CN210804136U

CN210804136U - Temperature control box

Info

Publication number: CN210804136U
Application number: CN201921642225.1U
Authority: CN
Inventors: 李永刚; 苏东东; 魏莹莹
Original assignee: TIANJIN TONGYANG TECHNOLOGY DEVELOPMENT CO LTD
Current assignee: TIANJIN TONGYANG TECHNOLOGY DEVELOPMENT CO LTD
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-06-19
Anticipated expiration: 2029-09-29

Abstract

The utility model relates to the technical field of temperature control equipment, in particular to a temperature control box, which comprises a bridge circuit, an acquisition circuit, a Pt100 temperature sensor, an MCU chip, an auxiliary circuit, an H bridge circuit and a temperature control chamber; pt100 temperature sensor installs in the control by temperature change indoor, and Pt100 temperature sensor passes through the signal line and links to each other with bridge circuit and acquisition circuit, MCU chip and subsidiary circuit with bridge circuit and acquisition circuit connect, and H bridge circuit passes through the signal line and links to each other with MCU chip and subsidiary circuit, the control by temperature change indoor includes outer wall and thermal insulation layer semiconductor refrigeration piece and semiconductor heating plate are installed to the inboard of outer wall, and the fin is fixed on the outer wall to link to each other with semiconductor refrigeration piece and semiconductor heating plate through heat conduction silicone grease, be fixed with radiator fan on the fin. The device ensures the accuracy of temperature measurement, and uses the semiconductor wafer as a cold source and a heat source to realize rapid refrigeration and heating.

Description

Temperature control box

Technical Field

The utility model relates to a temperature control equipment technical field especially relates to a temperature control box.

Background

In an instrument, the operating temperature of a core component plays a crucial role in the operating efficiency of the instrument, especially under severe environment conditions of extreme high temperature or extreme low temperature, and therefore a universal temperature control box and a temperature control system are needed to effectively control the ambient temperature of a core device inside the instrument so as to ensure the operating efficiency of the instrument. Because the temperature control system of the core device in the existing industrial equipment often has the defects of poor circuit stability, low refrigeration and heating precision, temperature control hysteresis and the like, the problem how to economically and effectively control the temperature of the core component of the instrument within a certain range is needed to be solved.

Disclosure of Invention

An object of the utility model is to overcome the not enough of above-mentioned technique, and provide a temperature control box.

The utility model discloses a realize above-mentioned purpose, adopt following technical scheme: a temperature control box comprises a bridge circuit, a collecting circuit, a Pt100 temperature sensor, an MCU chip, an auxiliary circuit, an H-bridge circuit and a temperature control chamber; pt100 temperature sensor installs in the control by temperature change indoor, and Pt100 temperature sensor passes through the signal line and links to each other with bridge circuit and acquisition circuit, MCU chip and attached circuit with bridge circuit and acquisition circuit connect, and H bridge circuit passes through the signal line and links to each other with MCU chip and attached circuit, the control by temperature change indoor includes outer wall and heat preservation insulating layer, and the heat preservation insulating layer is fixed the inboard of outer wall semiconductor refrigeration piece and semiconductor heating piece are installed to the inboard of outer wall, and the fin is fixed on the outer wall to link to each other with semiconductor refrigeration piece and semiconductor heating piece through heat conduction silicone grease, be fixed with radiator fan on the fin.

Preferably, the H-bridge circuit is divided into a reference bridge and a temperature measuring bridge, the voltage value V1 of the resistor R1 and the resistor R2 in the reference bridge, and the voltage value V2 of the temperature sensor Pt100, the resistor R3 and the resistor R4 in the temperature measuring bridge; the acquisition circuit of the temperature acquisition circuit module comprises an operational amplifier, a resistor R5 in the first-stage operational amplifier circuit, a resistor R7 and resistors R9 and R10 in the second-stage operational amplifier circuit.

Preferably, the output voltage value Vout of the H-bridge circuit is:

preferably, the bridge circuit, the acquisition circuit, the MCU chip, the auxiliary circuit and the H-bridge circuit are respectively arranged on the outer wall of the temperature control chamber.

Preferably, the controlled object and the heat insulation layer are relatively fixed.

Preferably, the refrigerating end of the semiconductor refrigerating sheet faces towards a controlled object in the temperature control chamber, and the heating end faces towards the radiating sheet; the heating end of the semiconductor heating sheet faces to a controlled object in the temperature control chamber, and the cooling end faces to the radiating sheet.

Preferably, the MCU chip selects a singlechip of STM32Fx series.

Preferably, the MCU chip simultaneously acquires the temperature of the controlled object in real time while heating or cooling the controlled object.

Compared with the prior art, the device has the advantages that the complexity of a temperature measuring circuit is simplified, the accuracy of a temperature measuring result is guaranteed, the semiconductor chip is used as a cold source and a heat source, rapid refrigeration and heating are realized, the semiconductor chip is prevented from being damaged by switching between refrigeration and heating, in addition, the refrigeration quantity and the heating quantity of the semiconductor chip can be changed by adjusting the current value of the semiconductor chip, and therefore real-time accurate control over the temperature is realized.

Drawings

Fig. 1 is a perspective view of the present invention;

fig. 2 is a schematic diagram of a bridge circuit and an acquisition circuit in the middle temperature acquisition circuit module of the present invention;

fig. 3 is a schematic view of the working flow of the system of the present invention;

in fig. 1: the temperature control circuit comprises a bridge circuit and an acquisition circuit, 2-Pt 100 temperature sensors, 3-MCU chips and auxiliary circuits, 4-H bridge circuits, 5-controlled objects, 6-heat preservation and insulation layers, 7-outer walls, 8-semiconductor refrigerating pieces, 9-semiconductor heating pieces, 10-radiating fins and 11-radiating fans.

Detailed Description

The following detailed description of the preferred embodiments will be made with reference to the accompanying drawings. As shown in fig. 1-3, a temperature control box comprises a bridge circuit and acquisition circuit 1, a Pt100 temperature sensor 2, an MCU chip and accessory circuit 3, an H-bridge circuit 4 and a temperature control chamber; the Pt100 temperature sensor 2 is installed in the temperature control chamber, the Pt100 temperature sensor 2 is connected with the bridge circuit and the acquisition circuit 1 through a signal line, the MCU chip and the auxiliary circuit 3 are connected with the bridge circuit and the acquisition circuit 1, the H bridge circuit 4 is connected with the MCU chip and the auxiliary circuit 3 through a signal line, and the MCU chip and the auxiliary circuit 3 are externally connected with a 24V power supply. The temperature control room includes outer wall 7 and heat preservation insulating layer 6, heat preservation insulating layer 6 is fixed the inboard of outer wall 7 semiconductor refrigeration piece 8 and semiconductor heating plate 9 are installed to the inboard of outer wall 7, and fin 10 is fixed on the outer wall 7 to through heat conduction silicone grease with semiconductor refrigeration piece 8 with semiconductor heating plate 9 links to each other, be fixed with radiator fan 11 on the fin 10.

The bridge circuit is divided into a reference bridge and a temperature measuring bridge, the voltage value V1 of a resistor R1 and a resistor R2 in the reference bridge, and the voltage value V2 of a temperature sensor Pt100 resistor R3 and a resistor R4 in the temperature measuring bridge; the acquisition circuit of the temperature acquisition circuit module comprises an operational amplifier, a resistor R5 and a resistor R7 in the first-stage operational amplifier circuit and resistors R9 and R10 in the second-stage operational amplifier circuit; the output voltage value Vout of the H-bridge circuit is:

the embodiment of the utility model provides a working method and theory of operation do:

the voltage change in the bridge circuit and the acquisition circuit 1 is captured according to the resistance change of the Pt100 temperature sensor 2 in the temperature acquisition circuit, and the changed voltage is positively correlated with the temperature value. The MCU chip and the auxiliary circuit 3 receive the voltage value Vout of the bridge circuit and the acquisition circuit 1, the temperature of the Pt100 temperature sensor is obtained after the MCU chip processes and operates, and then the MCU chip judges whether the temperature value is in a set range. If the temperature is higher than the upper limit value of the set temperature, a voltage control signal output by the MCU chip is transmitted into the semiconductor refrigerating sheet 8 through the H-bridge circuit 4, so that the temperature of the controlled object is reduced; if the temperature is lower than the lower limit value of the set temperature, a voltage control signal output by the MCU chip is transmitted into the semiconductor heating sheet 9 through the H-bridge circuit 4, and the temperature of the controlled object is increased. When the controlled object is heated or refrigerated, the MCU chip simultaneously collects the temperature of the controlled object in real time, and unnecessary power consumption caused by long-time operation of the semiconductor refrigerating sheet 8 or the semiconductor heating sheet 9 is avoided, so that the temperature of the controlled object is accurately controlled.

It should be noted that at least two Pt100 temperature sensors are required and distributed in two opposite walls of the controlled object, and this embodiment takes two Pt100 temperature sensors as an example for description.

To sum up can obtain, based on temperature control case and temperature control system with singlechip and semiconductor refrigeration piece as the basis, acquire the temperature of the inside core device of instrument through Pt100 temperature sensor, acquire this voltage signal of this temperature of sign by the MCU chip and handle after to control H bridge module and drive the accurate control that realizes the object temperature that awaits measuring to semiconductor refrigeration piece or semiconductor heating plate, the utility model discloses not only can be used to the ambient temperature of the inside core device of control instrument, also can the exclusive use, have advantages such as high accuracy, interference immunity are strong, the universality is strong.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. A temperature control box, its characterized in that: the temperature control circuit comprises a bridge circuit, an acquisition circuit, a Pt100 temperature sensor, an MCU chip, an auxiliary circuit, an H-bridge circuit and a temperature control chamber; pt100 temperature sensor installs in the control by temperature change indoor, and Pt100 temperature sensor passes through the signal line and links to each other with bridge circuit and acquisition circuit, MCU chip and attached circuit with bridge circuit and acquisition circuit connect, and H bridge circuit passes through the signal line and links to each other with MCU chip and attached circuit, the control by temperature change indoor includes outer wall and heat preservation insulating layer, and the heat preservation insulating layer is fixed the inboard of outer wall semiconductor refrigeration piece and semiconductor heating piece are installed to the inboard of outer wall, and the fin is fixed on the outer wall to link to each other with semiconductor refrigeration piece and semiconductor heating piece through heat conduction silicone grease, be fixed with radiator fan on the fin.

2. The temperature control box of claim 1, wherein: the H bridge circuit is divided into a reference bridge and a temperature measuring bridge, the voltage value V1 of a resistor R1 and a resistor R2 in the reference bridge, and the voltage value V2 of a temperature sensor Pt100 resistor R3 and a resistor R4 in the temperature measuring bridge; the acquisition circuit of the temperature acquisition circuit module comprises an operational amplifier, a resistor R5 in the first-stage operational amplifier circuit, a resistor R7 and resistors R9 and R10 in the second-stage operational amplifier circuit.

3. The temperature control box of claim 1, wherein: the output voltage value Vout of the H-bridge circuit is:

4. the temperature control box of claim 1, wherein: the bridge circuit, the acquisition circuit, the MCU chip, the auxiliary circuit and the H-bridge circuit are respectively arranged on the outer wall of the temperature control room.

5. The temperature control box of claim 1, wherein: the controlled object and the heat insulation layer are relatively fixed.

6. The temperature control box of claim 1, wherein: the refrigerating end of the semiconductor refrigerating sheet faces towards a controlled object in the temperature control chamber, and the heating end faces towards the radiating sheet; the heating end of the semiconductor heating sheet faces to a controlled object in the temperature control chamber, and the cooling end faces to the radiating sheet.

7. The temperature control box of claim 1, wherein: the MCU chip selects STM32Fx series single-chip microcomputer.