CN210781855U - High-efficient heat dissipation type power amplifier board - Google Patents

High-efficient heat dissipation type power amplifier board Download PDF

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Publication number
CN210781855U
CN210781855U CN201921377874.3U CN201921377874U CN210781855U CN 210781855 U CN210781855 U CN 210781855U CN 201921377874 U CN201921377874 U CN 201921377874U CN 210781855 U CN210781855 U CN 210781855U
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CN
China
Prior art keywords
heat
power amplifier
heat dissipation
water tank
amplifier board
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Active
Application number
CN201921377874.3U
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Chinese (zh)
Inventor
陈仁江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaanxi Yinfeng Keyao Enterprise Information Consulting Co.,Ltd.
Original Assignee
Jiangmen Giant Electronics Co ltd
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Priority to CN201921377874.3U priority Critical patent/CN210781855U/en
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Publication of CN210781855U publication Critical patent/CN210781855U/en
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Abstract

The utility model discloses a high-efficient heat dissipation type power amplifier board relates to power amplifier board technical field, which comprises a mainboard, one side of mainboard is provided with the fin, fin and mainboard pass through the linkage plate and connect, the opposite side of mainboard is provided with the water tank, and the upper surface of mainboard is provided with the heat conduction mouth, the one end of water tank is provided with the water inlet, the one end of water inlet is provided with rotatory stopper, run through between mainboard and the water tank and be provided with the heat pipe, and the front surface of mainboard is provided with the side vent. The utility model discloses heat conduction mouth intercommunication heat pipe, a large amount of heats are inhaled the heat pipe, have reduced the temperature of merit amplifier board top, and the inside ventilation of heat pipe can take away the heat rapidly, and the access & exit department at the heat pipe still is provided with the water tank, and the heat pipe runs through the water tank, and the heat can be absorbed by water for heat pipe temperature descends fast, and the heat dissipation is more comprehensive, has improved the radiating efficiency.

Description

High-efficient heat dissipation type power amplifier board
Technical Field
The utility model relates to a power amplifier board technical field specifically is a high-efficient heat dissipation type power amplifier board.
Background
The power amplifier board is a circuit board for mounting the power amplifier, and a power amplifier tube and a main amplifier tube are mainly mounted above the power amplifier board. The power amplification module is used for amplifying the weak signal source and playing the weak signal source through a loudspeaker.
The existing power amplifier board can basically meet the requirements. However, when the power amplifier module works, huge heat is often generated, and the power amplifier board and some components are damaged. Accordingly, those skilled in the art have provided an efficient heat dissipation type power amplifier board to solve the problems set forth in the background art.
Disclosure of Invention
An object of the utility model is to provide a high-efficient heat dissipation type power amplifier board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient heat dissipation type power amplifier board, includes the mainboard, one side of mainboard is provided with the fin, fin and mainboard pass through the linkage plate and connect, the opposite side of mainboard is provided with the water tank, and the upper surface of mainboard is provided with the heat conduction mouth, the one end of water tank is provided with the water inlet, the one end of water inlet is provided with rotatory stopper, it is provided with the heat pipe to run through between mainboard and the water tank, and the front surface of mainboard is provided with the side vent, the junction of heat pipe and water tank is provided with the leak protection ring, the below of mainboard is provided with the heating panel, the below of heating panel is provided.
As a further aspect of the present invention: the radiating fin is an aluminum component, and a heat-conducting silica gel medium is arranged between the radiating fin and the mainboard.
As a further aspect of the present invention: the surface of the rotating plug is provided with anti-skid grains, and the rotating plug is a rubber component.
As a further aspect of the present invention: the leak-proof ring is of an annular structure, and the inner ring of the leak-proof ring is matched with the outer ring of the heat conduction pipe.
As a further aspect of the present invention: the heat conduction pipe is a component made of copper, and the heat conduction pipe is of a U-shaped hollow structure.
As a further aspect of the present invention: the heat conduction port is provided with eight in total, and heat conduction port and heat pipe intercommunication.
As a further aspect of the present invention: the heat dissipation plate is of a rectangular structure, and the size of the heat dissipation plate is consistent with that of the main plate.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses heat conduction mouth intercommunication heat pipe, a large amount of heats are inhaled the heat pipe, have reduced the temperature of merit amplifier board top, and the inside ventilation of heat pipe can take away the heat rapidly, and the access & exit department at the heat pipe still is provided with the water tank, and the heat pipe runs through the water tank, and the heat can be absorbed by water for heat pipe temperature descends fast, and the heat dissipation is more comprehensive, has improved the radiating efficiency.
Drawings
Fig. 1 is a schematic structural diagram of an efficient heat dissipation type power amplifier board;
fig. 2 is a top view of an efficient heat dissipation type power amplifier board.
In the figure: 1. a main board; 2. a water tank; 3. a heat sink; 4. a heat conducting pipe; 5. a heat dissipation plate; 6. a leakage-proof ring; 7. a water inlet; 8. a rotating plug; 9. a side vent; 10. a heat conducting port; 11. a connector tile; 12. and (4) a support column.
Detailed Description
Please refer to fig. 1-2, in the embodiment of the present invention, an embodiment of the present invention provides a high-efficient heat dissipation type power amplifier board, including a main board 1, one side of the main board 1 is provided with a heat sink 3, the heat sink 3 is connected with the main board 1 through a connection board 11, the opposite side of the main board 1 is provided with a water tank 2, and the upper surface of the main board 1 is provided with a heat conduction port 10, one end of the water tank 2 is provided with a water inlet 7, one end of the water inlet 7 is provided with a rotary plug 8, a heat pipe 4 runs through between the main board 1 and the water tank 2, and the front surface of the main board 1 is provided with a side vent 9, the junction of the heat pipe 4 and the water tank 2 is provided with a leakage-proof ring 6.
In fig. 1: the radiating fin 3 is an aluminum component, a heat-conducting silica gel medium is arranged between the radiating fin 3 and the main board 1, the contact area of the radiating fin 3 and air is increased due to the design of the groove, and a better radiating effect is achieved.
In fig. 2: the surface of the rotating plug 8 is provided with anti-slip lines, the rotating plug 8 is a component made of rubber, the anti-slip lines are designed to facilitate people to take down the rotating plug 8 and add water into the water tank, and the material of the rubber increases the leakage-proof capacity of an inlet.
In fig. 1: leak protection ring 6 is the loop configuration, and the inner circle of leak protection ring 6 and the outer lane looks adaptation of heat pipe 4 have increased the waterproof ability that heat pipe 4 passes through 2 both sides of water tank, prevent that the outflow of water from damaging the components and parts on the mainboard 1.
In fig. 1: the heat conduction pipe 4 is a copper component, and the heat conduction pipe 4 is a U-shaped hollow structure, the heat conductivity of the copper structure is better, and the U-shaped structure is favorable for rapid circulation of air.
In fig. 1: the eight heat conducting ports 10 are formed, the heat conducting ports 10 are communicated with the heat conducting pipes 4, heat can conveniently enter the heat conducting pipes 4 and can be rapidly taken away by air, and the heat radiating effect is improved.
In fig. 1: the heat dissipation plate 5 is of a rectangular structure, the size of the heat dissipation plate 5 is consistent with that of the mainboard 1, heat dissipation space is saved, and the power amplifier module does not occupy installation space of other modules.
The utility model discloses a theory of operation is: the relevant device of power amplifier on mainboard 1 of power amplifier board produces a large amount of heats, to loss all around, these heats are absorbed rapidly to heat conduction mouth 10, and spread into in heat pipe 4, be in the ventilation status in heat pipe 4 always, the heat is taken away rapidly by wind, and entrance at heat pipe 4, still be provided with water tank 2, a temperature for reducing heat pipe 4, heat pipe 4 is provided with leak protection ring 6 through the both sides of basin, prevent that the basin from leaking, and simultaneously, remaining heat is absorbed by fin 3 and heating panel 5, fin 3 and the contact of air, the heat dissipation accelerates, reach high-efficient radiating effect.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (7)

1. A high-efficiency heat-dissipation power amplifier board comprises a main board (1), and is characterized in that a heat dissipation fin (3) is arranged on one side of the main board (1), the radiating fins (3) are connected with the main board (1) through the connecting plate (11), the other side of the main board (1) is provided with the water tank (2), the upper surface of the main board (1) is provided with a heat conduction port (10), one end of the water tank (2) is provided with a water inlet (7), a rotating plug (8) is arranged at one end of the water inlet (7), a heat conducting pipe (4) penetrates between the main board (1) and the water tank (2), a side vent (9) is arranged on the front surface of the main board (1), a leak-proof ring (6) is arranged at the joint of the heat conducting pipe (4) and the water tank (2), the heat dissipation plate (5) is arranged below the main plate (1), and the support columns (12) are arranged below the heat dissipation plate (5).
2. A high efficiency heat dissipation type power amplifier board as claimed in claim 1, wherein the heat sink (3) is an aluminum member, and a heat conductive silicone medium is disposed between the heat sink (3) and the main board (1).
3. The high-efficiency heat-dissipation power amplifier board as recited in claim 1, wherein the surface of the rotary plug (8) is provided with anti-slip threads, and the rotary plug (8) is a rubber member.
4. The high-efficiency heat-dissipation power amplifier board according to claim 1, wherein the leakage-proof ring (6) has an annular structure, and an inner ring of the leakage-proof ring (6) is fitted with an outer ring of the heat-conducting pipe (4).
5. The high efficiency heat dissipation type power amplifier board according to claim 1, wherein the heat pipe (4) is a copper member, and the heat pipe (4) has a U-shaped hollow structure.
6. The high efficiency heat dissipation type power amplifier board according to claim 1, wherein the number of the heat conduction ports (10) is eight, and the heat conduction ports (10) are communicated with the heat conduction pipes (4).
7. A high efficiency heat dissipation type power amplifier board as claimed in claim 1, wherein the heat dissipation plate (5) has a rectangular structure, and the size of the heat dissipation plate (5) is the same as the size of the main board (1).
CN201921377874.3U 2019-08-22 2019-08-22 High-efficient heat dissipation type power amplifier board Active CN210781855U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921377874.3U CN210781855U (en) 2019-08-22 2019-08-22 High-efficient heat dissipation type power amplifier board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921377874.3U CN210781855U (en) 2019-08-22 2019-08-22 High-efficient heat dissipation type power amplifier board

Publications (1)

Publication Number Publication Date
CN210781855U true CN210781855U (en) 2020-06-16

Family

ID=71045051

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921377874.3U Active CN210781855U (en) 2019-08-22 2019-08-22 High-efficient heat dissipation type power amplifier board

Country Status (1)

Country Link
CN (1) CN210781855U (en)

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Effective date of registration: 20201225

Address after: Room c310-1, 3 / F, building 4, Huigu commercial block, silk road, Xi'an national civil aerospace industry base, Shaanxi 710100

Patentee after: Shaanxi Yinfeng Keyao Enterprise Information Consulting Co.,Ltd.

Address before: 529080 factory building 12, No.9, Waihai Jinxi 1st Road, Jianghai District, Jiangmen City, Guangdong Province

Patentee before: Jiangmen giant Electronics Co.,Ltd.