CN210897234U - System for placing and taking wafer on vacuum chuck by Bernoulli manipulator - Google Patents
System for placing and taking wafer on vacuum chuck by Bernoulli manipulator Download PDFInfo
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- CN210897234U CN210897234U CN201921972043.0U CN201921972043U CN210897234U CN 210897234 U CN210897234 U CN 210897234U CN 201921972043 U CN201921972043 U CN 201921972043U CN 210897234 U CN210897234 U CN 210897234U
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Abstract
The utility model discloses a system for bernoulli manipulator puts and gets wafer on vacuum chuck belongs to semiconductor wafer processing field. This system includes bernoulli manipulator, vacuum chuck and gas circuit, the gas circuit includes first pipeline and second pipeline, wherein: one end of the first pipeline is connected with a vacuum, the other end of the first pipeline is connected with the vacuum chuck, and a first pneumatic valve is arranged on the first pipeline; one end of the second pipeline is connected with the nitrogen, the other end of the second pipeline is connected with the vacuum chuck, and a second pneumatic valve is arranged on the second pipeline; be provided with first bypass pipeline on the first pipeline, the one end and the atmosphere of first bypass pipeline are connected, and the other end is connected on the first pipeline between first pneumatic valve and vacuum chuck, be provided with the third pneumatic valve on the first bypass pipeline. The utility model discloses it is accurate to put and get the wafer position, has reduced the perk degree of wafer, has reduced the piece rate of wafer.
Description
Technical Field
The utility model relates to a semiconductor wafer processing field especially indicates a system of getting wafer is put to bernoulli manipulator on vacuum chuck.
Background
A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, is a basic material for manufacturing a semiconductor chip, and is called a wafer because its shape is circular.
The bernoulli principle can be expressed graphically as: in the water flow or the air flow, if the speed is low, the pressure is high, and if the speed is high, the pressure is low. A bernoulli robot (chuck) is a robot that uses the bernoulli principle, and when gas (e.g., inert gas such as nitrogen) ejected from a gas jet of the robot encounters a surface (e.g., an upper surface, but may also be a lower surface, which is only exemplary) of a disk, the gas rapidly diffuses from the upper surface of the disk, so that the gas velocity at the upper surface of the disk is greater than that at the lower surface.
In the wafer processing process, the Bernoulli manipulator adsorbs the wafer by the Bernoulli principle, and releases the wafer after the wafer is placed on the vacuum chuck with the vacuum adsorption function. And simultaneously, the vacuum chuck adsorbs the wafer to the vacuum chuck through porous vacuum adsorption. And after the process is finished, the vacuum chuck stops vacuum adsorption, the Bernoulli manipulator adsorbs the wafer, and the wafer is taken down from the vacuum chuck and taken out of the process chamber.
The Bernoulli manipulator is mainly used for adsorbing wafers with the thickness less than 200um, and the wafers are crisp and fragile and have large warping degree. When the Bernoulli manipulator puts the wafer on the vacuum chuck, if the Bernoulli manipulator puts the wafer on the vacuum chuck firstly, and then the vacuum chuck starts vacuum adsorption, the wafer is easy to slide, the deviation occurs at the placing position, and the uniformity of the process effect of the whole wafer is influenced. If the vacuum chuck is firstly started for vacuum adsorption, the Bernoulli manipulator puts the wafer on the vacuum chuck, the warping degree of the wafer is easily increased, and the wafer is easily broken.
When the bernoulli robot removes the wafer from the vacuum chuck, although the vacuum chuck has stopped vacuum chucking, there is still surface tension between the wafer and the vacuum chuck, causing the wafer to be also chucked on the vacuum chuck by surface tension. When the bernoulli robot is used to adsorb a wafer, one condition is that the adsorption force of the bernoulli robot is less than the surface tension, resulting in failure of the bernoulli robot to adsorb the wafer. The second situation is that the suction force of the bernoulli manipulator is slightly larger than the surface tension, the bernoulli manipulator can take away the wafer, but the warping degree of the wafer is increased, and the performance of the wafer is affected. The third situation is that the adsorption force of the bernoulli robot is much greater than the surface tension, so that the wafer chipping rate during the wafer suction process is significantly increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a system of getting wafer is put to bernoulli manipulator on vacuum chuck, the utility model discloses it is accurate to put and get the wafer position, has reduced the angularity of wafer, has reduced the piece rate of wafer.
The utility model provides a technical scheme as follows:
a system for placing and taking a wafer on a vacuum chuck by a Bernoulli manipulator, comprising a Bernoulli manipulator, a vacuum chuck and a gas path, wherein the gas path comprises a first pipeline and a second pipeline, and wherein:
one end of the first pipeline is connected with a vacuum, the other end of the first pipeline is connected with the vacuum chuck, and a first pneumatic valve is arranged on the first pipeline;
one end of the second pipeline is connected with the nitrogen, the other end of the second pipeline is connected with the vacuum chuck, and a second pneumatic valve is arranged on the second pipeline;
be provided with first bypass pipeline on the first pipeline, the one end and the atmosphere of first bypass pipeline are connected, and the other end is connected on the first pipeline between first pneumatic valve and vacuum chuck, be provided with the third pneumatic valve on the first bypass pipeline.
Furthermore, a second bypass pipeline is arranged on the first pipeline, one end of the second bypass pipeline is connected with the atmosphere, the other end of the second bypass pipeline is connected to the first pipeline between the first pneumatic valve and the vacuum chuck, and a differential pressure gauge is arranged on the second bypass pipeline.
Further, a gas flowmeter is arranged on the second pipeline.
Further, the first and second pneumatic valves are normally closed valves, and the third pneumatic valve is a normally open valve.
Furthermore, the first pneumatic valve is connected with a first dry gas pipeline for controlling the opening and closing of the first pneumatic valve, the second pneumatic valve is connected with a second dry gas pipeline for controlling the opening and closing of the second pneumatic valve, and the third pneumatic valve is connected with a third dry gas pipeline for controlling the opening and closing of the third pneumatic valve.
Furthermore, the Bernoulli manipulator comprises a sheet fork and a manipulator body, wherein a plurality of nitrogen outlets are formed in the sheet fork, and the sheet fork is connected with the manipulator body through a turnover mechanism.
Further, the vacuum chuck is a porous vacuum adsorption chuck.
The utility model discloses following beneficial effect has:
the utility model discloses a when the bernoulli manipulator is put the wafer on the vacuum chuck, the position that the wafer was placed can not appear the deviation, and the homogeneity of the technological effect of whole wafer is good, has reduced the angularity of wafer simultaneously, and the wafer is difficult broken. When the wafer is taken down from the vacuum chuck through the Bernoulli manipulator, the Bernoulli manipulator cannot absorb the wafer and fails, the warping degree of the wafer is reduced, and the position of the wafer on the Bernoulli manipulator does not deviate; the fragmentation rate of the wafer is reduced.
Drawings
FIG. 1 is a schematic view of a gas circuit;
fig. 2 is a schematic view of a bernoulli robot.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
An embodiment of the utility model provides a system for bernoulli manipulator puts and gets wafer on vacuum chuck, it includes bernoulli manipulator, vacuum chuck and gas circuit. As shown in fig. 1, the gas circuit includes a first pipe 1 and a second pipe 2, wherein:
one end of the first pipeline 1 is connected with vacuum, the other end is connected with a vacuum chuck 3, and a first pneumatic valve 4 is arranged on the first pipeline 1.
First pipeline and vacuum connection, indicate first pipeline and can provide vacuum various device or the headtotail, the utility model discloses do not restrict the structural style who provides vacuum device or system.
The first pipeline is connected with the vacuum chuck, namely connected with the inside of the vacuum chuck, and the vacuum chuck is provided with a porous structure communicated with the inside of the vacuum chuck and the like. When first pneumatic valve was opened, the vacuum was used for inside vacuum chuck through first pipeline for the inside pressure of vacuum chuck is less than outside pressure, produces one through porous isotructure to the inside suction of vacuum chuck (the utility model discloses in also call as vacuum force), adsorbs the wafer on vacuum chuck.
One end of the second pipeline 2 is connected with the nitrogen, the other end of the second pipeline is connected with the vacuum chuck 3, and the second pipeline 2 is provided with a second pneumatic valve 5.
The second pipeline is connected with nitrogen gas, indicates the second pipeline and can provide the various device or the headtotail of nitrogen gas, the utility model discloses the structural style of the device or the system that do not restrict to provide nitrogen gas, the second pipeline is connected with vacuum chuck, indicates the internal connection with vacuum chuck.
The first pipeline 1 is provided with a first bypass pipeline 6, one end of the first bypass pipeline 6 is connected with the atmosphere, the other end of the first bypass pipeline is connected to the first pipeline 1 between the first pneumatic valve 4 and the vacuum chuck 3, and the first bypass pipeline 6 is provided with a third pneumatic valve 7.
The first bypass line is connected to atmosphere, which means that the first bypass line is connected to atmosphere of the environment where the vacuum chuck is located. When the third pneumatic valve is opened, the interior of the vacuum chuck is communicated with the atmosphere of the environment, and the pressure difference between the interior and the exterior of the vacuum chuck, which is caused by vacuum, is eliminated. In one embodiment of the present invention, the vacuum chuck is in the process chamber, and the first bypass line is connected to the atmosphere in the process chamber.
The utility model discloses in, the process that the Bernoulli manipulator put the wafer on the vacuum chuck is called "put the piece process", and the process that the Bernoulli manipulator took off the wafer from the vacuum chuck is called "get the piece process".
The film placing process comprises the following steps:
1. the bernoulli robot takes the wafer out of the storage device such as a wafer storage box or the like or in the previous process, and enables the wafer to be adsorbed below the bernoulli robot. Before the sheet discharging process, the first pneumatic valve, the second pneumatic valve and the third pneumatic valve are in a closed state.
The film placing process comprises the following steps:
2. the bernoulli robot, which adsorbs the wafer, reaches above the vacuum chuck.
In this step, the reaching of the bernoulli manipulator above the vacuum chuck means reaching a position above the vacuum chuck where the wafer is placed, that is, a wafer placing position, and if the vacuum chuck is in the process chamber, the manipulator enters the process chamber to reach the wafer placing position.
3. And closing the Bernoulli manipulator, releasing the wafer, opening the first pneumatic valve, and enabling vacuum to act on the vacuum chuck through the first pipeline so as to adsorb the wafer on the vacuum chuck.
In this step, closing the bernoulli manipulator means closing a nitrogen valve on the bernoulli manipulator, so that the nitrogen is not ejected from a nitrogen outlet of the bernoulli manipulator any longer, and the bernoulli effect is not generated, so that the wafer falls off from the manipulator.
In order to open the first pneumatic valve when the nitrogen valve on the Bernoulli manipulator is closed, the nitrogen valve and the first pneumatic valve of the manipulator are controlled in a closed loop. The first pneumatic valve is automatically opened as soon as the nitrogen valve of the manipulator is closed, and the first pneumatic valve is automatically opened in the process that the wafer falls off from the manipulator.
In the prior art, if the bernoulli manipulator firstly puts the wafer on the vacuum chuck, and then the vacuum chuck starts vacuum adsorption, the wafer is easy to slide, the placing position has deviation, and the uniformity of the process effect of the whole wafer is influenced. If the vacuum chuck is firstly started for vacuum adsorption, the Bernoulli manipulator puts the wafer on the vacuum chuck, the warping degree of the wafer is easily increased, and the wafer is easily broken.
The utility model discloses when the bernoulli manipulator is released the wafer, open vacuum chuck's vacuum adsorption immediately, the wafer is adsorbed by vacuum chuck rapidly at once after the manipulator that takes off, has both prevented the gleitbretter phenomenon that the wafer appears easily, has solved the problem that leads to the wafer degree of warping to increase easily again. The position that the wafer was placed can not appear the deviation, and the homogeneity of the technological effect of whole wafer is good, has reduced the perk of wafer simultaneously, and the wafer is difficult broken.
4. The wafer is subjected to process treatment on the vacuum chuck, the wafer needs to be taken down from the vacuum chuck after the process treatment, the first pneumatic valve is in an open state, and the second pneumatic valve and the third pneumatic valve are in a closed state after the process treatment.
The slice taking process comprises the following steps:
5. the bernoulli robot reaches above the vacuum chuck in preparation for taking the wafer down.
6. The first pneumatic valve is closed, vacuum no longer acts on the vacuum chuck, the vacuum chuck stops vacuum adsorption, no vacuum adsorption force is applied to the wafer, but surface tension still exists between the wafer and the vacuum chuck, so that the wafer is also adsorbed on the vacuum chuck through the surface tension, and at the moment, if the Bernoulli manipulator is directly used for adsorbing the wafer, the problem existing in the background technology can occur.
7. And opening the third pneumatic valve to communicate the inside of the vacuum chuck with the atmosphere, so that the pressure inside the vacuum chuck is the same as the atmospheric pressure, and removing the pressure difference between the inside and the outside of the vacuum chuck caused by vacuum. In one embodiment of the present invention, the vacuum chuck is in the process chamber, and the inside of the vacuum chuck is connected to the atmosphere in the process chamber.
8. And opening a second pneumatic valve, introducing nitrogen with a preset flow into the second pipeline, allowing the nitrogen to enter the vacuum chuck through the second pipeline, and enabling the nitrogen to upwards jack the wafer to remove the surface tension between the wafer and the vacuum chuck.
9. And opening a nitrogen valve of the Bernoulli manipulator to adsorb the wafer on the Bernoulli manipulator.
The various opening and closing operations described above are preferably performed by a controller.
In the prior art, when a Bernoulli manipulator sucks a lower wafer from a vacuum chuck, the failure of the Bernoulli manipulator in sucking the wafer is easy to occur due to the surface tension existing between the wafer and the vacuum chuck; although the wafer is successfully sucked, the warping degree of the wafer is increased; the position of the wafer on the Bernoulli manipulator deviates; the wafer chipping rate is significantly increased.
The utility model discloses with the inside and atmosphere intercommunication of vacuum chuck, detach because of the inside and outside pressure differential of vacuum chuck that the vacuum leads to, then let in proper amount nitrogen gas in to vacuum chuck, upwards push up the wafer once, get rid of the surface tension between wafer and the vacuum chuck, rethread Bernoulli manipulator absorbs the wafer, has solved a series of problems that the surface tension that exists between because of wafer and the vacuum chuck leads to.
To sum up, the utility model discloses a when the bernoulli manipulator is put the wafer on the vacuum chuck, the deviation can not appear in the position that the wafer was placed, and the homogeneity of the technological effect of whole wafer is good, has reduced the angularity of wafer simultaneously, and the wafer is difficult broken. When the wafer is taken down from the vacuum chuck through the Bernoulli manipulator, the Bernoulli manipulator cannot absorb the wafer and fails, the warping degree of the wafer is reduced, and the position of the wafer on the Bernoulli manipulator does not deviate; the fragmentation rate of the wafer is reduced.
The utility model discloses still set up the other branch pipeline of second 8 on first pipeline 1, the one end and the atmosphere of the other branch pipeline of second 8 are connected, and the other end is connected on first pipeline 4 between first pneumatic valve 4 and vacuum chuck 3, is provided with differential pressure gauge 9 on the other branch pipeline of second 8. Based on the other branch pipeline of second, the utility model discloses open the third pneumatic valve after, treat that the reading of differential pressure gauge is close 0, the vacuum chuck is inside the same with the pressure of environment, opens the second pneumatic valve again.
The utility model discloses be provided with gas flowmeter 10 on second pipeline 2, the flow of the nitrogen gas of top wafer is controlled through gas flowmeter.
As an improvement of the present invention, the first pneumatic valve 4 and the second pneumatic valve 5 are normally closed valves, and the third pneumatic valve 7 is normally open valves. The purpose of the third pneumatic valve selecting the normally open valve is that if the machine station has problems, once the power is cut off or the air is cut off, the valve is automatically opened, the pressure of the vacuum chuck is ensured to be the same as the ambient atmospheric pressure, and the injury of workers can not be caused.
The utility model discloses a first pneumatic valve 4 is connected with first dry gas pipeline (CDA-1)11 of the 4 switching of control first pneumatic valve, and second pneumatic valve 5 is connected with second dry gas pipeline (CDA-2)12 of the 5 switching of control second pneumatic valve, and third pneumatic valve 7 is connected with third dry gas pipeline (CDA-3)13 of the 7 switching of control third pneumatic valve.
Illustratively, the first pneumatic valve is a normally closed valve, the dry gas (CDA) in the first dry gas line (CDA-1) is a control gas for controlling the first pneumatic valve, the CDA is introduced into the CDA-1, the first pneumatic valve is opened, the CDA of the CDA-1 is closed, and the first pneumatic valve is closed. The control process of the normally closed second pneumatic valve is similar to that of the first pneumatic valve. The third pneumatic valve is a normally open valve, the dry gas (CDA) in the third dry gas pipeline (CDA-3) is control gas for controlling the third pneumatic valve, the CDA is introduced into the CDA-3, the third pneumatic valve is closed, the CDA of the CDA-3 is closed, and the third pneumatic valve is opened.
The utility model discloses a Bernoulli manipulator can be multiple structural style, and is exemplary, as shown in FIG. 2, Bernoulli manipulator includes piece fork 14 and manipulator body 15, and it has a plurality of nitrogen gas export 16 to open on the piece fork 14, is connected through tilting mechanism 17 between piece fork 14 and the manipulator body 15. The number of the nitrogen outlets is preferably four, and the nitrogen sprayed from the four nitrogen outlets forms a Bernoulli effect to adsorb the wafer.
In wafer cassettes the wafers are typically held with the thick edge ring raised in the back side in contact with support structures in the cassette, with the back side facing down, in order to avoid wafer breakage due to thin area contact. The wafer is typically processed on its backside in a processing station, which requires placement with the backside up. Therefore, the wafer needs to be turned by 180 ° during the whole wafer transferring process.
The utility model discloses connect through tilting mechanism between the piece fork of Bernoulli manipulator and the manipulator body, can make the piece fork upset 180, and then drive the upset of absorbent wafer on it, satisfied whole wafer processing technology's requirement.
Based on the Bernoulli manipulator, before the Bernoulli manipulator puts the wafer on the vacuum chuck, when taking the wafer out of the storage box, the wafer is adsorbed by the sheet fork of the Bernoulli manipulator from the bottom surface of the wafer; and then the turnover mechanism of the Bernoulli manipulator rotates to turn the wafer below the wafer fork.
The utility model discloses a vacuum chuck is preferred porous vacuum adsorption chuck.
The embodiment of the utility model provides a have following advantage: 1. prevent the gleitbretter that the piece in-process caused, 2, prevent to put the warpage of piece in-process wafer appearance, 3, prevent to get the warpage of piece in-process wafer, 4, reduce the probability that the piece was got to the manipulator, 5, reduce the probability of wafer piece, 6, the board outage or the outage guarantees that vacuum chuck's pressure is the same with atmospheric pressure, avoids personnel's injury.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (7)
1. The system for placing and taking wafers on and from a vacuum chuck by a Bernoulli manipulator is characterized by comprising the Bernoulli manipulator, the vacuum chuck and a gas circuit, wherein the gas circuit comprises a first pipeline and a second pipeline, and the first pipeline and the second pipeline are respectively connected with the first pipeline and the second pipeline, wherein:
one end of the first pipeline is connected with a vacuum, the other end of the first pipeline is connected with the vacuum chuck, and a first pneumatic valve is arranged on the first pipeline;
one end of the second pipeline is connected with the nitrogen, the other end of the second pipeline is connected with the vacuum chuck, and a second pneumatic valve is arranged on the second pipeline;
be provided with first bypass pipeline on the first pipeline, the one end and the atmosphere of first bypass pipeline are connected, and the other end is connected on the first pipeline between first pneumatic valve and vacuum chuck, be provided with the third pneumatic valve on the first bypass pipeline.
2. The bernoulli robot system for placing and removing wafers on and from a vacuum chuck as claimed in claim 1, wherein a second bypass line is provided on the first line, one end of the second bypass line is connected to atmosphere, the other end of the second bypass line is connected to the first line between the first pneumatic valve and the vacuum chuck, and a differential pressure gauge is provided on the second bypass line.
3. The bernoulli robot wafer placing and retrieving system on a vacuum chuck as claimed in claim 2, wherein a gas flow meter is provided on the second conduit.
4. The bernoulli robot system for placing and retrieving wafers on a vacuum chuck as claimed in any one of claims 1 to 3, wherein the first and second pneumatic valves are normally closed valves and the third pneumatic valve is a normally open valve.
5. The system of claim 4, wherein the first pneumatic valve is connected to a first dry gas line that controls the opening and closing of the first pneumatic valve, the second pneumatic valve is connected to a second dry gas line that controls the opening and closing of the second pneumatic valve, and the third pneumatic valve is connected to a third dry gas line that controls the opening and closing of the third pneumatic valve.
6. The system for placing and taking a wafer on and off a vacuum chuck of a bernoulli robot as claimed in any one of claims 1 to 3, wherein the bernoulli robot comprises a wafer fork and a robot body, the wafer fork is provided with a plurality of nitrogen outlets, and the wafer fork is connected with the robot body through a turnover mechanism.
7. The system of claim 6, wherein the vacuum chuck is a multi-aperture vacuum chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921972043.0U CN210897234U (en) | 2019-11-15 | 2019-11-15 | System for placing and taking wafer on vacuum chuck by Bernoulli manipulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921972043.0U CN210897234U (en) | 2019-11-15 | 2019-11-15 | System for placing and taking wafer on vacuum chuck by Bernoulli manipulator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210897234U true CN210897234U (en) | 2020-06-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921972043.0U Active CN210897234U (en) | 2019-11-15 | 2019-11-15 | System for placing and taking wafer on vacuum chuck by Bernoulli manipulator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210897234U (en) |
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2019
- 2019-11-15 CN CN201921972043.0U patent/CN210897234U/en active Active
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