CN210835978U - Computer hardware temperature control device - Google Patents
Computer hardware temperature control device Download PDFInfo
- Publication number
- CN210835978U CN210835978U CN202020049767.4U CN202020049767U CN210835978U CN 210835978 U CN210835978 U CN 210835978U CN 202020049767 U CN202020049767 U CN 202020049767U CN 210835978 U CN210835978 U CN 210835978U
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- CN
- China
- Prior art keywords
- type semiconductors
- insulating shell
- heat conduction
- fan
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000005678 Seebeck effect Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model provides a computer hardware temperature control device which has simple structure and low production cost, can fully utilize the heat energy generated by the computer to dissipate heat and save energy consumption, and comprises a radiator body and a radiator fan, wherein the radiator fan is arranged on the radiator body, the computer hardware temperature control device also comprises a thermoelectric generator and a first radiating fin, the thermoelectric generator comprises an insulating shell, a plurality of conducting strips, a plurality of N-type semiconductors and a plurality of P-type semiconductors, the thermoelectric generator is arranged on the radiator body, the N-type semiconductors and the P-type semiconductors are arranged in the insulating shell at intervals, the N-type semiconductors and the P-type semiconductors are connected in series through the conducting strips, one side of the insulating shell is thermally conducted with the radiator body, the other side of the insulating shell is thermally conducted with the first radiating fin, the first radiating fin is arranged on the air duct of the first fan, the first heat dissipation fan is electrically connected with the conductive sheet.
Description
Technical Field
The utility model relates to a computer hardware technical field, in particular to computer hardware temperature control device.
Background
Referring to fig. 2, a modern home computer generally includes a chassis, a motherboard 2 and a power supply 22 are accommodated in the chassis, the motherboard is loaded with electronic devices such as a CPU and a graphics card 21, in order to provide heat dissipation for the CPU, a heat sink is disposed on the CPU, the heat sink includes an air-cooled heat sink and a water-cooled heat sink, the air-cooled heat sink can dissipate the temperature of the CPU into the air of the chassis, in order to exhaust the hot air in the chassis and avoid heat accumulation in the chassis, an exhaust fan 3 is disposed behind the chassis, for a user with a high requirement for heat dissipation performance, a plurality of intake fans are additionally installed at the front of the chassis, and a plurality of exhaust fans are additionally installed at the top of the chassis. More fans result in greater power consumption, and the heat energy of the CPU is wasted.
SUMMERY OF THE UTILITY MODEL
Therefore, to foretell problem, the utility model provides a simple structure, low in production cost, the heat energy that can make full use of computer self produced dispels the heat, energy saving consumes's computer hardware temperature control device.
In order to realize the technical problem, the utility model discloses the solution who takes does: the computer hardware temperature control device comprises a radiator body and a radiator fan, the radiator fan is arranged on the radiator body, and also comprises a thermoelectric generator and a first radiating fin, the thermoelectric generator comprises an insulating shell, a plurality of conducting strips, a plurality of N-type semiconductors and a plurality of P-type semiconductors, the thermoelectric generator is arranged on the radiator body, the N-type semiconductor and the P-type semiconductor are arranged in the insulating shell at intervals, the N-type semiconductor and the P-type semiconductor are connected in series through the conducting strip, one side of the insulating shell is thermally conducted with the radiator body, the other side of the insulating shell is in heat conduction with a first radiating fin, the first radiating fin is arranged on an air duct of a first fan, and the first radiating fan is electrically connected with the conductive sheet.
The further improvement is that: the radiator body comprises a second radiating fin and a plurality of first heat conduction copper pipes, the second radiating fin is in heat conduction with the first heat conduction copper pipes, and the first heat conduction copper pipes partially extend out of the second radiating fin and are attached to the insulating shell for heat conduction.
The further improvement is that: and a plurality of second heat conduction copper pipes are arranged on the insulating shell, and the second heat conduction copper pipes penetrate through the first radiating fins and are in heat conduction with the first radiating fins.
The further improvement is that: the insulating shell is a ceramic shell.
The further improvement is that: the conducting strip is a copper sheet.
By adopting the technical scheme, the beneficial effects of the utility model are that: the effectual heat energy that has utilized the computer to produce has avoided the loss of the energy, and the effectual kinetic energy that is used for first fan with heat energy conversion to can adjust first fan power by oneself according to computer hardware's calorific capacity, can effectively assist quick-witted case with hot-air outgoing, play supplementary radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of a computer hardware temperature control device according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of the use of the computer hardware temperature control device according to the embodiment of the present invention.
Detailed Description
The present invention will now be further described with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 and 2 the embodiment of the present invention discloses a computer hardware temperature control device, including radiator body 5, thermoelectric generator, including second fin 51, five first heat conduction copper pipes 52 on radiator body 5, first heat conduction copper pipes 52 wear to locate second fin 51 through wearing the PIN technology to carry out heat-conduction with second fin 51, second fin 51 passes through the steel wire buckle (steel wire buckle is the buckle commonly used to the radiator, and its concrete structure is the well-known technique in the art, does not describe herein repeatedly) lock has radiator fan 53, radiator fan 53 is connected through power cord and mainboard 2 and is rotated by mainboard 2 power supply drive.
The thermoelectric generator comprises an insulating shell 68, a plurality of conducting strips 66, a plurality of N-type semiconductors 61 and a plurality of P-type semiconductors 62, wherein the N-type semiconductors 61 and the P-type semiconductors 62 are arranged in the insulating shell 68 at intervals, and the N-type semiconductors 61 and the P-type semiconductors 62 are connected in series through the conducting strips 66.
The first heat conducting copper pipe 52 extends partially to the outside of the second heat sink 51 and is attached to one side of the insulating housing 68 for heat conduction, a heat conducting copper plate 521 is fixedly arranged on the first heat conducting copper pipe 52, the heat-conducting copper plate 521 is detachably connected with the insulating shell 68 through a screw, heat-conducting silicone grease is coated between the heat-conducting copper plate 521 and the insulating shell 68 for heat conduction, a first heat sink 67 is arranged on the other side of the insulating shell 68 for heat conduction, a first fan 63 is arranged at the upper end part of the case close to the air outlet fan, the first radiating fins 67 are arranged on the air channel of the first fan 63, in order to make the first fan 63 better radiate heat to the first heat sink 67, the first fan 63 is attached to the first heat sink 67, the wind direction of the first fan 63 can exhaust hot air in the chassis out of the chassis, and the first fan 63 is electrically connected to the conductive sheet 66.
In order to better cool the other side of the insulating shell 68 and further improve the temperature difference between the two sides of the thermoelectric generator, three second heat conducting copper pipes 65 are arranged on the insulating shell 68, and the second heat conducting copper pipes 65 penetrate through the first heat radiating fins 67 through the PIN transferring process and are in heat conduction with the first heat radiating fins 67.
The insulating housing 68 is a ceramic housing for ease of manufacture and to improve the insulating and thermal conductivity of the housing.
To improve the efficiency of the electrical conduction, the conductive sheet 66 is a copper sheet.
The utility model discloses computer hardware temperature control device, install radiator body 5 on the CPU heat source, when the computer is worked, the heat source generates heat, the heat passes to one side of thermoelectric generator through first heat conduction copper pipe 52, the opposite side of two thermoelectric generator is heat-conducting mutually with first fin 67, the temperature is relatively low, the temperature at both ends of thermoelectric generator forms the difference in temperature at this moment, the function of electricity generation has been realized to electric current production because of the seebeck effect, first fin 67 keeps the lower temperature under the effect of first fan 63, guarantee that the temperature of thermoelectric generator both sides keeps the difference in temperature to generate electricity continuously, drive first fan 63 simultaneously and dispel the heat to first fin 67, when the temperature of heat source risees, the difference in temperature of thermoelectric generator both sides increases, the output of thermoelectric generator increases, the rotational speed of first fan 63 also promotes thereupon, increase the heat dissipation capacity, when the temperature of the heat source returns to the normal temperature, the thermoelectric generator does not generate electricity any more, and the first fan 63 stops working.
Under the condition that the air exhaust fan 3 is installed on the case, the first fan 63 can play a good role in assisting heat dissipation, and the heat energy generated when the computer runs is fully utilized, so that the effects of energy conservation and emission reduction are achieved. And the operation speed of the first fan 63 is automatically adjusted according to the heat generation amount of the computer.
Modifications and variations of the present invention are within the scope of the claims and are not limited by the disclosure of the embodiments.
Claims (5)
1. Computer hardware temperature control device, including radiator body, radiator fan set up in on the radiator body, its characterized in that: the thermoelectric generator comprises an insulating shell, a plurality of conducting strips, a plurality of N-type semiconductors and a plurality of P-type semiconductors, the thermoelectric generator is arranged in the radiator body, the N-type semiconductors and the P-type semiconductors are arranged in the insulating shell at intervals, the N-type semiconductors and the P-type semiconductors are connected in series through the conducting strips, one side of the insulating shell is in heat conduction with the radiator body, the other side of the insulating shell is in heat conduction with the first radiating fin, the first radiating fin is arranged on an air channel of the first fan, and the first radiating fan is electrically connected with the conducting strips.
2. The computer hardware temperature control device of claim 1, wherein: the radiator body comprises a second radiating fin and a plurality of first heat conduction copper pipes, the second radiating fin is in heat conduction with the first heat conduction copper pipes, and the first heat conduction copper pipes partially extend out of the second radiating fin and are attached to the insulating shell for heat conduction.
3. The computer hardware temperature control device of claim 1, wherein: and a plurality of second heat conduction copper pipes are arranged on the insulating shell, and the second heat conduction copper pipes penetrate through the first radiating fins and are in heat conduction with the first radiating fins.
4. The computer hardware temperature control device of claim 1, wherein: the insulating shell is a ceramic shell.
5. The computer hardware temperature control device of claim 1, wherein: the conducting strip is a copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020049767.4U CN210835978U (en) | 2020-01-10 | 2020-01-10 | Computer hardware temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020049767.4U CN210835978U (en) | 2020-01-10 | 2020-01-10 | Computer hardware temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210835978U true CN210835978U (en) | 2020-06-23 |
Family
ID=71281688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020049767.4U Expired - Fee Related CN210835978U (en) | 2020-01-10 | 2020-01-10 | Computer hardware temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210835978U (en) |
-
2020
- 2020-01-10 CN CN202020049767.4U patent/CN210835978U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200623 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |