning during welding is ignored. In the embodiment, the isolation region 113 is arranged between the first welding region 111 and the second welding region 112, and the communication area of the first welding region 111 and the second welding region 112 is reduced, so that the heat dissipation area of the bonding pad is reduced, the heat dissipation speed of the bonding pad can be effectively reduced, and the phenomenon that a small package element stands upright when being welded is prevented.
A first soldering area 111 and a second soldering area 112 for soldering the first patch element and the second patch element having different package sizes. In one embodiment, the patch element may be: one of the patch elements such as resistance patch element, capacitance patch element, magnetic bead patch element and inductance patch element, this embodiment does not do the limitation.
The shape of the first soldering area 111 and the second soldering area 112 may be provided as a square to ensure that the first patch element and the second patch element are filled and uniform with tin on the respective pads. In other embodiments, the first welding region 111 and the second welding region 112 may be provided in other shapes, and the embodiment is not limited.
As shown in fig. 1, the area of the first soldering region 111 is smaller than that of the second soldering region 112, so that the small-packaged patch element is soldered at the first soldering region 111, and the large-packaged patch element is soldered at the second soldering region 112. The small-packaged patch element may be 0201 and 0402-packaged resistive-capacitive, where 0201 is 0.5 x 0.025mm in size and 0402 is 1 x 0.5mm in size. Of course, other patch elements with small package size are also possible, and the present embodiment is not limited to the specific type of patch element.
The compatible bonding pad 100 provided by the embodiment includes a first bonding region 111, an isolation region 113, and a second bonding region 112; the isolation region 113 is located partly between the first welding region 111 and the second welding region 112 and partly interrupts the connection between the first welding region 111 and the second welding region 112. By arranging the isolation region between the first welding region 111 and the second welding region 112, the communication area of the first welding region 111 and the second welding region 112 can be reduced, so that the heat dissipation area of the compatible bonding pad is reduced, the heat dissipation speed of the compatible bonding pad can be effectively reduced, and the tombstoning phenomenon during welding of small package elements is prevented.
In one embodiment, the isolation area 113 is provided with a hollow-out portion, and the hollow-out portion partially blocks the connection between the first welding area 111 and the second welding area 112.
As shown in fig. 2, the hollow portion 1133 is disposed in the middle of the isolation region 113, and a first communicating portion 1131 and a second communicating portion 1132 are formed at both ends of the isolation region 113, and the first communicating portion 1131 and the second communicating portion 1132 are used for communicating the first welding region 111 and the second welding region 112.
In an embodiment, the hollowed-out portion 1133 may be formed by performing a copper-out process on the isolation region 113, that is, removing copper in a partial region between the first soldering region 111 and the second soldering region 112 to form the hollowed-out portion 1133, so as to partially block the connection between the first soldering region 111 and the second soldering region 112, thereby preventing heat of solder from being rapidly dissipated through the second soldering region 112 communicated with the first soldering region 111 when a small package size chip component is soldered on the compliant pad 110, and further preventing a tombstoning phenomenon when the small package component is soldered. In an embodiment, the inner wall of the hollow portion may be coated with a green oil layer to prevent the pad at the bottom of the hollow portion from being oxidized.
It is understood that the hollowed-out portion 1133 is opened in the middle of the isolation region 113, and the first communicating portion 1131 and the second communicating portion 1132 are located at two sides of the isolation region 113. The first welding area 111 and the second welding area 112 can be communicated with the second welding area 112 only through the first communicating part 1131 and the second communicating part 1132 at two sides, so that the heat dissipation area can be reduced, the heat dissipation speed of a compatible pad can be reduced, and the tombstoning phenomenon during the welding of small package components can be prevented.
In one embodiment, the first patch element is 0201 and the second patch element is 0402. The sum of the lengths of the first communicating portion 1131 and the second communicating portion 1132 is 0.2mm ± 0.01 mm. The sum of the lengths of the first communicating portion 1131 and the second communicating portion 1132 is the sum of the lengths in the Y direction. As is apparent from fig. 2, the larger the sum of the lengths of the first communicating portion 1131 and the second communicating portion 1132 is, the larger the communication area between the first welding region 111 and the second welding region 112 is, and the smaller the sum of the lengths of the first communicating portion 1131 and the second communicating portion 1132 is, the smaller the communication area between the first welding region 111 and the second welding region 112 is. If the sum of the lengths of the first communicating portion 1131 and the second communicating portion 1132 is large, the communicating area between the first welding region 111 and the second welding region 112 is large, so that the heat dissipation speed cannot be effectively reduced, and the occurrence of a tombstoning phenomenon when a small-package-size chip component is welded cannot be effectively prevented; if the sum of the lengths of the first communicating portion 1131 and the second communicating portion 1132 is small, the communicating area between the first welding region 111 and the second welding region 112 can be reduced, but the welding area is greatly reduced. In this embodiment, the sum of the lengths of the first communicating portion 1131 and the second communicating portion 1132 is set to 0.2mm ± 0.01mm, so that the occurrence of the tombstoning phenomenon in soldering the patch element with a small package size can be effectively prevented, and the soldering area of the compatible pad 100 can be ensured.
In one embodiment, the width of the hollow portion 1133 is 0.06mm or more and D or less and 0.25mm or less. If the width D of the hollow portion 1133 is large, although heat can be effectively prevented from being dissipated through the second soldering region 112 when the small package patch element is soldered to the first soldering region 111, the area of the second soldering region 112 is greatly reduced; if the width D of the hollow portion 1133 is small, the communication between the first welding area 111 and the second welding area 112 cannot be effectively blocked. In the embodiment, the width D of the hollow portion 1133 is set to be not less than 0.06mm and not more than 0.25mm, which can effectively prevent heat from being dissipated through the second welding region 112 when the first welding region 111 is used for welding the small package patch element, and can also ensure the area of the second welding region 112.
In an embodiment, as shown in fig. 3, the hollow portions include a first hollow portion 1134 and a second hollow portion 1135 respectively disposed at two ends of the isolation area 113, the isolation area between the first hollow portion 1134 and the second hollow portion 1135 forms a third communicating portion 1136, and the third communicating portion 1136 is used for communicating the first welding area 111 and the second welding area 112.
It can be understood that the first hollow portion 1134 and the second hollow portion 1135 are opened at two sides of the isolation region 113, and the third communicating portion 1136 is located between the first hollow portion 1134 and the second hollow portion 1135. The first welding area 111 can be communicated with the second welding area 112 only through the third communication part 1136 in the middle of the isolation area 113, so that the heat dissipation area can be reduced, the heat dissipation speed of the compatible bonding pad can be reduced, and the tombstoning phenomenon during the welding of the small package element can be prevented.
In one embodiment, the length of the third connecting portion 1136 is 0.2mm ± 0.01 mm; the widths of the first hollow-out part 1134 and the second hollow-out part 1135 are more than or equal to 0.06mm and less than or equal to 0.25 mm. If the length of the third communicating portion 1136 is large, the communicating area between the first welding area 111 and the second welding area 112 is large, so that the heat dissipation speed cannot be effectively reduced, and the occurrence of a tombstoning phenomenon when a patch element with a small package size is welded cannot be effectively prevented; if the length of the third communicating portion 1136 is small, the communicating area between the first welding region 111 and the second welding region 112 can be reduced, but the welding area is greatly reduced. In this embodiment, the third connecting portion 1136 has a length of 0.2mm ± 0.01mm, which not only can effectively prevent the occurrence of a tombstoning phenomenon when soldering a small-sized chip component, but also can ensure a soldering area of the compatible pad 100.
In one embodiment, the widths of the first hollow-out portion 1134 and the second hollow-out portion 1135 are 0.06mm or more and D or less than 0.25 mm. If the width D of the first and second hollow portions 1134 and 1135 is large, although heat can be effectively prevented from being dissipated through the second bonding pad 120 when the first bonding pad 110 is bonded with the small-package chip component, the area of the second bonding region 112 can be greatly reduced; if the width D of the first and second openings 1134 and 1135 is small, the communication between the first welding area 111 and the second welding area 112 cannot be effectively blocked. In the embodiment, the width D of the first hollow-out portion 1134 and the second hollow-out portion 1135 is set to be 0.06mm or more and D or less and 0.25mm or less, so that heat can be effectively prevented from being dissipated through the second welding region 112 when the first welding region 111 is used for welding the small package patch element, and the welding area of the second welding region 112 can be ensured.
In an embodiment, as shown in fig. 4 to 5, the hollow portion 1133 is disposed at one end of the isolation region 113, and the other end of the isolation region 113 forms a fourth communicating portion 1138, and the fourth communicating portion 1138 is used for communicating the first welding region 111 and the second welding region 112.
It can be understood that the hollow portion 1133 is opened at one side of the isolation region 113, and may be an upper side of the isolation region 113, see fig. 4, or a lower side of the isolation region 113, see fig. 5. The fourth communicating portion 1138 is located on the other side of the hollow portion 1133. The first welding area 111 and the second welding area 112 can be communicated with the second welding area 112 only through the fourth communication part 1138 on one side of the isolation area 113, so that the heat dissipation area can be reduced, the heat dissipation speed of the compatible bonding pad can be reduced, and the tombstoning phenomenon during the welding of the small package component can be prevented.
In one embodiment, the length of the fourth connecting portion 1138 is 0.2mm ± 0.01 mm; the width of the hollow-out part 1133 is more than or equal to 0.06mm and less than or equal to 0.25 mm. If the length of the fourth communicating portion 1138 is large, the communicating area between the first welding area 111 and the second welding area 112 is large, so that the heat dissipation speed cannot be effectively reduced, and the occurrence of a tombstoning phenomenon when a patch element with a small package size is welded cannot be effectively prevented; if the length of the fourth communication portion 1138 is small, the communication area between the first welding region 111 and the second welding region 112 can be reduced, but the welding area is significantly reduced. In this embodiment, the length of the fourth communicating portion 1138 is set to 0.2mm ± 0.01mm, which not only can effectively prevent the occurrence of the tombstoning phenomenon when the small-package-size chip component is soldered, but also can ensure the soldering area of the compatible pad 100.
In one embodiment, the width of the hollow portion 1133 is 0.06mm or more and D or less and 0.25mm or less. If the width D of the hollow portion 1133 is large, although heat can be effectively prevented from being dissipated through the second bonding pad 120 when the first bonding pad 110 is bonded to the small package chip component, the area of the second bonding region 112 can be greatly reduced; if the width D of the hollow portion 1133 is small, the communication between the first welding area 111 and the second welding area 112 cannot be effectively blocked. In the embodiment, the width D of the hollow portion 1133 is set to be not less than 0.06mm and not more than 0.25mm, so that heat can be effectively prevented from being dissipated through the second bonding pad 120 when the first bonding pad 110 is used for welding the small-package chip component, and the welding area of the second welding region 112 can be ensured.
The application also provides a circuit board, which comprises a substrate and the compatible bonding pad arranged on the substrate. The compliant pad includes a first bonding area 111, an isolation area 113, and a second bonding area 112; the isolation region 113 is located partly between the first welding region 111 and the second welding region 112 and partly interrupts the connection between the first welding region 111 and the second welding region 112.
In one embodiment, the circuit board comprises two compatible bonding pads, and the two compatible bonding pads are arranged in an axisymmetric manner.
As shown, the circuit board includes a first compliant pad 110 and a second compliant pad 120; the first compliant pad 110 and the second compliant pad 120 are separated from each other and are disposed in axial symmetry, that is, the first compliant pad 110 and the second compliant pad 120 are disposed at intervals on both sides of the axis of symmetry.
The first compatible bonding pad 110 and the second compatible bonding pad 120 are symmetrically arranged, so that the welding position deviation of the element caused by 180-degree rotation in the welding process can be effectively prevented, the influence on the normal welding of other peripheral elements is avoided, and the assembly and welding efficiency of the element is improved.
Since the first compatible pad 110 and the second compatible pad 120 are completely symmetrical pads and the first compatible pad 110 and the second compatible pad 120 have the same structure, the first compatible pad 110 will be described as an example. A bonding pad is provided on the first compliant pad 110, and the bonding pad is used for bonding a pin on the chip component. Specifically, the soldering point is a soldering point for soldering a pin on the chip component, because the soldering point is disposed on the first compatible pad 110, the first compatible pad 110 and the chip component are connected by soldering the pin and the soldering point.
The patch element comprises a central line, a first pin and a second pin which are symmetrically arranged on two sides of the central line. Specifically, the first pin and the second pin are arranged on two sides of the central line at intervals along a direction perpendicular to the central line. The first lead may be connected to correspond to the first bonding region 111 of the first pad 110, and the second lead may be connected to correspond to the first bonding region 111 of the second pad 120. It is understood that the first lead of the patch element may also be correspondingly connected to the second bonding region 112 of the first pad 110, and the second lead may also be correspondingly connected to the second bonding region 112 of the second pad 120.
By arranging the isolation region between the first welding region 111 and the second welding region 112, the communication area of the first welding region 111 and the second welding region 112 can be reduced, so that the heat dissipation area of the compatible bonding pad is reduced, the heat dissipation speed of the compatible bonding pad can be effectively reduced, and the tombstoning phenomenon during welding of small package elements is prevented.
The application also provides an electronic device, which comprises the compatible bonding pad.
The compatible bonding pad comprises a first welding area, an isolation area and a second welding area; the isolation region is partially located between the first welding region and the second welding region and partially interrupts a connection between the first welding region and the second welding region. The isolation area is arranged between the first welding area and the second welding area, so that the communication area of the first welding area and the second welding area can be reduced, the heat dissipation area of the compatible bonding pad can be reduced, the heat dissipation speed of the compatible bonding pad can be effectively reduced, and the tombstoning phenomenon during welding of small packaging elements can be prevented.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. A compliant pad comprising a first bonding area, an isolation area, and a second bonding area; the isolation region is partially located between the first welding region and the second welding region and partially interrupts a connection between the first welding region and the second welding region.
2. The compliant pad of claim 1 wherein said isolation region is provided with a cutout that partially obstructs the connection between said first bonding area and said second bonding area.
3. The compliant pad of claim 2 wherein said hollowed out portion is disposed in the middle of said isolation region, and wherein said isolation region has two ends forming a first communication portion and a second communication portion, said first communication portion and said second communication portion being configured to communicate said first bonding region with said second bonding region.
4. A compliant pad according to claim 3,
the sum of the lengths of the first communicating part and the second communicating part is 0.2mm +/-0.01 mm;
the width of the hollow part is more than or equal to 0.06mm and less than or equal to 0.25 mm.
5. The compatible pad of claim 2, wherein the hollowed-out portion comprises a first hollowed-out portion and a second hollowed-out portion respectively disposed at two ends of the isolation region, and a third communication portion is formed in the isolation region between the first hollowed-out portion and the second hollowed-out portion and used for communicating the first welding region and the second welding region.
6. The compliant pad of claim 5,
the length of the third communicating part is 0.2mm +/-0.01 mm;
the width of the first hollow-out part and the width of the second hollow-out part are respectively more than or equal to 0.06mm and less than or equal to 0.25 mm.
7. The compliant pad of claim 2 wherein said opening is disposed at one end of said isolation region, said another end of said isolation region forming a fourth communication path, said fourth communication path communicating said first bonding region with said second bonding region.
8. The compliant pad of claim 7,
the length of the fourth communicating part is 0.2mm +/-0.01 mm;
the width of the hollow part is more than or equal to 0.06mm and less than or equal to 0.25 mm.
9. The compliant pad of claim 1,
the area of the first welding region is smaller than the area of the second welding region.
10. The compliant pad of claim 3 wherein the inner wall of the hollowed out portion is coated with a layer of green oil.
11. A circuit board comprising a substrate and the compliant pad of any of claims 1-10 disposed on the substrate.
12. The circuit board of claim 11, wherein the circuit board comprises two of the compliant pads, and wherein the two compliant pads are arranged axisymmetrically.
13. An electronic device, characterized in that it comprises a compliant pad according to any of claims 1-10.
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| CN201920928119.3U CN210899834U (en) | 2019-06-19 | 2019-06-19 | Compatible bonding pad, circuit board and electronic device |
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| CN201920928119.3U CN210899834U (en) | 2019-06-19 | 2019-06-19 | Compatible bonding pad, circuit board and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411960A (en) * | 2021-06-22 | 2021-09-17 | 深圳市瑞科慧联科技有限公司 | Printed circuit board, finished circuit board and welding method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411960A (en) * | 2021-06-22 | 2021-09-17 | 深圳市瑞科慧联科技有限公司 | Printed circuit board, finished circuit board and welding method |
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