CN210896829U - Electronic component - Google Patents

Electronic component Download PDF

Info

Publication number
CN210896829U
CN210896829U CN201921700145.7U CN201921700145U CN210896829U CN 210896829 U CN210896829 U CN 210896829U CN 201921700145 U CN201921700145 U CN 201921700145U CN 210896829 U CN210896829 U CN 210896829U
Authority
CN
China
Prior art keywords
main body
pin
electronic component
body part
extending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201921700145.7U
Other languages
Chinese (zh)
Inventor
刘东乐
陈飞龙
陈石
梁振刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Set Electronics Co Ltd
Original Assignee
Xiamen Set Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Set Electronics Co Ltd filed Critical Xiamen Set Electronics Co Ltd
Priority to CN201921700145.7U priority Critical patent/CN210896829U/en
Application granted granted Critical
Publication of CN210896829U publication Critical patent/CN210896829U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model discloses an electronic component, including the main part and connect in this main part and downwardly extending's pin, wherein: the main body part is defined to take the downward extending direction of the pin connected with the main body part as the vertical direction, the tail section of the pin and the main body part are bent at an angle of approximately 90 degrees to form a part extending in the horizontal direction, and the horizontally extending part is in a flat structure. The utility model discloses an electronic components not only can be used for surface mounting welding, makes components and parts be vertical type structural arrangement moreover in order to reach the efficiency that reduces circuit board area occupied.

Description

Electronic component
Technical Field
The utility model relates to an electronic components especially relates to electronic components's packaging structure improvement.
Background
The packaging structure of some currently known electronic components, such as the chip varistor, is a horizontal structure arrangement as shown in fig. 1, that is, the flat main body is mainly distributed on the transverse plane, so the longitudinal height is low, but the transverse occupied area is large, which is only beneficial to thinning the circuit board, but not beneficial to miniaturization of the circuit board area.
In addition, the vertical (or plug-in) piezoresistors are all arranged in a vertical structure, and the packaging structure of the vertical packaging structure is shown in fig. 2, and the flat main body part of the vertical packaging structure is mainly distributed on the longitudinal surface, so that the horizontal thickness is thinner, the horizontal occupied area is small, and the miniaturization of the area of the circuit board is facilitated. However, the varistor element of the vertical (or called plug-in) packaging structure can only be welded by using a plug-in, but cannot be surface-mounted, which is not favorable for improving the production efficiency.
SUMMERY OF THE UTILITY MODEL
Therefore, to the above problem, the utility model provides a can realize that circuit board area occupied is little and by the electronic components structure that can be used for surface mounting.
The utility model discloses a following technical scheme realizes:
an electronic component, comprising a main body portion and a pin connected to the main body portion and extending downward, wherein: the main body part is defined to take the downward extending direction of the pin connected with the main body part as the vertical direction, the tail section of the pin and the main body part are bent at an angle of approximately 90 degrees to form a part extending in the horizontal direction, and the part extending in the horizontal direction is in a flat structure.
Wherein, for more stable support, the flat structure is a rectangular sheet structure, or a sheet structure with branches, or a fan-shaped sheet structure, or a round sheet structure.
In order to adapt to different circuit board pad designs, the bending directions of the tail sections of the pins are positioned on the same side or on two sides which deviate from each other.
In order to further improve the support stability, the pins are bent at right angles at the extreme ends of the flat structure of the tail section.
Specifically, the bending section at the extreme end is of a cylindrical structure.
Wherein, in order to do benefit to the chip mounter and absorb and batch production, still include an annex shell, the annex shell cover is established and is fixed the upper end of main part.
Specifically, the accessory housing includes a recess at a lower end that matches the contour of the edge of the main body portion and a flat surface at an upper end.
In a specific embodiment, the main body portion has a substantially circular flat structure, the number of the pins is two, and the two pins are respectively connected to two side surfaces of the main body portion.
In one specific embodiment, the electronic component is a varistor element.
The utility model discloses an electronic components not only can be used for surface mounting welding, makes components and parts be vertical type structural arrangement moreover in order to reach the efficiency that reduces circuit board area occupied.
Drawings
FIG. 1 is a schematic diagram of a prior art chip varistor element in a horizontal package configuration;
FIG. 2 is a schematic diagram of a prior art package-in-package varistor element in a vertical package configuration;
fig. 3 is a schematic structural view of a pin of embodiment 1 of the present invention before being bent;
fig. 4a is a schematic view of a first bending form of a pin according to embodiment 1 of the present invention;
fig. 4b is a schematic view of a second bending form of the pin according to embodiment 1 of the present invention;
fig. 5 is a schematic structural view of a pin of embodiment 2 of the present invention before being bent;
fig. 6a is a schematic view of a first bending form of a pin according to embodiment 2 of the present invention;
fig. 6b is a schematic view of a second bending form of the pin according to embodiment 2 of the present invention;
fig. 7 is a schematic structural view of embodiment 3 of the present invention;
fig. 8 is a schematic view for circuit board soldering of embodiment 3.
FIG. 9 is a schematic structural view of an accessory housing for use with the present invention;
FIG. 10 is a schematic structural view of embodiment 4, namely the embodiment 1 shown in FIG. 4a is a schematic structural view after an accessory housing is added;
FIG. 11 is a schematic view for circuit board soldering of embodiment 4.
Detailed Description
To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The present invention will now be further described with reference to the accompanying drawings and detailed description.
In order to realize that circuit board area occupied is little and by the electronic components structure that can be used for surface mounting, the utility model discloses bend the pin of electronic components downwardly extending and handle into the part that has horizontal extension, make it be approximately 90 dog-ear with the main part of flatter vertical setting, set up the part of the horizontal extension of pin simultaneously into having the platykurtic structure in order to form the holding surface that can tie in the pad to the realization can be used for surface mounting welding and makes components and parts be vertical type structural arrangement in order to reach the efficiency that reduces circuit board area occupied. The improved structure of the electronic component can be suitable for the electronic component structure with a main body part and a main body part connecting pin, in particular to the electronic component structure with the main body part in a flat three-dimensional structure, such as a piezoresistor element, a thermistor element, a ceramic capacitor element and the like. For convenience of explanation, the present invention is specifically illustrated by the above embodiments of the plurality of varistor elements:
example 1:
referring to fig. 3 and fig. 4a and 4b, the varistor element of this embodiment includes a main body 1 in a substantially circular flat shape and two pins 2 connected to the main body 1 and extending downward, wherein the tail of each pin 2 is set to be a flat structure 21, and the pin 2 extending downward is bent to define that the main body is vertical to the downward extending direction of the pin connected thereto, and the tail of each pin 2 is bent at an angle of substantially 90 ° with respect to the main body 1 to form a portion extending horizontally; specifically, the two pins 2 on two sides of the main body 1 may be bent in 2-pin bending modes, as shown in fig. 4a, the two pins 2 on two sides of the main body 1 are respectively bent toward two opposite sides, or as shown in fig. 4b, the two pins 2 on two sides of the main body 1 are respectively bent toward the same side, so as to be respectively suitable for different circuit board structures where component pads are arranged on two sides or where pads are arranged on one side. Thus, in this embodiment, since the tail section of the pin 2 is the flat structure 21 and is bent and then extends horizontally, a supporting Surface which is flatly attached to the circuit board pad can be formed, so that the pin can be soldered with the circuit board pad by Surface Mount Technology (SMT); meanwhile, after the pins 2 are bent, the main body part 1 and the flat structure 21 of the pins 2 extending horizontally are approximately 90 degrees, and the flat main body part 1 can be supported to be vertically arranged along the vertical direction, so that the projection area of the flat main body part 1 on the circuit board is smaller, and the effect of reducing the occupied area of the circuit board is achieved. Naturally, it is feasible that the above-mentioned main body 1 and the horizontally extending flat structure 21 of the pin 2 are substantially at 90 °, and in practice, the bending angle should be adjusted adaptively according to actual conditions, so as to make the support of the pin 2 on the main body 1 more stable, for example, in the bending structure shown in fig. 4a, the bending angle may be substantially selected to be 90 °, and in the bending structure shown in fig. 4b, the bending angle may be slightly less than 90 °, for example, selected to be 80 °, so that the gravity center of the main body 1 is more biased to the bending side of the flat structure 21 of the pin 2, which is more favorable for stable support.
Example 2:
referring to fig. 5 and fig. 6a and 6b, the same as the varistor element of embodiment 1, the embodiment includes a main body 1 with a substantially circular flat shape and two pins 2 connected to the main body 1 and extending downward, wherein the tail end of the pin 2 is configured as a flat structure 21', and the pin 2 extending downward is bent to have a horizontally extending portion, so as to form a substantially 90 ° bending angle with the flatter and vertically arranged main body; the difference from the embodiment 1 is that: the flat structure 21 ' of the tail section of the pin 2 of this embodiment is not a rectangular sheet structure but has a 3-pronged sheet structure (similar to a chicken claw shape), and a more stable support can be achieved, but is more complicated to manufacture, compared to the different flat structure 21 ' of the pin 2 having a larger support range than the rectangular sheet flat structure 21 ' of embodiment 1. In addition, in other embodiments, the flat structure of the tail section of the pin may also be other structures, such as a fan-shaped sheet structure or a circular sheet structure. This embodiment may have a 2-pin bending form as in embodiment 1, and the two pins 2 on both sides of the main body portion 1 are respectively bent to two opposite sides as shown in fig. 6a, or the two pins 2 on both sides of the main body portion 1 are respectively bent to the same side as shown in fig. 6b, so as to be respectively suitable for different circuit board structures with component pads arranged on both sides or with pads arranged on one side.
Example 3:
referring to fig. 7, this embodiment is an improvement on the embodiment shown in fig. 4b, in order to make the flat structure 21 of the pins 2 bent at the same side as shown in fig. 4b better support the main body 1, the pins 2 are further bent at right angles at the extreme ends 22 of the flat structure 21. Referring to fig. 8, such a component structure may be applied to a circuit board 3 having a positioning through hole 32 around a chip pad 31, and the extreme end 22 of the pin 2 may be inserted into the positioning through hole 32 around the chip pad 31 of the circuit board 3 for pre-positioning, at which time the flat structure 21 of the pin 2 is just flatly attached to the chip pad 31 of the circuit board 3. The main body 1 of this embodiment is not only surface-supported by the flat structure 21 of the pins 2, but also positioned and supported by inserting the extreme end 22 into the positioning through hole 32 of the circuit board 3, so that the main body 1 is more stably supported, and the main body 1 is not firmly supported by shaking during the transfer process of the mounting operation or during the reflow process, thereby preventing the main body 1 from falling down. It should be noted that, since the positioning through holes on the circuit board are usually circular hole structures, the bent segments of the extreme ends 22 of the pins 2 of this embodiment also usually adopt matching cylindrical structures.
Example 4:
referring to fig. 9-10, in this embodiment, an accessory housing 4 is added on the basis of the embodiment 1 shown in fig. 4a, since the main body 1 of the embodiment 1 is a round and flat structure, and the edge of the main body is a relatively rounded curved surface, it is not beneficial for the suction nozzle of the chip mounter to suck; in order to solve the problem, in embodiment 4, an accessory housing 4 is fixedly sleeved on the upper end of the main body portion 1, the lower end of the accessory housing 4 is a groove 41 matched with the edge shape of the main body portion 1, and the upper end of the accessory housing 4 is a plane 42, so that the suction nozzle of the chip mounter can realize firm suction of the embodiment by sucking the plane 42 of the accessory housing 4. Fig. 11 shows that the flat structure 21 of the pin 2 of this embodiment can be accurately and reliably attached to the land 31 of the circuit board by sucking the pin 4 of this embodiment 4 onto the circuit board 3 by the mounter through the accessory housing 4.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (9)

1. Electronic components, including the main part and connect in this main part and downwardly extending's pin, its characterized in that: the main body part is defined to take the downward extending direction of the pin connected with the main body part as the vertical direction, the tail section of the pin and the main body part are bent at an angle of approximately 90 degrees to form a part extending in the horizontal direction, and the horizontally extending part is in a flat structure.
2. An electronic component as claimed in claim 1, wherein: the flat structure is a rectangular sheet structure, or a sheet structure with branches, or a fan-shaped sheet structure, or a round sheet structure.
3. An electronic component as claimed in claim 1, wherein: the bending direction of the tail section of the pin is positioned at the same side or at two sides which deviate from each other.
4. An electronic component as claimed in claim 1, wherein: the tail end of the pin at the extreme end of the flat structure of the tail section is also bent at a right angle.
5. An electronic component as claimed in claim 4, wherein: the bending section at the tail end is of a cylindrical structure.
6. An electronic component as claimed in claim 1, wherein: the portable electronic device further comprises an accessory shell, and the accessory shell is sleeved and fixed at the upper end of the main body part.
7. An electronic component as claimed in claim 6, wherein: the accessory housing includes a recess at a lower end that matches the edge profile of the body portion and a flat surface at an upper end.
8. An electronic component as claimed in claim 1, wherein: the main body part is a roughly circular flat structure, the number of the pins is two, and the two pins are respectively connected to two side surfaces of the main body part.
9. An electronic component as claimed in claim 8, wherein: the electronic component is a piezoresistive element.
CN201921700145.7U 2019-10-12 2019-10-12 Electronic component Active CN210896829U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921700145.7U CN210896829U (en) 2019-10-12 2019-10-12 Electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921700145.7U CN210896829U (en) 2019-10-12 2019-10-12 Electronic component

Publications (1)

Publication Number Publication Date
CN210896829U true CN210896829U (en) 2020-06-30

Family

ID=71322217

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921700145.7U Active CN210896829U (en) 2019-10-12 2019-10-12 Electronic component

Country Status (1)

Country Link
CN (1) CN210896829U (en)

Similar Documents

Publication Publication Date Title
US8821198B2 (en) Surface mounted electrical contact
US6478599B1 (en) Contact for CPU socket
CN210896829U (en) Electronic component
US4262986A (en) Electrical interconnect device
CN108493650B (en) Electric connector
CN211656512U (en) Circuit board structure with anti-drop element
CN210245328U (en) Novel high-reliability chip aluminum electrolytic capacitor
CN113301717A (en) Circuit board structure and electronic equipment
JP2003051692A (en) Method for mounting shielding box
US9004959B2 (en) Electrical connecting device
CN218473730U (en) High-efficient SMT paster material feeding unit
CN217544984U (en) Miniature shell fragment and electronic equipment
CN108037324B (en) Surface Mount Device (SMD) test terminal and processing method thereof
CN218887182U (en) DIP packaging body
JP3729257B2 (en) Chip-type aluminum electrolytic capacitor and circuit board device
CN104795653B (en) Electric connector
CN216648295U (en) Patch element
JPH0416421Y2 (en)
CN108923134A (en) A kind of flexible terminal
CN216700442U (en) Circuit board device mounting structure and circuit board
CN211378371U (en) Wireless communication module chip welding PCB board
CN215898094U (en) V-shaped exhaust structure for preventing welding bubbles of LGA (land grid array) component
JPH0416423Y2 (en)
TWI436711B (en) USB device with prefabricated structure
JP2862437B2 (en) Surface mount type package

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant