CN210847028U - Powder feeding and wiping device - Google Patents

Abstract

The utility model discloses a go up whitewashed powder device relates to semiconductor device processing technology field. Including vacuum negative pressure machine, hollow shaft motor, negative pressure pipe and sucking disc, the hollow shaft motor comprises rotating electrical machines and rotation axis, one side of rotating electrical machines is equipped with the connection pipe, the middle part at the rotating electrical machines is installed to the rotation axis, the rotation axis is hollow cylinder, the hollow department and the connection pipe intercommunication of rotation axis, the sucking disc is installed on the rotation axis, the sucking disc is discoid, establishes a perforating hole in the centre of sucking disc, the perforating hole with the rotation axis intercommunication, the negative pressure pipe one end with connect the pipe intercommunication, the other end of negative pressure pipe is connected to vacuum negative pressure machine, the utility model discloses can be quick carry out quick powdering to semiconductor device and wipe whitewashed unnecessary glass powder and take out the collection through vacuum negative pressure machine in-process to going up the powder to prevent that glass powder from scattering to causing dust pollution in the air.

Description

Powder feeding and wiping device

Technical Field

The utility model relates to a semiconductor device processing technology field especially relates to a go up whitewashed powder device.

Background

The silicon controlled rectifier and other high voltage devices produced by using the mesa process structure have relatively mature processes in the production of semiconductor devices, and when the semiconductor devices are manufactured by using the mesa process, one of the very important steps is to fill special pasty glass powder in a mesa groove after the mesa groove is formed by photoetching.

Patent No. CN203316360U in the prior art provides a plastic knife for glass powder coating and scraping, which comprises a handle and a scraper, it is characterized in that the handle comprises an upper scraper handle, a middle scraper handle and a lower scraper handle which are tightly connected by plastic screws, the scraper and the middle scraper handle are arranged in a clamping groove formed by the upper scraper handle and the lower scraper handle, the knife edge of the scraper extends out of the clamping groove, the thickness of the scraper is 0.2mm-0.4mm larger than that of the middle scraper handle, the scraper is made of a helium polyester material, the upper scraper blade handle, the middle scraper blade handle and the lower scraper blade handle are made of PVC materials, the plastic screw is made of PVC materials, the width of the blade of the scraper is 100mm or 125mm, the thickness is 0.6mm, the utility model discloses a also can make things convenient for the manual work to fill the glass powder to the mesa groove of photoetching in, but this utility model still has following problem: firstly, the novel use method has the advantages that the efficiency of manually filling the glass powder into the groove by using the scraper is low, the requirement on the operation method of an operator is high, and the surface of the semiconductor device is easily scratched; secondly, in the process of scraping and coating the glass powder, part of the glass powder is substituted into the air to be scattered, so that dust pollution is caused.

SUMMERY OF THE UTILITY MODEL

The utility model provides a go up whitewashed powder device to solve the technical problem of the low easy fish tail of efficiency among the prior art artifical packing glass powder.

The utility model provides a go up whitewashed powder device, includes vacuum negative pressure machine, hollow shaft motor, negative pressure pipe and sucking disc, the hollow shaft motor comprises rotating electrical machines and rotation axis, one side of rotating electrical machines is equipped with the connection pipe, the middle part at rotating electrical machines is installed to the rotation axis, the rotation axis is hollow cylinder, the hollow department and the connection pipe intercommunication of rotation axis, the sucking disc is installed on the rotation axis, the sucking disc is discoid, and a perforating hole is established to the centre of sucking disc, the perforating hole with the rotation axis intercommunication, the one end of negative pressure pipe with connect the pipe intercommunication, the other end of negative pressure pipe is connected to vacuum negative pressure machine.

Further, be equipped with the cavity in the sucking disc, the through-hole intercommunication that sets up in cavity and the sucking disc, install the flow distribution plate in the cavity, be equipped with a large amount of holes on the flow distribution plate.

Furthermore, a single-sided adhesive film is further arranged on the flow distribution plate, and one side with viscosity in the single-sided adhesive film is pasted on the flow distribution plate.

Further, the hollow shaft motor is provided with a ground wire, and the ground wire is communicated to the ground.

Compared with the prior art, the beneficial effects of the utility model reside in that:

one of the two problems is that the utility model discloses in through setting up hollow shaft motor and sucking disc, whitewash semiconductor device through the sucking disc, the sucking disc can receive operator's strength to rotate at will when the rotating electrical machines is not started, be convenient for make the glass powder carry out the whitewashing of multi-angle, start the rotating electrical machines after the whitewashing is accomplished and make the sucking disc rotate, make the glass powder can be even scribbled in photoetching formation mesa groove through the rotation of sucking disc, still be equipped with single face adhesive film in the sucking disc simultaneously, then play the effect of buffering and avoiding metal ion to stain to the wafer through single face adhesive film; the operation is simple when the sucker is cleaned, and only the old single-sided adhesive film is needed to be removed and replaced by a new single-sided adhesive film. Scratch caused by friction can be reduced to the maximum extent by carrying out soft contact on the single-sided adhesive film and the semiconductor device, so that the technical problem that the scratch is easy to occur due to low efficiency when glass powder is filled manually in the prior art is effectively solved.

And secondly, the utility model discloses in use the hollow shaft motor to through vacuum negative pressure machine intercommunication hollow shaft motor, be provided with perforating hole and cavity and hollow shaft motor intercommunication on the sucking disc, start vacuum negative pressure machine at the in-process of wiping the powder, the cavity that makes to set up on the sucking disc is in negative pressure state, can adsorb the glass powder that scatters on the sucking disc and prevent in the cavity that the glass powder from wafting to form dust pollution in the air, cavity department installation flow distribution plate on the sucking disc simultaneously, the scope that can make the sucking disc can adsorb the glass powder through the flow distribution plate is bigger, and efficiency is higher.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of a first angle structure of the present invention;

FIG. 2 is a schematic view of the split structure of the present invention;

fig. 3 is a cross-sectional view of the present invention;

reference numerals: the device comprises a hollow shaft motor 1, a negative pressure pipe 2, a suction cup 3, a rotating motor 11, a rotating shaft 12, a connecting circular pipe 13, a through hole 31, a cavity 32, a flow distribution plate 33 and a single-sided adhesive film 34.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention.

The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.

Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

A powdering and powdering device comprises a vacuum negative pressure machine, a hollow shaft motor 1, a negative pressure pipe 2 and a suction cup 3, wherein the hollow shaft motor 1 is composed of a rotating motor 11 and a rotating shaft 12, one side of the rotating motor 11 is provided with a connecting circular pipe 13, the rotating shaft 12 is installed at the middle part of the rotating motor 11, the rotating shaft 12 is a hollow cylinder, the hollow part of the rotating shaft 12 is communicated with the connecting circular pipe 13, the rotating shaft 12 can rotate when the rotating motor 11 is started, the suction cup 3 is installed on the rotating shaft 12, the suction cup 3 is disc-shaped, a through hole 31 is arranged in the middle of the suction cup 3, the through hole 31 is communicated with the rotating shaft 12, the suction cup 3 can rotate freely when the rotating motor 11 is in a disconnected state, the powder applying device is used for facilitating the omnidirectional powdering of the semiconductor device placed on the suction cup 3, one end of the negative pressure pipe 2 is, the other end is connected to a vacuum negative pressure machine.

The utility model discloses a theory of operation: at first coating the glass powder on semiconductor device through sucking disc 3, then start rotating electrical machines 11, through the even slot of filling to semiconductor device of sucking disc 3 under the rotation state with the glass powder of coating on semiconductor device spare, start vacuum negative pressure machine, make negative pressure pipe 2, rotation axis 12 and the sucking disc 3 of intercommunication rotation axis 12 be in negative pressure state through vacuum negative pressure machine, can concentrate the absorption collection with the glass powder that the powder in-process of wiping scatters, prevent that the glass powder from scattering and forming dust pollution in the air, the utility model discloses can be quick carry out the work of powdering and wiping the powder to semiconductor device to adsorb wherein collection with unnecessary glass powder, prevent that the glass powder from scattering and causing dust pollution in the air.

Preferably, be equipped with cavity 32 in the sucking disc 3, the perforating hole 31 intercommunication that sets up in cavity 32 and the sucking disc 3, install flow distribution plate 33 in the cavity 32, be equipped with a large amount of holes on flow distribution plate 33, when the vacuum negative pressure machine starts, be in the negative pressure state in the cavity 32 for during a large amount of holes that the air passes through on the flow distribution plate 33 get into cavity 32, can substitute near the glass powder of scattering when the air gets into cavity 32, its effect lies in, the scope that makes the glass powder that sucking disc 3 can adsorb is wider through cavity 32 and the flow distribution plate 33 that set up, thereby increases the utility model discloses adsorption efficiency to glass powder.

Preferably, the shunting plate 33 is further provided with a single-sided adhesive film 34, and one side of the single-sided adhesive film 34 with adhesiveness is adhered to the shunting plate 33, so that the effect of buffering the wafer and avoiding metal ion contamination is achieved by arranging the single-sided adhesive film 34 on the shunting plate 33; when the single face adhesive film 34 can't make the glass powder on the semiconductor device evenly paint the back after long-time use, take off original single face adhesive film 34, change brand-new single face adhesive film 34 again, the cleanness of the equipment of being convenient for has improved the utility model discloses an availability.

Preferably, the hollow shaft motor 1 is connected with a ground wire, and static electricity in equipment is guided to the ground through the ground wire, so that the equipment is prevented from generating static electricity in the using process to cause irreparable damage to semiconductor devices in powder.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims (4)

1. A powdering and powdering device, which comprises a vacuum negative pressure machine and is characterized by also comprising a hollow shaft motor (1), a negative pressure pipe (2) and a sucker (3), the hollow shaft motor (1) consists of a rotating motor (11) and a rotating shaft (12), one side of the rotating motor (11) is provided with a connecting circular tube (13), the rotating shaft (12) is arranged in the middle of the rotating motor (11), the rotating shaft (12) is a hollow cylinder, the hollow part of the rotating shaft (12) is communicated with the connecting circular tube (13), the sucking disc (3) is arranged on the rotating shaft (12), the sucking disc (3) is disc-shaped, a through hole (31) is arranged in the middle of the sucking disc (3), perforating hole (31) with rotation axis (12) intercommunication, the one end of negative pressure pipe (2) with connect pipe (13) intercommunication, the other end of negative pressure pipe (2) is connected to vacuum negative pressure machine.

2. A powder coating and wiping device as claimed in claim 1, wherein a cavity (32) is arranged in the suction cup (3), the cavity (32) is communicated with a through hole (31) arranged in the suction cup (3), a splitter plate (33) is arranged in the cavity (32), and a large number of holes are arranged on the splitter plate (33).

3. A powdering device according to claim 2, wherein said splitter plate (33) is further provided with a single-sided adhesive film (34), and the sticky side of said single-sided adhesive film (34) is adhered to said splitter plate (33).

4. A dusting device according to claim 1, characterized in that the hollow shaft motor (1) is provided with a ground wire, which is connected to ground.

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