CN210837800U - LED chip with anti-arc gold thread of beating line - Google Patents
LED chip with anti-arc gold thread of beating line Download PDFInfo
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- CN210837800U CN210837800U CN201922020251.7U CN201922020251U CN210837800U CN 210837800 U CN210837800 U CN 210837800U CN 201922020251 U CN201922020251 U CN 201922020251U CN 210837800 U CN210837800 U CN 210837800U
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Abstract
The utility model discloses a LED chip with reverse-striking arc gold thread, relating to the technical field of LED; the LED lamp comprises an LED bracket, an LED lamp cup, an LED chip, a first reverse striking arc and a second reverse striking arc; the LED lamp cup is provided with a concave cavity, the inner wall of the cavity is a smooth reflecting panel, the LED support comprises an anode pin and a cathode pin, and the anode pin and the cathode pin both extend into the cavity of the LED lamp cup and are positioned at the bottom of the cavity; the LED chip is fixed on the negative pin and is provided with a positive end and a negative end; the first reverse-striking wire arc and the second reverse-striking wire arc respectively comprise a first bonding pad, a vertical end, a bent end, an inclined end and a second bonding pad; the utility model has the advantages that: the condition that the gold thread breaks appears in cold and hot impact in-process can be avoided, the lamp that dies is avoided appearing.
Description
Technical Field
The utility model relates to a LED technical field, more specifically the utility model relates to a LED chip with anti-arc gold thread of beating.
Background
With the development of semiconductor lighting technology, Light Emitting Diodes (LEDs) are widely used in the lighting and display fields due to their characteristics of high brightness, low power consumption, small size, long life, safety, reliability, etc., and are considered as a fourth generation light source to replace incandescent lamps, fluorescent lamps, and high-pressure gas discharge lamps. The LED has a plurality of types, including a direct plug-in type LED, an SMDLED, a high-power LED and the like. The SMD LED is a surface mount light emitting diode and is extremely widely applied.
The electrode of the LED chip is connected with the electrode of the bracket through a gold wire, and the existing gold wire is QA wire arc. The wire bonding mode is firstly stretched upwards from the anode of the LED chip, then the wire bonding mode bends towards the anode of the bracket and is directly LED to the anode of the bracket, and an included angle between the end part of the gold wire and the anode of the bracket is an acute angle; because the arc of the wire is relatively straight, the gold wire is easily broken in the cold and hot impact process, and the lamp is dead.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a LED chip with anti-arc gold thread of beating, this LED chip can avoid the gold thread to appear the condition of breaking at cold and hot impact in-process through the first anti-arc of beating and the anti-structural design who beats the arc of beating of second, avoids appearing dead lamp.
The utility model provides a technical scheme that its technical problem adopted is: the improvement of an LED chip with a reverse-bonding arc gold wire is that: the LED lamp comprises an LED bracket, an LED lamp cup, an LED chip, a first reverse striking arc and a second reverse striking arc;
the LED lamp cup is provided with a concave cavity, the inner wall of the cavity is a smooth reflecting panel, the LED support comprises an anode pin and a cathode pin, and the anode pin and the cathode pin both extend into the cavity of the LED lamp cup and are positioned at the bottom of the cavity;
the LED chip is fixed on the negative pin and is provided with a positive end and a negative end; the first reverse wiring arc and the second reverse wiring arc respectively comprise a first bonding pad, a vertical end, a bent end, an inclined end and a second bonding pad, the first bonding pad of the first reverse wiring arc is welded on the positive pin, the vertical end of the first reverse wiring arc is perpendicular to the upper plane of the positive pin, the second bonding pad of the first reverse wiring arc is welded on the positive end of the LED chip, the inclined end of the first reverse wiring arc and the upper surface of the LED chip form an acute angle, and the bent end is connected between the vertical end and the inclined end; the second pad of the second reverse-striking arc is welded on the negative pin, the vertical end of the second reverse-striking arc is perpendicular to the upper plane of the negative pin, the second pad of the second reverse-striking arc is welded on the negative end of the LED chip, the inclined end of the second reverse-striking arc and the included angle formed by the upper surface of the LED chip are acute angles, and the bent end is connected between the vertical end and the inclined end.
In the above structure, the reflective panel has an inclined racetrack shape.
In the above structure, a boundary region is reserved between the positive electrode pin and the negative electrode pin, a distance between the LED chip and the boundary region is X1, and X1 is 50 ± 38 um.
In the above structure, the distances between the opposite sides of the LED chip and the inner wall of the cavity are Y1 and Y2, respectively, and | Y1-Y2| ═ 38 um.
In the above structure, the distance between the central point of the first pad on the positive electrode pin and the boundary line region is a1, and a1 is 160 ± 60 um; the distance between the central point of the first bonding pad on the positive electrode pin and the inner wall of the cavity is B1, and B1 is 330 +/-60 um.
In the above structure, the distances between the center point of the first pad and the inner walls of the two adjacent cavities on the negative pin are a2 and B2, respectively, and a2 is greater than 150um, and B2 is 240 ± 60 um.
In the structure, the vertical distance between the highest point of the first reverse striking arc and the second reverse striking arc and the upper surface of the LED chip is 135 +/-15 um.
In the above structure, the length of the LED lamp cup is less than 31mil, and the width of the LED lamp cup is between 12mil and 16 mil.
The utility model has the advantages that: in the use, if receive cold and hot impact, make the distance increase or reduce between first pad and the second pad, owing to the structural design of vertical end, crooked end and tip at this moment, through the skew about vertical end, the change of the crookedness of crooked end and the change of the inclination of tip, in order to adapt to the influence that cold and hot impact caused first anti-act line arc and the anti-act line arc of second, can avoid first anti-act line arc and the anti-act line arc of second to appear the condition of snapping, in order to avoid appearing the dead lamp.
Drawings
Fig. 1 is a schematic diagram of the structure of the LED chip with reverse-looping arc gold thread after die bonding.
Fig. 2 is a schematic diagram of the structure behind the bonding wire of the LED chip with the reverse-looping arc gold thread of the present invention.
Fig. 3 is the first anti-arcing, the second anti-arcing, the LED support and the LED chip of the present invention.
Fig. 4 is a schematic structural diagram of a first reverse striking arc according to the present invention.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. The utility model discloses each technical feature in the creation can the interactive combination under the prerequisite that does not contradict conflict each other.
Referring to fig. 1 and 2, the utility model discloses a LED chip with turn over and beat wire arc gold thread, it is concrete, including LED support 10, LED lamp cup 20, LED chip 30, first turn over beat wire arc 40 and second turn over and beat wire arc 50, LED lamp cup 20 be provided with sunken cavity, the inner wall of cavity is glossy reflecting panel 201, this reflecting panel 201 forms the runway shape that is the slope, LED lamp cup 20's corner still is provided with an unfilled corner 202. The LED support 10 includes an anode pin 101 and a cathode pin 102, and both the anode pin 101 and the cathode pin 102 extend into the cavity of the LED cup 20 and are located at the bottom of the cavity.
As shown in fig. 3 and 4, the LED chip 30 is fixed on the negative pin 102, and the LED chip 30 has a positive terminal and a negative terminal; the first reverse-striking wire arc 40 and the second reverse-striking wire arc 50 have the same structure, and a specific structure of the first reverse-striking wire arc 40 is described in detail in fig. 4, where the first reverse-striking wire arc 40 includes a first pad 401, a vertical end 403, a bent end 404, an inclined end 405, and a second pad 402, the first pad 401 of the first reverse-striking wire arc 40 is welded to the positive electrode pin 101, the vertical end 403 of the first reverse-striking wire arc 40 is perpendicular to the upper plane of the positive electrode pin 101, the second pad 402 of the first reverse-striking wire arc 40 is welded to the positive electrode end of the LED chip 30, an included angle formed by the inclined end 405 of the first reverse-striking wire arc 40 and the upper surface of the LED chip 30 is an acute angle, and the bent end 404 is connected between the vertical end 403 and the inclined end 405; therefore, it can be understood that the second pad 402 of the second flip-flop arc 50 is welded on the negative terminal 102, the vertical end 403 of the second flip-flop arc 50 is perpendicular to the upper plane of the negative terminal 102, the second pad 402 of the second flip-flop arc 50 is welded on the negative terminal of the LED chip 30, the inclined end 405 of the second flip-flop arc 50 forms an acute angle with the upper surface of the LED chip 30, and the bent end 404 is connected between the vertical end 403 and the inclined end 405.
Through the structure, as shown in fig. 3, when the utility model discloses a LED chip with anti-arc gold thread of beating wire is in the use, if receive cold and hot impact, make the distance increase or reduce between first pad 401 and the second pad 402, because the structural design of vertical end 403, crooked end 404 and slope end 405, through the skew about vertical end 403, the change of the crookedness of crooked end 404 and the change of the inclination of slope end 405, so as to adapt to the influence that cold and hot impact caused first anti-arc 40 of beating wire and the anti-arc 50 of beating wire of second, can avoid first anti-arc 40 of beating wire and the anti-arc 50 of beating wire condition that breaks to appear, in order to avoid appearing the dead lamp.
In the above embodiments, the size of the LED lamp cup 20, the size of the LED chip 30, and the specific position of the LED chip 30 are specifically defined, in this embodiment, the length of the LED lamp cup 20 is less than 31mil, and the width of the LED lamp cup 20 is between 12mil and 16 mil; a boundary area is reserved between the positive pin 101 and the negative pin 102, the distance between the LED chip 30 and the boundary area is X1, and X1 is 50 ± 38 um; the distances between the two opposite sides of the LED chip 30 and the inner wall of the cavity are Y1 and Y2, respectively, and | Y1-Y2| ═ 38 um. In addition, the distance between the central point of the first pad 401 on the positive electrode pin 101 and the boundary line region is a1, and a1 is 160 ± 60 um; the distance between the central point of the first pad 401 on the positive electrode pin 101 and the inner wall of the cavity is B1, and B1 is 330 ± 60 um; the distances between the central point of the first pad 401 on the negative pin 102 and the inner walls of the two adjacent cavities are a2 and B2, respectively, a2 is greater than 150um, and B2 is 240 ± 60 um. For the heights of the first reverse-striking arc 40 and the second reverse-striking arc 50, in this embodiment, the vertical distance between the highest point of the first reverse-striking arc 40 and the second reverse-striking arc 50 and the upper surface of the LED chip 30 is 135 ± 15 um.
While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.
Claims (8)
1. The utility model provides a LED chip with reverse-bonding wire arc gold thread which characterized in that: the LED lamp comprises an LED bracket, an LED lamp cup, an LED chip, a first reverse striking arc and a second reverse striking arc;
the LED lamp cup is provided with a concave cavity, the inner wall of the cavity is a smooth reflecting panel, the LED support comprises an anode pin and a cathode pin, and the anode pin and the cathode pin both extend into the cavity of the LED lamp cup and are positioned at the bottom of the cavity;
the LED chip is fixed on the negative pin and is provided with a positive end and a negative end; the first reverse wiring arc and the second reverse wiring arc respectively comprise a first bonding pad, a vertical end, a bent end, an inclined end and a second bonding pad, the first bonding pad of the first reverse wiring arc is welded on the positive pin, the vertical end of the first reverse wiring arc is perpendicular to the upper plane of the positive pin, the second bonding pad of the first reverse wiring arc is welded on the positive end of the LED chip, the inclined end of the first reverse wiring arc and the upper surface of the LED chip form an acute angle, and the bent end is connected between the vertical end and the inclined end; the second pad of the second reverse-striking arc is welded on the negative pin, the vertical end of the second reverse-striking arc is perpendicular to the upper plane of the negative pin, the second pad of the second reverse-striking arc is welded on the negative end of the LED chip, the inclined end of the second reverse-striking arc and the included angle formed by the upper surface of the LED chip are acute angles, and the bent end is connected between the vertical end and the inclined end.
2. The LED chip with the reverse-bonding arc gold wire according to claim 1, wherein: the reflecting panel is in an inclined runway shape.
3. The LED chip with the reverse-bonding arc gold wire according to claim 1, wherein: a boundary area is reserved between the anode pin and the cathode pin, the distance between the LED chip and the boundary area is X1, and X1 is 50 +/-38 um.
4. The LED chip with the reverse-bonding arc gold wire according to claim 3, wherein: the distances between the two opposite sides of the LED chip and the inner wall of the cavity are Y1 and Y2 respectively, and | Y1-Y2| ═ 38 um.
5. The LED chip with the reverse-bonding arc gold wire according to claim 3, wherein: the distance between the central point of the first bonding pad on the positive electrode pin and the boundary line area is A1, and A1 is 160 +/-60 um; the distance between the central point of the first bonding pad on the positive electrode pin and the inner wall of the cavity is B1, and B1 is 330 +/-60 um.
6. The LED chip with the reverse-bonding arc gold wire according to claim 3, wherein: the distances between the central point of the first bonding pad on the negative electrode pin and the inner walls of the two adjacent cavities are A2 and B2 respectively, A2 is greater than 150um, and B2 is 240 +/-60 um.
7. The LED chip with the reverse-bonding arc gold wire according to claim 1, wherein: the vertical distance between the highest point of the first reverse striking arc and the second reverse striking arc and the upper surface of the LED chip is 135 +/-15 um.
8. The LED chip with the reverse-bonding arc gold wire according to claim 1, wherein: the length of the LED lamp cup is less than 31mil, and the width of the LED lamp cup is between 12mil and 16 mil.
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CN201922020251.7U CN210837800U (en) | 2019-11-21 | 2019-11-21 | LED chip with anti-arc gold thread of beating line |
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CN201922020251.7U CN210837800U (en) | 2019-11-21 | 2019-11-21 | LED chip with anti-arc gold thread of beating line |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115972418A (en) * | 2023-03-20 | 2023-04-18 | 西安中威新材料有限公司 | Silicon carbide ceramic wafer boat tooth punching equipment for wafer diffusion |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115972418A (en) * | 2023-03-20 | 2023-04-18 | 西安中威新材料有限公司 | Silicon carbide ceramic wafer boat tooth punching equipment for wafer diffusion |
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