CN209169132U - A kind of radiator of power component - Google Patents
A kind of radiator of power component Download PDFInfo
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- CN209169132U CN209169132U CN201821903171.5U CN201821903171U CN209169132U CN 209169132 U CN209169132 U CN 209169132U CN 201821903171 U CN201821903171 U CN 201821903171U CN 209169132 U CN209169132 U CN 209169132U
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- hot
- heat dissipation
- side heat
- radiator
- dissipation device
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Abstract
The utility model discloses a kind of radiators of power component, it includes semiconductor temperature differential power generating sheet, cold end radiator, hot-side heat dissipation device and hot-side heat dissipation fan；The cold end radiator be arranged in the cold endface of semiconductor temperature differential power generating sheet and with cold end face contact；The hot-side heat dissipation device is connected with power component, and be arranged in semiconductor temperature differential power generating sheet hot endface and with hot end face contact；The hot-side heat dissipation fan is arranged on hot-side heat dissipation device and is connected by conducting wire with semiconductor temperature differential power generating sheet.This thermal energy is converted to electric energy as radiator fan power supply by the thermal energy that the radiator is generated when can effectively be worked using power component.
Description
Technical field
The utility model relates to radiator fields, refer in particular to a kind of radiator of power component.
Background technique
At present rectification module, IGBT module, silicon controlled module constant power element radiator be by a radiator outside
Add a radiator fan composition, wherein radiator is made of several metal fins；The radiator fan of the radiator must be by
The power supply of one additional power source, no matter radiator temperature height, radiator fan all rotating.It will disappear when radiator fan operates in this way
Consume a large amount of electric energy.And the thermal energy generated when power component work also loses in vain.
Summary of the invention
The purpose of this utility model is that: in view of the above problems, a kind of radiator of power component is provided, it should
The thermal energy that radiator is generated when can effectively be worked using power component, it is radiator fan that this thermal energy, which is converted to electric energy,
Power supply.
The technical solution adopted in the utility model is as follows:
A kind of radiator of power component, it include semiconductor temperature differential power generating sheet, cold end radiator, hot-side heat dissipation device and
Hot-side heat dissipation fan；The cold end radiator be arranged in the cold endface of semiconductor temperature differential power generating sheet and with cold end face contact；Institute
Hot-side heat dissipation device is stated to be connected with power component, and be arranged in semiconductor temperature differential power generating sheet hot endface and with hot end face contact；
The hot-side heat dissipation fan is arranged on hot-side heat dissipation device and is connected by conducting wire with semiconductor temperature differential power generating sheet.
In above structure, semiconductor temperature differential power generating sheet utilizes " Seebeck effect " that thermal energy is converted directly into electric energy, Sai Bei
The working principle of gram effect is that a temperature difference is arranged at two pieces of semiconductor both ends of different nature, then will produce at semiconductor both ends
Raw direct electromotive force., as long as can generate electricity always with the presence of the temperature difference；The semiconductor temperature differential power generating sheet power generation of the application is then benefit
The thermal energy of power component is converted to electric energy with this principle, is powered for radiator fan；
At work: when power component does not work, semiconductor temperature differential power generating sheet hot end face and cold end face do not have the temperature difference, and half
Conductor thermoelectric generation film Non voltage output, hot-side heat dissipation fan do not rotate.When power semiconductor component start-up operation, power component
When having electric current to flow through, power component fever, since power component is connected with hot-side heat dissipation device, then power component is transferred heat to
Hot-side heat dissipation device, hot-side heat dissipation device temperature increases, and cold junction temperature is constant, then this semiconductor temperature differential power generating sheet hot end face and cold end
There are the temperature difference, semiconductor temperature differential power generating sheet starts to generate electricity in face, as hot-side heat dissipation device temperature constantly increases, semiconductor temperature differential generating
Piece hot end face is continued to increase with the cold end face temperature difference, and semiconductor temperature differential power generating sheet output voltage constantly increases, then hot-side heat dissipation wind
Fan starts to rotate, and takes away the heat on hot-side heat dissipation device, and then radiate to power component.The rotation of hot-side heat dissipation fan starts
When cooling down to hot-side heat dissipation device, hot-side heat dissipation device temperature is reduced, and semiconductor temperature differential power generating sheet hot end face and the cold end face temperature difference reduce,
Semiconductor temperature differential power generating sheet output voltage reduces, and cooling fan rotation speed reduces.When cold end radiator and hot-side heat dissipation device reach heat
When equalization point, hot-side heat dissipation rotation speed of the fan is constant.
The structure effectively utilizes the thermal energy of power component, saves the electric energy of driving hot-side heat dissipation fan.
Further, the semiconductor temperature differential power generating sheet is at least one.It can by multiple semiconductor temperature differential power generating sheets
It is further to improve thermoelectric conversion efficiency.
Further, at least one hot-side heat dissipation fan is set on the hot-side heat dissipation device.
Further, the semiconductor temperature differential power generating sheet is multiple, and multiple hot-side heat dissipation wind are provided on hot-side heat dissipation device
Fan；The semiconductor temperature differential power generating sheet and hot-side heat dissipation fan are by conducting wire composition closed circuit, wherein each semiconductor temperature difference is sent out
Electric piece is parallel with one another, and each hot-side heat dissipation device is parallel with one another.
Further, the anode of each hot-side heat dissipation fan is serially connected with zener diode.
Further, the hot-side heat dissipation device and cold end radiator are attached by bolt, by semiconductor temperature differential generating
Piece is clipped between hot-side heat dissipation device and cold end radiator.
Further, the hot-side heat dissipation device is identical with cold end heat spreader structures, includes bottom plate and setting on bottom plate
Metal fin；Bolt connecting hole is offered on the bottom plate.
Further, the cold end face contact of the bottom plate of cold end radiator and semiconductor temperature differential power generating sheet, hot-side heat dissipation device
The hot end face contact of bottom plate and semiconductor temperature differential power generating sheet, the bottom plate of cold end radiator and the bottom plate of hot-side heat dissipation device pass through bolt
It is attached, semiconductor temperature differential power generating sheet is clipped between two bottom plates；The hot-side heat dissipation fan is arranged by bolt in hot end
The top of radiator.
Further, power component mounting groove, the power component insertion power member are offered on the hot-side heat dissipation device
It is connected in part mounting groove with hot-side heat dissipation device.
Further, power component mounting groove is extended at the top of hot-side heat dissipation device from the bottom plate of hot-side heat dissipation device；Function
The bottom of rate member mounting recess offers threaded hole, and the threaded hole is located on the bottom plate of hot-side heat dissipation device；Power component insertion
In power component mounting groove, and it is fixed by screws on the bottom plate of hot-side heat dissipation device.
By the way that power component to be inserted into power component mounting groove, power component is by the heat dissipation metal of entire hot-side heat dissipation device
Piece package, hot-side heat dissipation device is preferably transferred heat to convenient for power component, improves energy conversion efficiency.
In conclusion by adopting the above-described technical solution, the beneficial effects of the utility model are:
The thermal energy that power component generates can be used for the utility model, and thermal energy is made to pass through semiconductor temperature differential power generating sheet
Electric energy is converted to as radiator fan power supply, makes radiator fan that need not save power consumption in external power supply in radiation processes.And
Radiating fan rotation speed can be adjusted according to the heat that power component generates.
Detailed description of the invention
Fig. 1 is the main view of the utility model；
Fig. 2 is the top view of the utility model；
Fig. 3 is the bottom view of the utility model；
Fig. 4 is to tie from the power component for looking up direction of Fig. 1 with position of the power component mounting groove on hot-side heat dissipation device
Composition；
It is 3 that Fig. 5, which is semiconductor temperature differential power generating sheet, main view when hot-side heat dissipation fan is 2；
It is 3 that Fig. 6, which is semiconductor temperature differential power generating sheet, top view when hot-side heat dissipation fan is 2；
It is 3 that Fig. 7, which is semiconductor temperature differential power generating sheet, bottom view when hot-side heat dissipation fan is 2；
It is 3 that Fig. 8, which is semiconductor temperature differential power generating sheet, wiring diagram when hot-side heat dissipation fan is 2.
Specific embodiment
With reference to the accompanying drawing, the utility model is described in detail.
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
A kind of radiator of power component, it includes semiconductor temperature differential power generating sheet 2, cold end radiator 1, hot-side heat dissipation device
3 and hot-side heat dissipation fan 4；The cold end radiator 1 is arranged in the cold endface of semiconductor temperature differential power generating sheet 2 and connects with cold end face
Touching；The hot-side heat dissipation device 3 is connected with power component 5, and hot endface and and the hot end of semiconductor temperature differential power generating sheet 2 is arranged in
Face contact；The hot-side heat dissipation fan 4 is arranged on hot-side heat dissipation device 3 and is connected by conducting wire with semiconductor temperature differential power generating sheet 2.
The semiconductor temperature differential power generating sheet 2 can be one or more, can be connected by the way of in parallel or series
It connects.One or more hot-side heat dissipation fans 4 are set on the hot-side heat dissipation device 3, can be connected by the way of in parallel or series.
In the present embodiment, the semiconductor temperature differential power generating sheet 2 is multiple, and multiple hot ends are provided on hot-side heat dissipation device 3
Radiator fan 4；As viewed in figures 5-8, semiconductor temperature differential power generating sheet 2 is 3, and hot-side heat dissipation fan 4 is 2, wherein described partly to lead
Body thermoelectric generation film 2 and hot-side heat dissipation fan 4 are by conducting wire composition closed circuit, wherein each semiconductor temperature differential power generating sheet 2 is mutual
Parallel connection, each hot-side heat dissipation device 3 are parallel with one another.
The anode of each hot-side heat dissipation fan 4 is serially connected with zener diode.
The hot-side heat dissipation device 3 and cold end radiator 1 are attached by bolt, and semiconductor temperature differential power generating sheet 2 is clipped in heat
It holds between radiator 3 and cold end radiator 1.
The hot-side heat dissipation device 3 is identical with 1 structure of cold end radiator, includes bottom plate 101 and being arranged on bottom plate 101
Metal fin 102, metal fin 102 constitute the cylinder of rectangle；Bolt connecting hole is offered on the bottom plate 101.
The bottom plate 101 of cold end radiator 1 and the cold end face contact of semiconductor temperature differential power generating sheet 2, the bottom plate of hot-side heat dissipation device 3
101 with the hot end face contact of semiconductor temperature differential power generating sheet 2, the bottom plate 101 of cold end radiator 1 and the bottom plate 101 of hot-side heat dissipation device 3
It is attached by bolt, semiconductor temperature differential power generating sheet 2 is clipped between two bottom plates 101；And the bottom plate 101 of hot-side heat dissipation device 3,
One layer of heat-conducting silicone grease is also coated on the bottom plate 101 of cold end radiator 1 and the contact surface of semiconductor temperature differential power generating sheet 2.The hot end
The top of hot-side heat dissipation device 3 is arranged in by bolt for radiator fan 4.
Power component mounting groove 6 is offered on the hot-side heat dissipation device 3, the power component 5 is inserted into power component installation
It is connected in slot 6 with hot-side heat dissipation device 3.
Power component mounting groove 6 extends to from the bottom plate 101 of hot-side heat dissipation device 3 from the top of hot-side heat dissipation device 3；Power member
The bottom of part mounting groove 6 offers threaded hole, and the threaded hole is located on the bottom plate 101 of hot-side heat dissipation device 3；Power component 5 is inserted
Enter in power component mounting groove 6, and is fixed by screws on the bottom plate 101 of hot-side heat dissipation device 3.
The working principle of the utility model is as follows:
Power component 5 is mounted on hot-side heat dissipation device 3 when use, when power component 5 does not work, semiconductor temperature difference hair
Electric 2 hot end face of piece and cold end face do not have the temperature difference, 2 Non voltage output of semiconductor temperature differential power generating sheet, and hot-side heat dissipation fan 4 does not rotate.
When power semiconductor component 5 is started to work, when power component 5 has electric current to flow through, power component 5 generates heat, due to 5 He of power component
Hot-side heat dissipation device 3 is connected, then power component 5 transfers heat to hot-side heat dissipation device 3, and 3 temperature of hot-side heat dissipation device increases, and cold end
Temperature-resistant, then there are the temperature difference, semiconductor temperature differential power generating sheet 2 starts to send out for this 2 hot end face of semiconductor temperature differential power generating sheet and cold end face
Electricity, as 3 temperature of hot-side heat dissipation device constantly increases, 2 hot end face of semiconductor temperature differential power generating sheet is continued to increase with the cold end face temperature difference, and half
2 output voltage of conductor thermoelectric generation film constantly increases, and when this voltage is greater than 6V, is connected on 4 anode of hot-side heat dissipation fan
Zener diode conducting, hot-side heat dissipation fan 4 start to rotate, and take away the heat on hot-side heat dissipation device 3, and then to power component 5
It radiates.When the rotation of hot-side heat dissipation fan 4 starts to cool down to hot-side heat dissipation device 3,3 temperature of hot-side heat dissipation device is reduced, semiconductor
2 hot end face of thermoelectric generation film and the cold end face temperature difference reduce, and 2 output voltage of semiconductor temperature differential power generating sheet reduces, hot-side heat dissipation fan 4
Revolving speed reduces.When cold end radiator 1 and hot-side heat dissipation device 3 reach heat balance point, 4 invariablenes turning speed of hot-side heat dissipation fan.
The structure effectively utilizes the thermal energy of power component 5, and hot-side heat dissipation fan 4 is not necessarily to external power supply, economize on electricity
Energy conservation；Calorific value size automatically adjusts when radiating fan rotation speed works with power component 5.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. a kind of radiator of power component, it is characterised in that: it includes semiconductor temperature differential power generating sheet (2), cold end radiator
(1), hot-side heat dissipation device (3) and hot-side heat dissipation fan (4)；The cold end radiator (1) is arranged in semiconductor temperature differential power generating sheet (2)
Cold endface and with cold end face contact；The hot-side heat dissipation device (3) is connected with power component (5), and is arranged in semiconductor temperature
The hot endface of poor power generation sheet (2) and with hot end face contact；The hot-side heat dissipation fan (4) is arranged on hot-side heat dissipation device (3)
And it is connected by conducting wire with semiconductor temperature differential power generating sheet (2).
2. the radiator of power component according to claim 1, it is characterised in that: the semiconductor temperature differential power generating sheet
(2) it is at least one.
3. the radiator of power component according to claim 1, it is characterised in that: set on the hot-side heat dissipation device (3)
Set at least one hot-side heat dissipation fan (4).
4. the radiator of power component according to claim 1, it is characterised in that: the semiconductor temperature differential power generating sheet
(2) to be multiple, multiple hot-side heat dissipation fans (4) are provided on hot-side heat dissipation device (3)；The semiconductor temperature differential power generating sheet (2) and
Hot-side heat dissipation fan (4) constitutes closed circuit by conducting wire, wherein each semiconductor temperature differential power generating sheet (2) is parallel with one another, each hot end
Radiator (3) is parallel with one another.
5. the radiator of power component according to claim 4, it is characterised in that: each hot-side heat dissipation fan (4)
Anode is serially connected with zener diode.
6. the radiator of power component described in one of -5 according to claim 1, it is characterised in that: the hot-side heat dissipation device
(3) it is attached with cold end radiator (1) by bolt, semiconductor temperature differential power generating sheet (2) is clipped in hot-side heat dissipation device (3) and cold
It holds between radiator (1).
7. the radiator of power component according to claim 6, it is characterised in that: the hot-side heat dissipation device (3) and cold
It holds radiator (1) structure identical, includes the metal fin (102) of bottom plate (101) and setting on bottom plate (101)；It is described
Bottom plate offers bolt connecting hole on (101).
8. the radiator of power component according to claim 7, it is characterised in that: the bottom plate of cold end radiator (1)
(101) it is sent out with the cold end face contact of semiconductor temperature differential power generating sheet (2), the bottom plate (101) and semiconductor temperature difference of hot-side heat dissipation device (3)
The hot end face contact of electric piece (2), the bottom plate (101) of cold end radiator (1) and the bottom plate (101) of hot-side heat dissipation device (3) pass through spiral shell
Bolt is attached, and semiconductor temperature differential power generating sheet (2) is clipped between two bottom plates (101)；The hot-side heat dissipation fan (4) passes through spiral shell
Bolt is arranged at the top of hot-side heat dissipation device (3).
9. the radiator of power component according to claim 8, it is characterised in that: opened on the hot-side heat dissipation device (3)
Equipped with power component mounting groove (6), the power component (5) is inserted into power component mounting groove (6) and hot-side heat dissipation device (3) phase
Even.
10. the radiator of power component according to claim 9, it is characterised in that: power component mounting groove (6) is from warm
It is extended at the bottom plate (101) of hot-side heat dissipation device (3) at the top of end radiator (3)；The bottom of power component mounting groove (6) opens up
There is threaded hole, the threaded hole is located on the bottom plate (101) of hot-side heat dissipation device (3)；Power component (5) is inserted into power component installation
In slot (6), and it is fixed by screws on the bottom plate (101) of hot-side heat dissipation device (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821903171.5U CN209169132U (en) | 2018-11-19 | 2018-11-19 | A kind of radiator of power component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821903171.5U CN209169132U (en) | 2018-11-19 | 2018-11-19 | A kind of radiator of power component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209169132U true CN209169132U (en) | 2019-07-26 |
Family
ID=67338805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821903171.5U Active CN209169132U (en) | 2018-11-19 | 2018-11-19 | A kind of radiator of power component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209169132U (en) |
-
2018
- 2018-11-19 CN CN201821903171.5U patent/CN209169132U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A heat dissipation device for power components Effective date of registration: 20230921 Granted publication date: 20190726 Pledgee: Zhengning County Rural Credit Cooperative Association Pledgor: QINGYANG OUWEI ELECTROMECHANICAL EQUIPMENT CO.,LTD. Registration number: Y2023980058162 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |