CN210837763U - 一种大尺寸硅圆片 - Google Patents
一种大尺寸硅圆片 Download PDFInfo
- Publication number
- CN210837763U CN210837763U CN201922000762.2U CN201922000762U CN210837763U CN 210837763 U CN210837763 U CN 210837763U CN 201922000762 U CN201922000762 U CN 201922000762U CN 210837763 U CN210837763 U CN 210837763U
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- Prior art keywords
- silicon wafer
- groove
- grinding wheel
- silicon
- thinning
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 141
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 141
- 239000010703 silicon Substances 0.000 title claims abstract description 141
- 235000012431 wafers Nutrition 0.000 description 93
- 238000000034 method Methods 0.000 description 15
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 235000012046 side dish Nutrition 0.000 description 3
- 229910001651 emery Inorganic materials 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922000762.2U CN210837763U (zh) | 2019-11-19 | 2019-11-19 | 一种大尺寸硅圆片 |
Applications Claiming Priority (1)
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CN201922000762.2U CN210837763U (zh) | 2019-11-19 | 2019-11-19 | 一种大尺寸硅圆片 |
Publications (1)
Publication Number | Publication Date |
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CN210837763U true CN210837763U (zh) | 2020-06-23 |
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Family Applications (1)
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CN201922000762.2U Active CN210837763U (zh) | 2019-11-19 | 2019-11-19 | 一种大尺寸硅圆片 |
Country Status (1)
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CN (1) | CN210837763U (zh) |
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2019
- 2019-11-19 CN CN201922000762.2U patent/CN210837763U/zh active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Pei Kunyu Inventor after: Xie Yan Inventor after: Yang Chunxue Inventor after: Liu Miao Inventor after: Chang Xueyan Inventor after: Lv Ying Inventor after: Xu Rongqing Inventor after: Zhu Bin Inventor after: Liu Jiaolong Inventor after: Wu Wei Inventor after: Sun Chenguang Inventor after: Liu Jianwei Inventor after: You Bailing Inventor after: Wang Juan Inventor after: Liu Yuan Inventor before: Pei Kunyu Inventor before: Xie Yan Inventor before: Yang Chunxue Inventor before: Liu Miao Inventor before: Chang Xueyan Inventor before: Lv Ying Inventor before: Xu Rongqing Inventor before: Zhu Bin Inventor before: Liu Jiaolong Inventor before: Wu Wei Inventor before: Sun Chenguang Inventor before: Liu Jianwei Inventor before: You Bailing Inventor before: Wang Juan Inventor before: Liu Yuan |
|
CB03 | Change of inventor or designer information | ||
CP03 | Change of name, title or address |
Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |
|
CP03 | Change of name, title or address |