CN108615713A - Tandem type thermo-electric generation drives the coupled thermomechanics radiator of cooling fluid - Google Patents
Tandem type thermo-electric generation drives the coupled thermomechanics radiator of cooling fluid Download PDFInfo
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- CN108615713A CN108615713A CN201810471014.XA CN201810471014A CN108615713A CN 108615713 A CN108615713 A CN 108615713A CN 201810471014 A CN201810471014 A CN 201810471014A CN 108615713 A CN108615713 A CN 108615713A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/32—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from a charging set comprising a non-electric prime mover rotating at constant speed
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/34—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses the coupled thermomechanics radiators that a kind of tandem type thermo-electric generation drives cooling fluid, including：Semiconductor temperature differential generating unit, accessory power supply, judges that discharge cell, fluid flow rate adjust unit and cooling fluid heat-sink unit at electricity collection storage unit, the electric energy generated using electricity collection storage unit storing semiconductor thermo-electric generation unit, it powers simultaneously with accessory power supply, it is continual and steady to power；The radiating mode being combined with gaseous fluid using liquid phase fluid, radiator are bonded with semiconductor temperature differential generating unit, and radiating fin is detached with radiator, improve the conduction of velocity of heat from heat source, reach better heat dissipation effect；Semiconductor temperature differential generating unit passes through fluid line cascade Connection with cooling fluid heat-sink unit, it is in short and small space occasion suitable for heating device, realize low cost heat dissipation, solve semiconductor power generation it is unstable, it is discontinuous caused by the discontinuous technical problem of power supply.
Description
Technical field
The invention belongs to the radiator fields of semiconductor temperature differential generating, and in particular to a kind of tandem type thermo-electric generation driving
The coupled thermomechanics radiator of cooling fluid.
Background technology
Industry globalization brings environment and energy crisis, and people are sought for environmentally protective energy technology, the whole mankind
The efficient energy-saving and emission-reduction theory using energy is gradually built up.Have become from a large amount of waste heats produced and life link generates
One potential energy treasure-house.According to energy devalue principle, the lower thermal energy of energy figure can not spontaneous nuclear transformation be high-quality energy,
Thus waste heat is difficult to effectively utilize and directly discharge.With the further investigation of semiconductor and its associated materials technology, Ren Menkai
The value that the concern semiconductor temperature differential generating technology that begins is utilized in waste heat, Waste Heat Recovery.
Traditional power electronic device radiator generally use the preferable material of heat-conductive characteristic then by heat radiation, from
The modes such as right convection current radiate, but this mode radiating efficiency is low, once the heat radiation power of heat source increases, just cannot meet
The radiating requirements of heat source, or heat is taken away using fan is mandatory, this radiating mode is carried compared with the former radiating efficiency
It rises, but needs to consume a large amount of electric energy, of high cost, effects of energy saving and emission reduction is poor.In patent CN201510203633.7, will partly it lead
The cold end of body material is connected with the hot junction of high-power electronic device, and the hot junction of semi-conducting material is connected with liquid-cooling heat radiator, but
It is to need to provide electric energy to cooling piece, cost is caused to increase.In patent CN201410016216.7, sent out using semiconductor temperature difference
The electric energy of power technology, acquisition radiates to projecting apparatus for driving fan, but there are unstable, no for the power generation of unresolved semiconductor
The discontinuous problem of continuous and caused power supply.
Invention content
The purpose of the present invention is to provide always the thermal energy of heat source can be converted to electric energy, more preferable heat dissipation effect is realized
Low energy consumption radiator proposes a kind of coupled thermomechanics radiator of tandem type thermo-electric generation driving cooling fluid, realizes low cost
Heat dissipation, solve semiconductor power generation it is unstable, it is discontinuous caused by the discontinuous technical problem of power supply.
The present invention adopts the following technical scheme that a kind of tandem type thermo-electric generation drives the coupled thermomechanics heat dissipation of cooling fluid
Device, including semiconductor temperature differential generating unit, electricity collection storage unit, accessory power supply, judge discharge cell, fluid flow rate adjust
Unit and cooling fluid heat-sink unit, wherein
Electric energy is transmitted to electricity collection and deposited by semiconductor temperature differential generating unit for converting the thermal energy of heat source to electric energy
Storage unit；
Electricity collection storage unit is used for electric energy by being that cooling fluid heat-sink unit and fluid flow rate are adjusted after energy storage
Unit provides operating voltage；
Accessory power supply is cooling fluid heat-sink unit and fluid flow rate when being used for electricity collection storage unit generation deficiency
It adjusts unit and operating voltage is provided；
Judge discharge cell, is connected with electricity collection storage unit and accessory power supply, the way of output for selecting electric energy,
When the output voltage of electricity collection storage unit is less than accessory power supply output voltage, powered using accessory power supply；When electric energy is received
When collecting the output voltage of storage unit more than accessory power supply output voltage, electricity collection storage unit is utilized to power；
Fluid flow rate adjusts unit, is connected with discharge cell is judged, the heat dissipation speed for adjusting cooling fluid heat-sink unit
Degree and power consumption；
Cooling fluid heat-sink unit adjusts unit with fluid flow rate and is connected, including liquid phase fluid radiator and gas phase stream
Body radiator, liquid phase fluid radiator include liquid phase fluid pipeline and radiator, radiator and semiconductor temperature differential generating list
Member fitting, for radiating for semiconductor temperature differential generating unit, gaseous fluid radiator includes radiating fin, radiating fin with dissipate
Hot device separation, for radiating for liquid phase fluid radiator, liquid phase fluid pipeline is separately positioned in radiator and radiating fin.
Preferably, semiconductor temperature differential generating unit uses the pyroelectric effect generating means of sandwich, semiconductor temperature difference hair
The heat absorbing end of electric unit is bonded heat source, and release end of heat is bonded cooling fluid heat-sink unit.The structure largely increases semiconductor
The temperature difference on thermo-electric generation two sides, to improve generating efficiency.
Preferably, liquid phase fluid radiator includes radiator, liquid phase fluid pipeline, liquid reserve tank and liquid pump, is located at liquid storage
Coolant liquid in case is transported to liquid phase fluid pipeline by liquid pump, is changed by carrying out convection current with semiconductor temperature differential generating unit in radiator
Heat absorbs the heat of semiconductor temperature difference heat-generating units.
Preferably, gaseous fluid radiator includes radiating fin and radiator fan, and radiating fin radiates with liquid phase fluid
Radiator separation in device, radiator fan drive air to carry out forced-convection heat transfer to radiating fin, are dissipated to radiator
Heat.
Preferably, electricity collection storage unit includes charge and discharge protecting module and energy-storage module, wherein
The voltage that charge and discharge protecting module is used to obtain semiconductor thermo-electric generation unit boosts；
Energy-storage module uses super capacitor, is connected with charge and discharge protecting module, for keeping stable operating voltage.
Preferably, fluid flow rate adjust unit include temperature detector, micro-control unit (Micro Control Unit,
Micro-control unit), liquid phase heat dissipation driving and gas phase heat dissipation driving, temperature detector, and will be warm for detecting heat source temperature in real time
Degrees of data is transferred to MCU, during MCU drives according to the different PWM waveform of temperature data output duty cycle to heat dissipation, controls cooling stream
Body heat-sink unit radiating rate passes through the electricity of motor in the Duty ratio control liquid cooling of control PWM waveform but fluid for radiating heat unit
Press regulation motor rotating speed.
The reached advantageous effect of invention：The present invention is a kind of coupled thermomechanics of tandem type thermo-electric generation driving cooling fluid
Radiator realizes low cost heat dissipation, solve semiconductor power generation it is unstable, it is discontinuous caused by the discontinuous technical problem of power supply.
The present invention is utilized according to Seebeck effect, Thomson effect, and the two sides of semiconductor temperature differential generating unit generates temperature difference thus will
Thermal energy is converted to electric energy, and the transfer process of thermoelectric power can enhance heat dissipation effect；It can be by the electric energy of generation using accumulator
It stores and powers for other component, external auxiliary power supply power supply is used when generation deficiency, it is continual and steady to reach power supply
Thermal energy is simultaneously effective utilized in effect, has saved electric energy, and effects of energy saving and emission reduction is preferable；Using liquid phase fluid and gaseous fluid
The radiating mode being combined is compared with monophasic fluid heat dissipation, enhances the conduction of heat from heat source, better heat-radiation effect；It radiates simultaneously
Area can do more, and be suitable for more powerful heat dissipation occasion.
Description of the drawings
Fig. 1 is the system allomeric function block diagram of the present invention；
Fig. 2 is the tandem type structural schematic diagram of the present invention；
Fig. 3 is the vertical view of heating surface in the embodiment of the present invention；
Fig. 4 is the overall diagram of the radiator in the embodiment of the present invention；
Fig. 5 is the left view of the radiator in the embodiment of the present invention；
Fig. 6 is the front view of the radiator in the embodiment of the present invention；
Fig. 7 is the overall diagram of the radiating fin in the embodiment of the present invention；
Fig. 8 is the vertical view of the radiating fin in the embodiment of the present invention；
Fig. 9 is the left view of the radiating fin in the embodiment of the present invention；
Figure 10 is the front view of the radiating fin in the embodiment of the present invention；
Figure 11 is the power supply selection course block diagram in the embodiment of the present invention；
Figure 12 is the electricity collection storage unit circuit figure in the embodiment of the present invention；
Figure 13 is the auxiliary power circuit figure in the embodiment of the present invention；
Figure 14 is the electric discharge judging unit circuit diagram in the embodiment of the present invention；
Figure 15 is Vs power circuit diagrams in the embodiment of the present invention；
Figure 16 is that the fluid flow rate in the embodiment of the present invention adjusts unit flow chart；
Figure 17 is the temperature detection circuit figure of the present invention；
Figure 18 is the PWM program flow diagrams of the present invention；
Figure 19 is the motor regulation and control schematic diagram of the present invention；
Figure 20 is the work flow diagram of the present invention.
Reference numeral：1- radiator fans, 2- radiating fins, 3- radiators, 4- semiconductor temperature differential generating pieces, 5- heat sources, 6-
Electricity collection storage unit, 7- judge that discharge cell, 8- fluid flow rate adjust unit, 9- temperature detectors, 10- liquid reserve tanks, 11-
Liquid pump, 12- liquid phase fluid pipelines.
Specific implementation mode
Below according to attached drawing and technical scheme of the present invention is further elaborated in conjunction with the embodiments.
Fig. 1 is the system allomeric function block diagram of the present invention, according to Fig. 1, designs the tandem type structural schematic diagram of the present invention
As shown in Figure 2.
A kind of coupled thermomechanics radiator of tandem type thermo-electric generation driving cooling fluid, including semiconductor temperature differential generating list
Member, electricity collection storage unit 6, accessory power supply judge that discharge cell 7, fluid flow rate adjust unit and cooling fluid heat dissipation is single
Member, wherein
Electric energy is transmitted to electricity collection and deposited by semiconductor temperature differential generating unit for converting the thermal energy of heat source to electric energy
Storage unit 6；
Electricity collection storage unit 6 is used for electric energy by being cooling fluid heat-sink unit and fluid stream velocity modulation after energy storage
It saves unit and operating voltage is provided；
Accessory power supply is cooling fluid heat-sink unit and fluid flow rate when being used for electricity collection 6 generation deficiency of storage unit
It adjusts unit and operating voltage is provided；
Judge discharge cell 7, is connected with electricity collection storage unit 6 and accessory power supply, the output side for selecting electric energy
Formula is powered when the output voltage of electricity collection storage unit 6 is less than accessory power supply output voltage using accessory power supply；Work as electricity
When can collect the output voltage of storage unit 6 more than accessory power supply output voltage, electricity collection storage unit 6 is utilized to power；
Fluid flow rate adjusts unit 8, is connected with discharge cell 7 is judged, the heat dissipation for adjusting cooling fluid heat-sink unit
Speed and power consumption；
Cooling fluid heat-sink unit adjusts unit with fluid flow rate and is connected, including gaseous fluid radiator and liquid phase stream
Body radiator, setting liquid phase fluid pipeline 12 and radiator 3, radiator 3 and semiconductor temperature difference in liquid phase fluid radiator
Generator unit is bonded, and for radiating for semiconductor temperature differential generating unit, radiating fin 2 is arranged in gaseous fluid radiator, dissipates
Hot fin 2 is detached with radiator 3, and for radiating for liquid phase fluid radiator, liquid phase fluid pipeline 12 is separately positioned on heat dissipation
In device 3 and radiating fin 2.
As a kind of preferred embodiment, semiconductor temperature differential generating unit is filled using the pyroelectric effect of sandwich
It sets, i.e. semiconductor temperature differential generating piece 4, the heat absorbing end of semiconductor temperature differential generating unit is bonded heat source 5, and release end of heat is bonded cooling fluid
Heat-sink unit.
As a kind of preferred embodiment, liquid phase fluid radiator includes radiator 3, liquid phase fluid pipeline 12, liquid storage
Case 10 and liquid pump 11, the coolant liquid in liquid reserve tank 10 are transported to liquid phase fluid pipeline 12 by liquid pump 11, by radiator 3 with
Semiconductor temperature differential generating unit carries out heat convection, absorbs the heat of semiconductor temperature difference heat-generating units.
As a kind of preferred embodiment, gaseous fluid radiator includes radiating fin 2 and radiator fan 1, radiating fin
Piece 2 is detached with the radiator 3 in liquid phase fluid radiator, and radiator fan 1 drives air to carry out forced convertion to radiating fin 2
Heat exchange, radiates to radiator 3.
Fig. 3 is the vertical view of heating surface, and Fig. 4 is the overall diagram of the radiator 3 of the present invention, and Fig. 5 is the radiator 3 of the present invention
Left view, Fig. 6 is the front view of the radiator 3 of the present invention, and Fig. 7 is the overall diagram of the radiating fin 2 of the present invention, and Fig. 8 is this
The vertical view of the radiating fin 2 of invention, Fig. 9 are the left views of the radiating fin 2 of the present invention, and Figure 10 is the radiating fin of the present invention
2 front view.
Radiation processes include three principles：Conduction, convection current and radiation.Heat flux is respectively：
Conduction heat transfer：
Convection current is conducted heat：Φ=hS1ΔT (2)
Radiant heat transfer：Φ=ε S2KT4 (3)
In formula, Φ is heat flux, and λ is thermal conductivity, and A is heat-conducting area, and T is the temperature of radiator, and x is heat transfer circuit path length
Degree, S1For heat dissipation area, h is convection transfer rate, and Δ T is the difference of wall surface temperature and fluid temperature (F.T.), and K is that Boltzmann is normal
Number, S2For radiation surface area, ε is heat emissivity coefficient.
It needs, from convection transfer rate is improved, to reduce heat to improve the radiating efficiency of radiator 3 according to radiating principle
Resistance improves heat emissivity coefficient etc. and considers.For metallic conductor, for thus increasing heat radiation effect, need to improve radiating surface
Product, under same volume, increasing heat radiation area can make the thinning thermal resistance of the thickness of conductor become larger, and heat dissipation effect is caused to be deteriorated.By
Formula 2 is it is found that heat flux and convection transfer rate, sectional area and the surface of solids are directly proportional to the product of the temperature difference of fluid.By formula 3
It is found that color of object surface is deeper, more coarse, radianting capacity is stronger, and heat dissipation effect is better.
Due to there is the radiator fan of various specification on the market, for the different equipment for needing to radiate, the present invention
Devise radiator 3 and radiating fin 2.Different semiconductor temperature differential generatings is designed present invention is only intended for different radiating elements
The size of piece 4, the mechanical dimension of radiator 3 and radiating fin 2.Heat-generating units (such as central processing unit (CPU), power field effect
Pipe, pliotron, high power LED etc.) area A=a × b, wherein a and b be respectively heat-generating units length and
Width, 4 heat absorbing end of semiconductor temperature differential generating piece are tightly attached in heating surface, size and heating surface it is equal in magnitude, if being directed to it
His equipment cooling, such as powerful circuit, the size of semiconductor temperature differential generating piece 4 can be equal in magnitude with radiator 3, radiator
3 are close to 4 release end of heat of semiconductor temperature differential generating piece, and radiator 3 can be designed such as Fig. 4, Fig. 5, Fig. 6, the length of radiator 3, width
With height depending on the space of practical application, size can be unequal with the size of heating surface, permits in condition
Perhaps under, do as possible it is larger, the distance between the diameter of liquid phase fluid pipeline 12 and two liquid phase fluid pipelines 12 design should
Suitable, the diameter of liquid phase fluid pipeline 12 is smaller than the distance between two liquid phase fluid pipelines 12.The design of radiating fin 2 such as Fig. 7,
Fig. 8, Fig. 9, Figure 10.The length of 2 substrate of radiating fin, width and height depending on the space of practical application, the length of substrate,
The size of width can be equal with the length of radiator 3, width, can also be more bigger than the length of radiator 3, width, by electricity
The installation space limitation of the size or other equipment of brain.In order to increase heat dissipation effect, carried under conditions of space meets as possible
Length, width and the height of 2 substrate of high radiating fin.Height, fin thickness and the spacing of fin of 2 substrate of radiating fin are according to such as
Lower thought design, in order to improve thermal conductivity and convection transfer rate h, by the height of radiating fin 2 in the case of conditions permit
The advantages of that designs is high as possible, this design scheme is largest surface area, is convenient for cross-ventilation, advantageous heat dissipation；Save material and
Cost.It is simultaneously raising heat emissivity coefficient ε, radiating fin 2 and 3 surface of radiator heat proof material painted black.
As a kind of preferred embodiment, Figure 11 is the power supply selection course block diagram of the present invention.
Electricity collection storage unit 6 includes charge and discharge protecting module and energy-storage module, and energy-storage module and accessory power supply are simultaneously
As power supply system, micro-control unit MCU, temperature detector 9 and cooling fluid for being adjusted for fluid flow rate in unit dissipate
The motor of hot cell provides stable operating voltage, and judges discharge cell 7 for selecting energy-storage module and accessory power supply wherein
One of be powered.
Figure 12 is 6 circuit diagram of electricity collection storage unit of the present invention.Charge and discharge protecting module is using booster switcher electricity
The classic applications circuit of source controller (such as LTC3119, LM2623-Q1, TPS61099, TPS61220, TPS61040) is half-and-half
The voltage that conductor thermo-electric generation unit obtains boosts, and by taking TPS61040 (U1) as an example, the ends VIN connect semiconductor temperature differential generating
The anode of unit, input voltage size is related with the quantity of concatenated semiconductor temperature differential generating piece 4, and input voltage range is
1.8V-6V, the defeated feedback resistance that feedback circuit is selected when designing circuit, makes output voltage stabilization in 5V.
Energy-storage module uses super capacitor, is the output voltage of super capacitor for keeping stable operating voltage, Vo1.
Figure 13 is auxiliary power circuit figure, using Off-line SMPS circuit (such as DK125, TOP201, TOP202
Typical application circuit), the present invention illustrates that design process, wherein U3 are optocoupler, input/output argument by taking TOP202 (U2) as an example
For：Input voltage 85V-220V, output voltage indicate that value is 5V with Vo2.
Figure 14 is the electric discharge judging unit circuit diagram of the present invention, and Vo1 and Vo2 are by voltage comparator A1, when the voltage of Vo1
When more than Vo2, switching tube Q3 conductings, the voltage of the grid of PMOS tube Q1 is low level, so PMOS tube Q1 conductings, Vo1
As supply voltage, when Vo2 is more than Vo1, voltage comparator exports low level, and switching tube Q3 is disconnected, the grid of switching tube Q4
Voltage is Vs, and switching tube Q4 is connected at this time, and PMOS tube Q2 grid voltages are low level, and PMOS tube Q2 conductings, Vo2 is as power supply electricity
Pressure.
As a kind of preferred embodiment, Figure 15 is Vs power circuit diagrams of the present invention.
As a kind of preferred embodiment, Figure 16 is that the fluid flow rate of the present invention adjusts unit flow chart, fluid stream velocity modulation
Section unit includes that temperature detector 9, micro-control unit MCU, liquid phase heat dissipation driving and gas phase heat dissipation driving, temperature detector 9 are adopted
With temperature sensor, for detecting 5 temperature of heat source in real time, and temperature data is transferred to micro-control unit MCU, micro-control unit
MCU according to the different PWM of temperature data output duty cycle to liquid phase heat dissipation driving and gas phase heat dissipation driving, to control gas phase and
The radiating rate of the heat-sink unit of liquid phase, i.e. Duty ratio control gaseous fluid radiator and liquid phase fluid by controlling PWM
The voltage of motor carrys out regulation motor rotating speed in radiator.
When 5 temperature of heat source increases, micro-control unit MCU sends instructions to heat dissipation driving, and heat dissipation driving cooling fluid dissipates
Hot cell work is accelerated.When 5 temperature of heat source reduces, the motor of micro-control unit MCU control radiator fans 1 and liquid pump 11 slows down
Rotating speed maintains semiconductor temperature differential generating unit temperature difference between the two ends, it is made persistently to produce electricl energy.
Figure 17 is 9 circuit diagram of temperature detector of the present invention, and temperature detector 9 uses PN junction temperature sensor, implementation column
In by taking MMBT3904 as an example, indicated with T1 and T2 in figure, by the base stage b of the triode on the left side and collector c short circuits, with emitter
E, which forms a PN junction and is placed on, to be needed between the radiating surface to radiate and semiconductor temperature differential generating piece, is drawn with conducting wire.Using to pipe
PN junction obtain linear function.When temperature change, conducting electric current can change PN junction, by Kirchhoff's current law (KCL)
Understand that the electric current for flowing through opposite PN junction can change, when the PN junction electric current on the left side is IF1When, the electric current of another PN junction is IF2, by
This obtains the difference (V of PN junction forward voltage dropF1-VF2) and temperature composition linear function, VF1-VF2=(kT/q) × ln (IF1/IF2).Its
Middle VF1It is the PN junction electric current I on the left sideF1Forward voltage drop under work, VF2It is the electric current I of the right PN junctionF2Under forward voltage drop, k
For Boltzmann constant, T is absolute temperature, and q is electron charge, IF1+IF2=ICS。ICSFor constant-current source, size of current ICS
It indicates, the voltage in figure on R13 is transferred to the MCU interfaces with ADC analog-digital conversion functions by voltage follower.
Figure 18 is the PWM program flow diagrams of the present invention, and Figure 19 is the motor regulation and control schematic diagram of the present invention, excessively high when generating heat
When, it needs to accelerate radiating rate, it is therefore desirable to accelerate the flow velocity of streaming flow, the flow velocity of flowing is determined by the rotating speed of direct current generator
It is fixed.The rotating speed of motor can be accelerated by increasing the voltage at direct current generator both ends.The present invention is the duty ratio by controlling PWM waveform,
Motor speed is controlled to control the voltage of direct current generator, i.e., is passed through by controller MCU output PWM waveforms as shown in figure 19
Signal amplification circuit, then the PWM waveform of amplification is transported in PMOS tube, control its break-make.Electric moter voltage formula is：VMotor=
VCC × D, wherein D are duty ratio, and VCC is the supply voltage of electric discharge judging unit output, in order to improve afterflow ability, in direct current
One diode of motor parallel.
Figure 20 is the work flow diagram of the present invention, after opening 5 power supply of heat source by button, semiconductor temperature differential generating unit
Start to produce electricl energy, electricity collection storage element starts to collect storage electric energy, when the output voltage of energy-storage module is higher than auxiliary electricity
When the voltage of source, energy-storage module adjusts unit 8 for electric drive cooling fluid heat-sink unit and fluid flow rate and works, otherwise by auxiliary electricity
Source adjusts unit 8 for electric drive cooling fluid heat-sink unit and fluid flow rate and works, while temperature detector 9 detects 5 temperature of heat source
Whether degree is excessively high, if temperature is excessively high, controller MCU tune improves PWM duty cycle and accelerates driving cooling fluid heat-sink unit work, such as
Fruit temperature declines, then reduces PWM duty cycle, reduces cooling fluid flow velocity, as long as heat-producing device works, the inspection of temperature detector moment
Calorimetric source temperature, to reach the rotating speed for controlling motor constantly.Until heat-producing device is stopped, closing voltage, radiator stops
Only run.
The heat dissipation object that the present invention is directed to is various, different according to the structure of device, can be computer CPU, power electronic device
The heat dissipations such as part or automobile engine.
Claims (6)
1. a kind of coupled thermomechanics radiator of tandem type thermo-electric generation driving cooling fluid, which is characterized in that including：Semiconductor temperature
Poor generator unit, accessory power supply, judges that discharge cell, fluid flow rate adjust unit and cooling fluid at electricity collection storage unit
Heat-sink unit, wherein
It is single to be transmitted to electricity collection storage for converting the thermal energy of heat source to electric energy by semiconductor temperature differential generating unit for electric energy
Member；
Electricity collection storage unit is used for electric energy by being that cooling fluid heat-sink unit and fluid flow rate adjust unit after energy storage
Stable operating voltage is provided；
Accessory power supply is that cooling fluid heat-sink unit and fluid flow rate are adjusted when being used for electricity collection storage unit generation deficiency
Unit provides operating voltage；
Judge discharge cell, be connected with electricity collection storage unit and accessory power supply, the way of output for selecting electric energy works as electricity
When can collect the output voltage of storage unit less than accessory power supply output voltage, powered using accessory power supply；When electricity collection is deposited
When the output voltage of storage unit is more than accessory power supply output voltage, powered using electricity collection storage unit；
Fluid flow rate adjusts unit, is connected with discharge cell is judged, for adjust the radiating rate of cooling fluid heat-sink unit with
Power consumption；
Cooling fluid heat-sink unit adjusts unit with fluid flow rate and is connected, including liquid phase fluid radiator and gaseous fluid dissipate
Thermal, liquid phase fluid radiator include liquid phase fluid pipeline and radiator, and radiator is pasted with semiconductor temperature differential generating unit
It closes, for radiating for semiconductor temperature differential generating unit, gaseous fluid radiator includes radiating fin, radiating fin and radiator
Separation, for radiating for liquid phase fluid radiator, liquid phase fluid pipeline is separately positioned in radiator and radiating fin.
2. the coupled thermomechanics radiator of tandem type thermo-electric generation driving cooling fluid according to claim 1, feature exist
In semiconductor temperature differential generating unit uses the pyroelectric effect generating means of sandwich, the heat absorption of semiconductor temperature differential generating unit
End fitting heat source, release end of heat are bonded cooling fluid heat-sink unit.
3. the coupled thermomechanics radiator of tandem type thermo-electric generation driving cooling fluid according to claim 1, feature exist
Include radiator, liquid phase fluid pipeline, liquid reserve tank, liquid pump in, liquid phase fluid radiator, be located at coolant liquid in liquid reserve tank by
Liquid pump is transported to liquid phase fluid pipeline, and heat convection is carried out with semiconductor temperature differential generating unit in radiator, absorbs semiconductor
The heat of temperature difference heat-generating units.
4. the coupled thermomechanics radiator of tandem type thermo-electric generation driving cooling fluid according to claim 1, feature exist
In gaseous fluid radiator includes radiating fin and radiator fan, is detached with the radiator in liquid phase fluid radiator, is dissipated
Hot-air fan drives air to carry out forced-convection heat transfer to radiating fin, radiates to radiator.
5. the coupled thermomechanics radiator of tandem type thermo-electric generation driving cooling fluid according to claim 1, feature exist
In electricity collection storage unit includes charge and discharge protecting module and energy-storage module, wherein
The voltage that charge and discharge protecting module is used to obtain semiconductor thermo-electric generation unit boosts；
Energy-storage module uses super capacitor, is connected with charge and discharge protecting module, for keeping stable operating voltage.
6. the coupled thermomechanics radiator of tandem type thermo-electric generation driving cooling fluid according to claim 1, feature exist
In it includes temperature detector, micro-control unit MCU, liquid phase heat dissipation driving and gas phase heat dissipation driving, temperature that fluid flow rate, which adjusts unit,
Detector is spent for detecting heat source temperature in real time, and temperature data is transferred to micro-control unit MCU, micro-control unit MCU roots
According in the different PWM waveform of temperature data output duty cycle to liquid phase heat dissipation driving and gas phase heat dissipation driving, cooling fluid is controlled
Heat-sink unit radiating rate.
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