CN210722958U

CN210722958U - Gluing device for semiconductor production

Info

Publication number: CN210722958U
Application number: CN201921685109.8U
Authority: CN
Inventors: 王国新
Original assignee: Danyang Haomao Semiconductor Technology Co Ltd
Current assignee: Danyang Haomao Semiconductor Technology Co Ltd
Priority date: 2019-10-10
Filing date: 2019-10-10
Publication date: 2020-06-09
Anticipated expiration: 2029-10-10

Abstract

The utility model discloses a rubberizing device is used in semiconductor production, concretely relates to rubberizing device technical field, including the airtight frame of work, the inside left side fixed surface of the airtight frame of work installs crowded rubber tube, the discharge gate has been seted up to the bottom of crowded rubber tube, the bottom surface fixed mounting of the airtight frame of work has the axis of rotation, the fixed mounting of axis of rotation has table surface, the bottom fixed mounting of axis of rotation has the base, the fixed surface of base installs the backup pad. The utility model discloses a set up first collecting plate and second collecting plate, first receiver and second receiver for the device is at the during operation, and the glue that is thrown away by high-speed rotatory table surface flies off is collected first receiver and second receiver through first collecting plate and second collecting plate, has reduced the quantity of glue gluing the internal surface of gluing the device body, has avoided the corruption that a large amount of glue caused the device body, has increased the device's life.

Description

Gluing device for semiconductor production

Technical Field

The utility model relates to a rubberizing technical field, more specifically say, the utility model relates to a semiconductor production is with rubberizing device.

Background

The semiconductor refers to a material having electrical conductivity between a conductor and an insulator at normal temperature. The semiconductor is mainly applied to radio, television and temperature measurement. Semiconductor refers to a material with controllable conductivity ranging from an insulator to a conductor. From the viewpoint of scientific and technical and economic development, semiconductors affect daily work and life of people.

However, in practical use, there still exist some disadvantages, such as:

(1) the utility model discloses a device for semiconductor gluing, including device body, glue dispersion, the device body is equipped with the device body, current device is when preparing to carry out the photoresist process flow for the semiconductor rubberizing, because current device needs high-speed rotatory, make the glue dispersion on semiconductor surface even, when current device is high-speed rotatory, unnecessary glue can be got rid of the surface of device body, because glue has certain corrosivity and is stained with viscidity, when making glue get rid of this surface of device, operating personnel very difficult clean the surface of device body, greatly increased operating personnel's the work degree of difficulty, and glue has certain corrosivity, can cause a large amount of corrosions to the surface of device body, the device body has been destroyed, the service life of the device has been reduced, the economic benefits of the.

(2) When the existing device is used for preparing photoresist flow for semiconductor gluing, glue on the surface of a semiconductor can be thrown out to the outside by the high-speed rotating workbench, even the glue pollutes the air, the ecological environment around the device is polluted, the thrown-out glue can be recycled, the existing device does not have the function of collecting the glue, the economic benefit of the device is greatly reduced, and the practical effect of the device is not facilitated.

Therefore, it is desirable to provide an environmentally friendly glue applying device for semiconductor production.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above defects of the prior art, the embodiment of the utility model provides a gluing device for semiconductor production, which is characterized in that a first collecting plate and a second collecting plate, a first storage box and a second storage box are arranged, so that when the device works, glue scattered and thrown off by a high-speed rotating worktable surface is collected into the first storage box and the second storage box through the first collecting plate and the second collecting plate, the quantity of the glue adhered to the inner surface of the device body is reduced, the corrosion of a large amount of glue to the device body is avoided, through arranging the first accommodating box and the second accommodating box, the first filter screen and the second filter screen and the guide plate, the glue scattered and thrown off by the high-speed rotating worktable surface is guided into the first accommodating box and the second accommodating box by the guide plate, then the first filter screen and the second filter screen filter off dust and impurities in the glue, the first and second containers then collect the glue to solve the problems mentioned in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a gluing device for semiconductor production comprises a work airtight frame, wherein a glue extruding pipe is fixedly arranged on the left side surface inside the work airtight frame, a discharge hole is formed in the bottom end of the glue extruding pipe, a rotating shaft is fixedly arranged on the bottom surface of the work airtight frame, a working table surface is fixedly arranged on the rotating shaft, a base is fixedly arranged at the bottom end of the rotating shaft, a supporting plate is fixedly arranged on the surface of the base, a first storage box is detachably arranged inside the left side of the work airtight frame, a first filter screen is fixedly arranged at the top end of the first storage box, a first collecting plate is fixedly arranged on the left side inner surface of the work airtight frame, a second storage box is detachably arranged on the right side inner surface of the work airtight frame, a second filter screen is fixedly arranged at the top end of the second storage box, and a second collecting plate is fixedly arranged on the right, the surface of the first collecting plate is bonded with a guide plate.

In a preferred embodiment, the inner surface of the discharge opening is smooth, and the diameter of the discharge opening has a value of two to three millimeters.

In a preferred embodiment, the first storage case and the second storage case have the same structure, and have a volume value of ten cubic centimeters.

In a preferred embodiment, the first filter has a filter hole diameter of one to three millimeters.

In a preferred embodiment, the first collecting plate cassette has a smooth surface of the second collecting plate.

In a preferred embodiment, the number of the support plates is two, and the two support plates are fixedly mounted on the surface of the rotating shaft.

In a preferred embodiment, the deflector is in the form of a cylindrical stick, and the bottom end of the deflector is slightly smaller than the main body of the deflector.

In a preferred embodiment, a rubber pad is adhered to the surface of the base, and the thickness of the rubber pad is one millimeter to two millimeters.

The utility model discloses a technological effect and advantage:

1. the utility model discloses a set up first collecting plate and second collecting plate, first receiver and second receiver, make the device at the during operation, the glue that is thrown away by high-speed rotatory table surface flies off is collected first receiver and second receiver through first collecting plate and second collecting plate, the quantity of glue gluing the internal surface of device body has been reduced, the corruption that a large amount of glue caused the device body has been avoided, the device's life has been increased, the device's practicality has been increased, the device's social profitability has been improved.

2. The utility model discloses a set up first case and the second of holding and hold the case, first filter screen and second filter screen, the guide plate, make the glue that is thrown away by high-speed rotatory table surface flies off advance the first inside that holds the case and the second holds the case by the guide plate water conservancy diversion, first filter screen and second filter screen filter fall dust and impurity in the glue after that, first case and the second of holding after that holds collects glue, then operating personnel can carry out manifold cycles with collecting the glue after filtering and utilize, greatly increased the device's economic benefits, the practicality of the device is improved, the surrounding environment of glue pollution the device has been avoided, the device's feature of environmental protection has been increased.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic structural view of the first storage box of the present invention.

Fig. 3 is a schematic diagram of a first collecting plate structure of the present invention.

Fig. 4 is a schematic structural view of the working table of the present invention.

The reference signs are: 1. a working airtight frame; 2. extruding a rubber pipe; 3. a discharge port; 4. a first storage box; 5. a first filter screen; 6. a first collection plate; 7. a second storage box; 8. a second filter screen; 9. a second collection plate; 10. a rotating shaft; 11. a work table; 12. a base; 13. a support plate; 14. a baffle.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The gluing device for semiconductor production shown in the attached drawings 1-4 comprises a work airtight frame 1, wherein a rubber extruding pipe 2 is fixedly arranged on the left side of the inside of the work airtight frame 1, a discharge hole 3 is formed in the bottom end of the rubber extruding pipe 2, a rotating shaft 10 is fixedly arranged on the bottom surface of the work airtight frame 1, a working table 11 is fixedly arranged on the rotating shaft 10, a base 12 is fixedly arranged at the bottom end of the rotating shaft 10, a supporting plate 13 is fixedly arranged on the surface of the base 12, a first storage box 4 is detachably arranged inside the left side of the work airtight frame 1, a first filter screen 5 is fixedly arranged at the top end of the first storage box 4, a first collecting plate 6 is fixedly arranged on the left side inside of the work airtight frame 1, a second storage box 7 is detachably arranged on the right side inner surface of the work airtight frame 1, and a second filter screen 8 is fixedly arranged at the top end, the inside right side fixed surface of the airtight frame of work 1 installs

second collecting plate

9, 6 surface bonding of first collecting plate has guide plate 14, the internal surface of discharge gate 3 is smooth, and the diameter value of discharge gate 3 is two millimeters to three millimeters, first receiver 4 is the same with the structure of second receiver 7, first receiver 4 is ten cubic centimeters with the volume value of second receiver 7, the surface of 6 box second collecting plates of first collecting plate 9 is smooth, and the quantity of backup pad 13 is two, two backup pad 13 fixed mounting is on the surface of axis of rotation 10, the surface bonding of base 12 has the one deck rubber pad, the thickness value of rubber pad is one millimeter to two millimeters.

Referring to the attached fig. 2 of the specification, the aperture of the first filter 5 is one millimeter to three millimeters.

The implementation mode is specifically as follows: the filter hole aperture of the first filter screen 5 is utilized, so that when glue drips into the first storage box 4, most of impurities and dust on the surface of the glue are separated by the first filter screen 5, the glue is guaranteed not to affect the working quality of photoresist work of a semiconductor when being recycled, the economic benefit of the device is increased, the production quality of the device is guaranteed, and the practicability of the device is improved.

Referring specifically to fig. 3 of the specification, the deflector 14 is in the shape of a cylindrical stick, and the bottom end of the deflector 14 is slightly smaller than the main body of the deflector 14.

The implementation mode is specifically as follows: the shape of the guide plate 14 is utilized, when glue contacts the surface of the guide plate 14, the glue can flow into the first storage box 4 and the second storage box 7 from the top of the surface of the guide plate 14 quickly, the efficiency of collecting the glue by the glue collecting device is increased, and the practicability of the glue collecting device is improved.

The utility model discloses the theory of operation:

a preparation stage: firstly, an operator assembles each component of the device, normally starts the device, then glue drops on the surface of a semiconductor placed on the surface of a worktable 11 through a glue extruding pipe 2 through a discharge port 3, and then the device normally carries out photoresist process flow operation on the semiconductor.

The working stage is as follows: firstly, the worktable 11 rotates at a high speed through the rotating shaft 10 to uniformly lay the glue on the top surface of the semiconductor, then the thrown glue flows into the second storage box 7 and the first storage box 4 through the first collecting plate 6 and the second collecting plate 9, and the guide plate 14 constantly controls the glue to drip on the central positions inside the first storage box 4 and the second storage box 7.

And (5) finishing: firstly, an operator closes the device, then checks whether the fixity among all components of the device is normal or not, then replaces and maintains parts with serious aging and abrasion in the device, and finally the device finishes the work of collecting, filtering and recycling redundant glue.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a gluing device for semiconductor production, includes work airtight frame (1), the inside left side fixed surface of work airtight frame (1) installs crowded rubber pipe (2), discharge gate (3) have been seted up to the bottom of crowded rubber pipe (2), the bottom surface fixed mounting of work airtight frame (1) has axis of rotation (10), the fixed mounting of axis of rotation (10) has table surface (11), the bottom fixed mounting of axis of rotation (10) has base (12), the fixed surface of base (12) installs backup pad (13), its characterized in that: the utility model discloses a sealed frame of work, including the sealed frame of work (1), the inside demountable installation in left side has first receiver (4), the top fixed mounting of first receiver (4) has first filter screen (5), the inside fixed surface in left side of the sealed frame of work (1) installs first collecting plate (6), the right side internal surface demountable installation of the sealed frame of work (1) has second receiver (7), the top fixed mounting of second receiver (7) has second filter screen (8), the inside right side fixed surface of the sealed frame of work (1) installs second collecting plate (9), first collecting plate (6) surface bonding has guide plate (14).

2. The gluing device for semiconductor production according to claim 1, wherein: the inner surface of the discharge port (3) is smooth, and the diameter value of the discharge port (3) is two millimeters to three millimeters.

3. The gluing device for semiconductor production according to claim 1, wherein: the structure of first receiver (4) is the same with second receiver (7), the volume value of first receiver (4) and second receiver (7) is ten cubic centimeters.

4. The gluing device for semiconductor production according to claim 1, wherein: the aperture of the filter holes of the first filter screen (5) ranges from one millimeter to three millimeters.

5. The gluing device for semiconductor production according to claim 1, wherein: the surfaces of the first collecting plate (6) and the second collecting plate (9) are smooth.

6. The gluing device for semiconductor production according to claim 1, wherein: the number of the supporting plates (13) is two, and the two supporting plates (13) are fixedly arranged on the surface of the rotating shaft (10).

7. The gluing device for semiconductor production according to claim 1, wherein: the guide plate (14) is in a cylindrical stick shape, and the bottom end of the guide plate (14) is slightly smaller than the main body of the guide plate (14).

8. The gluing device for semiconductor production according to claim 1, wherein: the surface of the base (12) is bonded with a layer of rubber pad, and the thickness value range of the rubber pad is one millimeter to two millimeters.