CN210837749U

CN210837749U - LED chip for improving heat dissipation performance

Info

Publication number: CN210837749U
Application number: CN201922041857.9U
Authority: CN
Inventors: 钟胜萍
Original assignee: Shenzhen Xinke Photoelectric Technology Co ltd
Current assignee: Shenzhen Xinke Photoelectric Technology Co ltd
Priority date: 2019-11-21
Filing date: 2019-11-21
Publication date: 2020-06-23
Anticipated expiration: 2029-11-21

Abstract

The utility model discloses a LED chip for improving heat dispersion performance, relating to the technical field of LED; the LED lamp comprises an LED lamp cup, an LED bracket, a first chip, a second chip and a third chip; the LED support comprises an anode pin and a cathode pin, and the anode pin and the cathode pin both extend into the cavity of the LED lamp cup; the first chip, the second chip and the third chip are arranged side by side, the first chip is fixed on the positive electrode pin, the second chip and the third chip are fixed on the negative electrode pin, the distance between the second chip and the second chip is H, and H is 340 +/-38 um; the positive end of the first chip is electrically connected with the positive pin, the negative end of the first chip and the positive end of the second chip are connected through a gold wire, the negative end of the second chip is connected with the positive end of the third chip through a gold wire, and the negative end of the third chip is electrically connected with the negative pin; the utility model has the advantages that: the positions of the chips are set, so that the heat dissipation efficiency of the chips is improved.

Description

LED chip for improving heat dissipation performance

Technical Field

The utility model relates to a LED technical field, more specifically the utility model relates to a LED chip for improving heat dispersion.

Background

At present, LED lamps are widely applied to daily life, and gradually replace incandescent lamps in the field of illumination, and meanwhile, LEDs are actively popularized in other fields. The LED light source has the characteristics of high brightness and energy conservation, so the LED light source is environment-friendly for illumination. However, LEDs have certain drawbacks as light sources, and one of the problems is heat dissipation, which directly affects the lifetime of the LED light source itself. In the prior art, only one LED is generally welded in one chip, and the main reason is that the inner space of a lamp cup is limited, and heat emitted by the LED is collected in the lamp cup, which becomes a problem to be solved urgently in the industry.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a LED chip for improving heat dispersion sets for through the position to a plurality of chips to improve the radiating efficiency of a plurality of chips.

The utility model provides a technical scheme that its technical problem adopted is: in an LED chip for improved heat dissipation, the improvement comprising: the LED lamp comprises an LED lamp cup, an LED bracket, a first chip, a second chip and a third chip;

the LED lamp cup is provided with a concave cavity, the cavity is provided with an inclined inner wall, the inner wall is a smooth reflecting surface, the LED support comprises a positive electrode pin and a negative electrode pin, and the positive electrode pin and the negative electrode pin both extend into the cavity of the LED lamp cup and are positioned at the bottom of the cavity;

the first chip, the second chip and the third chip are arranged side by side, the first chip is fixed on the anode pin, the second chip and the third chip are fixed on the cathode pin, the distance between the second chip and the second chip is H, and H is 340 +/-38 um; the positive terminal of the first chip is electrically connected with the positive pin, the negative terminal of the first chip and the positive terminal of the second chip are connected through a gold thread, the negative terminal of the second chip is connected with the positive terminal of the third chip through a gold thread, and the negative terminal of the third chip is electrically connected with the negative pin.

In the structure, the thicknesses of the first chip, the second chip and the third chip are H2, and H2 is less than or equal to 7 um.

In the above structure, the distance from the highest point of the gold wire to the first chip upper surface is H1, and H1 is 120 ± 15 um.

In the above structure, the positive pin is provided with a first solder joint, the positive terminal of the first chip is electrically connected to the first solder joint, a distance between the first solder joint and the adjacent side wall is B1, and B1 is 220 ± 60 um.

In the above structure, an isolation region is disposed between the positive electrode pin and the negative electrode pin, a distance between the first solder joint and the isolation region is a1, and a1 is 130 ± 60 um.

In the above structure, the negative pin is provided with a second solder joint, the negative end of the third chip is electrically connected to the second solder joint, the distance between the second solder joint and the adjacent side wall is B2, and B2 is 220 ± 60um, the distance between the second solder joint and the isolation region is a2, and a2 is 220 ± 60 um.

In the above structure, the distances between the third chip and the two adjacent side walls are Y1 and L, respectively, and Y1 is 260 ± 38um, and L > 180 um.

In the above structure, the distance between the first chip and the adjacent sidewall is Y2, the distance between the second chip and the adjacent sidewall is Y3, and Y2 ═ Y3 ═ 250 ± 38 um.

In the above structure, a corner of the LED lamp cup is provided with a notch.

The utility model has the advantages that: the LED lamp cup has the advantages that the LED chips are arranged in the LED lamp cup side by side, the positions of the LED chips and the positions of welding spots are limited, the LED chips are luminous, the temperature in the LED lamp cup can be more uniform, the overhigh temperature of a certain position in the LED lamp cup is avoided, and accordingly the heat dissipation performance of the LED chips and the service life of the LED chips are improved.

Drawings

Fig. 1 is a die bonding diagram of an LED chip for improving heat dissipation performance according to the present invention.

Fig. 2 is a welding line diagram of an LED chip for improving heat dissipation performance of the present invention.

Detailed Description

The present invention will be further explained with reference to the drawings and examples.

The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. The utility model discloses each technical feature in the creation can the interactive combination under the prerequisite that does not contradict conflict each other.

Referring to fig. 1 and 2, the present invention discloses an LED chip for improving heat dissipation, specifically, the LED chip includes an LED lamp cup 10, an LED bracket, a first chip 20, a second chip 30 and a third chip 40, wherein the LED lamp cup 10 is provided with a recessed cavity, the cavity has an inclined inner wall, the inner wall is a smooth reflective surface 101, and light irradiated on the inner wall is reflected by the reflective surface 101; further, the LED bracket includes a positive pin 50 and a negative pin 60, and the positive pin 50 and the negative pin 60 both extend into the cavity of the LED lamp cup 10 and are located at the bottom of the cavity, an isolation region 70 is disposed between the positive pin 50 and the negative pin 60, and the isolation region 70 is in a long strip shape.

In this embodiment, as shown in fig. 2, the first chip 20, the second chip 30, and the third chip 40 are arranged side by side, and the first chip 20 is fixed on the positive electrode pin 50, the second chip 30 and the third chip 40 are fixed on the negative electrode pin 60, a distance between the second chip 30 and the second chip 30 is H, and H is 340 ± 38um, in this distance range, light emission of the second chip 30 and the third chip 40 will not affect each other, and it can be ensured that heat emitted by the second chip 30 and the third chip 40 can be timely dissipated, in this embodiment, the distance H is 340 um. In this embodiment, the positive terminal of the first chip 20 is electrically connected to the positive pin 50, the negative terminal of the first chip 20 and the positive terminal of the second chip 30 are connected to each other through a gold wire, the negative terminal of the second chip 30 and the positive terminal of the third chip 40 are connected to each other through a gold wire, and the negative terminal of the third chip 40 is electrically connected to the negative pin 60.

For the sizes of the first chip 20, the second chip 30 and the third chip 40, the present invention provides a specific embodiment, the thickness of the first chip 20, the second chip 30 and the third chip 40 is H2, and H2 is less than or equal to 7 um; the distance from the highest point of the gold wire to the upper surface of the first chip 20 is H1, and H1 is 120 ± 15 um.

In addition, for the arrangement of the solder joints on the negative electrode pin 60 and the positive electrode pin 50, the present invention provides a specific embodiment, as shown in fig. 2, the positive electrode pin 50 is provided with a first solder joint, the positive electrode end of the first chip 20 is electrically connected to the first solder joint, the distance between the first solder joint and the adjacent side wall is B1, and B1 is 220 ± 60 um; the distance between the first solder joint and the isolation region 70 is a1, and a1 is 130 ± 60 um. Further, the negative pin 60 is provided with a second solder joint, the negative end of the third chip 40 is electrically connected to the second solder joint, the distance between the second solder joint and the adjacent side wall is B2, and B2 is 220 ± 60um, the distance between the second solder joint and the isolation region 70 is a2, and a2 is 220 ± 60 um. By defining the positions of the first and second welding points, the heat generated by the first and second welding points can be prevented from affecting the light emission of the first, second and

third chips

20, 30 and 40.

Further, the distances between the third chip 40 and two adjacent side walls are Y1 and L, respectively, and Y1 is 260 ± 38um, and L is greater than 180 um; the distance between the first chip 20 and the adjacent side wall is Y2, the distance between the second chip 30 and the adjacent side wall is Y3, and Y2 is equal to Y3 is equal to 250 ± 38 um. In addition, in the above embodiments, it should be noted that a corner 102 is disposed at a corner of the LED lamp cup 10, so as to facilitate positioning of the LED lamp cup 10.

Through foretell structure, with the setting of a plurality of LED chips side by side in LED lamp cup 10, inject the position of LED chip, the position of solder joint simultaneously, when satisfying the LED chip luminous, can make the temperature in the LED lamp cup 10 more even, avoid the high temperature of a certain department in LED lamp cup 10, consequently improved the heat dispersion of LED chip and the life of LED chip.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.

Claims

1. An LED chip for improving heat dissipation performance, comprising: the LED lamp comprises an LED lamp cup, an LED bracket, a first chip, a second chip and a third chip;

2. The LED chip for improving heat dissipation according to claim 1, wherein: the thickness of the first chip, the second chip and the third chip is H2, and H2 is not more than 7 um.

3. The LED chip for improving heat dissipation according to claim 2, wherein: the distance from the highest point of the gold wire to the upper surface of the first chip is H1, and H1 is 120 +/-15 um.

4. The LED chip for improving heat dissipation according to claim 1, wherein: the positive electrode pin is provided with a first welding point, the positive electrode end of the first chip is electrically connected with the first welding point, the distance between the first welding point and the adjacent side wall is B1, and B1 is 220 +/-60 um.

5. The LED chip for improving heat dissipation according to claim 4, wherein: an isolation region is arranged between the positive electrode pin and the negative electrode pin, the distance between the first welding point and the isolation region is A1, and A1 is 130 +/-60 um.

6. The LED chip for improving heat dissipation according to claim 5, wherein: the negative electrode pin is provided with a second welding spot, the negative electrode end of the third chip is electrically connected with the second welding spot, the distance between the second welding spot and the adjacent side wall is B2, B2 is 220 +/-60 um, the distance between the second welding spot and the isolation region is A2, and A2 is 220 +/-60 um.

7. The LED chip for improving heat dissipation according to claim 1, wherein: the distances between the third chip and two adjacent side walls are Y1 and L respectively, and Y1 is 260 +/-38 um, and L is more than 180 um.

8. The LED chip for improving heat dissipation according to claim 7, wherein: the distance between the first chip and the adjacent side wall is Y2, the distance between the second chip and the adjacent side wall is Y3, and Y2 is Y3 is 250 +/-38 um.

9. The LED chip for improving heat dissipation according to claim 1, wherein: a corner of the LED lamp cup is provided with a unfilled corner.