CN211176348U

CN211176348U - high-power L ED lighting device

Info

Publication number: CN211176348U
Application number: CN202020010157.3U
Authority: CN
Inventors: 颜宇东; 石家声; 陈国平
Original assignee: Guangzhou Guanglian Electronic Technology Co ltd
Current assignee: Guangzhou Guanglian Electronic Technology Co ltd
Priority date: 2020-01-03
Filing date: 2020-01-03
Publication date: 2020-08-04
Anticipated expiration: 2030-01-03
Also published as: WO2021134877A1

Abstract

the utility model relates to a stage lamp field especially relates to a high-power L ED lighting device for solve the problem that lens array center explodes and splits and the too high of central region L ED junction temperature, including base plate, lens support and the lens array that has the L ED chip of installing in proper order, be equipped with the collimating lens with L ED chip one-to-one on the lens support, a serial communication port, the center of lens support is hollow out construction, be equipped with on the base plate with the corresponding bottom plate in hollow out construction position, the bottom plate is provided with the boss, forms the installation inner chamber of L ED chip between boss and the bottom plate, and is equipped with the collimating lens that corresponds with L ED chip on the boss.

Description

high-power L ED lighting device

Technical Field

the utility model relates to a stage lamp field, more specifically relates to a high-power L ED lighting device.

Background

with the development of semiconductor lighting technology, the light emitting density of an L ED chip is higher and higher, so that the development of a high-power L ED light source is faster and faster, as shown in fig. 1, the high-power L ED light source applied to the field of stage lamps in the prior art is provided, white light is radiated from an L ED chip array on a copper substrate 1, the white light is collimated into nearly parallel light by a collimating lens group which is installed on a lens support 2 and corresponds to the L ED chip one by one, and is focused on a specific focus position by a condenser lens to form a specific uniform white light illumination area, wherein the collimating lens is composed of two lenses, and the second lens is spliced to form a lens array 3.

at present, a high-power light source is applied, so that large heat is generated in the light source, the problem of heat dissipation is urgently solved, the heat of the high-power light source is mainly from two aspects, namely, the heat radiated by an L ED chip is partially taken away by a copper substrate, and is partially transferred to a lens support to cause the temperature of the lens support and an adjacent lens array to rise, and the heat emitted by CMY is concentrated near the center of an optical axis after passing through a condenser lens and is mainly concentrated on the surface of the light source and a collimation system, and the lens support can secondarily emit the energy to the lens array, so that the temperature of the lens array, the lens support and the central area of the copper substrate is overhigh, the center of the lens array is cracked, the L ED junction temperature of the central area of the copper substrate is overhigh, and the service life of the L ED.

SUMMERY OF THE UTILITY MODEL

the utility model aims at overcoming above-mentioned prior art's at least one defect, provide a high-power L ED lighting device for solve the problem that lens array center explodes and splits and central region L ED junction temperature is too high.

The technical proposal adopted by the utility model is that,

the utility model provides a high-power L ED lighting device, is including the base plate, lens support and the lens array that have the L ED chip of installing in proper order, be equipped with the collimating lens with L ED chip one-to-one on the lens support, the center of lens support is hollow out construction, be equipped with on the base plate with the corresponding bottom plate in hollow out construction position, the bottom plate is provided with the boss, forms the installation inner chamber of L ED chip between boss and the bottom plate, and is equipped with the collimating lens that corresponds with L ED chip on the boss.

the utility model discloses on prior art's basis, set up original lens support center into hollow out construction, form a new lens support, install the bottom plate on the base plate that corresponds with the hollow out construction region, be equipped with the boss on the bottom plate, collimating lens in the hollow out construction region no longer fixes on the lens support, but hold and lean on the boss, the cavity that forms between boss and the bottom plate is used for installing L ED chip, the effect of boss is equivalent to the lens support this moment, collimating lens installs on the boss, make collimating lens and L ED form the relation of one-to-one and keep certain distance with L ED, the utility model discloses a set up the center of lens support into hollow out construction, avoid appearing lens support deformation because of central region high temperature, avoid lens support central region heat radiation to transmit lens array central region simultaneously, also avoided light to pass through on the secondary reflection back lens array central region, solve lens array central region and peripheral problem of exploding because of being heated inhomogeneously, set up the bottom plate on the base plate position that hollow out construction corresponds, increased the heat dissipation face, be favorable to the heat conduction, make whole board temperature descend, solve central region L regional L and use the problem that the ED, the life-span that the.

Furthermore, the boss comprises a plurality of sub-bosses, and gaps are formed among the sub-bosses.

have the breach between the sub-boss, the L ED chip cavity of being convenient for ventilates, improves L ED's radiating efficiency.

furthermore, the number of the sub-bosses is two, and the sub-bosses are of an L-shaped structure.

the utility model discloses a boss comprises two sub-bosss, and two sub-bosss that are L type structure are symmetrical structure.

Furthermore, the inner side surface of the boss is arc-shaped, and/or the bending part of the outer side surface of the boss is arc-shaped.

The circular arc design of the inner side surface of the boss is designed to meet the requirement of the circular bottom surface of the collimating lens, and the circular arc design is better attached to the bottom surface of the collimating lens, so that the collimating lens is convenient to mount and stable.

Furthermore, the top end of the boss is in a step shape and comprises a first step surface arranged close to the inside and a second step surface arranged close to the outside.

The boss top is the echelonment, and the upper surface includes first step face and second step face, and first step face is close to the boss inboard, and the second step face is close to the boss outside, and first step face height is less than second step face height. The utility model discloses a be the boss on echelonment top for the small lens installation is firm or in the installation, and the small lens position can not take place to remove.

Further, the height of the collimating lens arranged on the boss is consistent with that of the collimating lens on the lens support.

The height of the step designed by the boss on the base plate ensures that the height of the collimating lens arranged on the boss is consistent with that of the collimating lens on the lens support, so that the optical efficiency is prevented from being influenced.

Further, the boss is of a detachable installation structure.

furthermore, the collimating lens corresponding to the L ED chip is arranged on the boss and is of a detachable mounting structure.

The utility model discloses in, the whole demountable installation structure that is of base plate, wherein, central zone's bottom plate, boss and the mounting structure who installs the collimating lens on the boss are demountable installation structure, and when central zone's bottom plate, boss and collimating lens mounting structure take place inevitable damage, are convenient for replace central zone's mounting structure, save the cost.

furthermore, the edge of the bottom plate is provided with a lead hole, and the lead hole is used for communicating an LED chip circuit on the bottom plate with the whole circuit.

the utility model provides a bottom plate edge is provided with the pin hole, and the bottom plate is in the same place through welding or other modes installation with the base plate, the pin hole on the bottom plate edge for the gold thread is connected and is made L ED chip circuit and whole circuit intercommunication on the bottom plate.

Furthermore, the hollow structure is a quadrilateral structure, and the bottom plate is made of ceramic materials.

according to the arrangement rule of actual process and collimating lens, rationally set up hollow out construction in the middle of into quadrilateral structure, the utility model discloses well bottom plate adopts the ceramic material, and the radiating effect is good, helps improving the life of central region L ED chip.

Compared with the prior art, the beneficial effects of the utility model are that:

1. The utility model discloses a set up lens support central area as hollow out construction, avoided appearing lens support deformation because of central area high temperature, avoided lens support central area thermal radiation to transmit lens array central area simultaneously, also avoided light to act on lens array central area after the secondary reflection, solve lens array central area and peripheral problem of exploding because of being heated unevenly;

2. the utility model discloses set up the bottom plate on the base plate position that hollow out construction corresponds, increased the cooling surface, be favorable to the heat conduction for whole board temperature descends, solves the too high problem of central zone L ED junction temperature, improves L ED's life.

3. The utility model discloses an improvement to current structure does not relate to optical element, and optical efficiency is not influenced, changes with low costs, does not influence the efficiency of volume production.

Drawings

Fig. 1 is a block diagram of the prior art.

Fig. 2 is a structural diagram of the present invention.

Fig. 3 is a structural diagram of the lens holder of the present invention.

Fig. 4 is an overall mounting structure view of the collimator lens mounted on the boss.

Fig. 5 is a view showing an installation structure of the base plate and the boss.

Detailed Description

The drawings of the present invention are for illustration purposes only and are not to be construed as limiting the invention. For a better understanding of the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

Examples

as shown in fig. 2, the high-power L ED lighting device includes a substrate 1 with L ED chips, a lens support 2 and a lens array 3, which are sequentially mounted, wherein collimating lenses corresponding to the L ED chips one to one are disposed on the lens support 2, a hollow structure 4 is disposed in the center of the lens support, a bottom plate 5 corresponding to the hollow structure 4 is disposed on the substrate, a boss is disposed on the bottom plate, and the bottom plate can be connected to the substrate by welding or other methods.

for the present embodiment, more specifically, the substrate with the led chip is used for heat dissipation, so the substrate may be a copper substrate, an aluminum substrate or other materials with good heat conductivity, the bottom plate is also used for heat dissipation, the bottom plate may also be made of a material with good heat dissipation effect, and in the present embodiment, the bottom plate is made of a ceramic material.

As shown in fig. 3, the hollow structure in this embodiment is a quadrilateral structure 4.

as shown in fig. 4, fig. 4 is a schematic view illustrating the mounting of the collimating lens on the base plate, the bosses 6 are disposed on the base plate 5, mounting cavities of the L ED chips are formed between the bosses 6, and the collimating lenses corresponding to the L ED chips one to one are mounted on the bosses 6.

as shown in fig. 5, fig. 5 is a schematic structural view of the bottom plate 5 and the boss 6, in this embodiment, the boss includes two sub-bosses, the sub-bosses are in an L-shaped structure, and a gap is formed between the sub-bosses.

Preferably, in this embodiment, the inner side surface of the boss 6 is arc-shaped, and/or the bending part of the outer side surface of the boss is arc-shaped.

Preferably, in this embodiment, the top end of the boss 6 is stepped, and includes a first step surface disposed inside and a second step surface disposed outside.

Preferably, the height of the collimating lens mounted on the boss 6 in this embodiment is the same as the height of the collimating lens on the lens holder 2.

preferably, in this embodiment, the boss 6 is a detachable mounting structure, and the collimating lens corresponding to the led chip on the boss 6 is a detachable mounting structure.

For the embodiment, more specifically, the whole substrate is a detachable mounting structure, and the bottom plate, the boss and the collimating lens mounted on the boss in the central region are all detachably mounted, so that the central region can be replaced after being damaged.

preferably, in this embodiment, the bottom plate edge is provided with a lead hole 7, and the lead hole 7 is used for communicating the L ED chip circuit on the bottom plate with the integrated circuit.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not limitations to the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. the utility model provides a high-power L ED lighting device, is including the base plate, lens support and the lens array that have the L ED chip that install in proper order, be equipped with on the lens support with the collimating lens of L ED chip one-to-one, its characterized in that, the center of lens support is hollow out construction, be equipped with on the base plate with the corresponding bottom plate in hollow out construction position, the bottom plate is provided with the boss, forms the installation inner chamber of L ED chip between boss and the bottom plate, and is equipped with the collimating lens that corresponds with the L ED chip on the boss.

2. a high power L ED lighting device according to claim 1, wherein said projection comprises a plurality of sub-projections, and there are gaps between said sub-projections.

3. a high power L ED lighting device according to claim 2, wherein said number of sub-bosses is two, and the sub-bosses are L-shaped.

4. a high power led lighting device according to claim 1, wherein the inner side of the boss is arc-shaped, and/or the bending of the outer side of the boss is arc-shaped.

5. A high power L ED lighting device as claimed in any one of claims 1 to 4, wherein the top of said boss is stepped to include a first stepped surface disposed inwardly and a second stepped surface disposed outwardly.

6. a high power L ED lighting device as claimed in claim 1, wherein said boss mounted collimating lenses are of substantially the same height as said lens holders.

7. a high power L ED lighting device as claimed in claim 1, wherein said boss is a removable mounting structure.

8. a high power L ED lighting device as claimed in claim 1, wherein the collimating lens corresponding to the L ED chip is detachably mounted on the boss.

9. a high power L ED lighting device according to claim 1, wherein the edge of the base plate is provided with wire holes for connecting the L ED chip circuit on the base plate with the integrated circuit.

10. the high power L ED lighting device according to claim 1, wherein the hollow structure is a quadrilateral structure, and the bottom plate is made of ceramic.